CN113997647B - Composite heat conduction shielding material, preparation method and electronic equipment - Google Patents

Composite heat conduction shielding material, preparation method and electronic equipment Download PDF

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Publication number
CN113997647B
CN113997647B CN202010740109.4A CN202010740109A CN113997647B CN 113997647 B CN113997647 B CN 113997647B CN 202010740109 A CN202010740109 A CN 202010740109A CN 113997647 B CN113997647 B CN 113997647B
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composite
shielding material
heat conduction
metal layer
conductive shielding
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CN113997647A (en
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徐峰
戈云飞
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/0028—Stretching, elongating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The embodiment of the invention discloses a composite heat conduction shielding material, a preparation method and electronic equipment. The composite heat conduction shielding material comprises a flexible heat conduction film and a first metal layer, wherein the flexible heat conduction film comprises a first surface and a second surface, and the first metal layer is arranged on the first surface so as to form a first composite structure; wherein the first composite structure forms a plurality of pleat structures. According to the embodiment of the invention, a heat conduction and shielding integrated scheme is adopted, and a fold forming process is combined, so that the prepared composite material has high heat conduction, high shielding and high compression performance.

Description

Composite heat conduction shielding material, preparation method and electronic equipment
Technical Field
The invention relates to the technical field of heat dissipation shielding of electronic equipment, in particular to a composite heat conduction shielding material, a preparation method and the electronic equipment.
Background
Along with the rapid alternation of electronic industry technology, the chip is developed towards high integration and multifunction, so that the heat flux of the chip is continuously improved, if the heat generated by the chip cannot be timely taken away from the electronic equipment, the temperature of the internal electronic components is increased, the reliability of the electronic components is greatly reduced, and the service life of the electronic equipment is seriously influenced. In addition, when the chip works, electromagnetic interference (Electromagnetic Interference, abbreviated as 'EMI') and electromagnetic compatibility (Electromagnetic Compatibility, abbreviated as 'EMC') caused by electromagnetic waves generated by high-low level change are increasingly serious, so that the chip not only causes interference and damage to electronic instruments and equipment, but also influences the work of normal equipment. The IC chip (Integrated Circuit integrated circuit) needs to meet the requirements of electromagnetic interference (EMI) and electromagnetic compatibility (EMC) when in operation, namely, the IC chip is not interfered by external electromagnetic waves, and meanwhile, electromagnetic waves emitted by the IC chip per se also do not interfere with other components. Therefore, the integrated IC chip generally needs to have both heat dissipation and EMC electromagnetic radiation.
Disclosure of Invention
In view of the above, the embodiment of the invention provides a composite heat-conducting shielding material, a preparation method and electronic equipment, which can simultaneously give consideration to the heat-conducting shielding function.
The embodiment of the invention provides a composite heat conduction shielding material, which comprises a flexible heat conduction film and a first metal layer, wherein the flexible heat conduction film comprises a first surface and a second surface, and the first metal layer is arranged on the first surface so as to form a first composite structure; wherein the first composite structure forms a plurality of pleat structures.
The embodiment of the invention provides a preparation method of a composite heat conduction shielding material, which comprises the following steps:
providing a flexible heat conducting film, wherein the flexible heat conducting film is provided with a first surface;
a metal layer is arranged on the first surface to form a first composite structure;
stretching an elastic structure to form a pre-stretched elastic structure;
disposing the first composite structure to a surface of the pre-stretched elastic structure;
the pre-stretched elastic structure is retracted and the first composite structure forms a second composite structure having a plurality of pleat structures.
The embodiment of the invention provides electronic equipment, which comprises a composite heat conduction shielding material, a chip, a printed circuit board, a shielding frame and a heat dissipation structure, wherein the chip is arranged on the shielding frame; the chip is arranged on the surface of the printed circuit board, the composite heat conduction shielding material is arranged on the surface of the chip far away from the printed circuit board, the shielding frame is arranged around the chip, and the heat dissipation structure is arranged on the surface of the composite heat conduction shielding material far away from the chip, wherein the composite heat conduction shielding material is prepared by the preparation method provided by the embodiment of the invention.
