KR20150029494A - Touch panel sensor and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a touch panel sensor and to a method for manufacturing the same to simplify a structure and manufacturing processes and improve reliability. The method for manufacturing the touch panel sensor to sense the contact location of an object to be disposed on the upper side of a display unit includes the steps of: providing a release film, a base layer which is formed on the upper side of the release film; a first electrode pattern which is formed on the upper side of the base layer, and a lamination film having a film member to be supplied on the upper side of the base layer to cover the upper side of the film member; laminating the lamination film on an insulation substrate to cover the upper side of the film member; and transferring the base layer, the first electrode pattern and the film member to the insulation substrate at once by removing the release film from the lamination film.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch panel sensor,

The present invention relates to a touch panel sensor and a method of manufacturing the touch panel sensor, and more particularly, to a touch panel sensor capable of sensing a contact position of an object approaching a display.

1 is a perspective view illustrating a conventional capacitive touch panel sensor.

1, in a conventional touch panel sensor, a lower insulating sheet 10 and an upper insulating sheet 20 are bonded at a predetermined interval. The lower ITO electrode 30 and the upper ITO electrode 40 are vertically arranged on the opposing surfaces of the lower insulating sheet 10 and the upper insulating sheet 20. Specifically, The upper ITO electrode 40 is oriented from the upper side to the lower side on the bottom surface of the upper insulating sheet 20.

The touch panel sensor has a predetermined capacitance corresponding to the area of each intersection at each intersection of the lower ITO electrode 30 and the upper ITO electrode 40 arranged to cross each other, The area of the upper ITO electrode 40 disposed on the upper part may be added to the area of the body part to change the capacitance value.

A connection line 48 made of a metal is connected from the end of the upper ITO electrode 40 to the upper insulating sheet 20 to electrically connect the upper ITO electrode 40 and the electrode 52 of the external circuit board 50 And the lower ITO electrode 20 is connected to the circuit board 50 by a separate connection line.

At this time, the connecting line 48, which is generally made of metal, is shiny with metallic luster and can not be seen through the transparent upper insulating sheet 20 because the light does not pass through. Conventionally, a separate non-transmissive film for the window decoration 65 is formed on the bottom surface of the reinforced substrate 60 such as a separate glass or translucent reinforced plastic so that the connecting line 48 and the circuit board 50 can not be visually recognized , And the reinforcing substrate (60) is disposed on the upper insulating sheet (20). For details of the conventional touch panel sensor described above, refer to the touch panel sensor disclosed in Japanese Patent Application Laid-Open No. 10-2011-0137231 (December 22, 2011).

However, providing a separate reinforcing substrate 60 on the upper insulating sheet 20 causes an increase in the thickness of the touch panel sensor and complicates the assembling process, and an increase in the thickness of the touch panel sensor It may cause the transparency and sharpness of the touch panel sensor to deteriorate, and the sensitivity of the touch panel sensor may be lowered.

Accordingly, in recent years, a variety of researches have been conducted in order to simplify the manufacturing process of the touch panel sensor, to reduce the thickness thereof, and to improve the sensitivity.

The present invention provides a touch panel sensor capable of reducing a defective rate and improving stability, and a method of manufacturing the same.

In particular, the present invention provides a touch panel sensor capable of maintaining a spacing of electrode patterns without increasing the thickness of the adhesive layer using a film member, and a method of manufacturing the same.

The present invention also provides a touch panel sensor and a method of manufacturing the same that can simplify the manufacturing process and shorten the manufacturing time.

According to another aspect of the present invention, there is provided a method of manufacturing a touch panel sensor, the touch panel sensor including a release film, a base A first electrode pattern formed on an upper surface of the base layer, and a film member provided on an upper surface of the base layer to cover the first electrode pattern; Stacking an insulating substrate on the laminated film so as to cover the upper surface of the film member; And removing the release film from the laminated film, and transferring the base layer, the first electrode pattern, and the film member to the insulating substrate all at once.

As the insulating substrate, a normal glass substrate or a reinforced plastic substrate can be used, and the present invention is not limited or limited depending on the type and characteristics of the insulating substrate.

