KR20140078455A - Touch panel and method of fabricating the same - Google Patents

Abstract

A touch panel according to an embodiment includes a substrate; a transparent electrode formed on the substrate; and a coat layer which is formed on the substrate and is in direct contact with a side surface of the transparent electrode. A manufacturing method for the touch panel according to an embodiment includes the steps of preparing the substrate; forming the transparent electrode by coating a transparent electrode material on the substrate; forming a first coat layer by coating a first coat layer material on the substrate; and forming a plurality of transparent electrodes by patterning the transparent electrode. The first coat layer is formed while being in direct contact with the side surface of the transparent electrode.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a touch panel,

Embodiments relate to a touch panel and a method of manufacturing the touch panel.

2. Description of the Related Art In recent years, a touch panel has been applied to an image displayed on a display device in various electronic products by a method of touching an input device such as a finger or a stylus.

The touch panel can be largely divided into a resistance film type touch panel and a capacitive type touch panel. In the resistive touch panel, the glass and the electrode are short-circuited by the pressure of the input device and the position is detected. A capacitance type touch panel senses a change in electrostatic capacitance between electrodes when a finger touches them, thereby detecting the position.

Nanowires, which can replace indium tin oxide (ITO), are emerging as transparent electrodes of such touch panels. Nanowires are superior to indium tin oxide in various aspects such as transmittance and conductivity.

The transparent electrode is formed on the substrate. When patterning and fixing the transparent electrode, the transparent electrode is separated from the substrate due to a low adhesion between the transparent electrode and the substrate.

Accordingly, there is a need for a touch panel capable of improving adhesion between the substrate and the transparent electrode and a method for manufacturing the touch panel.

Embodiments provide a touch panel with improved reliability and a manufacturing method thereof.

A touch panel according to an embodiment includes a substrate; A transparent electrode formed on the substrate; And a coating layer formed on the substrate and in direct contact with a side surface of the transparent electrode.

A method of manufacturing a touch panel according to an embodiment includes preparing a substrate; Forming a transparent electrode by applying a transparent electrode material on the substrate; Forming a first coating layer by applying a first coating material on the substrate; And forming a plurality of transparent electrodes by patterning the transparent electrode, wherein the first coating layer is formed in direct contact with a side surface of the transparent electrode.

The touch panel according to the embodiment can improve adhesion between the substrate and the transparent electrode by the first coating layer. Therefore, even when the transparent electrode is patterned, the touch panel according to the embodiment can prevent the transparent electrode from being detached from the substrate due to the enhanced adhesion, and the first coating layer can prevent the transparent electrode from being separated from the side surface of the transparent electrode The transparent electrode can be prevented from being oxidized, so that the reliability of the touch panel can be improved.

A method of manufacturing a touch panel according to an embodiment of the present invention includes forming a first coating layer on the transparent electrode before patterning the transparent electrode. That is, the transparent electrode material is coated on the substrate, and then the polymer insulating resin as the first coating layer forming material is coated on the transparent electrode material.

Accordingly, the first coating layer formed on the transparent electrode enhances adhesion between the substrate and the transparent electrode, thereby preventing the transparent electrode from being detached from the substrate during the patterning process of the transparent electrode to be formed later can do.

Also, after the patterning process, the second coating layer is disposed between the transparent electrodes to improve adhesion between the substrate and the transparent electrodes, and when the transparent electrodes are exposed to the outside, the transparent electrodes are oxidized Can be prevented.

Therefore, in the method of manufacturing a touch panel according to the embodiment, after forming the transparent electrode on the substrate, the first coating layer serving to strengthen the adhesion and prevent oxidation is formed before the patterning process, And the reliability of the touch panel can be improved.

1 is a cross-sectional view of a touch panel according to an embodiment.
2 is a cross-sectional view of a touch panel according to another embodiment.
3 is a plan view of the touch panel according to the embodiment.
4 is a flowchart illustrating a method of manufacturing a touch panel according to an embodiment of the present invention.
5 to 9 are views for explaining a method of manufacturing a touch panel according to an embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; includes all that is formed directly or through another layer. The criteria for top / bottom or bottom / bottom of each layer are described with reference to the drawings.