The composite heat conduction shielding material, the preparation method and the electronic equipment provided by the embodiment of the invention have the following advantages: firstly, the composite heat conduction shielding material provided by the invention has the characteristic of folds in the structural form, can change in the range of 0.2-5 mm in the thickness direction, thus has excellent compression performance, and can be well contacted with structural parts such as an IC chip and a radiator due to the deformation of the folds, thus has excellent tolerance capability and can be used as a thermal interface material between the IC chip and the radiator; second, the heat conduction shielding integrated design can reduce the gap and thermal resistance between the chip and the heat sink, which is beneficial to the light and thin and low-cost production and installation of electronic equipment such as mobile phones and computers.
Drawings
The technical solution of the present invention and its advantageous effects will be made apparent by the following detailed description of the specific embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic flow chart of a preparation method of a composite heat-conducting shielding material according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a graphite sheet according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a second composite structure according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a pleat structure provided by an embodiment of the invention.
Fig. 5 is a schematic structural diagram of a composite heat conductive shielding material provided in embodiment 1 of the present invention.
Fig. 6 is a schematic structural diagram of a composite heat conductive shielding material according to embodiment 2 of the present invention.
Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Fig. 8 is a schematic diagram of the mechanism of the heat conductive shielding material provided in comparative example 1.
Detailed Description
Referring to the drawings, wherein like reference numerals refer to like elements throughout. The following description is based on illustrative embodiments of the invention and should not be taken as limiting other embodiments of the invention not described in detail herein.
In the description of embodiments of the present invention, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first," "second," "third," etc. may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless explicitly defined otherwise.
In the description of the embodiments of the present invention, all directional indications (such as X, Y, Z, … …) are merely used to explain the relative positional relationship, movement conditions, etc. between the components at a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indication is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system article, or apparatus that comprises a list of steps or elements is not limited to the list of steps or elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The following will describe the specific embodiments in detail.
Referring to fig. 1-4, an embodiment of the present invention provides a method for preparing a composite heat conductive shielding material 10, which may include the following steps:
step S101, providing a flexible heat conductive film 101, wherein the flexible heat conductive film 101 has a first surface 1010 and a second surface 1012 opposite to the first surface 1010;
step S102, disposing a metal layer 102 on the first surface 1010 to form a first composite structure 103;
step S103, stretching an elastic structure 104 to form a pre-stretched elastic structure 104;
step S104, disposing the first composite structure 103 to the first surface 1040 of the pre-stretched elastic structure 104;
step S105, retracting the pre-stretched elastic structure 104, wherein the first composite structure 103 forms a second composite structure 105 having a plurality of fold structures 1052;
step S106, removing the elastic structure 104.
In step S101, the flexible heat-conducting film 101 is a flexible film with heat-conducting property, such as a carbon nanotube film, a graphite sheet, graphene or a composite material of graphene and graphene. In an embodiment of the present invention, the material of the flexible heat-conducting film 101 is a graphite sheet, wherein the structure of the graphite sheet is shown in fig. 2. The flexible thermally conductive film 101 has a first surface 1010 and a second surface 1012 opposite the first surface 1010. The larger the thickness of the flexible heat conductive film 101 is, the better the heat conductive property thereof is, but the flexibility is deteriorated. It is thus necessary to select the thickness of the flexible heat conductive film 101 which is good in flexibility and high in heat conductivity. In an embodiment of the present invention, the thickness of the flexible heat conductive film 101 is 10 micrometers (μm) to 100 μm, and the heat conductivity coefficient of the flexible heat conductive film 101 in the direction parallel to the first surface 1010 may reach K >800W/mK or more. In another embodiment of the present invention, the thickness of the flexible heat conductive film 101 is 18 μm to 50 μm, and the heat conductivity coefficient of the flexible heat conductive film 101 in the direction parallel to the first surface 1010 may reach K >1200W/mK or more.