In addition, a second electrode pattern may be formed on the bottom surface of the insulating substrate, and a second wire member electrically connected to the second electrode pattern may be formed. For reference, the second electrode pattern may serve as a transmitter line, and the first electrode pattern may serve as a receiver electrode. In some cases, it is also possible to form the transmitter electrode on the laminated film and to form the receiver electrode on the insulating substrate. Alternatively, it is also possible to sense the touch operation only with the first electrode pattern formed on the laminated film without a separate second electrode pattern.

The first and second electrode patterns, the first and second wire patterns may be formed in various ways according to the required conditions and design specifications. For example, after forming an electrode layer (not shown) as a whole on an insulating substrate or a base layer, first and second electrode patterns can be formed by patterning the electrode layer in a predetermined pattern by a normal etching method, The second wire pattern can be formed by a normal printing process. In some cases, it is possible to form the first and second electrode patterns by printing or other methods, and it is possible to form the first and second wire members by metal thin film deposition, metal electrode etching or the like. Alternatively, the electrode pattern and the wire member may be simultaneously formed by a single process. Alternatively, a second base layer may be formed on a separate second release film, a second electrode pattern of the second base layer and a second wire member may be formed, and then the second release film may be removed, It is also possible to transfer the two base layers, the second electrode pattern and the second wire member all at once.

In addition, the first and second electrode patterns may be formed using a conductive material and a transparent material, and the present invention is not limited or limited by the materials of the first and second electrode patterns. For example, the first and second electrode patterns may be formed using ITO, IZO, ATO, AZO, carbon nanotubes, transparent organic materials, or the like. In some cases, the first and the electrode patterns may be formed using metal fibers such as silver nano fibers. Alternatively, instead of the first and second electrode patterns, a metal having a thickness of about 10 μm or less It is also possible that a metal mesh is applied.

The laminated film may be provided in various ways depending on the required conditions and design specifications. For example, the laminated film may include a step of providing a release film, a step of forming a base layer on the top surface of the release film, a step of forming a first electrode pattern on the top surface of the base layer, And then laminating the film member on the upper surface.

The base layer can be formed in various ways depending on the required conditions and design specifications. For example, the base layer may be provided by applying or printing a liquid curing agent on the top surface of the release film, and then curing the liquid curing agent. Alternatively, it is possible that the base layer is formed in other ways such as printing, etching or the like. As another example, the base layer may be provided using a synthetic resin film. For reference, a plastic film in which an electrode pattern is formed is generally provided to have a thickness of about several hundreds of micrometers. The reason for this is that in order to form an electrode pattern directly on the plastic film by laying an electrode layer on the plastic film and patterning process such as photolithography, the thickness of the plastic film must be at least several hundreds of micrometers. However, in the present invention, since the base layer is formed on the release film and the first electrode pattern to be described later is formed on the upper surface of the base layer, there is no problem in forming the first electrode pattern even if the thickness of the base layer is thin. For example, the base layer may be provided using a synthetic resin film having a thickness of 10 to 30 탆, which does not require a separate thermal curing treatment or ultraviolet curing treatment.

The film member may be laminated on the upper surface of the base layer via an adhesive layer. The adhesive layer can be provided in various ways depending on the required conditions and design specifications. In one example, the adhesive layer may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and then curing. Particularly, in the case of an adhesive layer made of an ultraviolet curing agent, it is possible to minimize the pressurization of a circuit board to be described later. In some cases, the adhesive layer may be provided with an optical adhesive film or an OCA (Optically Clear Adhesive) film together with other liquid adhesive.

The insulating substrate may be laminated to the laminated film via the substrate bonding layer. The substrate adhesive layer may be provided in various ways depending on the required conditions and design specifications. In one example, the substrate bonding layer may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and then curing. In some cases, the substrate adhesive layer may be provided with an optical adhesive film or an OCA (Optically Clear Adhesive) film together with a liquid adhesive.

