CN104981138A - Electromagnetic shielding heat-dissipation film and manufacturing method thereof - Google Patents
Electromagnetic shielding heat-dissipation film and manufacturing method thereof Download PDFInfo
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- CN104981138A CN104981138A CN201410140979.2A CN201410140979A CN104981138A CN 104981138 A CN104981138 A CN 104981138A CN 201410140979 A CN201410140979 A CN 201410140979A CN 104981138 A CN104981138 A CN 104981138A
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- film
- heat dissipation
- electromagnetic shielding
- dissipation film
- shielding heat
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 13
- 239000011230 binding agent Substances 0.000 claims abstract description 9
- 229910021383 artificial graphite Inorganic materials 0.000 claims abstract description 8
- 239000000696 magnetic material Substances 0.000 claims abstract description 7
- 239000003054 catalyst Substances 0.000 claims abstract description 3
- 239000007791 liquid phase Substances 0.000 claims abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 26
- 229910002804 graphite Inorganic materials 0.000 claims description 26
- 239000010439 graphite Substances 0.000 claims description 26
- 239000002390 adhesive tape Substances 0.000 claims description 23
- 230000005855 radiation Effects 0.000 claims description 20
- 230000004888 barrier function Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 9
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 8
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
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- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
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- QHCZEKMIMJAYOR-UHFFFAOYSA-N [Fe].[Zn].[Nb] Chemical compound [Fe].[Zn].[Nb] QHCZEKMIMJAYOR-UHFFFAOYSA-N 0.000 claims description 4
- 239000006096 absorbing agent Substances 0.000 claims description 4
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- 229910000676 Si alloy Inorganic materials 0.000 claims description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- RFIJBZKUGCJPOE-UHFFFAOYSA-N [Fe].[Ni].[Zn] Chemical compound [Fe].[Ni].[Zn] RFIJBZKUGCJPOE-UHFFFAOYSA-N 0.000 claims description 2
- KLARSDUHONHPRF-UHFFFAOYSA-N [Li].[Mn] Chemical compound [Li].[Mn] KLARSDUHONHPRF-UHFFFAOYSA-N 0.000 claims description 2
- KSIIOJIEFUOLDP-UHFFFAOYSA-N [Si].[Fe].[Ni] Chemical compound [Si].[Fe].[Ni] KSIIOJIEFUOLDP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- ADCXHZZSUADYMI-UHFFFAOYSA-N cadmium lithium Chemical compound [Li].[Cd] ADCXHZZSUADYMI-UHFFFAOYSA-N 0.000 claims description 2
- RIVZIMVWRDTIOQ-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co].[Co] RIVZIMVWRDTIOQ-UHFFFAOYSA-N 0.000 claims description 2
- ZGDWHDKHJKZZIQ-UHFFFAOYSA-N cobalt nickel Chemical compound [Co].[Ni].[Ni].[Ni] ZGDWHDKHJKZZIQ-UHFFFAOYSA-N 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 2
- 239000002905 metal composite material Substances 0.000 claims description 2
- 229910001120 nichrome Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229910000702 sendust Inorganic materials 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000012808 vapor phase Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 claims description 2
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
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- 238000010521 absorption reaction Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
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- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
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- 229910017052 cobalt Inorganic materials 0.000 description 1
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- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
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- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
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Abstract
The invention provides an electromagnetic shielding heat-dissipation film and a manufacturing method thereof. The electromagnetic shielding heat-dissipation film comprises a heat-dissipation film layer, a shielding film layer and a wave-absorbing film layer, wherein the heat-dissipation film layer is a synthetic graphite film, the shielding film layer is a metal film, and the wave-absorbing film layer is an organic binder film mixed with soft magnetic material powders. The method for manufacturing the electromagnetic shielding heat-dissipation film comprises the following steps: 1) attaching a heat-dissipation film to a smooth high-temperature-resistant film layer to form the heat-dissipation film layer; 2) depositing the metal film onto the surface of heat-dissipation film through a gas phase method or a liquid phase method or the combination of the two to form the shielding film layer; 3) coating organic binder mixed with the soft magnetic material powders onto the surface, wherein the metal film heat-dissipation film are deposited, and carrying out solidification under the function of high temperature or a catalyst; and 4) stripping the high-temperature-resistant film layer on the surface of the heat-dissipation film to obtain the electromagnetic shielding heat-dissipation film.