The thickness or the size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of explanation, and thus does not entirely reflect the actual size.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Hereinafter, a touch panel according to an embodiment will be described in detail with reference to FIGS. 1 to 3. FIG. FIG. 1 is a sectional view of a touch panel according to an embodiment of the present invention. FIG. 2 is a sectional view of a touch panel according to another embodiment. FIG. 3 is a plan view of a touch panel according to an embodiment.

1 to 3, a touch panel according to an embodiment includes a substrate 10, a transparent electrode 20, a wiring electrode 30, a first coating layer 40, a second coating layer 50, an adhesive layer (not shown) 60).

The substrate 10 may be formed of various materials capable of supporting the transparent electrodes 20 and the wiring electrodes 30 formed on the substrate 10. The substrate 10 may be formed of glass A substrate or a plastic substrate.

The transparent electrode 20 is formed on the substrate 10. The transparent electrode 20 may be formed in various shapes to detect whether or not an input device such as a finger is in contact.

For example, as shown in FIG. 3, the transparent electrode 20 may include a first electrode 22 and a second electrode 24. The first electrode 22 and the second electrode 24 include a first sensor unit 22a and a second sensor unit 24a for detecting whether an input device such as a finger is in contact with the first sensor unit 22a, And a second connection part 24b for connecting the second sensor part 24a and the second connection part 22b. The first connection part 22b of the first electrode 22 connects the first sensor part 22a in the Y axis direction (vertical direction in the drawing), and the second connection part 22b of the second electrode 24 And the second sensor portion 24b connects the second sensor portion 24a in the X-axis direction (left-right direction in the drawing).

The insulating layer 26 is located between the first connection portion 22b of the first electrode 22 and the second connection portion 24b of the second electrode 24, The first electrode 22 and the second electrode 24 can be prevented from being electrically short-circuited. The insulating layer 26 may be formed of a transparent insulating material that can insulate the first connection portion 22b and the second connection portion 24b. For example, the insulating layer 26 may be formed of a metal oxide such as silicon oxide, or a resin such as acryl.

In an embodiment, the first sensor 22a and the second sensor 24a of the first electrode 22 and the second electrode 24 are formed on the same layer, The first sensor portion 22a and the second sensor portion 24a may be formed as a single layer. Thus, the use of the transparent conductive material layer can be minimized, and the thickness of the touch panel can be reduced.

When such an input device such as a finger touches the touch panel, a difference in capacitance occurs at a portion where the input device is contacted, and a portion where the difference occurs can be detected as the contact position. In the embodiment, the transparent electrode 20 is applied to the capacitive touch panel. However, the present invention is not limited thereto. Therefore, the transparent electrode 20 may be formed in a structure that is applied to a resistance-type touch panel.

The transparent electrode 20 may include a transparent conductive material so that electricity can flow without disturbing the transmission of light. In particular, the transparent electrode 20 may include a nanowire 70. In detail, the transparent electrode 20 may comprise a silver (Ag) nanowire 70. Since the transparent electrode 20 includes the nanowire 70, it can replace the conventional indium tin oxide (ITO). Nanowires are superior to indium tin oxide in various aspects such as transmittance and conductivity.

The transparent electrode 20 may be coated on the substrate 10 in various ways. For example, the transparent electrode 20 may be coated on the substrate 10 by a dip coating method. The dip coating is a kind of coating method and refers to a method of obtaining a coating film by dipping a coating material in a coating solution or slurry to form a precursor layer on the surface of the coating material and then firing the coated material at a suitable temperature.

However, the embodiment is not limited thereto, and the transparent electrode 20 may be formed by various methods such as spin coating, flow coating, spray coating, slot die coating and roll coating, Can be coated on the substrate 10 by a coating method.

Then, the wiring electrode 30 is electrically connected to the transparent electrode 20. The wiring electrode 30 may be located on the same plane as the transparent electrode 20. That is, the wiring electrode 30 may be located on the same substrate 10 as the transparent electrode 20. Therefore, the thickness of the touch panel can be reduced.