Since the film member can be disposed between the first electrode pattern and the second electrode pattern as the laminated film and the insulating substrate are laminated, the thickness of the substrate bonding layer provided between the first electrode pattern and the second electrode pattern can be minimized I can do it. That is, generally, in the touch panel sensor, in order to prevent mutual interference between the first electrode pattern and the second electrode pattern, the spacing distance between the first electrode pattern and the second electrode pattern (spacing along the vertical direction) Be able to. Conventionally, a thick adhesive layer such as OCA (Optically Clear Adhesive) is formed between the first electrode pattern and the second electrode pattern so that a gap between the first electrode pattern and the second electrode pattern can be ensured. However, as the thickness of the adhesive layer formed between the first electrode pattern and the second electrode pattern increases, the defective rate increases and adhesion becomes difficult. Further, in the case of the adhesive layer using OCA, there is a problem that various defects are caused as the external circuit board is pressed when pressed. However, in the present invention, by providing the film member between the first electrode pattern and the second electrode pattern, the thickness of the adhesive layer between the first electrode pattern and the second electrode pattern is minimized, So that a predetermined distance or more can be ensured between them.

Also, the external circuit board may be electrically connected to the first wire member and the second wire member. In one example, the circuit board may be provided between the insulating substrate and the upper surface of the film member, and between the bottom surface of the film member and the base layer, and electrically connected to the first wire member and the second wire member. In another example, one end of the first wire member and the other end of the second wire member may be exposed to the bottom surface of the base layer, and the circuit board is provided on the bottom surface of the base layer, And can be electrically connected to the wire member.

On the other hand, the laminated film may be provided corresponding to at least one insulating substrate, and the laminated film may be cut to a size corresponding to the insulating substrate before laminated to the insulating substrate. For example, the laminated films can be formed at a time in an array of 4 * 4, 5 * 5, 6 * 6, 3 * 4 or the like according to the required conditions and design specifications. But is not limited thereto.

According to the touch panel sensor and the manufacturing method thereof according to the present invention, it is possible to reduce the defect rate and improve the stability.

Particularly, according to the present invention, by providing the film member between the first electrode pattern and the second electrode pattern, the thickness of the adhesive layer between the first electrode pattern and the second electrode pattern can be minimized, The spacing distance between the patterns can be secured to a certain extent or more.

The gap between the first electrode pattern and the second electrode pattern can be ensured by thickening the adhesion layer such as OCA between the first electrode pattern and the second electrode pattern in the conventional case, As the thickness of the adhesive layer formed between the electrode patterns increases, the defect rate increases and the adhesion becomes difficult. However, in the present invention, since the thickness of the adhesive layer between the first electrode pattern and the second electrode pattern can be minimized by using the film member, it is possible to prevent defective rate and adherence problems due to an increase in the thickness of the adhesive layer.

Further, according to the present invention, since the base layer, the first electrode pattern, and the film member can be transferred onto the insulating substrate at one time, it is possible to shorten the process time, The occurrence of defects can be minimized.

In addition, since an electrode layer for an electrode pattern is conventionally formed and an electrode pattern is formed directly on a plastic film through a patterning process such as a photolithography process, the thickness of the plastic film used in the conventional touch panel sensor must be maintained at least several hundreds of micrometers did. However, in the touch panel sensor and the manufacturing method thereof according to the present invention, since the base layer is provided on the release film and the electrode pattern is formed on the base layer, there is no problem in forming the electrode pattern even if the thickness of the base layer is thin, The base layer can be made thinner. Accordingly, the thickness of the touch panel sensor can be further reduced, and the sensitivity of the touch panel sensor can be improved to enhance the merchantability of the product.

According to the present invention, since the circuit board can be attached to the outer surface of the laminated film in the state that the insulating substrate and the laminated film are laminated, space utilization and design freedom between the insulating substrate and the laminated film can be maximized, The process can be further simplified.

In addition, according to the present invention, since a laminated film corresponding to a plurality of insulating substrates can be made and cut and used, a natural finishing process can be performed in the cutting process. Therefore, a separate finishing treatment is not required, and it is possible to shorten the time required for finishing the components such as the base layer on the release film, the adhesive layer that can be formed in the middle of the laminated film, and the like.

1 is a perspective view illustrating a conventional touch panel sensor.
2 is a view showing a touch panel sensor according to the present invention.
3 to 9 are views for explaining a method of manufacturing a touch panel sensor according to the present invention.
10 and 11 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments. For reference, the same numbers in this description refer to substantially the same elements and can be described with reference to the contents described in the other drawings under these rules, and the contents which are judged to be obvious to the person skilled in the art or repeated can be omitted.