Description
Technical field
The present invention relates to a kind of electromagnetic shielding heat dissipation film and manufacture method thereof, there is the electromagnetic shielding heat dissipation film of electromagnetic shielding and heat sinking function, for the suppression of the electromagnetic shielding in motor and electronics industry and electromagnetic noise.
Background technology
Along with the develop rapidly of electronic technology, have the day by day universal of the electronic product of various personalized entertainment function, also make electronic product be rapidly to the future developments such as intellectuality, integrated, lightening, multifunction.
But, due to the speed of transfer of data and the increase of frequency and circuit board integrated level, with the interference reducing adjacent component, more and more higher requirement is proposed to the environment improving electromagnetic interference.Smart machine operationally in addition, and the continuous emitting electromagnetic wave outward of meeting, maximum power can reach 2w, and this is very large on the impact of surrounding environment.Therefore, for avoiding its interference operationally each other and to surrounding environment, must limit some unnecessary radiation.Therefore, use and can to absorb and the absorbing material of loss magnetic energy can avoid the problem of this respect, as magnetic material and blend rubber being formed of proposing in patent EP0667643B1 inhales ripple rete.
It is that the electromagnetic wave of absorption is converted into heat energy that absorbing material shields electromagnetic principle, and this can cause the rising of electronic device temperature, not only can reduce the wave-absorbing effect inhaling ripple film, also can reduce power consumption and the stability of electronic device.
Synthetic graphite film (JP1985181129A), due to the thermal conductivity (800-2000 W/mk) of its superelevation and frivolous feature (10-50um), becomes the focus in Heat Conduction Material gradually.But because the little (<2g/cm of its proportion
3), cause its thermal capacity and heat flux limited, can not in time heat conduction be gone out.Therefore, improve synthetic graphite film thermal capacity and with stable being combined in of absorbing material, can effectively solve absorbing material heating problem and increase the reliability of its processing.
The invention provides a kind of electromagnetic shielding heat dissipation film, its heat-conducting layer is synthetic graphite film, provide very high thermal diffusivity, sedimentation is provided with metal screen layer thereon, effectively increase the thermal capacity of graphite rete, and because metal level is deposited directly to graphite linings surface, greatly reduce two-layer between thermal resistance.Be provided with on metal screen layer surface and inhale ripple rete, in use, penetrate inhale ripple layer and do not have absorbed electromagnetic wave part can be covered, typically with metal layers reflection thus secondary by inhaling ripple layer, thus by double absorption, effectively increase electro-magnetic wave absorption effect.
Summary of the invention
The present invention be directed to the technical problem that current electronic product exists on electromagnetic shielding and heat radiation, provide a kind of comprehensive solution simultaneously with excellent electromagnetic screening effectiveness and heat sinking function, electromagnetic shielding heat dissipation film.Described electromagnetic shielding heat dissipation film can paste on the electronic devices easily, while meeting ultra-thin dimensional requirement, plays the function of heat radiation and electromagnetic shielding.
Electromagnetic shielding heat dissipation film of the present invention comprises heat radiation rete, and barrier film layer and suction ripple rete, heat radiation rete is wherein graphite rete, and barrier film layer is metal film, and inhaling ripple rete is the organic adhesive agent film being mixed with soft magnetic material powder.
Preferably; according to electromagnetic shielding heat dissipation film of the present invention; the heat dissipation film side of described electromagnetic shielding heat dissipation film is with diaphragm; inhaling the side of ripple film with double faced adhesive tape and release film; after peeling off release film, suction ripple film side and electronic device are fitted by double faced adhesive tape by electromagnetic shielding heat dissipation film, and diaphragm then plays the function of protective film and insulation.
Preferably; according to electromagnetic shielding heat dissipation film of the present invention; the suction ripple film side of described electromagnetic shielding heat dissipation film is with diaphragm; in the side of heat dissipation film with double faced adhesive tape and release film; after peeling off release film, heat dissipation film side and electronic device are fitted by double faced adhesive tape by electromagnetic shielding heat dissipation film, and diaphragm then plays the function of protective film and insulation.
Preferably, according to electromagnetic shielding heat dissipation film of the present invention, the suction ripple film side of described electromagnetic shielding heat dissipation film and the side of heat dissipation film are with double faced adhesive tape and release film, after peeling off release film, electromagnetic shielding heat dissipation film is fitted in electronic device surface, and outer surface can pass through other functional parts of sticking double faced adhesive tape.
