CN113997647A - Composite heat-conducting shielding material, preparation method and electronic equipment - Google Patents

Composite heat-conducting shielding material, preparation method and electronic equipment Download PDF

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Publication number
CN113997647A
CN113997647A CN202010740109.4A CN202010740109A CN113997647A CN 113997647 A CN113997647 A CN 113997647A CN 202010740109 A CN202010740109 A CN 202010740109A CN 113997647 A CN113997647 A CN 113997647A
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composite
thermally conductive
shielding material
heat
metal layer
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CN113997647B (en
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徐峰
戈云飞
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B32B2038/0028—Stretching, elongating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

Abstract

The embodiment of the invention discloses a composite heat-conducting shielding material, a preparation method and electronic equipment. The composite heat-conducting shielding material comprises a flexible heat-conducting film and a first metal layer, wherein the flexible heat-conducting film comprises a first surface and a second surface, and the first metal layer is arranged on the first surface so as to form a first composite structure; wherein the first composite structure forms a plurality of corrugated structures. According to the embodiment of the invention, a heat conduction and shielding integrated scheme is adopted, and a wrinkle forming process is combined, so that the prepared composite material has high heat conduction, high shielding and high compression performance.

Description

Composite heat-conducting shielding material, preparation method and electronic equipment
Technical Field
The invention relates to the technical field of heat dissipation shielding of electronic equipment, in particular to a composite heat-conducting shielding material, a preparation method and electronic equipment.
Background
Along with the rapid change of the electronic industry technology, the chip develops towards the direction of high integration and multi-functionalization, so that the heat flux density of the chip is continuously improved, if the heat generated by the chip cannot be brought away from the electronic equipment in time, the temperature of the internal electronic component is increased, the reliability of the internal electronic component is sharply reduced, and the service life of the electronic equipment is seriously influenced. In addition, when the chip works, the problems of Electromagnetic Interference (EMI) and Electromagnetic Compatibility (EMC) caused by Electromagnetic waves generated by high and low level changes are getting worse, which not only causes Interference and damage to electronic instruments and equipment, but also affects the normal operation of the equipment. When an IC chip (Integrated Circuit) works, it needs to meet the requirements of electromagnetic interference (EMI) and electromagnetic compatibility (EMC), i.e. it is not interfered by external electromagnetic waves, and the electromagnetic waves radiated by the IC chip do not interfere with other components. Therefore, integrated IC chips generally need to take into account the problems of chip heat dissipation and EMC electromagnetic radiation.
Disclosure of Invention
In view of this, embodiments of the present invention provide a composite thermal conductive shielding material, a preparation method thereof, and an electronic device, which can simultaneously consider the thermal conductive shielding function.
The embodiment of the invention provides a composite heat-conducting shielding material, which comprises a flexible heat-conducting film and a first metal layer, wherein the flexible heat-conducting film comprises a first surface and a second surface, and the first metal layer is arranged on the first surface so as to form a first composite structure; wherein the first composite structure forms a plurality of corrugated structures.
The embodiment of the invention provides a preparation method of a composite heat conduction shielding material, which comprises the following steps:
providing a flexible heat conducting film, wherein the flexible heat conducting film is provided with a first surface;
arranging a metal layer on the first surface to form a first composite structure;
stretching an elastic structure to form a pre-stretched elastic structure;
applying the first composite structure to a surface of the pre-stretched elastic structure;
retracting the pre-stretched elastic structure, the first composite structure forming a second composite structure having a plurality of pleat structures.
The embodiment of the invention provides electronic equipment, which comprises a composite heat-conducting shielding material, a chip, a printed circuit board, a shielding frame and a heat dissipation structure, wherein the chip is arranged on the composite heat-conducting shielding material; the chip is arranged on the surface of the printed circuit board, the composite heat conduction shielding material is arranged on the surface of the chip far away from the printed circuit board, the shielding frame is arranged around the chip, and the heat dissipation structure is arranged on the surface of the composite heat conduction shielding material far away from the chip, wherein the composite heat conduction shielding material is the composite heat conduction shielding material prepared by the preparation method provided by the embodiment of the invention.