FIG. 2 is a view showing a touch panel sensor according to the present invention, and FIGS. 3 to 8 are views for explaining a method of manufacturing a touch panel sensor according to the present invention.

2 to 9, a touch panel sensor according to the present invention is placed on a display and can be used for sensing a contact position of a target object, and includes an insulating substrate 200 and a laminated film 100.

Since a part of the body such as a finger or a touch tool touches directly with the insulating substrate 200, a rigid glass substrate which is excellent in strength and can not be easily refracted may be used, or a polycarbonate having a light- Reinforced plastic can be used.

A second wire member 230 may be formed under the insulating substrate 200 to be electrically connected to the second electrode pattern 220 and the second electrode pattern 220. For example, the second electrode pattern 220 and the second wire member 230 may be formed on the bottom surface of the insulating substrate 200. In some cases, the second electrode pattern and the second wire member may be formed on the upper surface of the laminated film stacked on the bottom surface of the insulating substrate.

A window decoration 240 may be provided under the insulating substrate 200. The window decoration 240 is provided below the insulating substrate 200. The window decoration 240 may be formed on the bottom surface of the insulating substrate 200 or on the upper surface of the film member facing the bottom surface of the insulating substrate 200. [ The present invention is not limited thereto. For example, a window decoration 240 may be formed on the bottom surface of the insulating substrate 200. The window decoration 240 may be provided as an application for covering the circuit board 400 and the wire members 130 and 230 disposed at the edges of the non-transparent component, for example, the touch panel sensor, And may be formed by a normal printing process or the like.

The laminated film 100 may include a release film 150, a base layer 110, a first electrode pattern 120 and a film member 140 which are sequentially stacked. The first electrode pattern 120 may be electrically connected to the first wire member 130.

In order to prevent mutual interference between the first electrode pattern 120 and the second electrode pattern 220 in the touch panel sensor, a distance between the first electrode pattern 120 and the second electrode pattern 220 Spacing along the direction) should be able to be secured over a certain level. Conventionally, a thick adhesive layer such as OCA (Optically Clear Adhesive) is formed between the first electrode pattern and the second electrode pattern so that a gap between the first electrode pattern and the second electrode pattern can be ensured. However, as the thickness of the adhesive layer formed between the first electrode pattern and the second electrode pattern increases, the defective rate increases and adhesion becomes difficult. Further, in the case of the adhesive layer using OCA, there is a problem that various defects are caused as the external circuit board is pressed when pressed. In the present invention, by providing the film member 140 between the first electrode pattern 120 and the second electrode pattern 220, the gap between the first electrode pattern 120 and the second electrode pattern 220 The spacing between the first electrode pattern 120 and the second electrode pattern 220 can be maintained at a certain level while minimizing the thickness of the adhesive layer 310. [

The insulating substrate 200 is stacked on top of the laminated film 100 so as to cover the upper surface of the film member 140. The release film 150 may be removed after the insulation substrate 200 and the laminated film 100 are laminated and the base film 110 and the first electrode pattern 120 may be removed as the release film 150 is removed. The first wire member 130 and the film member 140 can be transferred to the insulating substrate 200 at one time.

The external circuit board 400 may be electrically connected to the first wire member 130 and the second wire member 230. The circuit board 400 may be provided between the insulating substrate 200 and the upper surface of the film member 140 and between the bottom surface of the film member 140 and the base layer 110 to form a first wire member 130 and the second wire member 230, respectively. The first wire member and the second wire member may be exposed to the bottom surface of the base layer. The circuit board may be provided on the bottom surface of the base layer and exposed to the bottom surface of the base layer. And can be electrically connected to the two-wire member (see Fig. 10).

Hereinafter, a method of manufacturing a touch panel sensor according to the present invention will be described with reference to FIGS. 3 to 9. FIG. FIG. 3 is a view for explaining an insulating substrate, FIGS. 4 to 6 are views for explaining a laminated film, and FIG. 7 is a view for explaining a lamination step of an insulating substrate and a laminated film. 8 is a view for explaining the mounting structure of the circuit board, and Fig. 9 is a view for explaining the step of removing the release film.