Preferably, according to electromagnetic shielding heat dissipation film of the present invention, described heat radiation rete is synthetic graphite film, and its thickness is 10um-50um, and thermal conductivity is 800-2000W/mk.The high thermal conductivity of synthetic graphite film can be that the heat that come out of electronic device on heat generating spot diffuses to rapidly on whole graphite film, thus realizes its high efficient heat dissipation performance by increasing heating area.
Preferably, according to electromagnetic shielding heat dissipation film of the present invention, the synthetic method of the synthetic graphite film of described heat radiation rete is, by polyimide film under the protection of inert gas, with 5-20
othe speed of C/min rises to 500 from room temperature
oc/min is also incubated 1-5 hour, thereafter with 5-10
othe speed of C/min is warming up to 800-1200
oc is also incubated 1-5 hour, and then with 5-10
othe speed of C/min is warming up to 2600-3200
oc is also incubated 1-5 hour, obtains graphite film after cooling, makes the graphite film goods with desired thickness and surface smoothing by firing the graphite film obtained by calendering.
Preferably, according to electromagnetic shielding heat dissipation film of the present invention, described barrier film layer is metal film, and its material is gold, silver, copper, nickel, iron, aluminium, zinc, titanium, chromium, cobalt or alloy.Described metal film is the film of single metal or the metal composite film for two-layer or two-layer above different metal formation, and its thickness is 5nm-50um.
Preferably, according to electromagnetic shielding heat dissipation film of the present invention, the manufacture method of the metal film of described barrier film layer is that physical vaporous deposition (PVD), chemical vapour deposition technique (CVD), evaporation coating method, magnetron sputtering method, chemical plating, plating or its combination process are formed.
Preferably, according to electromagnetic shielding heat dissipation film of the present invention, described suction ripple film consist of the wave absorbing agent of 50-90% and the organic binder bond of 10-40%, its thickness is 20um-1mm, is greater than 50 at the magnetic permeability of 1MHz frequency.
Preferably, according to electromagnetic shielding heat dissipation film of the present invention, the material of described wave absorbing agent is soft magnetic alloy powder, include but are not limited to nickel zinc-iron alloy, ambrose alloy ferroalloy, zinc chrome ferroalloy, MnZn ferroalloy, niobium zinc-iron alloy, sendust, nichrome, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, ferrocobalt, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy or lithium cadmium ferroalloy.
Preferably, according to electromagnetic shielding heat dissipation film of the present invention, described organic binder bond is macromolecular material, includes but are not limited to phenolic resins, Lauxite, epoxy resin, acrylic resin, polyvinyl butyral resin, vinyl acetate and copolymer thereof, organic silica gel resinoid, polyurethane, rubber resin or their polymer.
Present invention also offers a kind of manufacture method of electromagnetic shielding heat dissipation film, the method comprises:
Step 1, is covered on ganoid high temperature resistant rete by heat dissipation film;
Step 2, by metal film by vapor phase method or liquid phase method again or both associated methods be deposited on the heat dissipation film surface of step 1,
Step 3, by soft magnetic material powder and organic binder bond mixing and high-speed stirred mix, be coated with by inverse, net roller coat cloth, blade coating, the modes such as spraying or slot coated are coated in the metallic film surface of step 2 and solidify under the effect of high temperature or catalyst,
Step 4, the high temperature resistant rete peeling off heat dissipation film surface obtains electromagnetic shielding heat dissipation film of the present invention.
Preferably, according to above-mentioned manufacture method, the material of high temperature resistance diaphragm is indeformable material at the temperature being greater than 100oC, as high-temperature resistance plastice, and glass, stainless steel, pottery.
Electromagnetic shielding heat dissipation film of the present invention, its structure comprises graphite radiating rete, metallic diaphragm and inhale ripple rete, and this sandwich construction is every layer of function with its uniqueness not only, and each layer can be worked in coordination with mutually, strengthens overall heat radiation and effectiveness.
In heat sinking function, because metal level has higher density (as copper 8.9g/cm
3), therefore ratio of heat capacities is comparatively large, reduces temperature when electronic device caloric value is larger as a part of heat of heat sink storage, and because its high thermal conductivity (as copper 400W/mk) also can auxiliary heat conduction.And inhale ripple layer because its alloy packing ratio up to 50-90%, make its also can as heat sink come store heat.