The composite heat-conducting shielding material, the preparation method and the electronic equipment provided by the embodiment of the invention have the following advantages: firstly, the structural form of the composite heat conduction shielding material provided by the invention has a fold characteristic, and the fold characteristic can be changed within the range of 0.2 mm-5 mm in the thickness direction, so that the composite heat conduction shielding material has excellent compression performance, and the fold structure can be deformed, so that the composite heat conduction shielding material can be in good contact with structural components, such as an IC chip, a radiator and the like, so that the composite heat conduction shielding material has excellent tolerance capability, and can be used as a thermal interface material between the IC chip and the radiator; secondly, the heat conduction and shielding integrated design can reduce the gap and the thermal resistance between the chip and the heat sink, and is beneficial to lightening and thinning, and reducing the production and installation costs of electronic equipment such as mobile phones, computers and the like.
Drawings
The technical solution and the advantages of the present invention will be apparent from the following detailed description of the embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic flow chart of a method for preparing a composite thermal conductive shielding material according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a graphite sheet provided by an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a second composite structure provided in an embodiment of the present invention.
Fig. 4 is a schematic diagram of a pleat structure provided by an embodiment of the invention.
Fig. 5 is a schematic structural diagram of a composite thermal conductive shielding material provided in embodiment 1 of the present invention.
Fig. 6 is a schematic structural diagram of a composite thermal conductive shielding material provided in embodiment 2 of the present invention.
Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Fig. 8 is a schematic view of the mechanism of the thermally conductive shielding material provided in comparative example 1.
Detailed Description
Referring to the drawings, like numbers indicate like elements throughout. The following description is based on illustrated embodiments of the invention and should not be taken as limiting the invention with regard to other embodiments that are not detailed herein.
In the description of the embodiments of the present invention, the terms "first", "second", "third", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first," "second," "third," etc. may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the description of the embodiments of the present invention, all the directional indications (such as X, Y, Z, level … …) are used only to explain the relative positional relationship between the components, the movement, etc. in a certain posture (as shown in the drawings), and if the certain posture is changed, the directional indication is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The following detailed description is to be read in connection with specific embodiments.
Referring to fig. 1-4, an embodiment of the present invention provides a method for preparing a composite thermal conductive shielding material 10, which may include the following steps:
step S101, providing a flexible thermal conductive film 101, where the flexible thermal conductive film 101 has a first surface 1010 and a second surface 1012 opposite to the first surface 1010;
step S102, disposing a metal layer 102 on the first surface 1010 to form a first composite structure 103;
step S103, stretching an elastic structure 104 to form a pre-stretched elastic structure 104;
step S104, disposing the first composite structure 103 to the first surface 1040 of the pre-stretched elastic structure 104;
step S105, retracting the pre-stretched elastic structure 104, the first composite structure 103 forming a second composite structure 105 having a plurality of pleat structures 1052;
step S106, removing the elastic structure 104.
In step S101, the flexible heat conducting film 101 is a flexible thin film with heat conducting property, such as a carbon nanotube film, a graphite sheet, graphene, or a composite material of a graphite sheet and graphene. In an embodiment of the present invention, the material of the flexible thermal conductive film 101 is a graphite sheet, wherein the structure of the graphite sheet is as shown in fig. 2. The flexible thermal conductive film 101 has a first surface 1010 and a second surface 1012 opposite to the first surface 1010. The greater the thickness of the flexible heat conductive film 101, the better the heat conductive property thereof, but the flexibility may be deteriorated. It is therefore necessary to select the thickness of the flexible heat conductive film 101 having good flexibility and high thermal conductivity. In an embodiment of the present invention, a thickness of the flexible thermal conductive film 101 is 10 micrometers (μm) to 100 μm, and a thermal conductivity of the flexible thermal conductive film 101 in a direction parallel to the first surface 1010 may be greater than or equal to K > 800W/mK. In another embodiment of the present invention, the thickness of the flexible thermal conductive film 101 is 18 μm to 50 μm, and the thermal conductivity of the flexible thermal conductive film 101 in the direction parallel to the first surface 1010 may be K >1200W/mK or more.
