TW201320116A - Electromagnetically absorbing, thermally conductive sheet and electronic instrument - Google Patents

Electromagnetically absorbing, thermally conductive sheet and electronic instrument Download PDF

Info

Publication number
TW201320116A
TW201320116A TW101129487A TW101129487A TW201320116A TW 201320116 A TW201320116 A TW 201320116A TW 101129487 A TW101129487 A TW 101129487A TW 101129487 A TW101129487 A TW 101129487A TW 201320116 A TW201320116 A TW 201320116A
Authority
TW
Taiwan
Prior art keywords
magnetic metal
metal particles
electromagnetic wave
magnetic
conductive sheet
Prior art date
Application number
TW101129487A
Other languages
Chinese (zh)
Inventor
Tatsuo Kumura
Yusuke Kubo
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW201320116A publication Critical patent/TW201320116A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Hard Magnetic Materials (AREA)
  • Soft Magnetic Materials (AREA)

Abstract

Provided is an electromagnetically absorbing, thermally conductive sheet having excellent heat conducting characteristics and electromagnetic absorbing characteristics. An electromagnetically absorbing, thermally conductive sheet (11) disposed near a high-frequency-signal-transmitting substrate (17) for transmitting a high-frequency signal, the substrate being disposed inside an electronic instrument (1), wherein the sheet is characterized in that first magnetic metallic particles and second magnetic metallic particles are included on a flexible resin material. The second magnetic metallic particles have a smaller average particle diameter and a lower electrical resistivity than first magnetic metallic particles.

Description

電磁波吸收性導熱片及電子機器 Electromagnetic wave absorptive heat conducting sheet and electronic machine

本發明係有關於一種電磁波吸收性導熱片,其可自電子機器內部的發送高頻信號之信號發送部附近,例如半導體封裝體等電子零件,向散熱板或熱管、散熱器等散熱零件高效地傳導熱,並吸收電磁波。 The present invention relates to an electromagnetic wave absorptive heat-conducting sheet which can efficiently emit heat-dissipating components such as a heat sink or a heat pipe or a heat sink from a vicinity of a signal transmitting portion for transmitting a high-frequency signal inside the electronic device, such as a semiconductor package. Conduct heat and absorb electromagnetic waves.

本申請案係基於日本2011年8月18日所申請之日本專利申請編號特願2011-178854,主張優先權,藉由參照該申請案而引用至本申請案中。 The present application is based on Japanese Patent Application No. 2011-178854, filed on Jan.

近年來,電子機器不斷呈現出小型化之趨勢,且應用程式多樣化,然而未能使耗電量亦隨之變化,機器內的散熱對策愈加受到重視。 In recent years, electronic devices have been showing a trend of miniaturization and diversification of applications. However, power consumption has not changed, and heat dissipation measures in the machine have received increasing attention.

作為上述電子機器的散熱對策,由銅或鋁等導熱率較高的金屬材料製成之散熱板或熱管、或散熱器等被廣泛利用。將該等導熱性優異的散熱零件以貼近電子機器內部的作為發熱部之半導體封裝體等電子零件的方式進行配置,以謀求散熱效果或緩和機器內部之溫度上升。並且,該等導熱性優異的散熱零件,係自作為發熱部之電子零件向低溫處配置。並且,將具有可撓性之導熱片配置於電子零件與金屬散熱零件之間,以填補當電子零件與金屬散熱零件接合時所產生之空隙。 As a countermeasure against heat dissipation of the above-described electronic device, a heat dissipation plate, a heat pipe, or a heat sink made of a metal material having a high thermal conductivity such as copper or aluminum is widely used. The heat dissipating component having excellent thermal conductivity is disposed so as to be close to an electronic component such as a semiconductor package as a heat generating portion inside the electronic device, thereby achieving a heat dissipation effect or a temperature increase inside the device. Further, these heat dissipating components having excellent thermal conductivity are disposed at a low temperature from electronic components as heat generating portions. Further, a flexible thermally conductive sheet is disposed between the electronic component and the metal heat dissipating component to fill a gap generated when the electronic component is bonded to the metal heat dissipating component.

由於該等導熱性優異的散熱零件為金屬,因此作為其副作用,因接收電信號的高諧波成分而產生電磁感應,結 果經常引起多餘的電磁波輻射。 Since the heat dissipating component excellent in such thermal conductivity is metal, as a side effect thereof, electromagnetic induction is generated by receiving a harmonic component of an electric signal. It often causes unwanted electromagnetic radiation.

又,電子機器內部的發熱部,係高電流密度的半導體元件等電子零件。高電流密度指可能導致多餘的輻射之電場強度或磁場強度較大。因此,若將金屬製成之散熱零件配置於電子零件附近,則同時接收熱與流經電子零件內之電信號的高諧波成分之情況較為常見。 Further, the heat generating portion inside the electronic device is an electronic component such as a semiconductor element having a high current density. High current density refers to the electric field strength or magnetic field strength that may cause excess radiation. Therefore, if a heat-dissipating component made of metal is disposed in the vicinity of an electronic component, it is common to receive heat and a harmonic component of an electrical signal flowing through the electronic component.

具體而言,由於散熱零件係由金屬材料製造而成,因此產生以下現象:其本身作為高諧波成分的天線而發揮功能,或作為高諧波雜訊成分的通信通路而發揮功能。 Specifically, since the heat dissipating component is made of a metal material, the following phenomenon occurs: it functions as an antenna of a harmonic component or functions as a communication path of a harmonic noise component.