In electromagnetic shielding, metal film and suction ripple film all have electro-magnetic screen function, but mechanism of its shielding is not identical.It is main shielding material that metal film belongs to reflection loss, and inhaling ripple film is then arrive the electromagnetic function of shielding by magnetic hysteresis loss.After metal film and suction ripple film being combined, in application process, electromagnetic wave is first by inhaling ripple film by absorption loss, and unabsorbed part is then consumed by the reflection loss of metal film after inhaling ripple film.After by Metal film reflector, remaining electromagnetic wave again through inhaling ripple film, thus can be absorbed by suction ripple film second time, thus strengthens effectiveness greatly.And graphite itself is as electric conducting material, also there is certain effectiveness, certain shield effectiveness can be formed to the electromagnetic wave projecting metal film.
From the project organization of entirety, metal film is produced on graphite film, do not have the bonding material of the high thermal resistance of double faced adhesive tape and so on, ensure that heat conducts fast between graphite film and metal film between graphite film and metal film.Further, because the surface distributed of graphite film the micropore of nano-scale, by deposition process, metal can be deposited on these micropores thus increase the contact area with graphite film, and its adhesion effect can be more firm than stickup, is not easy to peel off because of graphite laminated.Finally, the surface energy of graphite film is lower, is not easy to apply organic binder bond thereon, and metal film effectively can increase suction ripple film adhesive property thereon as intermediate layer.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the present invention will be described in more detail.
Fig. 1 is the structure chart of an embodiment of electromagnetic shielding heat dissipation film of the present invention.
Fig. 2 is the structure chart of another embodiment of electromagnetic shielding heat dissipation film of the present invention.
Fig. 3 is the structure chart of another embodiment of electromagnetic shielding heat dissipation film of the present invention.
Fig. 4 is the electromagnet shield effect figure of embodiment 1.
Fig. 5 is the electromagnet shield effect figure of embodiment 2.
Fig. 6 is the flow chart of the manufacture method of electromagnetic shielding heat dissipation film of the present invention.
Embodiment
With reference to the accompanying drawings, the present invention is further illustrated in conjunction with specific embodiments.
Embodiment 1: as shown in Figure 1, electromagnetic shielding heat dissipation film comprises heat radiation rete 11, barrier film layer 12 and suction ripple rete 13, heat radiation rete 11 is wherein the graphite film of 25um, and its thermal conductivity is 1600 W/mk, and barrier film layer 12 is Copper Foil, thickness is 20um, inhaling ripple film 13 is the film containing the Fe-Ni Alloy Powder of 80% weight ratio and the epoxy resin adhesive of 20% weight ratio, and thickness is 50mm, and magnetic permeability is 120 at 1MHz.
Embodiment 2: as shown in Figure 1, heat radiation rete 11 in electromagnetic shielding heat dissipation film is the graphite film of 10um, its thermal conductivity is 1900 W/mk, barrier film layer 12 is aluminium foil, thickness is 40um, inhaling ripple film 13 is the film containing the Fe-Ni Alloy Powder of 70% weight ratio and the epoxy resin adhesive of 30% weight ratio, and thickness is 30mm, and magnetic permeability is 90 at 1MHz.
Embodiment 3: as shown in Figure 2, electromagnetic shielding heat dissipation film comprises heat radiation rete 11, barrier film layer 12 and suction ripple rete 13, heat radiation rete 11 is wherein the graphite film of 25um, and its thermal conductivity is 1600 W/mk, and barrier film layer 12 is Copper Foil, thickness is 20um, inhaling ripple film 13 is the film containing the Fe-Ni Alloy Powder of 80% weight ratio and the epoxy resin adhesive of 20% weight ratio, and thickness is 50mm, and magnetic permeability is 120 at 1MHz.Inhaling the PET protective film 14(PETG with 25um on ripple film 13), scribble the PET release film layer 16 of silicone oil with 10um acrylic acid adhesive double faced adhesive tape 15 and contact-making surface on graphite film 11 surface, thickness is 50um.