In step S102, the material of the metal layer 102 is at least one of copper, aluminum, gold, nickel or an alloy thereof. The metal layer 102 is disposed on the first surface 1010 by any means, such as electroless gold plating, vacuum plating, sputtering, metal spraying, attaching a foil film, and the like. In an embodiment of the invention, a manner of disposing the metal layer 102 on the first surface 1010 is an electroless gold plating manner. The thickness of the metal layer 102 is 0.5 μm to 10 μm, and in one embodiment of the present invention, the thickness of the metal layer 102 is 5 μm to 10 μm. In another embodiment of the present invention, the thickness of the metal layer 102 is 3 μm to 8 μm. If the thickness of the metal layer 102 is too large, for example, greater than 10 μm, the flexibility of the composite structure formed by the flexible heat-conducting film 101 and the metal layer 102 may be affected, and further the formation of the subsequent corrugated structure 1052 and the compression set performance of the prepared composite heat-conducting and shielding material 10 may be affected, and if the thickness of the metal layer 102 is too small, for example, less than 0.5 μm, the thickness of the prepared metal layer 102 may be uneven, which may cause difficulty in the production process and may also affect the shielding performance of the prepared composite heat-conducting and shielding material 10.
In another embodiment of the present invention, a metal layer 102 may be further disposed on the second surface 1012 of the flexible thermal conductive film 101, that is, the metal layer 102, the flexible thermal conductive film 101, and the metal layer 102 are stacked to form a sandwich structure. In the present embodiment, the thickness of the metal layer 102 is 0.5 to 5 μm, and preferably, the thickness of the metal layer 102 is 0.5 to 2 μm. By arranging the double-layer metal layer structure and adjusting the thickness of the metal layer to be 0.5-2 μm, the shielding performance of the composite heat-conducting shielding material 10 can be increased under the condition that the heat-conducting performance of the composite heat-conducting shielding material 10 is not influenced. In the embodiment of the invention, the shielding effectiveness of the composite heat-conducting shielding material 10 is higher than 45dB and even higher than 60dB between 10KHz and 10 GHz.
In step S103, the elastic structure 104 may be stretch-deformed by an external force F. The material of the elastic structure 104 is not limited and can be selected as desired. In an embodiment of the present invention, the elastic structure 104 at least includes an adhesive surface, and specifically, the elastic structure 104 is an elastic tape, and the elastic tape includes at least one adhesive surface. The bonding surface is used to bond the first composite structure 103 in a snug fit so that the first composite structure 103 and the elastic tape do not move relative to each other in subsequent steps to produce a corrugated structure 1052 when the elastic tape is retracted. The stretching direction is the same as and opposite to the extending direction of the X axis and/or the extending direction of the Y axis, wherein the plane of the X axis and the plane of the Y axis are parallel to the bonding surface. In one embodiment of the present invention, the stretching direction is the same direction as the extending direction of the X-axis and the opposite direction.
In the process of stretching the elastic adhesive tape, two opposite sides of the elastic adhesive tape can be respectively fixed by two fixing frames, and then the elastic adhesive tape is stretched by applying force F to the two fixing frames along two opposite directions. The degree of stretch of the elastic tape may be selected as needed, and for example, the stretch ratio may be 1.5 or more. In an embodiment of the present invention, the stretch ratio is 2 or more and 10 or less. The elastic tape has different degrees of stretch to produce the pleat structures 1052 with different densities and morphologies. When the stretching degree is large, the density of the wrinkle structure 1052 produced by the method is large and thick as the stretch ratio of the elastic tape is more than 5. When the stretching degree is small, the stretching ratio of the elastic tape is less than 2, and the obtained wrinkle structure 1052 is low in density and thin.