於此種背景下,有導熱片為了抑制散熱零件作為天線而發揮功能,即為了切斷磁場的耦合,而含有磁性材料之情形(專利文獻1)。此種導熱片係,藉由使有機矽系或丙烯酸系等高分子材料含有例如鐵氧磁體(ferrite)等具有高磁導率之磁性材料,來實現導熱特性與電磁波抑制特性這兩種功能。 In this case, the heat transfer sheet has a function of suppressing the heat radiation component as an antenna, that is, a magnetic material is included in order to cut off the coupling of the magnetic field (Patent Document 1). Such a thermally conductive sheet has two functions of a heat conductive property and an electromagnetic wave suppressing property by including a magnetic material having a high magnetic permeability such as a ferrite or the like in a polymer material such as an organic lanthanum or an acrylic.

專利文獻1:日本特開2006-310812號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-310812

具有上述導熱特性與電磁波抑制特性兩種功能之導熱片根據作為母材之高分子材料中所含有的目標粉末之填充量,其特性顯著變化。 The thermally conductive sheet having both of the above-described heat conduction characteristics and electromagnetic wave suppression characteristics has a characteristic change depending on the amount of the target powder contained in the polymer material as the base material.

例如,導熱率若根據布魯格曼(Bruggeman)公式,存在以下關係。(參考:「電子機器零件用散熱材料之高導熱化及導熱性之測定、評價技術」,技術資訊研究所,2003年出版) For example, if the thermal conductivity is based on the Bruggeman formula, the following relationship exists. (Reference: "Measurement and Evaluation Techniques for High Thermal Conductivity and Thermal Conductivity of Thermal Materials for Electronic Machine Parts", Institute of Technical Information, 2003)

此處,λe係片材整體的導熱率,λd係導熱性材料的導熱率,λc係母材的高分子材料的導熱率,φ係導熱性材料占片材之體積分率。 Here, the thermal conductivity of the entire λ e- based sheet, the thermal conductivity of the λ d- based thermal conductive material, the thermal conductivity of the λ c -based base material, and the φ-based thermal conductive material account for the volume fraction of the sheet.

又,通常使用相對複磁導率(μrr’-jμr")的虛數部分μr",作為電磁波抑制特性的指標。關於該磁氣特性,若根據例如李赫田納科(Lichtenecker)公式,亦存在以下關係。(參考:「低損耗高介電常數磁體之相關研究」,電子資訊通信學會論文期刊C,Vol.J86-C,No.4,pp.450-456,2003) log(μ r )=v 1×log(μ r1)+v 2×log(μ r2) Further, an imaginary part μ r " with respect to the complex magnetic permeability (μ r = μ r '-jμ r ") is generally used as an index of electromagnetic wave suppression characteristics. Regarding the magnetic gas characteristics, the following relationship also exists according to, for example, the Lichtenecker formula. (Reference: "Research on Low Loss and High Dielectric Constant Magnets", Journal of Electronic Information and Communication Society, Vol. J86-C, No. 4, pp. 450-456, 2003) log(μ r )= v 1 ×log(μ r 1 )+ v 2 ×log(μ r 2 )

此處,μr係片材整體的相對複磁導率,μr1係磁性材料的相對複磁導率,μr2係母材的相對複磁導率,υ1係磁性材料的體積分率,υ2係母材的體積分率。 Here, μ r the entire sheet based complex relative permeability, complex relative permeability μ r1 based magnetic material, the complex relative permeability μ r2-based base material, υ 1 based volume fraction of magnetic material, υ 2 is the volume fraction of the base metal.

如上所述,導熱特性及電磁波抑制特性根據填充於各片材之磁性材料及導熱性材料的填充量,而顯著變化。 As described above, the heat conduction characteristics and the electromagnetic wave suppression characteristics significantly change depending on the filling amount of the magnetic material and the heat conductive material filled in each sheet.

然而,在製造此種電磁波吸收性導熱片時,僅是將任意的磁性粉末與樹脂混合,則粉末的填充量有限。 However, when such an electromagnetic wave absorptive heat conductive sheet is manufactured, only the arbitrary magnetic powder and the resin are mixed, and the filling amount of the powder is limited.

當最為緊密地填充相同尺寸的球狀磁性粉末時,其最大填充率為74vol%。當填充更多的磁性粉末時,在先前填充之球狀磁性粉末的縫隙中,依次填入直徑較小的球狀磁性粉末。 When the spherical magnetic powder of the same size was most closely packed, the maximum filling ratio was 74 vol%. When more magnetic powder is filled, spherical magnetic powder having a smaller diameter is sequentially filled in the gap of the previously filled spherical magnetic powder.

如此一來,當於樹脂中填充物質時,與樹脂的親密性 成為問題,填充物質之比表面積較小的可高填充,通常,粒徑較大的填充物質由於單位體積的比表面積較小,因此容易高填充。 In this way, when the material is filled in the resin, the intimacy with the resin It is a problem that the filling material has a small specific surface area and can be highly filled. Generally, a filler having a large particle diameter is easy to be highly filled because the specific surface area per unit volume is small.

然而,當使用粒徑較大的金屬磁性粒子作為填充物質時,受集膚效應(skin effect)影響,高頻帶中的磁導率降低,無法實現良好的磁吸收特性。如果使用電阻率較高的金屬材料以減輕此種集膚效應,通常會產生導熱率變小,導熱性受損之問題。 However, when a metal magnetic particle having a large particle diameter is used as a filling substance, the magnetic permeability in the high frequency band is lowered by the skin effect, and good magnetic absorption characteristics cannot be achieved. If a metal material having a relatively high resistivity is used to alleviate such a skin effect, there is usually a problem that the thermal conductivity is small and the thermal conductivity is impaired.