Embodiment 4: as shown in Figure 3, electromagnetic shielding heat dissipation film comprises heat radiation rete 11, barrier film layer 12 and suction ripple rete 13, heat radiation rete 11 is wherein the graphite film of 25um, and its thermal conductivity is 1600 W/mk, and barrier film layer 12 is Copper Foil, thickness is 20um, inhaling ripple film 13 is the film containing the Fe-Ni Alloy Powder of 80% weight ratio and the epoxy resin adhesive of 20% weight ratio, and thickness is 50mm, and magnetic permeability is 120 at 1MHz.With the PET protective film 14(PETG of 25um on graphite film 11), scribble the PET release film layer 16 of silicone oil at the surperficial acrylic acid adhesive double faced adhesive tape 15 thick with 10um of suction ripple film 13 and contact-making surface, thickness is 50um.
Screening effectiveness is tested: screening effectiveness (dB) is in accordance with ASTM-D-4935 testing standard by Agilent E5061A vector network tester, and the test of DN1015 screening effectiveness testing apparatus, it the results are shown in Fig. 4 and Fig. 5.From test result, in the frequency range of 0-1GHz, the electromagnetic shielding effectiveness of embodiment 1 is average 96dB, and the electromagnetic shielding effectiveness of embodiment 1 is average 85dB.
Thermal conductivity test experiments: thermal conductivity test is in accordance with ASTM-E-1461 testing standard by resistance to LFA 447 heat conduction coefficient tester test of speeding, and it the results are shown in table 1.From test result, the conductive coefficient of embodiment 1 is 1605.317 W/mk, and the conductive coefficient of embodiment 2 is 1909.385 W/mk.
Screening effectiveness and thermal conductivity test experiments result show, height heat radiation of the present invention is inhaled ripple composite membrane and had significantly excellent electromagnetic shielding and radiating effect with respect to pasting heat conducting film with the composite material inhaling ripple film.
Table 1, thermal conductivity test result
| Sample | Ambient temperature (DEG C) | Model | Thermal diffusion coefficient (mm 2/s） | Conductive coefficient (W/mK) |
| Embodiment 1 | 25.0 | In Plan, isotropism | 933.324 | 1605.317 |
| Embodiment 2 | 25.0 | In Plan, isotropism | 1110.108 | 1909.385 |
Embodiment 5: the manufacture method that the invention provides a kind of electromagnetic shielding heat dissipation film, as shown in Figure 6, the method comprises:
Step 1, uses compounding machine to be covered in by heat dissipation film on ganoid stainless steel thin slice,
Step 2, uses chemical vapour deposition technique (CVD) to adopt the divalence complex Cu of copper
(II)(hfac)
2as predecessor, take hydrogen as carrier gas, 250
oon graphite guide hotting mask, the metallic copper rete of 10nm is deposited under C normal pressure.Afterwards, take copper sulphate as electroplate liquid, the copper film formed with CVD method continues galavanic growth copper film layer, until the thickness of copper film reaches 25um,
Step 3, mixes the epoxy resin adhesive of the Anhyster powder with 20% weight ratio that are mixed with 80% weight ratio and uses coater on copper film layer surface and solidify to form the suction ripple rete of 50umm in agitator tank.
Step 4, peels off the stainless steel thin slice contacted with graphite film, obtains electromagnetic shielding heat dissipation film.
When applying, double faced adhesive tape can be attached to the graphite film side of electromagnetic shielding heat dissipation film or inhale ripple film side, and being covered in the electronical elements surface needing heat radiation and electromagnetic shielding, thus reaching reduction device temperature, preventing the effect of electromagnetic interference.
The heat dissipation film side of described electromagnetic shielding heat dissipation film is with diaphragm; inhaling the side of ripple film with double faced adhesive tape and release film; after peeling off release film, suction ripple film side and electronic device are fitted by double faced adhesive tape by electromagnetic shielding heat dissipation film, and diaphragm then plays the function of protective film and insulation.
The suction ripple film side of described electromagnetic shielding heat dissipation film is with diaphragm; in the side of heat dissipation film with double faced adhesive tape and release film; after peeling off release film, heat dissipation film side and electronic device are fitted by double faced adhesive tape by electromagnetic shielding heat dissipation film, and diaphragm then plays the function of protective film and insulation.
The suction ripple film side of described electromagnetic shielding heat dissipation film and the side of heat dissipation film are all with double faced adhesive tape and release film, and after peeling off release film, electromagnetic shielding heat dissipation film is fitted in electronic device surface, and outer surface can pass through other functional parts of sticking double faced adhesive tape.