In another embodiment of the present invention, the elastic structure 104 may further include a fourth surface opposite to the third surface 1040.
In step S104, the second surface 1012 of the flexible thermal conductive film 101 may be directly attached to the bonding surface of the elastic structure. Or the metal layer 102 may be attached directly to the adhesive side of the elastic tape. In another embodiment of the present invention, the first composite structure 103 may be attached to the surface of the elastic structure 104 by a layer of adhesive after the adhesive is disposed on the surface of the elastic structure 104.
In another embodiment of the present invention, in step S104, one first composite structure 103 may be disposed on the third surface 1040 and one first composite structure 103 may be disposed on the fourth surface, so that two composite thermal conductive shielding materials 10 may be simultaneously prepared.
In step S105, when the pre-stretched elastic structure 104 is retracted, the first composite structure 103 contracts together with the pre-stretched elastic structure 104, thereby forming a second composite structure 105 comprising a plurality of pleat structures 1052, the second composite structure 105 and the pleat structures 1052 being respectively seen in fig. 3 and 4. The arrangement of the plurality of pleat structures 1052 may be regular or irregular, depending on the direction of stretch when stretching the elastic structure 104 and the manner in which the pre-stretched elastic structure 104 is retracted. If the stretching direction in which the elastic structure 104 is stretched is both the same direction as the stretching direction of the X-axis and opposite direction, and if the pre-stretched elastic structure 104 is slowly retracted by controlling the external force, a regularly arranged pleat structure 1052 can be produced; the plurality of pleat structures 1052 produced are random if the elastic structure 104 is stretched in at least three different directions parallel to the XY plane, or if the pre-stretched elastic structure 104 retracts at a relatively high rate, even if the external force is momentarily lost. Wherein, the plurality of corrugated structures 1052 arranged randomly can bear the extrusion and bending in a plurality of directions.
The thickness of the plurality of corrugated structures 1052 may be the same or different. The closer the thickness of the plurality of pleat structures 1052, the higher the flatness of the second composite structure 105. The flatness refers to an absolute value of a difference between an average value of thicknesses of the plurality of wrinkle structures 1052 and the highest thickness and/or the lowest thickness. In one embodiment of the invention, the flatness is 20-500 μm. In another embodiment of the present invention, the flatness is 20 μm to 150 μm. Therefore, the more the plurality of corrugated structures 1052 are in contact with the chip and the heat dissipation structure in the subsequent application, the thermal contact resistance can be reduced, and the heat conductivity coefficient in the thickness direction can be improved. In this embodiment of the present invention, the thermal conductivity in the thickness direction is greater than 40W/mK.
The corrugation structure 1052 includes a corrugation angle α that is greater than 0 degrees and less than 180 degrees. As the fold angle a approaches 180 degrees, the second composite structure 105 approaches full deployment. In one embodiment, the fold angle α is greater than 0 degrees and equal to or less than 120 degrees. In another embodiment of the present invention, the fold angle α is equal to or greater than 0 degrees and equal to or less than 60 degrees. In another embodiment of the present invention, the fold angle α is equal to or greater than 0 degrees and equal to or less than 30 degrees. In another embodiment of the present invention, the fold angle α is equal to or greater than 0 degrees and equal to or less than 10 degrees. In another embodiment of the present invention, the fold angle α is 0 degree or more and 3 degrees or less. The smaller the fold angle α is, the larger the thermal conductivity coefficient in the thickness direction of the composite thermal conductive shielding material 10 prepared subsequently is, and the thermal conductivity coefficient in the thickness direction is greater than 40W/mK when the fold angle α is greater than or equal to 0 degrees and less than or equal to 3 degrees.
In the present invention, the heat conductivity of the composite heat conduction and shielding material 10 can be improved by adjusting the form of the plurality of corrugation structures 1052, such as the flatness, the density, etc., when the flatness is 20 μm to 150 μm, the density is 50 pieces/cm2200 pieces/cm2In time, the composite heat-conducting shielding materialThe thermal conductivity of the material 10 in the thickness direction can reach more than 40W/mK.