本發明係鑒於此種實際情況而提出,其目的在於提供一種導熱特性與電磁波吸收特性兩種功能良好的電磁波吸收性導熱片、及構裝有該電磁波吸收性導熱片之電子機器。 The present invention has been made in view of such circumstances, and it is an object of the invention to provide an electromagnetic wave absorptive heat conductive sheet having two functions of heat conduction characteristics and electromagnetic wave absorption characteristics, and an electronic apparatus incorporating the electromagnetic wave absorptive heat conductive sheet.

為解決上述課題,本發明提供一種電磁波吸收性導熱片,配置於電子機器內部的發送高頻信號之信號發送部附近,其特徵在於,於可撓性樹脂材料含有第1磁性金屬粒子及第2磁性金屬粒子,其中該第2磁性金屬粒子之平均粒徑與電阻率均小於第1磁性金屬粒子。 In order to solve the above problems, the present invention provides an electromagnetic wave absorptive heat conductive sheet which is disposed in the vicinity of a signal transmitting portion for transmitting a high frequency signal inside an electronic device, and is characterized in that the flexible resin material contains the first magnetic metal particles and the second The magnetic metal particles, wherein the second magnetic metal particles have an average particle diameter and a specific resistance smaller than that of the first magnetic metal particles.

又,本發明的電子機器具備:發送高頻信號之信號發送部;及,配置於信號發送部附近之電磁波吸收性導熱片;電磁波吸收性導熱片於可撓性樹脂材料含有第1磁性金屬粒子及第2磁性金屬粒子,其中該第2磁性金屬粒子之平均粒徑與電阻率均小於第1磁性金屬粒子。 Moreover, the electronic device of the present invention includes: a signal transmitting unit that transmits a high-frequency signal; and an electromagnetic wave absorptive heat-conductive sheet disposed in the vicinity of the signal transmitting unit; and the electromagnetic wave-absorbing heat-conductive sheet contains the first magnetic metal particle in the flexible resin material And the second magnetic metal particles, wherein the second magnetic metal particles have an average particle diameter and a specific resistance smaller than that of the first magnetic metal particles.

由於本發明係於可撓性樹脂材料含有第1磁性金屬粒子及第2磁性金屬粒子,其中該第2磁性金屬粒子之平均粒徑與電阻率均小於該第1磁性金屬粒子,因此,可提供 一種導熱特性與電磁波抑制特性兩種功能良好的導熱片。進而,可提供一種具有高導熱性與高電磁波抑制效果,且兼具可撓性之電磁波抑制散熱片。 In the present invention, the flexible resin material contains the first magnetic metal particles and the second magnetic metal particles, wherein the second magnetic metal particles have an average particle diameter and a specific resistance which are smaller than the first magnetic metal particles, and therefore, A thermal conductive sheet having two functions of heat conduction characteristics and electromagnetic wave suppression characteristics. Further, it is possible to provide an electromagnetic wave suppression fin having both high thermal conductivity and high electromagnetic wave suppression effect and having flexibility.

以下,參照圖式,詳細地說明實施方式。再者,本發明並非僅限定於以下實施方式,在不脫離本發明的要旨之範圍內,當可作各種更動。 Hereinafter, embodiments will be described in detail with reference to the drawings. Further, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the gist of the invention.

應用本發明之電磁波吸收性導熱片,係配置於電子機器內部的發送高頻信號之信號發送部附近。該電磁波吸收性導熱片,係自例如半導體封裝體等電子零件,向散熱板或熱管、散熱器等散熱零件高效地傳導熱,並吸收電磁波。 The electromagnetic wave absorptive heat conductive sheet to which the present invention is applied is disposed in the vicinity of a signal transmitting portion that transmits a high frequency signal inside the electronic device. The electromagnetic wave absorptive heat conductive sheet is configured to efficiently conduct heat to heat dissipating components such as a heat sink, a heat pipe, and a heat sink, and absorb electromagnetic waves, for example, from an electronic component such as a semiconductor package.

<貼著有導熱性片之電路板> <Ply board with thermal conductive sheet>

應用本發明之電磁波吸收性導熱片,係貼著於例如圖1A所示之電子機器1內部的電路板1a上。即,如圖1A所示之具有電磁波吸收性與導熱性之片材11,係配置於發送高頻信號之高頻信號發送基板17、與使高頻信號發送基板17所發出之熱散熱之散熱金屬板12之間。具體而言,片材11係以分別使一面11a緊貼於將構成高頻信號發送基板17之半導體封裝體密封之樹脂模具13,使另一面11b緊貼於散熱金屬板12的方式貼著於電路板1a。 The electromagnetic wave absorptive heat conductive sheet to which the present invention is applied is attached to, for example, the circuit board 1a inside the electronic apparatus 1 shown in Fig. 1A. That is, the sheet 11 having electromagnetic wave absorptivity and thermal conductivity as shown in Fig. 1A is disposed on the high-frequency signal transmitting substrate 17 for transmitting a high-frequency signal and the heat radiating heat radiated from the high-frequency signal transmitting substrate 17. Between the metal plates 12. Specifically, the sheet 11 is attached to the resin mold 13 that seals the semiconductor package constituting the high-frequency signal transmission substrate 17 with the one surface 11a, and the other surface 11b is adhered to the heat dissipation metal plate 12, respectively. Circuit board 1a.

高頻信號發送基板17,係電子機器1內部的發送高頻信號之信號發送部的具體例,由在介電基板16的一面形成為GND電極之銅箔15、與在另一面經圖案化而構成之銅的信號線14形成,並構成微帶線(microstripline)。 The high-frequency signal transmitting substrate 17 is a specific example of a signal transmitting unit that transmits a high-frequency signal inside the electronic device 1. The copper foil 15 formed as a GND electrode on one surface of the dielectric substrate 16 is patterned on the other surface. A signal line 14 of copper is formed and constitutes a microstrip line.