In step S102, the material of the metal layer 102 is at least one of copper, aluminum, gold, nickel or an alloy thereof. The manner in which the metal layer 102 is disposed on the first surface 1010 is not limited, such as electroless gold plating, vacuum plating, sputtering, metal-spraying, adhering a metal foil film, and the like. In an embodiment of the present invention, the metal layer 102 is disposed on the first surface 1010 by electroless gold plating. The thickness of the metal layer 102 is 0.5 μm to 10 μm, and in one embodiment of the present invention, the thickness of the metal layer 102 is 5 μm to 10 μm. In another embodiment of the present invention, the thickness of the metal layer 102 is 3 μm to 8 μm. If the thickness of the metal layer 102 is too large, for example, greater than 10 μm, the flexibility of the composite structure formed by the flexible heat conductive film 101 and the metal layer 102 may be affected, and thus the formation of the subsequent pleated structure 1052 and the compression set performance of the prepared composite heat conductive shielding material 10 may be affected, and if the thickness of the metal layer 102 is too small, for example, less than 0.5 μm, the thickness of the prepared metal layer 102 may be easily uneven, which may cause difficulty in the manufacturing process, and may also affect the shielding performance of the prepared composite heat conductive shielding material 10.
In another embodiment of the present invention, a metal layer 102 may be further disposed on the second surface 1012 of the flexible heat conductive film 101, that is, the metal layer 102, the flexible heat conductive film 101 and the metal layer 102 are stacked to form a sandwich structure. The thickness of the metal layer 102 in this embodiment is 0.5 to 5 μm, and preferably, the thickness of the metal layer 102 is 0.5 to 2 μm. By providing a double-layer metal layer structure and adjusting the thickness of the metal layer to be 0.5 μm-2 μm, the shielding performance of the composite heat conduction shielding material 10 can be increased without affecting the heat conduction performance of the composite heat conduction shielding material 10. The shielding effectiveness of the composite heat conduction shielding material 10 in the embodiment of the invention is higher than 45dB and even higher than 60dB between 10KHz and 10 GHz.
In step S103, the elastic structure 104 may be stretch-deformed by an external force F. The material of the elastic structure 104 is not limited and may be selected as desired. In an embodiment of the present invention, the elastic structure 104 includes at least one bonding surface, and in particular, the elastic structure 104 is an elastic tape, and the elastic tape includes at least one bonding surface. The bonding surface is used for bonding with the first composite structure 103, so that the first composite structure 103 and the elastic tape do not move relatively in a subsequent step, and thus a folded structure 1052 is produced when the elastic tape is retracted. The stretching direction is the same and opposite to the extending direction of the X axis and/or the extending direction of the Y axis, wherein the plane of the X axis and the Y axis is parallel to the bonding surface. In one embodiment of the present invention, the stretching direction is the same as or opposite to the extending direction of the X-axis.
In the process of stretching the elastic adhesive tape, two opposite sides of the elastic adhesive tape can be fixed by two fixing frames respectively, and then the elastic adhesive tape is stretched by applying force F to the two fixing frames along two opposite directions. The degree of stretching of the elastic tape may be selected as desired, and for example, the stretch ratio may be 1.5 or more. In one embodiment of the present invention, the stretch ratio is 2 or more and 10 or less. The elastic tapes are stretched to different extents to produce a pleated structure 1052 having different densities and morphologies. When the stretching degree is large, as the stretch ratio of the elastic tape is more than 5, the folded structure 1052 prepared by the method is large and thick in density. When the stretching degree is small, the elastic tape has a stretch ratio of less than 2, and the resulting folded structure 1052 has a small density and is thin.
In another embodiment of the present invention, the elastic structure 104 may further include a fourth surface opposite the third surface 1040.