Claims (12)
1. an electromagnetic shielding heat dissipation film, it is characterized in that: this electromagnetic shielding heat dissipation film comprises heat radiation rete, barrier film layer and suction ripple rete, heat radiation rete is wherein graphite rete, barrier film layer is metal film, and inhaling ripple rete is the organic adhesive agent film being mixed with soft magnetic material powder.
2. electromagnetic shielding heat dissipation film as claimed in claim 1, it is characterized in that: described heat radiation rete is synthetic graphite film, its thickness is 10um-50um, and thermal conductivity is 800-2000W/mk.
3. electromagnetic shielding heat dissipation film as claimed in claim 1, it is characterized in that: described barrier film layer is metal film, its material is gold, silver, copper, nickel, iron, aluminium, zinc or alloy, described metal film is the film of single metal or the metal composite film for two-layer or two-layer above different metal formation, and its thickness is 5nm-50um.
4. electromagnetic shielding heat dissipation film as claimed in claim 1, is characterized in that: described suction ripple rete consist of the wave absorbing agent of 50-90% and the organic binder bond of 10-40%, its thickness is 20um-1mm, is greater than 50 at the magnetic permeability of 1MHz frequency.
5. the electromagnetic shielding heat dissipation film as described in claim 4, it is characterized in that: the material of described wave absorbing agent is soft magnetic alloy powder, includes but are not limited to nickel zinc-iron alloy, ambrose alloy ferroalloy, zinc chrome ferroalloy, MnZn ferroalloy, niobium zinc-iron alloy, sendust, nichrome, niobium zinc-iron alloy, iron-nickel alloy, ferroaluminium, ferrocobalt, ferrochrome, iron silicon nickel alloy, iron, silicon, aluminum and nickel alloy, magnesium manganeisen, cobalt-nickel alloy, lithium manganese alloy or lithium cadmium ferroalloy.
6. the electromagnetic shielding heat dissipation film as described in claim 4, it is characterized in that: described organic binder bond is macromolecular material, include but are not limited to phenolic resins, Lauxite, epoxy resin, acrylic resin, polyvinyl butyral resin, vinyl acetate and copolymer thereof, organic silica gel resinoid, polyurethane, rubber resin or their polymer.
7. the electromagnetic shielding heat dissipation film as described in claim 1, is characterized in that: described electromagnetic shielding heat dissipation film side or suction ripple film side have double faced adhesive tape to fit with electronic device.
8. electromagnetic shielding heat dissipation film as claimed in claim 1; it is characterized in that: the heat dissipation film side of described electromagnetic shielding heat dissipation film is with diaphragm; inhaling the side of ripple film with double faced adhesive tape and release film; after peeling off release film, suction ripple film side and electronic device are fitted by double faced adhesive tape by electromagnetic shielding heat dissipation film, and diaphragm then plays the function of protective film and insulation.
9. electromagnetic shielding heat dissipation film as claimed in claim 1; it is characterized in that: the suction ripple film side of described electromagnetic shielding heat dissipation film is with diaphragm; in the side of heat dissipation film with double faced adhesive tape and release film; after peeling off release film, heat dissipation film side and electronic device are fitted by double faced adhesive tape by electromagnetic shielding heat dissipation film, and diaphragm then plays the function of protective film and insulation.
10. electromagnetic shielding heat dissipation film as claimed in claim 1, it is characterized in that: the suction ripple film side of described electromagnetic shielding heat dissipation film and the side of heat dissipation film are all with double faced adhesive tape and release film, after peeling off release film, electromagnetic shielding heat dissipation film is fitted in electronic device surface, and outer surface can pass through other functional parts of sticking double faced adhesive tape.
The manufacture method of 11. 1 kinds of electromagnetic shielding heat dissipation films, is characterized in that it comprises step:
Step 1, is covered on ganoid high temperature resistant rete by heat dissipation film;
Step 2, passes through vapor phase method or liquid phase method or both associated methods deposition heat dissipation film surface in step 1 by metal film,
Step 3, applies the organic binder bond being mixed with soft magnetic material powder the metallic film surface formed in step 2 and solidifies under the effect of high temperature or catalyst,
Step 4, the high temperature resistant rete peeling off heat dissipation film surface obtains electromagnetic shielding heat dissipation film.
12. manufacture methods as claimed in claim 11, is characterized in that: the material of described high temperature resistance diaphragm is for be greater than 100
oindeformable material at the temperature of C.
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