The touch panel sensor according to the present invention includes a release film 150, a base layer 110 formed on the upper surface of the release film 150, a first electrode pattern 120 formed on the upper surface of the base layer 110, Providing a laminated film (100) comprising a film member (140) provided on an upper surface of a base layer (110) to cover the first electrode pattern (120); Stacking the insulating substrate 200 on the laminated film 100 so as to cover the upper surface of the film member 140; And removing the release film 150 from the laminated film 100 to transfer the base layer 110, the first electrode pattern 120 and the film member 140 to the insulating substrate 200 at one time .

For reference, in the embodiment of the present invention, the insulating substrate 200 is provided earlier than the laminated film 100, but in some cases, the laminated film 100 may be provided before the insulating substrate 200 .

Referring to FIG. 3, an insulating substrate 200 may be provided. As the insulating substrate 200, an ordinary glass substrate or a reinforced plastic substrate can be used, and the present invention is not limited or limited by the type and characteristics of the insulating substrate 200.

A second electrode pattern 220 and a second wire member 230 electrically connected to the second electrode pattern 220 may be formed on the bottom surface of the insulating substrate 200. The second electrode pattern 220 and the second wire member 230 may be formed in various ways according to required conditions and design specifications. For example, after forming an electrode layer (not shown) as a whole on the bottom surface of the insulating substrate 200, the second electrode pattern 220 can be formed by patterning the electrode layer into a predetermined shape by a normal etching method, The wire member 230 may be formed by a conventional printing process. In some cases, the second electrode pattern may be formed by printing or other method, and the second wire pattern may be formed by a metal thin film deposition, Alternatively, after forming a second base layer on a separate second release film and forming a second electrode pattern and a second wire member of the second base layer, the second release film It is also possible to transfer the second base layer, the second electrode pattern, and the second wire member to one surface of the insulating substrate at one time. [0051] In the embodiment of the present invention, the second electrode pattern and the second wire member are separately Process However, in some cases, the second electrode pattern and the second wire member may be simultaneously formed by a single process.

The second electrode pattern 220 may be formed to have various shapes and structures according to required conditions and design specifications. For example, the second electrode pattern 220 may be formed to have a square or diamond shape. In some cases, the first electrode pattern may be formed in a general line shape, or at least two of the lines may be electrically connected As shown in FIG.

The second electrode pattern 220 may be formed of a conductive material and a transparent material. The present invention is not limited to the second electrode pattern 220 according to the material of the second electrode pattern 220. For example, the second electrode pattern 220 may be formed using ITO, IZO, ATO, AZO, carbon nanotubes, or a transparent organic material. In some cases, the second electrode pattern may be formed using a metal fiber such as silver nano fiber. Alternatively, a metal mesh having a thickness of about 10 mu m or less may be used instead of the second electrode pattern. ) May be applied.

Next, the laminated film 100 can be provided. The laminated film 100 includes a release film 150, a base layer 110 formed on the top surface of the release film 150, a first electrode pattern 120 formed on the top surface of the base layer 110, A first wire member 130 electrically connected to the first electrode pattern 120 and a film member 140 provided on the upper surface of the base layer 110 to cover the first electrode pattern 120. [

The laminated film 100 may be provided in various ways according to required conditions and design specifications. For example, the laminated film 100 may include the steps of providing a release film 150, forming a base layer 110 on an upper surface of the release film 150, Forming the electrode pattern 120 and stacking the film member 140 on the upper surface of the base layer 110 so as to cover the first electrode pattern 120. [

4, a release film 150 may be provided, and a base layer 110 may be formed on an upper surface of the release film 150. Referring to FIG.

As the release film 150, a typical synthetic resin film may be used. In some cases, a thin metal plate may be used as the release film 150, or a synthetic resin film having a metal coating on one side thereof may be used.

For reference, a release-type adhesive layer 152 may be formed on the release film 150. The dummy adhesive layer 152 may be provided in a layer state and may be laminated on the release film 150 as it is. In this case, since bubbles may enter or be displaced in the laminating process, A liquid material for forming the layer 152 is applied on the release film 150 and the release material 150 is rotated to uniformly spread the liquid material on the release film 150 and then cured .