In step S104, the second surface 1012 of the flexible heat conductive film 101 may be directly attached to the bonding surface of the elastic structure. Or the metal layer 102 may be directly attached to the adhesive side of the elastic tape. In another embodiment of the present invention, a layer of adhesive may be disposed on the surface of the elastic structure 104, and then the first composite structure 103 may be attached to the surface of the elastic structure 104 by using the adhesive.
In another embodiment of the present invention, in step S104, one first composite structure 103 may be disposed on the third surface 1040 and one first composite structure 103 may be disposed on the fourth surface, so that two composite heat conductive shielding materials 10 may be simultaneously prepared.
In step S105, when the pre-stretched elastic structure 104 is retracted, the first composite structure 103 is contracted together with the pre-stretched elastic structure 104, thereby forming a second composite structure 105 comprising a plurality of pleat structures 1052, the second composite structure 105 and the pleat structures 1052 being respectively see fig. 3 and 4. The arrangement of the plurality of fold structures 1052 may be regular or irregular, depending on the direction of stretching when stretching the elastic structure 104 and the manner in which the pre-stretched elastic structure 104 is retracted. If the stretching direction at the time of stretching the elastic structure 104 is the same and opposite to the extending direction of the X-axis, and if the pre-stretched elastic structure 104 is slowly retracted by controlling the external force, the wrinkle structure 1052 of regular arrangement can be prepared; the plurality of pleated structures 1052 are made random if the stretching direction includes at least three different directions parallel to the XY plane when stretching the elastic structure 104, or the pre-stretched elastic structure 104 is retracted relatively fast, even if the external force is instantaneously lost. Wherein the plurality of pleated structures 1052 arranged randomly are capable of withstanding multiple directional compressions and bends.
The thickness of the plurality of pleat structures 1052 may be the same or different. The closer the thicknesses of the plurality of corrugated structures 1052 are, the higher the flatness of the second composite structure 105. The flatness refers to the absolute value of the difference between the average of the thicknesses of the plurality of corrugated structures 1052 and the highest thickness and/or the lowest thickness. In one embodiment of the present invention, the flatness is 20 μm to 500 μm. In another embodiment of the present invention the flatness is 20 μm to 150 μm. Therefore, the more the plurality of fold structures 1052 are contacted with the chip and the heat dissipation structure in the subsequent application, the contact thermal resistance can be reduced, and the thermal conductivity in the thickness direction can be improved. In this embodiment of the invention, the thermal conductivity in the thickness direction is greater than 40W/mK.
The fold structure 1052 includes a fold angle α that is greater than 0 degrees and less than 180 degrees. As the pleat angle a approaches 180 degrees, the second composite structure 105 approaches full deployment. In one embodiment, the fold angle α is greater than 0 degrees and equal to or less than 120 degrees. In another embodiment of the present invention, the fold angle α is equal to or greater than 0 degrees and equal to or less than 60 degrees. In another embodiment of the present invention, the fold angle α is greater than or equal to 0 degrees and less than or equal to 30 degrees. In another embodiment of the present invention, the fold angle α is greater than or equal to 0 degrees and less than or equal to 10 degrees. In another embodiment of the present invention, the fold angle α is greater than or equal to 0 degrees and less than or equal to 3 degrees. The smaller the fold angle α is, the larger the thermal conductivity coefficient of the composite thermal conductive shielding material 10 in the thickness direction, which is prepared later is, and the thermal conductivity coefficient in the thickness direction is greater than 40W/mK when the fold angle α is greater than or equal to 0 degrees and less than or equal to 3 degrees.
The thermal conductive properties of the composite thermal conductive shielding material 10 can be improved in the present invention by adjusting the morphology, such as flatness, density, etc., of the plurality of corrugated structures 1052, when the flatness is 20 μm to 150 μm, the density is 50 pieces/cm 2 About 200 pieces/cm 2 When the composite heat conduction shielding material 10 is used, the heat conduction coefficient in the thickness direction can reach more than 40W/mK.