The wiring electrode 30 may include the same material as the transparent electrode 20. That is, the wiring electrode 30 may include nanowires. The wiring electrode 30 may be formed simultaneously with the transparent electrode 20.

Although not shown in the figure, the printed circuit board may further include a printed circuit board connected to the wiring electrode 30. [ As the printed circuit board, various types of printed circuit boards can be applied. For example, a flexible printed circuit board (FPCB) or the like can be applied.

The first coating layer (40) is formed on the substrate (10). The first coating layer 40 may be formed between the transparent electrode 20 and / or the wiring electrode 30 formed on the substrate 10.

The first coating layer 40 may be formed in direct contact with the side surface of the transparent electrode 20. In detail, the first coating layer 40 may directly contact the entire side surface of the transparent electrode 20 or may directly contact a part of the side surface of the transparent electrode 20. Accordingly, the thickness of the first coating layer 40 may be equal to or less than the thickness of the transparent electrode 20. That is, the thickness of the first coating layer 40 may be less than the thickness of the transparent electrode 20.

For example, the thickness of the first coating layer 40 may be about 50 nm or less. In detail, the thickness of the first coating layer 40 may be about 50 nm to 200 nm. If the thickness of the first coating layer 40 is less than 50 nm, adhesion of the transparent electrode 20 and / or the wiring electrode 30 can not be improved. If the thickness of the first coating layer 40 is 200 nm The process efficiency may be reduced as the process time is increased.

The first coating layer 40 may include at least one of an acrylic resin, a urethane resin, a phenol resin, an epoxy resin, and a silane resin. For example, the first coating layer 40 may include a polymer resin having adhesive properties. can do.

The first coating layer 40 is formed between the transparent electrode 20 and / or the wiring electrode 30 and is in direct contact with a part of the entire side surface or the side surface of the transparent electrode 20, 20 and the substrate 10 can be improved. That is, the first coating layer 40 may be an adhesion improving layer.

Conventionally, the transparent electrode is formed on a substrate, and the transparent electrode is separated from the substrate during a process of etching the transparent electrode during a patterning process.

Accordingly, after forming the transparent electrode on the substrate, the first coating layer is formed on the transparent electrode to a thickness equal to or less than the thickness of the transparent electrode before the transparent electrode is patterned , The adhesion between the transparent electrode and the substrate can be improved. Accordingly, it is possible to reduce the rate at which the transparent electrode is detached from the substrate during the patterning process of the transparent electrode.

Also, since the first coating layer is in direct contact with the side surface of the transparent electrode, when the transparent electrode is exposed to the outside, the transparent electrode can be prevented from being oxidized, and the change in sheet resistance can be reduced.

Also, after the patterning process, the first coating layer is disposed between the transparent electrodes to enhance the adhesion of the transparent electrodes, so that the adhesion between the transparent electrodes and the substrate can be strongly maintained even after patterning.

Therefore, the touch panel according to the embodiment can improve the adhesion between the transparent electrode and the substrate, and prevent the transparent electrode from being oxidized. Therefore, damage of the transparent electrode can be prevented, It is possible to improve the reliability.

The second coating layer 50 may be formed on the transparent electrode 20. In detail, the second coating layer 50 is formed while covering the transparent electrode 20, the wiring electrode 30, and the first coating layer 40.

The second coating layer 50 may include an insulating material that is the same as or similar to the first coating layer. For example, the second coating layer 50 may include at least one of an acrylic resin, a urethane resin, a phenol resin, an epoxy resin, and a silane resin.

The second coating layer 50 may be formed to a thickness of about 5 mu m or less. In one example, the second coating layer 50 may be formed to a thickness of about 150 nm to about 5 탆.

The second coating layer 50 may be formed on the transparent electrode 20 to prevent the transparent electrode 20 from being oxidized. In particular, when the transparent electrode 20 includes silver nanowires, the oxidation of the silver nanowires can be prevented, thereby improving the reliability of the transparent electrode. That is, the second coating layer 50 may be an anti-oxidation layer or an overcoating layer.