高頻信號發送基板17,係設計為將本身作業時的遠電場強度抑制在特定值以下,以避免產生多餘的輻射的影響。在具有此種高頻信號發送基板17之電路板1a中,散熱金屬板12,透過片材11,接收流經相對向之高頻信號發送基板17的信號線14內之電信號的高諧波成分,並作為高諧波成分的天線而發揮功能,結果使遠電場強度增大。為了抑制散熱金屬板12作為天線而發揮作用,並實現良好的導熱特性,於片材11中含有磁性金屬粒子,且使磁性金屬粒子占片材11之體積分率在特定值以上。 The high-frequency signal transmitting substrate 17 is designed to suppress the strength of the far electric field when operating itself to a specific value or less to avoid the influence of excessive radiation. In the circuit board 1a having such a high-frequency signal transmitting substrate 17, the heat-dissipating metal plate 12, through the sheet 11, receives the harmonics of the electric signal flowing through the signal line 14 opposite to the high-frequency signal transmitting substrate 17. The component functions as an antenna of a harmonic component, and as a result, the strength of the far electric field is increased. In order to prevent the heat radiating metal plate 12 from functioning as an antenna and to realize good heat conduction characteristics, the sheet 11 contains magnetic metal particles, and the magnetic metal particles occupy the volume fraction of the sheet 11 at a specific value or more.

再者,例如圖1B所示,具有應用本發明之電磁波吸收性導熱功能之片材11,亦可不緊貼於散熱金屬板12。即,如圖1B所示地使用,藉此,片材11不會使高頻信號發送基板17所產生之熱的散熱效率惡化,可吸收由高頻信號發送基板17所放出之電磁波。 Further, for example, as shown in FIG. 1B, the sheet 11 having the electromagnetic wave absorbing heat transfer function to which the present invention is applied may not be in close contact with the heat dissipation metal plate 12. That is, as shown in FIG. 1B, the sheet 11 does not deteriorate the heat radiation efficiency of the heat generated by the high-frequency signal transmitting substrate 17, and absorbs the electromagnetic waves emitted from the high-frequency signal transmitting substrate 17.

繼而,說明應用本發明之片材11的具體構成。片材11係於可撓性樹脂材料含有第1磁性金屬粒子及第2磁性金屬粒子,其中該第2磁性金屬粒子之平均粒徑與電阻率均小於第1磁性金屬粒子。 Next, a specific configuration of the sheet 11 to which the present invention is applied will be described. The sheet 11 is composed of a first magnetic metal particle and a second magnetic metal particle in the flexible resin material, wherein the second magnetic metal particle has an average particle diameter and a specific resistance smaller than that of the first magnetic metal particle.

由後述性能評價可知,具有此種構成之片材11,可同時具備良好的導熱特性與良好的電磁波抑制特性。 As is apparent from the performance evaluation described later, the sheet 11 having such a configuration can have both good heat conductivity and good electromagnetic wave suppression characteristics.

繼而,使用於下列條件下製成之片材11作為電磁波吸收性導熱片的實施例,並評價導熱特性與電磁波抑制效果。 Then, the sheet 11 produced under the following conditions was used as an example of the electromagnetic wave absorptive heat conductive sheet, and the heat conduction characteristics and the electromagnetic wave suppression effect were evaluated.

首先,使用矽氧樹脂作為可撓性樹脂材料,使用平均粒徑為6μm之球狀磁性非晶合金作為第1磁性金屬粒子, 使用平均粒徑為1.5μm之球狀鐵粉作為第2磁性金屬粒子。在本實施方式中,「平均粒徑」具體指依據中徑(亦稱為D50。)定義粉體之值,所述中徑係當由某一粒徑分成兩個時,較大一側與較小一側為等量,例如在該實施例中,可利用雷射繞射、散射方法來計算。 First, a neodymium resin is used as the flexible resin material, and a spherical magnetic amorphous alloy having an average particle diameter of 6 μm is used as the first magnetic metal particles. Spherical iron powder having an average particle diameter of 1.5 μm was used as the second magnetic metal particles. In the present embodiment, the "average particle diameter" specifically means the value of the powder defined by the median diameter (also referred to as D50.), when the median diameter is divided into two by a certain particle diameter, the larger side is The smaller side is equal, for example, in this embodiment, it can be calculated using a laser diffraction, scattering method.

於100g矽氧樹脂中,加入10g耦合劑,50vol%球狀磁性非晶合金及24vol%球狀鐵粉,並用真空攪拌機攪拌,然後使其成為厚1.5mm的片狀,在100℃、30分鐘之環境下使之硬化,從而製造電磁波吸收性導熱片。 10 g of a coupling agent, 50 vol% of a spherical magnetic amorphous alloy and 24 vol% of spherical iron powder were added to 100 g of the epoxy resin, and stirred with a vacuum stirrer, and then made into a sheet having a thickness of 1.5 mm at 100 ° C for 30 minutes. In the environment, it is hardened to produce an electromagnetic wave absorbing heat conductive sheet.

此處,在實施例的片材中,為了實現高頻信號所放出之電磁波的吸收性,例如實現1GHz帶域以上的電磁波吸收性,使用電阻率為0.5μΩm以上之材料作為第1磁性金屬粒子,但就增大平均粒徑並提高填充性之觀點來看,尤佳為使用電阻率為0.8μΩm以上之材料。又,在實施例的片材中,第2磁性金屬粒子的電阻率小於第1磁性金屬粒子,即低於0.5μΩm即可,尤佳為0.3μΩm以下,以實現良好的導熱性。 Here, in the sheet of the embodiment, in order to realize the absorption of electromagnetic waves emitted from the high-frequency signal, for example, electromagnetic wave absorption of a band of 1 GHz or more is achieved, and a material having a specific resistance of 0.5 μΩm or more is used as the first magnetic metal particle. However, from the viewpoint of increasing the average particle diameter and improving the filling property, it is particularly preferable to use a material having a specific resistance of 0.8 μΩm or more. Further, in the sheet of the example, the resistivity of the second magnetic metal particles is smaller than the first magnetic metal particles, that is, less than 0.5 μΩm, and particularly preferably 0.3 μΩm or less, in order to achieve good thermal conductivity.