In step S106, the manner of removing the elastic structure 104 is not limited, and may be selected according to need, for example, the elastic structure 104 may be separated from the second composite structure 105 by mechanical means, chemical etching, or by solvent treatment. When a chemical etching is used, the etching solution cannot damage the second composite structure 105.
The heat-conducting shielding composite material prepared by the method has high heat-conducting performance of graphite in the three directions of XYZ and high shielding performance of a metal film, the heat-conducting coefficient in the direction of XY can reach more than 800W/mK, even more than 1200W/mK, and the heat-conducting coefficient in the direction of Z can reach more than 40W/mK. The Z direction is a thickness direction of the pleated structure 1052, and the XY direction is a direction in which a plurality of pleated structures are arranged.
Further, the preparation method provided by the embodiment of the invention further comprises one or more of the following steps:
step S107, applying pressure to the second composite structure 105 in the X direction and the Z direction, and adjusting the thickness of the second composite structure 105;
step S108, disposing a phase change material layer 107 on the surface of the second composite structure 105 to form a third composite structure 108;
step S109, cutting the third composite structure 108.
In step S107, the second composite structure 105 applies pressure through a jig, and the direction of the applied pressure is the X direction and the Z direction. The X direction herein refers to a direction in which the plurality of corrugated structures 1052 are arranged, and the Z direction is a thickness direction of the second composite structure 105. The thickness of the second composite structure 105 may be adjusted within the range of 0.2mm to 5mm in one embodiment of the present invention by applying pressure to achieve the desired thickness of the second composite structure 105, so that the thermal conductivity of the second composite structure 105 in the Z direction may be up to 40W/mK or more.
The second composite structure 105 has a compressive property in the Z-direction and a tolerance property by being deformable due to the plurality of pleated structures 1052. When processing each component, such as a circuit board, a chip and the like, tolerance is unavoidable, namely, the surface of each component cannot be completely flattened, but the corrugated structure has compressibility, so that even if the component is uneven, the corrugated structure can be completely attached, has tolerance capability, and can be used as a thermal interface material between an IC chip and a radiator.
In addition, the thickness of the second composite structure 105 is 0.2 mm-5 mm due to the integrated design of heat conduction and shielding, so that the prepared electronic product, such as a mobile phone, a computer and the like, can be thinned.
In step S108, the phase change material layer 107 may be disposed on the second composite structure 105 by coating, and filled into the gaps of the plurality of corrugated structures 1052. The phase change material is not limited in kind, and can be selected according to the needs, and is a filling material such as heat conduction phase change paste, phase change gel or phase change microcapsule. In an embodiment of the invention, the phase change material is a polymer phase change material, and the polymer phase change material refers to a polymer capable of changing from a solid state to a liquid state at a phase change point. The thickness of the phase change material layer 107 is 5 μm to 10 μm. The thickness of the phase change material layer 107 refers to the thickness of removing the phase change material filled in the gaps of the pleated structure 1052 above the phase change material of the second composite structure 105. When the thickness of the phase change material layer 107 is 5 μm-10 μm, the phase change material layer can be ensured to be fully contacted with structural members such as chips, radiating fins and the like after being melted, and the reduction of the flexibility of the composite heat conduction shielding material caused by the too thick phase change material layer 107 is prevented, so that the deformation and the lamination to a curved surface are not facilitated.
Since the second composite structure 105 has a plurality of corrugated structures 1052, the plurality of corrugated structures 1052 have different heights, it is difficult to ensure that each corrugated structure 1052 can contact a chip or the like in use, thereby resulting in an increase in contact thermal resistance. By coating the phase change material layer 107, the phase change material fills the gaps of the plurality of fold structures 1052 and is 5 μm to 10 μm higher than the surface of the second composite structure 1052, so that the heat conductive shielding composite material 10 can be completely contacted with the components such as a chip, and air residues between the heat conductive shielding composite material 10 and the components such as the chip can be reduced, and thus, the contact thermal resistance between the heat conductive shielding composite material 10 and the chip/heat sink can be reduced. The heat sink means that its temperature does not change with the magnitude of thermal energy transferred to it, and it may be an object such as the atmosphere, the earth, etc.