The adhesive layer 60 may be formed on the second coating layer 50. The adhesive layer 60 may adhere the module D to the touch panel. Further, the adhesive layer 60 can adhere the protective film disposed thereon.

The adhesive layer 60 may include a polymer resin capable of performing an adhesive function. In detail, the adhesive layer 60 may include an acryl-based, urethane-based or epoxy-based resin or a mixed resin thereof

However, the embodiment is not limited to this, and as shown in Fig. The adhesive layer 60 may be omitted. That is, the second coating layer 50 may be formed while simultaneously preventing oxidation and acting as an adhesive layer, and the module D may be adhered to the second coating layer 50.

As described above, the touch panel according to the embodiment can improve the adhesion between the substrate and the transparent electrode by the first coating layer. Therefore, even when the transparent electrode is patterned, the touch panel according to the embodiment can prevent the transparent electrode from being detached from the substrate due to the enhanced adhesion, and the first coating layer can prevent the transparent electrode from being separated from the side surface of the transparent electrode The transparent electrode can be prevented from being oxidized, so that the reliability of the touch panel can be improved.

Hereinafter, a method of manufacturing a touch panel according to an embodiment will be described with reference to FIGS. 4 to 9. FIG. FIG. 4 is a flowchart illustrating a method of manufacturing a touch panel according to an embodiment of the present invention. FIGS. 5 to 9 illustrate a method of manufacturing a touch panel according to an embodiment of the present invention. In the description of the touch panel manufacturing method, the same or similar parts to those of the above-described touch panel will not be described. That is, in the description of the touch panel manufacturing method, it is essentially combined with the description of the touch panel described above.

Referring to FIG. 4, a method of manufacturing a touch panel according to an embodiment includes preparing a substrate (ST10); Forming a transparent electrode (ST20); Forming a first coating layer (ST30); And patterning the transparent electrode (ST40).

In the step of preparing the substrate (ST10), a glass substrate or a plastic substrate is prepared. The substrate may be divided into a valid region and an ineffective region, and a material having a predetermined color, for example, black may be applied to the ineffective region, thereby forming a logo or the like.

Subsequently, in the step of forming the transparent electrode (ST20), as shown in FIG. 5, a material for forming the transparent electrode 20 may be applied on the substrate 10. The transparent electrode may include a transparent conductive material. For example, the transparent conductive material may include metal nanowires. Preferably, the transparent conductive material may include at least one material selected from the group consisting of copper, aluminum, nickel, tin, zinc, gold, silver, and alloys thereof. More preferably, the transparent conductive material may comprise silver nanowires.

The transparent conductive material may be formed on the substrate by various methods. In one example, the transparent conductive material may be formed on the substrate by a dip coating method. However, the embodiment is not limited thereto, and the transparent conductive material may be formed by various coating methods such as spin coating, flow coating, spray coating, slot die coating and roll coating May be coated on the substrate.

Subsequently, in step ST30 of forming the first coating layer, a material for forming the first coating layer 40 may be applied on the transparent electrode 20, as shown in FIG. The first coating layer 40 comprises an insulating material. For example, the first coating layer 40 may include at least one of an acrylic resin, a urethane resin, a phenol resin, an epoxy resin, and a silane resin.

6, the coating layer 40 is formed on the transparent electrode 20. However, the coating layer 40 may be formed on the transparent electrode 20 while the coating layer 40 and the transparent electrode 20 are formed, (20) may be positioned in a mixed manner. That is, the transparent electrode 20 including the nanowire may be floating on the coating layer 40 while being coated with the coating layer 40. That is, the coating layer and the transparent electrode may be formed by irregularly coating the lower and upper portions of the transparent electrode while being mixed with each other. In other words, the transparent electrode may be located above the coating layer with the coating layer applied thereto, or may include transparent electrodes positioned on the coating layer and transparent electrodes located under the coating layer.

Subsequently, in the step of patterning the transparent electrode (ST40), the transparent electrode 20 can be patterned. That is, as shown in FIG. 7, the transparent electrode can be patterned in a predetermined shape. The transparent electrode may be patterned by various methods. In one example, the transparent electrode may be patterned by photolithography. That is, the transparent electrode can be patterned in a predetermined shape by exposure, development and etching processes. Accordingly, the transparent electrode may include a plurality of transparent electrodes.