The base layer 110 may be formed in various ways depending on the required conditions and design specifications.

For example, the base layer 110 may be provided by applying or printing a liquid curing agent on the top surface of the release film 150, and then curing the liquid curing agent. In some cases, the liquid curing agent can be applied by spin coating or other methods, and the present invention is not limited or limited by the application method of the liquid curing agent. Hereinafter, as a liquid curing agent, an ordinary ultraviolet curing agent is used. In some cases, a heat curing agent may be used instead of the ultraviolet curing agent as a liquid curing agent. Alternatively, it is possible that the base layer is formed in other ways such as printing, etching or the like.

As another example, the base layer 110 may be provided using a synthetic resin film. For reference, a plastic film in which an electrode pattern is formed is generally provided to have a thickness of about several hundreds of micrometers. The reason for this is that in order to form an electrode pattern directly on the plastic film by laying an electrode layer on the plastic film and patterning process such as photolithography, the thickness of the plastic film must be at least several hundreds of micrometers. However, in the present invention, since the base layer 110 is formed on the release film 150 and the first electrode pattern 120 to be described later is formed on the upper surface of the base layer 110, the thickness of the base layer 110 There is no problem in forming the first electrode pattern 120 even if it is thin. For example, the base layer 110 may be provided using a synthetic resin film having a thickness of 10 to 30 탆, which does not require a separate thermal curing treatment or ultraviolet curing treatment.

As the synthetic resin film, plastic films such as polyethylene, polypropylene, acryloyl, and polyethylene terephthalate (PET) having transparency may be used. Depending on the type and characteristics of the synthetic resin film, Or < / RTI >

Next, as shown in FIG. 5, a first electrode pattern 120 is formed on the upper surface of the base layer 110.

The first electrode pattern 120 may be formed to have various shapes and structures according to required conditions and design specifications. For example, the first electrode pattern 120 may be formed to have a square or diamond shape, and in some cases, the first electrode pattern may be formed in a general line shape or two or more electrically connected As shown in FIG.

The first electrode pattern 120 may be formed of a conductive material and a transparent material. The present invention is not limited to the first electrode pattern 120. For example, the first electrode pattern 120 may be formed using ITO, IZO, ATO, AZO, carbon nanotubes, or a transparent organic material. In some cases, the first electrode pattern may be formed using a metal fiber such as silver nano fiber. Even if the first electrode pattern formed using the metal fiber solution is formed to be very thin, a fibrous metal Since the fibers are connected to each other, high conductivity can be maintained, and it is also possible to form a very thin thickness of 1 mu m or less. Alternatively, a metal mesh having a thickness of about 10 mu m or less may be applied instead of the first electrode pattern.

The first electrode pattern 120 may be formed by forming a first electrode layer (not shown) on the entire upper surface of the base layer 110, and patterning the first electrode layer into a predetermined shape by a conventional etching method. In some cases, it is possible to form the first electrode pattern by printing or other methods.

5, the first wire member 130 may be formed on the upper surface of the base layer 110 so as to be electrically connected to the first electrode pattern 120. Referring to FIG.

The first wire member 130 may be formed by a conventional printing process using a silver paste. In some cases, the first wire member may be formed by a metal thin film deposition process or a metal electrode etching process. For example, in the embodiment of the present invention, the first electrode pattern and the first wire member are respectively formed to be formed by separate processes. However, in some cases, the first electrode pattern and the first wire member may be single It is also possible to constitute them simultaneously.

Next, as shown in FIG. 6, a film member 140 is provided on the upper surface of the base layer 110 so as to cover the first electrode pattern 120. As the film member 140, a plastic film such as polyethylene, polypropylene, acryloyl, or polyethylene terephthalate (PET) having transparency may be used. The type and the characteristic of the film member 140 The present invention is not limited thereto.

The film member 140 may be laminated on the upper surface of the base layer 110 via an adhesive layer 310. The adhesive layer 310 may be provided in various ways according to required conditions and design specifications. For example, the adhesive layer 310 may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and then curing. Particularly, in the case of the adhesive layer 310 made of an ultraviolet curing agent, the pressing of the circuit board 400 to be described later can be minimized. In some cases, the adhesive layer may be provided with an optical adhesive film or an OCA (Optically Clear Adhesive) film together with other liquid adhesive.