In addition, the phase change material layer 107 may be filled with energy storage particles, such as paraffin energy storage particles and resin energy storage particles, and when the temperature of the external environment (such as a chip) increases, the energy storage particles can store the absorbed heat, so that the temperature of the composite heat conduction shielding material can slowly increase, damage to the composite heat conduction shielding material due to rapid temperature increase is avoided, and meanwhile, after the temperature of the external environment decreases, the stored heat can be released by the energy storage particles, so that the composite heat conduction shielding material is not always at a high temperature, and the chip and the like are not damaged.
The surface thermal resistance can be further reduced and the thermal conductivity can be improved by arranging the phase change material layer 107 on the surface of the second composite structure 105, and the surface of the surface graphite flake can be reduced by coating the phase change material on the surface of the second composite structure 105 for cladding.
In step S109, the method of cutting the third composite structure 108 is laser cutting. The composite heat conductive shielding material 10 of a desired size can be obtained by cutting the third structure. In addition, a plurality of composite heat conductive shielding materials 10 may be prepared by laser cutting.
The preparation method of the composite heat conduction shielding material 10 provided by the embodiment of the invention has the following advantages: firstly, applying pressure to the second composite structure 105 with the fold structure 1052 in the X direction and the Z direction, and combining side laser cutting to prepare the composite structure with the specified size and thickness, wherein the composite structure has certain compression performance because the fold structure can be changed within the range of 0.2-5 mm in the thickness direction; second, the fold structure 1052 can change the fold formation density and flatness by adjusting the stretch ratio of the elastic tape, when the density is 50/cm 2 About 200 pieces/cm 2 When the flatness is 20-150 mu m, the heat conductivity coefficient of the composite heat conduction shielding material 10 in the thickness direction can reach more than 40W/mK; thirdly, the metal layer 102 is arranged on the surface of the graphite sheet, so that the composite heat conduction shielding material 10 has high electric conductivity, and the shielding effectiveness is higher than 60dB between 10KHz and 10 GHz; fourth, since the graphene film is used as the flexible heat conductive film 101 and has the pleated structure 1052, the composite heat conductive shielding material 10 also has flexibility and can be disposed on a curved surface. Therefore, the composite heat-conducting shielding material 10 has high heat conduction, high shielding and high compression performance, and can achieve heat dissipation and shielding functions, so that the light and thin design of products such as mobile phones is realized.
Referring to fig. 5, embodiment 1 of the present invention further provides a composite heat conductive shielding material 10 prepared by the above method, where the composite heat conductive shielding material 10 includes a flexible heat conductive film 101 and a first metal layer 102, the flexible heat conductive film 101 includes a first surface 1010 and a second surface 1012, and the first metal layer 102 is disposed on the first surface 1010, so as to form a first composite structure 103; wherein the first composite structure 103 is folded a plurality of times to form a plurality of pleated structures 1052.
The flexible heat conducting film 101 has a thin film structure with heat conducting property, and the material of the flexible heat conducting film 101 may be a carbon nanotube film, a graphite sheet, a graphene film or a composite structure of a graphite sheet and a graphene film. The metal layer 102 is at least one of copper, aluminum, gold, nickel, etc., or an alloy thereof. The dimensions and thickness of the pleated structure 1052 are adjustable, and the thickness h of the pleated structure 1052 is 30-400 μm.