高電阻率的磁性金屬非晶粒子適合作為第1及第2磁性金屬粒子。磁性金屬非晶粒子例如可列舉:Fe-Si-B系、Fe-Si-B-C系、Co-Si-B系、Co-Zr系、Co-Nb系及Co-Ta系等,但並非僅限於此。 The high-resistivity magnetic metal amorphous particles are suitable as the first and second magnetic metal particles. Examples of the magnetic metal amorphous particles include Fe-Si-B based, Fe-Si-BC based, Co-Si-B based, Co-Zr based, Co-Nb based, and Co-Ta based, but not limited thereto. this.

再者,並非僅限於磁性金屬非晶系,亦可使用結晶系、微結晶系的磁性材料。作為結晶系的磁性金屬,可列舉出,Fe系、Co系、Ni系,或Fe-Ni系、Fe-Co系、Fe-Al 系、Fe-Si系、Fe-Si-Al系、Fe-Ni-Si-Al系等。作為微結晶系的磁性金屬,係在該等結晶系材料中加入微量的N、C、O及B等,並使其微細結晶化後的材料。 Further, it is not limited to the magnetic metal amorphous system, and a crystalline or microcrystalline magnetic material may be used. Examples of the magnetic metal of the crystal system include Fe-based, Co-based, Ni-based, or Fe-Ni-based, Fe-Co-based, and Fe-Al. System, Fe-Si system, Fe-Si-Al system, Fe-Ni-Si-Al system, and the like. The magnetic metal of the microcrystalline system is a material obtained by adding a small amount of N, C, O, B, or the like to the crystal material to be finely crystallized.

在實施例的片材中,使用該等複數種材料中電阻率為0.5μΩm以上且球、多面體等大致呈球狀之磁性粒子的至少一種以上來作為第1磁性金屬粒子,並使用相較於第1磁性金屬粒子,平均粒徑較小,且電阻率小於0.5μΩm之磁性粒子的至少一種以上來作為第2磁性金屬粒子。 In the sheet of the embodiment, at least one or more magnetic particles having a specific resistance of 0.5 μΩm or more and a substantially spherical shape such as a sphere or a polyhedron are used as the first magnetic metal particles, and the sheet is used as compared with The first magnetic metal particles have at least one of magnetic particles having a small average particle diameter and a specific resistance of less than 0.5 μΩm as the second magnetic metal particles.

又,若第2磁性金屬粒子的平均粒徑相對於第1磁性金屬粒徑,粒徑比率在5~50%的範圍內,則可設定為複數種。即,可組合使用複數種材料、組成、粒徑,來作為第2磁性金屬粒子。 In addition, when the average particle diameter of the second magnetic metal particles is in the range of 5 to 50% with respect to the particle diameter of the first magnetic metal, a plurality of types can be set. That is, a plurality of materials, compositions, and particle diameters can be used in combination as the second magnetic metal particles.

又,在實施例的片材中,除第2磁性金屬粒子的粉體之外,亦可添加氧化鋁、氮化硼、氮化矽、氮化鋁及碳化矽等導熱粒子,以提高導熱率。較佳為,此種導熱粒子相較於第1磁性金屬粒子,粒徑較小,且形狀近似於球形。 Further, in the sheet of the embodiment, in addition to the powder of the second magnetic metal particles, heat-conductive particles such as alumina, boron nitride, tantalum nitride, aluminum nitride, and tantalum carbide may be added to improve the thermal conductivity. . Preferably, the thermally conductive particles have a smaller particle diameter than the first magnetic metal particles and have a shape similar to a spherical shape.

又,可撓性樹脂例如可列舉:環氧樹脂、酚醛樹脂、三聚氰胺樹脂、脲樹脂、不飽和聚酯等樹脂;或矽氧橡膠、胺酯橡膠、丙烯酸橡膠、丁基橡膠及乙烯丙烯橡膠等橡膠,但並非僅限於此。又,在實施例的片材中,更可適量添加阻燃劑、反應調節劑、交聯劑及矽烷耦合劑等表面處理劑而使用。 Further, examples of the flexible resin include resins such as an epoxy resin, a phenol resin, a melamine resin, a urea resin, and an unsaturated polyester; or a silicone rubber, an amine ester rubber, an acrylic rubber, a butyl rubber, and an ethylene propylene rubber. Rubber, but not limited to this. Further, in the sheet of the examples, a surface treatment agent such as a flame retardant, a reaction modifier, a crosslinking agent, or a decane coupling agent may be added in an appropriate amount.

測定相對複磁導率與導熱率,以調查如此製成之片材的性能。 The relative complex permeability and thermal conductivity were measured to investigate the properties of the thus produced sheet.

首先,如下述所地進行複磁導率之測定。將製成之片材打通成外徑20mm、內徑6mm之環狀,從而製造測定用樣品。使用安捷倫科技公司(Agilent Technologies)製造之測定器「Agilent 4291B RF阻抗/材料分析儀」,測定該測定用樣品的相對複磁導率。 First, the measurement of the complex permeability was carried out as follows. The prepared sheet was punched into a ring shape having an outer diameter of 20 mm and an inner diameter of 6 mm to prepare a sample for measurement. The relative complex permeability of the sample for measurement was measured using an Agilent 4291B RF Impedance/Material Analyzer manufactured by Agilent Technologies.