7, the insulating substrate 200 is laminated on the laminated film 100 so that the bottom surface of the insulating substrate 200 covers the upper surface of the film member 140. Next, as shown in FIG.

The insulating substrate 200 may be laminated to the laminated film 100 via the substrate bonding layer 320. The substrate bonding layer 320 may be provided in various ways according to required conditions and design specifications. For example, the substrate bonding layer 320 may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and then curing. In some cases, the substrate adhesive layer may be provided with an optical adhesive film or an OCA (Optically Clear Adhesive) film together with a liquid adhesive.

Since the film member 140 may be disposed between the first electrode pattern 120 and the second electrode pattern 220 as the laminated film 100 and the insulating substrate 200 are stacked, The thickness of the substrate bonding layer 320 provided between the electrode pattern 120 and the second electrode pattern 220 can be minimized.

Referring to FIG. 8, the external circuit board 400 may be electrically connected to the first wire member 130 and the second wire member 230. The circuit board 400 may be provided between the insulating substrate 200 and the upper surface of the film member 140 and between the bottom surface of the film member 140 and the base layer 110 to form a first wire member 130 and the second wire member 230, respectively. For reference, the external circuit board 400 may be attached by conventional ACF bonding, and the present invention is not limited or limited by the method of attaching the external circuit board 400.

Next, as shown in FIG. 9, the release film 150 is removed from the laminated film 100. The base layer 110, the first electrode pattern 120 and the film member 140 can be transferred to the insulating substrate 200 at a time by removing the release film 150 from the laminated film 100.

10 and 11 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention. In addition, the same or equivalent portions as those in the above-described configuration are denoted by the same or equivalent reference numerals, and a detailed description thereof will be omitted.

In the embodiments of the present invention described above, the circuit board is provided between the insulating substrate and the upper surface of the film member, and between the bottom surface of the film member and the base layer, but alternatively, the first wire member and the second The wire member may be exposed to the bottom surface of the base layer and then electrically connected to the circuit board provided on the bottom surface of the base layer.

10, a first wire member 1130 and a second wire member 1230 electrically connected to the first electrode pattern 1120 and the second electrode pattern 1220 are formed on the bottom surface 1110 of the base layer 1110, And the circuit board 1400 may be provided on the bottom surface of the base layer 1110 and electrically connected to the first wire member 1130 and the second wire member 1230.

The first wire member 1130 may be formed by partially removing the base layer 1110 from the bottom surface of the base layer 1110 exposed when the release film 1150 is removed. May be exposed to the bottom of the base layer 1110 through the first penetration.

The first penetration portion 1001 may be formed in a hole shape in the base layer 1110 by a conventional laser processing, etching, machining, or the like. By the method of forming the first penetration portion 1001, But are not limited to. In some cases, the first penetrating portion may be formed by etching or other method.

The base layer 1110, the adhesive layer 1310, the film member 1140, and the substrate adhering layer 1320 are sequentially formed from the bottom surface of the base layer 1110 in the same or similar manner as the above-described first penetration portion 1001 And one end of the second wire member 1230 may be exposed to the bottom surface of the base layer 1110 through the second penetration portion 1002. In this case, For reference, in the embodiment of the present invention, the adhesive layer, the film member and the substrate adhesive layer are sequentially removed together with the base layer. However, in some cases, the adhesive layer, the film member, A penetrating through hole may be formed.

The first wire member 1130 and the second wire member 1230 may be exposed to the bottom of the base layer 1110 through the first penetration portion 1001 and the second penetration portion 1002, The first wire member 1130 and the second wire member 1230 may be electrically connected to the external circuit board 1400 attached to the bottom surface of the base layer 1110. [ For reference, the external circuit board 1400 may be attached by conventional ACF bonding, and the present invention is not limited or limited by the method of attaching the external circuit board 1400. In some cases, it is also possible to attach the circuit board to the outside after filling the inner space of the first penetrating portion and the second penetrating portion with a conductive material.