In step S106, the manner of removing the elastic structure 104 is not limited, and may be selected according to the requirement, such as separating the elastic structure 104 from the second composite structure 105 by mechanical means, chemical etching or solvent treatment. When chemical etching is used, the etching liquid cannot damage the second composite structure 105.
The heat conduction shielding composite material prepared by the method has the high heat conduction performance of graphite in XYZ directions and the high shielding performance of a metal film, the heat conduction coefficient in the XY direction can reach more than 800W/mK, even more than 1200W/mK, and the heat conduction coefficient in the Z direction can reach more than 40W/mK. Wherein the Z direction is a thickness direction of the corrugated structure 1052, and the XY direction is a direction in which a plurality of corrugated structures are arranged.
Further, the preparation method provided by the embodiment of the invention further comprises one or more of the following steps:
step S107, applying pressure to the second composite structure 105 in the X direction and the Z direction, and adjusting the thickness of the second composite structure 105;
step S108, arranging a phase change material layer 107 on the surface of the second composite structure 105 to form a third composite structure 108;
step S109, cutting the third composite structure 108.
In step S107, the second composite structure 105 applies pressure in the X direction and the Z direction through a jig. Here, the X direction refers to a direction in which the plurality of wrinkle structures 1052 are arranged, and the Z direction is a thickness direction of the second composite structure 105. The thickness of the second composite structure 105 is adjusted within a range of 0.2mm to 5mm by applying pressure to make the thickness of the second composite structure 105 reach a required thickness, so that the thermal conductivity of the second composite structure 105 in the Z direction can reach above 40W/mK.
The second composite structure 105 has a plurality of corrugated structures 1052, so that it has a compression property in the Z-direction, and can be deformed with a tolerance property. When parts, such as circuit boards, chips and the like, are processed, tolerance is inevitable, namely the surfaces of the parts are not completely flat, and due to the compressibility of the corrugated structure, the parts can be completely attached even if the parts are not flat, so that the corrugated structure has tolerance capability and can be used as a thermal interface material between an IC chip and a radiator.
In addition, the heat conduction and shielding are integrally designed, and the thickness of the second composite structure 105 is 0.2 mm-5 mm, so that the prepared electronic products, such as mobile phones, computers and the like, can be thinned.
In step S108, the phase change material layer 107 may be disposed on the second composite structure 105 by coating and filled into the gaps of the plurality of corrugated structures 1052. The type of the phase-change material is not limited, and can be selected according to the requirement, and the phase-change material is a heat-conducting phase-change paste, a phase-change gel, a phase-change microcapsule or other filling materials. In an embodiment of the present invention, the phase change material is a polymer phase change material, and the polymer phase change material refers to a polymer that can be changed from a solid state to a liquid state at a phase change point. The thickness of the phase change material layer 107 is 5 μm to 10 μm. The thickness of the phase change material layer 107 is the thickness of the phase change material filled into the gaps of the corrugated structure 1052 and higher than the second composite structure 105. When the thickness of the phase-change material layer 107 is 5-10 μm, the phase-change material layer can be ensured to be fully contacted with structural members such as chips and radiating fins after being melted, and the phenomenon that the flexibility of the composite heat-conducting shielding material is reduced due to the fact that the phase-change material layer 107 is too thick and is not beneficial to deformation and fitting on a curved surface is also prevented.
Since the second composite structure 105 has a plurality of corrugated structures 1052, the heights of the corrugated structures 1052 are different, so that it is difficult to ensure that each corrugated structure 1052 can contact with a chip or the like in use, thereby increasing the contact thermal resistance. By coating the phase change material layer 107, the phase change material is filled into the gaps of the plurality of corrugated structures 1052 and is 5-10 μm higher than the surface of the second composite structure 1052, so that the heat conduction shielding composite material 10 can be completely contacted with components such as chips, air residue between the heat conduction shielding composite material 10 and the components such as chips is reduced, and contact thermal resistance between the heat conduction shielding composite material 10 and the chips/heat sinks can be reduced. The heat sink is meant to mean that its temperature does not change with the magnitude of the thermal energy transferred to it, and it may be an object such as the atmosphere, the earth, etc.