The pleat angle α of the pleat structure 1052 is greater than 0 degrees and equal to or less than 150 degrees, and in one embodiment the pleat angle α is greater than 0 degrees and equal to or less than 120 degrees. In another embodiment of the present invention, the fold angle α is equal to or greater than 0 degrees and equal to or less than 60 degrees. In another embodiment of the present invention, the fold angle α is greater than or equal to 0 degrees and less than or equal to 30 degrees. The pleat angles are different, the pleat structures have different thicknesses, and the gaps between adjacent pleat structures 1052 have different sizes.
In another embodiment of the present invention, the composite thermal conductive shielding material 10 includes a second metal layer (not shown) disposed on the second surface 1012.
Referring to fig. 6, embodiment 2 of the present invention further provides a composite heat conductive shielding material 10 prepared by the above method, where the composite heat conductive shielding material 10 includes a flexible heat conductive film 101, a first metal layer 102 and at least one phase change material layer 107, and the flexible heat conductive film 101 includes a first surface 1010 and a second surface 1012, and the metal layer 102 is disposed on the first surface 1010, so as to form a first composite structure 103; the first composite structure 103 is bent for a plurality of times to form a plurality of pleated structures 1052, and the phase change material layer 107 is disposed on the surfaces of the plurality of pleated structures 1052 and fills the gaps of the plurality of pleated structures 1052 to encapsulate the pleated structures 1052.
When in use, the phase change material layer 107 absorbs heat and can fully contact with a chip, a radiating fin and the like after melting, so that the surface contact thermal resistance can be reduced.
Referring to fig. 7, the electronic device 100 may include a composite heat conductive shielding material 10, a chip 20, a Printed Circuit Board (PCB) 30, a shielding frame 40, and a heat dissipation structure 50; the chip 20 is disposed on the surface of the printed circuit board 30, the composite heat conductive shielding material 10 is disposed on the surface of the chip 20 away from the printed circuit board 30, the shielding frame 40 is disposed around the chip 20, and the heat dissipation structure 50 is disposed on the surface of the composite heat conductive shielding material 10 away from the chip 20. Wherein, the composite heat-conducting shielding material 10 is the composite heat-conducting shielding material 10 prepared in the above embodiment.
The heat dissipating structure 50 may be a heat sink, a heat spreader, a heat pipe, etc.
It is understood that the electronic device 100 in the embodiment of the present invention may be an electronic terminal device such as a smart phone or a tablet computer.
Referring to fig. 8, the present invention also provides a heat conductive shielding material 10A as a comparative example 1, in which comparative example 1, the structure of the heat conductive shielding material 10A is substantially the same as that of example 1, except that the heat conductive shielding material 10A in comparative example 1 includes only a wrinkled graphite film, and does not include a metal layer.
In comparative example 1, the highest conductivity of the graphite film was 1.1X10 6 S/m, and the shielding effectiveness of the graphite film against the wave band of 10 kHz-10 GHz is limited, which is only about 30 dB.
The composite heat conduction shielding material, the preparation method and the electronic equipment provided by the embodiment of the invention have the following advantages: first, the graphite-metal film heat conduction shielding composite material prepared by the invention has the high electrical conductivity characteristics of metal materials such as copper foil and the like, and the electrical conductivity is 10 7 S/m, and because graphite has conductivity, the shielding effectiveness is higher than 60dB between 10KHz and 10GHz, and the shielding performance is equivalent to or even higher than that of a conductive copper foil and a metal shielding cover; first, theSecondly, the graphite material is utilized to conduct heat in the horizontal direction (K)>800W/mK) property, the prepared composite material has the characteristic of high heat conduction in XY direction, the heat conduction property is more than 8W/mK in Z direction thickness direction, the fold shape (density, ping Zhendu) of the composite material is adjusted, and when the density is 50/cm 2 About 200 pieces/cm 2 And when the flatness is 20-150 mu m, the heat conducting property can reach more than 40W/mK.
The preparation method of the composite heat conduction shielding material, the composite heat conduction shielding material and the electronic equipment provided by the embodiment of the invention are described in detail, and specific examples are applied to illustrate the principle and the implementation mode of the invention, and the description of the above embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present invention, the present description should not be construed as limiting the present invention.