For reference, in the above-described embodiment of the present invention, a receiver electrode is formed on a laminated film and a transmitter electrode is formed on an insulating substrate. However, in some cases, It is also possible to form an electrode and to form a receiver electrode on an insulating substrate. In the embodiment of the present invention, the second electrode pattern is formed on the bottom surface of the insulating substrate. Alternatively, the first electrode pattern formed on the laminated film without the second electrode pattern may be used to sense the touch operation It is also possible.

11, the laminated film 100 may be provided corresponding to at least one insulating substrate 200, and the laminated film 100 may be provided before the laminated insulating substrate 200 (see 200 in FIG. 2) It can be cut and provided in a size corresponding to the substrate. For example, the laminated films can be formed at a time in an array of 4 * 4, 5 * 5, 6 * 6, 3 * 4 or the like according to the required conditions and design specifications. But is not limited thereto.

Although the present invention has been described with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that

100: laminated film 110: base layer
120: first electrode pattern 130: first wire member
140: Film member 150: Release film
200: insulating substrate 220: second electrode pattern
230: second wire member 240: window decoration
310: adhesive layer 320: substrate adhesive layer
400: circuit board

Claims (15)

1. A method of manufacturing a touch panel sensor disposed on an upper surface of a display,
A base film formed on an upper surface of the release film, a first electrode pattern formed on an upper surface of the base layer, and a film member provided on an upper surface of the base layer so as to cover the first electrode pattern, Providing a film;
Stacking an insulating substrate on the laminated film so as to cover an upper surface of the film member; And
Removing the release film from the laminated film, and transferring the base layer, the first electrode pattern, and the film member to the insulating substrate all at once;
Wherein the touch panel sensor comprises: The method according to claim 1,
Wherein the step of providing the laminated film comprises:
Providing the release film;
Forming a base layer on an upper surface of the release film;
Forming the first electrode pattern on the upper surface of the base layer; And
Stacking the film member on the upper surface of the base layer so as to cover the first electrode pattern;
The method of claim 1, 3. The method of claim 2,
Wherein the film member is laminated on an upper surface of the base layer via an adhesive layer. The method of claim 3,
Wherein the adhesive layer is provided by curing a liquid adhesive, or is provided using an adhesive film. The method according to claim 1,
Wherein the base layer is provided by coating a liquid curing agent on the release film, curing the liquid curing agent, or using a synthetic resin film having a thickness of 10 to 30 탆. The method according to claim 1,
A second electrode pattern is formed between the insulating substrate and the film member,
Wherein the spacing between the second electrode pattern and the first electrode pattern is maintained by the film member. The method according to claim 6,
Further comprising the step of mounting a circuit board to be electrically connected to the first electrode pattern and the second electrode pattern. 8. The method of claim 7,
A first wire member electrically connected to the first electrode pattern is formed on an upper surface of the base layer,
A second wire member electrically connected to the second electrode pattern is formed on a bottom surface of the insulating substrate,
Wherein the circuit board is electrically connected to the first wire member and the second wire member. 9. The method of claim 8,
Wherein the circuit board is provided between the insulating substrate and the upper surface of the film member, and between the bottom surface of the film member and the base layer. 9. The method of claim 8,
And exposing the first wire member and the second wire member to the bottom surface of the base layer,
Wherein the circuit board is provided on a bottom surface of the base layer. The method according to claim 6,
Wherein at least one of the first electrode pattern and the second electrode pattern is provided using at least one of indium tin oxide (ITO), indium zinc oxide (IZO), metal fiber, and metal mesh. A method of manufacturing a sensor. The method according to claim 1,
Wherein the insulating substrate is laminated on the laminated film via a substrate adhesive layer,
Wherein the substrate bonding layer is provided by curing a liquid adhesive, or is provided using an adhesive film. The method according to claim 1,
Further comprising forming a window decoration on a lower portion of the insulating substrate before the insulating substrate is stacked. The method according to claim 1,
Wherein the laminated film is provided corresponding to at least one of the insulating substrates, and the laminated film is cut and provided corresponding to the insulating substrate before laminated on the insulating substrate. A touch panel sensor manufactured by any one of the manufacturing methods of any one of claims 1 to 14.

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