又,如下所述地進行導熱率之測定。將製成之片材切割成大小為1cm左右的方形,並將該切割出之樣品夾持於金屬性散熱器與金屬製加熱箱(heater case)之間,在以1kgf的力加壓使其接觸之狀態下,對金屬製加熱箱充電而進行加熱。當金屬製加熱箱與金屬性散熱器達到固定溫度時,測量其間的溫度差。根據下述公式,計算導熱率。 Further, the measurement of the thermal conductivity was carried out as follows. The prepared sheet was cut into a square having a size of about 1 cm, and the cut sample was sandwiched between a metallic heat sink and a metal heater case, and pressed at a force of 1 kgf. In the state of contact, the metal heating box is charged and heated. When the metal heating box and the metal heat sink reach a fixed temperature, the temperature difference between them is measured. The thermal conductivity is calculated according to the following formula.

導熱率=(電力×樣品厚度)/(溫度差×測定面積) Thermal conductivity = (electricity × sample thickness) / (temperature difference × measured area)

藉由上述測定,從而獲得如圖2所示之相對複磁導率的測定結果。即,圖2係表示相對複磁導率的虛數部分的測定結果。由於相對複磁導率的虛數部分為磁導率的磁損耗項,因此,可用作磁吸收特性的評價指標。由圖2可明確看出,以2GHz為中心,磁損耗較大。 By the above measurement, the measurement result of the relative complex magnetic permeability as shown in Fig. 2 was obtained. That is, Fig. 2 shows the measurement results of the imaginary part of the relative complex permeability. Since the imaginary part of the relative complex permeability is a magnetic loss term of magnetic permeability, it can be used as an evaluation index of magnetic absorption characteristics. It can be clearly seen from Fig. 2 that the magnetic loss is large centering on 2 GHz.

此種磁性金屬材料的高頻中的磁損耗,主要係由渦流損耗與鐵磁共振所導致。 The magnetic loss in the high frequency of such a magnetic metal material is mainly caused by eddy current loss and ferromagnetic resonance.

其中,磁性材料的飽和磁化越高,鐵磁共振的峰值頻率越向高頻側偏移。其原因在於,當初始磁導率為μi,共振頻率為fr,且飽和磁化為Is時,(μi-1)fr與Is成比例關係。在如此高填充磁性粒子之片狀成形品中,由磁性粒子間的磁結合,去磁場的影響銳減,磁導率升高,共振頻 率向低頻側移動,但當磁體的飽和磁化為100A.m2/kg以上時,可使共振頻率處於GHz帶域中。因此,在低於該共振頻率之頻帶中,渦流損耗成為磁損耗的主體。作為參考文獻,可列舉出,久村、久保、加藤:「電磁雜訊抑制導熱片」,第33次日本磁氣學會學術演講會摘要集,14pF-14,(2009)。 Among them, the higher the saturation magnetization of the magnetic material, the more the peak frequency of the ferromagnetic resonance shifts toward the high frequency side. The reason is that (μ i -1) fr is proportional to Is when the initial magnetic permeability is μ i , the resonance frequency is fr, and the saturation magnetization is Is. In the sheet-like molded article in which the magnetic particles are highly filled, the influence of the demagnetizing field is sharply reduced by the magnetic coupling between the magnetic particles, the magnetic permeability is increased, and the resonance frequency is shifted to the low frequency side, but when the saturation magnetization of the magnet is 100 A. When m 2 /kg or more, the resonance frequency can be made to be in the GHz band. Therefore, in a frequency band lower than the resonance frequency, the eddy current loss becomes the main body of the magnetic loss. As a reference, Kyumura, Kubo, Kato: "Electromagnetic noise suppression heat transfer sheet", the 33rd Japan Society of Magnetic Gas Academic Lecture Summary, 14pF-14, (2009).

又,球狀磁性金屬粒子中由渦流損耗所導致之磁導率的惡化,可使用以米氏散射(Mie scattering)為基礎之複數渦流因素(R.Ramprasad and et al:J.Appl.Phus,96519(2004))作為評價指標。 Further, in the spherical magnetic metal particles, the magnetic permeability due to the eddy current loss is deteriorated, and a complex eddy current factor based on Mie scattering can be used (R. Ramprasad and et al: J. Appl. Phus, 96519 (2004)) as an evaluation index.

圖3係將球狀磁性金屬粒子的平均粒徑設為6μm,初始磁導率μi設為40,並計算當改變電阻率時的相對複磁導率的虛數部分μr"的頻率特性,以評價球狀磁性金屬粒子中由渦流損耗所導致之磁導率的惡化。 3 is a graph showing the average particle diameter of the spherical magnetic metal particles of 6 μm, the initial magnetic permeability μ i of 40, and the frequency characteristic of the imaginary part μ r " of the relative complex magnetic permeability when the resistivity is changed, The deterioration of the magnetic permeability caused by the eddy current loss in the spherical magnetic metal particles was evaluated.

此處,相對複磁導率的虛數部分係使用初始磁導率μr"進行規格化而示出。如圖3所明示,若電阻率較低,則磁損耗向低頻層大幅偏移。在使用有平均粒徑為6μm之球狀磁性金屬粒子之片材中,為了使磁損耗的峰值處於GHz帶域中,電阻率須為0.5μΩm以上。 Here, the imaginary part of the relative complex permeability is normalized by using the initial magnetic permeability μ r ". As shown in Fig. 3, if the resistivity is low, the magnetic loss is largely shifted to the low frequency layer. In the sheet using spherical magnetic metal particles having an average particle diameter of 6 μm, the resistivity must be 0.5 μΩm or more in order to make the peak of the magnetic loss in the GHz band.