The process of forming the transparent electrode 20 and the wiring electrode 30 may be performed simultaneously. That is, the wiring electrode may include the same insulating material as the transparent electrode 20, and the patterning process may be performed at the same time. Accordingly, as shown in FIG. 8, a plurality of patterned transparent electrodes and wiring electrodes are formed on the substrate.

Further, after the patterning step, the first coating layer is disposed between the transparent electrode and / or the wiring electrode, and is disposed in direct contact with the transparent electrode and / or the entire side surface or a part of the side surface of the wiring electrode.

Next, as shown in FIG. 9, the second coating layer may be formed on the transparent electrode 20. The second coating layer 50 may include the same material as the first coating layer. That is, the second coating layer 50 may include at least one of an acrylic resin, a urethane resin, a phenol resin, an epoxy resin, and a silane resin.

The second coating layer 50 may be disposed on the transparent electrode to prevent oxidation of the transparent electrode.

Next, as shown in FIG. 9, after the adhesive layer is formed on the second coating layer 50, the touch panel and the module D may be bonded by the adhesive layer 60. However, the step of forming the adhesive layer may be omitted. That is, instead of the adhesive layer, the second coating layer can simultaneously serve as an oxidation preventing layer and an adhesive layer.

A method of manufacturing a touch panel according to an embodiment of the present invention includes forming a first coating layer on the transparent electrode before patterning the transparent electrode. That is, the transparent electrode material is coated on the substrate, and then the polymer insulating resin as the first coating layer forming material is coated on the transparent electrode material.

Accordingly, the first coating layer formed on the transparent electrode enhances adhesion between the substrate and the transparent electrode, thereby preventing the transparent electrode from being detached from the substrate during the patterning process of the transparent electrode to be formed later can do.

Also, after the patterning process, the second coating layer is disposed between the transparent electrodes to improve adhesion between the substrate and the transparent electrodes, and when the transparent electrodes are exposed to the outside, the transparent electrodes are oxidized Can be prevented.

Therefore, in the method of manufacturing a touch panel according to the embodiment, after forming the transparent electrode on the substrate, the first coating layer serving to strengthen the adhesion and prevent oxidation is formed before the patterning process, And the reliability of the touch panel can be improved.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Claims (12)

Board;
A transparent electrode formed on the substrate; And
And a first coating layer formed on the substrate and in direct contact with a side surface of the transparent electrode. The method according to claim 1,
Wherein a thickness of the first coating layer is equal to or less than a thickness of the transparent electrode. 3. The method of claim 2,
Wherein the thickness of the first coating layer is 50 nm to 200 nm. The method according to claim 1,
Wherein the first coating layer comprises at least one of an acrylic resin, a urethane resin, a phenol resin, an epoxy resin, and a silane resin. The method according to claim 1,
And a second coating layer formed on the transparent electrode. 6. The method of claim 5,
Wherein the first coating layer and the second coating layer comprise at least one of an acrylic resin, a urethane resin, a phenol resin, an epoxy resin, and a silane resin. The method according to claim 6,
Wherein the transparent electrode comprises silver (Ag) nanowires. Preparing a substrate;
Forming a transparent electrode by applying a transparent electrode material on the substrate;
Forming a first coating layer by applying a first coating material on the substrate; And
And patterning the transparent electrode to form a plurality of transparent electrodes,
Wherein the first coating layer is formed in direct contact with a side surface of the transparent electrode. 9. The method of claim 8,
Wherein the first coating layer is formed to have a thickness equal to or smaller than the thickness of the transparent electrode. 9. The method of claim 8,
Wherein the first coating layer is formed to a thickness of 50 nm to 200 nm. 10. The method of claim 9,
And forming a second coating layer on the transparent electrode. 11. The method of claim 10,
Wherein the first coating layer and the second coating layer comprise at least one of an acrylic resin, a urethane resin, a phenol resin, an epoxy resin, and a silane resin.

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