In addition, energy storage particles, such as paraffin energy storage particles and resin energy storage particles, can be filled in the phase-change material layer 107, when the temperature of an external environment (such as a chip) rises, the energy storage particles can store absorbed heat, so that the temperature of the composite heat-conducting shielding material can slowly rise, the damage to the composite heat-conducting shielding material due to rapid temperature rise is avoided, and meanwhile, after the temperature of the external environment falls, the stored heat can be released by the energy storage particles, so that the composite heat-conducting shielding material cannot be always at a high temperature, and the chip and the like cannot be damaged.
The surface thermal resistance can be further reduced and the thermal conductivity can be improved by arranging the phase change material layer 107 on the surface of the second composite structure 105, and the risk of surface graphite flake surface powder falling can be reduced by coating the phase change material on the surface of the second composite structure 105 for cladding.
In step S109, the method of cutting the third composite structure 108 is laser cutting. The composite heat conductive and shielding material 10 with the required size can be obtained by cutting the third structure. In addition, a plurality of composite heat-conducting shielding materials 10 can be prepared by means of laser cutting.
The preparation method of the composite heat-conducting shielding material 10 provided by the embodiment of the invention has the following advantages: firstly, a second composite structure 105 with a corrugated structure 1052 is subjected to pressure in the X direction and the Z direction, and side laser cutting is combined to prepare a composite structure with a specified size and thickness, wherein the composite structure can change within the range of 0.2-5 mm in the thickness direction due to the corrugated structure and has a certain compression performance; second, the pleat structure 1052 can be formed by adjusting the stretch ratio of the elastic tape to change the pleat shapeDensity and flatness when the density is 50 pieces/cm2200 pieces/cm2And when the flatness is 20-150 μm, the thermal conductivity coefficient of the composite thermal conductive shielding material 10 in the thickness direction can reach more than 40W/mK; thirdly, the metal layer 102 is arranged on the surface of the graphite sheet, so that the composite heat-conducting and shielding material 10 has high electric conductivity, and the shielding effectiveness is higher than 60dB between 10KHz and 10 GHz; fourth, since the graphene film is used as the flexible heat conducting film 101 and has the corrugated structure 1052, the composite heat conducting and shielding material 10 also has flexibility and can be disposed on a curved surface. Therefore, the composite heat-conducting shielding material 10 has high heat-conducting, high shielding and high compression performance, and can achieve both heat dissipation and shielding functions, thereby realizing the light and thin design of products such as mobile phones.
Referring to fig. 5, embodiment 1 of the present invention further provides a composite thermal conductive shielding material 10 prepared by the above method, where the composite thermal conductive shielding material 10 includes a flexible thermal conductive film 101 and a first metal layer 102, the flexible thermal conductive film 101 includes a first surface 1010 and a second surface 1012, and the first metal layer 102 is disposed on the first surface 1010, so as to form a first composite structure 103; wherein the first composite structure 103 is bent multiple times to form multiple corrugated structures 1052.
The flexible heat conducting film 101 is a thin film structure with heat conducting property, and the material of the flexible heat conducting film 101 may be a carbon nanotube film, a graphite sheet, a graphene film, or a composite structure of a graphite sheet and a graphene film. The metal layer 102 is at least one of copper, aluminum, gold, nickel, etc. or an alloy thereof. The size and thickness of the corrugated structure 1052 can be adjusted, and the thickness h of the corrugated structure 1052 is 30-400 μm.