又,為了獲得與使用電阻率為0.5μΩm,平均粒徑為6μm,初始磁導率μi為40之磁性金屬粒子之片材相同的頻率特性,在使用電阻率為1.1μΩm、0.9μΩm、0.1μΩm之磁性金屬粒子之片材中,需要分別使平均粒徑為9μm、8μm、2.8μm,以。如此一來,若為電阻率較高的材料, 即使增大粒徑,亦可獲得良好的吸收高頻帶電磁波之頻率特性,若為電阻率較低的材料,則必須減小粒徑,才可獲得良好的吸收高頻帶電磁波之頻率特性。 Further, in order to obtain the same frequency characteristics as the sheet of the magnetic metal particles having an electric resistivity of 0.5 μΩm, an average particle diameter of 6 μm, and an initial magnetic permeability μ i of 40, the resistivity was 1.1 μΩm, 0.9 μΩm, and 0.1. In the sheet of magnetic metal particles of μΩm, it is necessary to have an average particle diameter of 9 μm, 8 μm, or 2.8 μm, respectively. In this way, if the material has a high resistivity, even if the particle size is increased, the frequency characteristics of the high-frequency electromagnetic wave can be well absorbed. If the material has a low resistivity, the particle size must be reduced. A good frequency characteristic of absorbing high frequency electromagnetic waves is obtained.

在實施例的片材中,為了實現吸收如上所述之高頻帶的電磁波之頻率特性,考慮以下幾點,將平均粒徑不同的磁性金屬粒子高填充於可撓性樹脂材料。 In order to realize the frequency characteristics of the electromagnetic wave in the high frequency band as described above, the magnetic metal particles having different average particle diameters are highly filled in the flexible resin material in consideration of the following points.

首先,作為常被用於磁性金屬粒子之製造的方法,有霧化法,可製造之粒徑通常為數μm~數十μm,用於商業之材料的最小粒徑為約5~6μm。 First, as a method which is often used for the production of magnetic metal particles, there is an atomization method, and the particle diameter which can be produced is usually several μm to several tens of μm, and the minimum particle diameter of a material for commercial use is about 5 to 6 μm.

因此,作為用於吸收GHz帶中的電磁波之電磁波吸收性片材的磁性金屬粒子,例如,當使用平均粒徑為5~6μm之粒子時,需要使用電阻率為0.5μΩm以上之材料。 Therefore, as the magnetic metal particles for absorbing the electromagnetic wave absorptive sheet of the electromagnetic wave in the GHz band, for example, when a particle having an average particle diameter of 5 to 6 μm is used, it is necessary to use a material having a specific resistance of 0.5 μΩm or more.

將此種用於吸收GHz帶中的電磁波之材料作為第1磁性金屬材料,進而將平均粒徑較小的磁性金屬粒子作為第2磁性金屬材料,配置為填充於第1磁性金屬材料之間,則可提高粒子整體的填充率。 The material for absorbing the electromagnetic wave in the GHz band is used as the first magnetic metal material, and the magnetic metal particles having a small average particle diameter are disposed as the second magnetic metal material, and are placed between the first magnetic metal materials. This increases the filling rate of the particles as a whole.

尤其,使用相對於第1磁性金屬粒子的平均粒徑,粒徑大小為5~50%之第2磁性金屬粒子,且相對於第1磁性金屬粒子,第2磁性金屬粒子的混合比率為10~60vol%,藉此,可提高磁性金屬粒子占可撓性樹脂之填充。 In particular, the second magnetic metal particles having a particle diameter of 5 to 50% with respect to the average particle diameter of the first magnetic metal particles are used, and the mixing ratio of the second magnetic metal particles to the first magnetic metal particles is 10 to 10 60 vol%, whereby the magnetic metal particles can be filled in the filling of the flexible resin.

此處,第2磁性金屬粒子,由於粒徑小而不易受渦流損耗之影響,因此無需提高電阻率,就提高導熱率之觀點來看,選擇電阻率較小的粒子。其原因在於,由於金屬中的自由電子之移動影響導熱率,因此電導率較高,即電阻 率較小的金屬材料可提高導熱率。 Here, since the second magnetic metal particles are less susceptible to eddy current loss due to the small particle size, particles having a small specific resistance are selected from the viewpoint of improving the thermal conductivity without increasing the electrical resistivity. The reason is that since the movement of free electrons in the metal affects the thermal conductivity, the electrical conductivity is high, that is, the electrical resistance A metal material with a lower rate can increase the thermal conductivity.

為了同時具有在良好的高頻帶中的電磁波吸收性與導熱性,在上述實施例中,選擇電阻率為1.1μΩm、平均粒徑為6μm之球狀磁性非晶合金作為第1磁性金屬粒子,選擇電阻率為0.15μΩm、平均粒徑為1.5μm之球狀鐵粉作為第2磁性金屬粒子。因此,在實施例的片材中,可在如圖3所示之GHz帶域中獲得較大的磁損耗,並實現良好的電磁雜訊抑制效果。 In order to simultaneously have electromagnetic wave absorptivity and thermal conductivity in a favorable high frequency band, in the above embodiment, a spherical magnetic amorphous alloy having a specific resistance of 1.1 μΩm and an average particle diameter of 6 μm is selected as the first magnetic metal particles. Spherical iron powder having a specific resistance of 0.15 μΩm and an average particle diameter of 1.5 μm was used as the second magnetic metal particles. Therefore, in the sheet of the embodiment, a large magnetic loss can be obtained in the GHz band as shown in FIG. 3, and a good electromagnetic noise suppression effect can be achieved.

又,在實施例的片材中,導熱率亦較高,為2.0W/m.K,兼具優異的導熱特性。 Moreover, in the sheet of the example, the thermal conductivity is also high, which is 2.0 W/m. K, has excellent thermal conductivity.