Claims (18)

1. The composite heat conduction shielding material is characterized by comprising a flexible heat conduction film and a first metal layer, wherein the flexible heat conduction film comprises a first surface and a second surface, and the first metal layer is arranged on the first surface so as to form a first composite structure; wherein the first composite structure forms a plurality of pleat structures from at least three directions, the plurality of pleat structures being irregular.
2. The composite heat conductive shielding material of claim 1, wherein the flexible heat conductive film is a graphite sheet, a graphene film, or a composite structure of graphite sheet and graphene.
3. The composite thermally conductive barrier material of claim 1, wherein the flexible thermally conductive film has a thickness of 10 to 100 μm.
4. The composite thermally conductive shielding material of claim 1, wherein the material of the first metal layer comprises at least one of copper, aluminum, gold, nickel, or alloys thereof.
5. The composite thermally conductive shielding material of claim 1, wherein the first metal layer has a thickness of 0.5 to 10 μm.
6. The composite thermally conductive shielding material of claim 1, wherein the pleat angle of the pleat structure is greater than 0 degrees and less than or equal to 30 degrees.
7. The composite thermally conductive shielding material of claim 1, further comprising a second metal layer disposed on the second surface.
8. The composite thermally conductive shielding material of claim 7, wherein the first metal layer has a thickness of 0.5 μm to 2 μm and the second metal layer has a thickness of 0.5 μm to 2 μm.
9. The composite thermally conductive shielding material of claim 1, further comprising a phase change material layer disposed on a surface of the pleated structure and filling gaps between the plurality of pleated structures.
10. The composite thermally conductive shielding material of claim 9, wherein the phase change material layer has a thickness of 5 μm to 10 μm.
11. The composite thermally conductive shielding material of claim 9, wherein the phase change material layer further comprises energy storage particles.
12. A preparation method of a composite heat conduction shielding material comprises the following steps:
providing a flexible heat conducting film, wherein the flexible heat conducting film is provided with a first surface;
a metal layer is arranged on the first surface to form a first composite structure;
stretching an elastic structure from at least three directions to form a pre-stretched elastic structure;
disposing the first composite structure to a surface of the pre-stretched elastic structure;
the pre-stretched elastic structure is retracted, the first composite structure forming a second composite structure having a plurality of pleat structures from the at least three directions, the plurality of pleat structures being random.
13. The method of preparing a composite thermal conductive shielding material of claim 12, further comprising the steps of: removing the elastic structure; and applying pressure to the second composite structure in the arrangement direction of the plurality of folds and the thickness direction of the folds, and adjusting the thickness of the second composite structure.
14. The method of preparing a composite thermal conductive shielding material of claim 12, wherein in the step of disposing the first composite structure on the surface of the pre-stretched elastic structure, the first composite structure is disposed on the surface of the pre-stretched elastic structure by a layer of adhesive.
15. The method of preparing a composite thermal conductive shielding material of claim 12, wherein in said step of disposing said first composite structure to a surface of said pre-stretched elastic structure, said elastic structure comprises a third surface and a fourth surface, disposing one of said first composite structures on said third surface and disposing another of said first composite structures on said fourth surface.
16. The method of preparing a composite thermal conductive shielding material of claim 12, further comprising: removing the elastic structure; and arranging a phase change material layer on the surface of the second composite structure.
17. The method of preparing a composite thermal conductive shielding material of claim 16, wherein the phase change material layer further comprises energy storage particles.
18. An electronic device, the electronic device comprising: a composite heat conduction shielding material, a chip, a printed circuit board, a shielding frame and a heat dissipation structure; the chip is arranged on the surface of the printed circuit board, the composite heat conduction shielding material is arranged on the surface of the chip far away from the printed circuit board, the shielding frame is arranged around the chip, and the heat dissipation structure is arranged on the surface of the composite heat conduction shielding material far away from the chip.
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