The corrugation angle α of the corrugation structure 1052 is greater than 0 degrees and less than or equal to 150 degrees, and in one embodiment, the corrugation angle α is greater than 0 degrees and less than or equal to 120 degrees. In another embodiment of the present invention, the fold angle α is equal to or greater than 0 degrees and equal to or less than 60 degrees. In another embodiment of the present invention, the fold angle α is equal to or greater than 0 degrees and equal to or less than 30 degrees. The fold angles are different, the thicknesses of the fold structures are different, and the sizes of gaps between the adjacent fold structures 1052 are different.
In another embodiment of the present invention, the composite thermal conductive and shielding material 10 includes a second metal layer (not shown) disposed on the second surface 1012.
Referring to fig. 6, an embodiment 2 of the present invention further provides a composite thermal conductive shielding material 10 prepared by the above method, where the composite thermal conductive shielding material 10 includes a flexible thermal conductive film 101, a first metal layer 102, and at least one phase change material layer 107, the flexible thermal conductive film 101 includes a first surface 1010 and a second surface 1012, and the metal layer 102 is disposed on the first surface 1010, thereby forming a first composite structure 103; wherein the first composite structure 103 is bent multiple times to form a plurality of corrugated structures 1052, and the phase change material layer 107 is disposed on the surfaces of the corrugated structures 1052 and filled into gaps of the corrugated structures 1052 to encapsulate the corrugated structures 1052.
When the phase change material layer 107 is used, the phase change material layer absorbs heat and melts to be in full contact with a chip, a radiating fin and the like, and further surface contact thermal resistance can be reduced.
Referring to fig. 7, the electronic device 100 may include a composite heat conductive shielding material 10, a chip 20, a Printed Circuit Board (PCB)30, a shielding frame 40 and a heat dissipation structure 50; the chip 20 is disposed on the surface of the printed wiring board 30, the composite thermal conductive shielding material 10 is disposed on the surface of the chip 20 away from the printed wiring board 30, the shielding frame 40 is disposed around the chip 20, and the heat dissipation structure 50 is disposed on the surface of the composite thermal conductive shielding material 10 away from the chip 20. The composite heat-conducting shielding material 10 is the composite heat-conducting shielding material 10 prepared in the above embodiment.
The heat dissipation structure 50 may be a heat sink, a heat radiator, a heat pipe, or the like.
It is understood that the electronic device 100 in the embodiment of the present invention may be an electronic terminal device such as a smart phone or a tablet computer.
Referring to fig. 8, the present invention also provides a thermal conductive-shielding material 10A as comparative example 1, in which comparative example 1 the structure of the thermal conductive-shielding material 10A is substantially the same as that of example 1 except that the thermal conductive-shielding material 10A in comparative example 1 includes only a corrugated graphite film, not including a metal layer.
In this comparative example 1, the maximum conductivity of the graphite thin film was 1.1 × 106S/m, and the graphite film has limited shielding effectiveness for the wave band of 10 kHz-10 GHz, which is only about 30 dB.
The composite heat-conducting shielding material, the preparation method and the electronic equipment provided by the embodiment of the invention have the following advantages: firstly, the graphite-metal film heat-conducting shielding composite material prepared by the invention has the high electrical rate characteristic of metal materials such as copper foil and the like, and the electrical conductivity is 107The shielding performance of the graphite is equivalent to or even higher than that of conductive copper foil and metal shielding cases; secondly, the graphite material with high heat conductivity (K) in the horizontal direction is utilized>800W/mK) property through a wrinkle forming mode, the prepared composite material has the characteristic of high heat conduction in the XY direction, the heat conduction performance in the thickness direction of the Z direction is more than 8W/mK, the wrinkle form (density and flat vibration degree) of the composite material is adjusted, and when the density is 50/cm2200 pieces/cm2And when the flatness is 20-150 mu m, the heat conductivity can reach more than 40W/mK.
The above detailed description is provided for the preparation method of the composite heat-conducting shielding material, the composite heat-conducting shielding material and the electronic device provided by the embodiment of the present invention, and a specific example is applied in the present document to explain the principle and the implementation manner of the present invention, and the description of the above embodiment is only used to help understanding the method and the core idea of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (18)

1. A composite thermally conductive and shielding material comprising a flexible thermally conductive film and a first metal layer, said flexible thermally conductive film comprising a first surface and a second surface, said first metal layer disposed on said first surface to form a first composite structure; wherein the first composite structure forms a plurality of corrugated structures.
2. The composite thermally conductive shielding material of claim 1, wherein said flexible thermally conductive film is a graphite sheet, a graphene film, or a composite structure of graphite sheets and graphene.
3. The composite thermally conductive and shielding material of claim 1, wherein the flexible thermally conductive film has a thickness of 10 to 100 μm.
4. The composite thermally conductive shield material of claim 1, wherein the material of the first metal layer comprises at least one of copper, aluminum, gold, nickel, or alloys thereof.
5. The composite thermally conductive and shielding material of claim 1, wherein the thickness of the first metal layer is 0.5 to 10 μm.
6. The composite thermally conductive shield material of claim 1, wherein a corrugation angle of the corrugated structure is greater than 0 degrees and less than or equal to 30 degrees.
7. The composite thermally conductive shield material of claim 1 further comprising a second metal layer disposed on said second surface.
8. The composite thermally conductive and shielding material of claim 7, wherein the first metal layer has a thickness of 0.5 μm to 2 μm and the second metal layer has a thickness of 0.5 μm to 2 μm.
9. The composite thermally conductive shield material of claim 1 further comprising a phase change material layer disposed on a surface of the corrugated structure and filling gaps between the plurality of corrugated structures.
10. The composite thermally conductive shield material of claim 9, wherein the phase change material layer has a thickness of 5 μm to 10 μm.
11. The composite thermally conductive shield material of claim 9, wherein the phase change material layer further comprises energy storage particles.
12. A preparation method of a composite heat-conducting shielding material comprises the following steps:
providing a flexible heat conducting film, wherein the flexible heat conducting film is provided with a first surface;
arranging a metal layer on the first surface to form a first composite structure;
stretching an elastic structure to form a pre-stretched elastic structure;
applying the first composite structure to a surface of the pre-stretched elastic structure;
retracting the pre-stretched elastic structure, the first composite structure forming a second composite structure having a plurality of pleat structures.
13. The method of making a composite thermally conductive shield material of claim 12, further comprising the steps of: removing the elastic structure; and applying pressure to the second composite structure in the arrangement direction of the plurality of wrinkles and the thickness direction of the wrinkles to adjust the thickness of the second composite structure.
14. The method of making a composite thermally conductive and shielding material of claim 12, wherein in the step of applying said first composite structure to a surface of said pre-stretched elastic structure, said first composite structure is applied to said surface of said pre-stretched elastic structure through a layer of adhesive.
15. The method of making a composite thermally conductive and shielding material of claim 12, wherein in said step of disposing said first composite structure on said surface of said pre-stretched resilient structure, said resilient structure comprises a third surface and a fourth surface, one of said first composite structures being disposed on said third surface and the other of said first composite structures being disposed on said fourth surface.
16. The method of making a composite thermally conductive shield material of claim 12, further comprising: removing the elastic structure; and arranging a phase change material layer on the surface of the second composite structure.
17. The method of making a composite thermally conductive shield material of claim 16, wherein the phase change material layer further comprises energy storage particles.
18. An electronic device, the electronic device comprising: the heat dissipation structure comprises a composite heat conduction shielding material, a chip, a printed circuit board, a shielding frame and a heat dissipation structure; the chip sets up the surface of printed wiring board, compound heat conduction shielding material sets up the chip is kept away from the surface of printed wiring board, the shielding frame sets up around the chip, heat radiation structure sets up compound heat conduction shielding material keeps away from the surface of chip, its characterized in that, compound heat conduction shielding material is according to claim 1 ~ 11 any one compound heat conduction shielding material.
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CN104981138A (en) * 2014-04-10 2015-10-14 苏州驭奇材料科技有限公司 Electromagnetic shielding heat-dissipation film and manufacturing method thereof
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