此處,作為比較對象,將與實施例組成相同的非晶粉用於磁性金屬粒子,與各實施例相同地分別摻合50vol%、24vol%之平均粒徑為10μm、3μm之粒子,從而製造出片材,並對導熱率進行評價。比較對象的片材的導熱率為1.71W/m.K。相較於此種比較對象的片材,實施例的片材11,由於係使用電阻率低於非晶粉之鐵粉,來作為第2磁性金屬粒子,藉此,可將導熱率提高18%左右。 Here, as a comparison object, the amorphous powder having the same composition as that of the examples was used for the magnetic metal particles, and 50 vol% and 24 vol% of particles having an average particle diameter of 10 μm and 3 μm were respectively blended in the same manner as in the respective examples. The sheet was taken out and the thermal conductivity was evaluated. The thermal conductivity of the sheet of the comparison object was 1.71 W/m. K. Compared with the sheet of the comparative object, the sheet 11 of the embodiment is used as the second magnetic metal particles by using iron powder having a lower specific resistance than the amorphous powder, whereby the thermal conductivity can be increased by 18%. about.

如上所述,在實施例的片材中,自實現高頻帶中的電磁波吸收性之觀點而言,因為抑制集膚效應,故即便於第1磁性金屬粒子使用電阻率較高的材料,亦可藉由於第2磁性金屬粒子使用電阻率較低的材料,來使成品片材的導熱率大幅提高。 As described above, in the sheet of the embodiment, since the skin effect is suppressed from the viewpoint of achieving electromagnetic wave absorptivity in the high frequency band, even if the first magnetic metal particle is made of a material having a high specific resistance, Since the second magnetic metal particles use a material having a low specific resistance, the thermal conductivity of the finished sheet is greatly improved.

如上所述,由於應用本發明之電磁波吸收性導熱片係於可撓性樹脂材料含有第1磁性金屬粒子及第2磁性金屬 粒子,其中該第2磁性金屬粒子之平均粒徑與電阻率均小於該第1磁性金屬粒子,故可提供一種導熱特性與電磁波抑制特性兩種功能良好的導熱片。進而,可提供一種具有高導熱性與高電磁波抑制效果,且兼具可撓性之電磁波抑制散熱片。 As described above, the electromagnetic wave absorptive heat conductive sheet to which the present invention is applied is based on the flexible resin material containing the first magnetic metal particles and the second magnetic metal. In the particles, the average particle diameter and the specific resistance of the second magnetic metal particles are smaller than those of the first magnetic metal particles, so that a heat conductive sheet having both functions of heat conduction characteristics and electromagnetic wave suppression characteristics can be provided. Further, it is possible to provide an electromagnetic wave suppression fin having both high thermal conductivity and high electromagnetic wave suppression effect and having flexibility.

尤其,電磁波吸收性導熱片,藉由選擇第1磁性金屬粒子的電阻率為0.5μΩm以上之材料,並選擇第2磁性金屬粒子的電阻率小於0.5μΩm之材料,可高效地吸收自發送GHz帶域之信號發送部所放射之電磁波,並獲得良好的導熱性。 In particular, the electromagnetic wave absorptive heat conductive sheet can efficiently absorb the self-transmitting GHz band by selecting a material having a first magnetic metal particle having a specific resistance of 0.5 μΩm or more and selecting a material having a second magnetic metal particle having a specific resistance of less than 0.5 μΩm. The electromagnetic wave emitted by the signal transmitting unit of the domain obtains good thermal conductivity.

1‧‧‧電子機器 1‧‧‧Electronic machines

1a‧‧‧電路板 1a‧‧‧Circuit board

11‧‧‧片材 11‧‧‧Sheet

12‧‧‧散熱金屬板 12‧‧‧heated metal sheet

13‧‧‧樹脂模具 13‧‧‧Resin mould

14‧‧‧信號線 14‧‧‧ signal line

15‧‧‧銅箔 15‧‧‧ copper foil

16‧‧‧介電基板 16‧‧‧Dielectric substrate

17‧‧‧高頻信號發送基板 17‧‧‧High frequency signal transmission substrate

圖1A係表示構裝有應用本發明之電磁波吸收性導熱片之電子機器的構成。 Fig. 1A is a view showing the configuration of an electronic apparatus incorporating an electromagnetic wave absorptive heat conductive sheet to which the present invention is applied.

圖1B係表示構裝有應用本發明之電磁波吸收性導熱片之電子機器的變化例之圖。 Fig. 1B is a view showing a modification of an electronic apparatus incorporating the electromagnetic wave absorptive heat conductive sheet to which the present invention is applied.

圖2係用於說明應用本發明之電磁波吸收性導熱性片的電磁波吸收特性之圖。 Fig. 2 is a view for explaining electromagnetic wave absorption characteristics of an electromagnetic wave absorptive heat conductive sheet to which the present invention is applied.

圖3係用於說明與應用本發明之電磁波吸收性導熱性片的電磁波吸收特性相關之頻率特性之圖。 Fig. 3 is a view for explaining frequency characteristics relating to electromagnetic wave absorption characteristics of the electromagnetic wave absorptive thermal conductive sheet of the present invention.

1‧‧‧電子機器 1‧‧‧Electronic machines

1a‧‧‧電路板 1a‧‧‧Circuit board

11‧‧‧片材 11‧‧‧Sheet

11a、11b‧‧‧表面 11a, 11b‧‧‧ surface

12‧‧‧散熱金屬板 12‧‧‧heated metal sheet

13‧‧‧樹脂模具 13‧‧‧Resin mould

14‧‧‧信號線 14‧‧‧ signal line

15‧‧‧銅箔 15‧‧‧ copper foil

16‧‧‧介電基板 16‧‧‧Dielectric substrate

17‧‧‧高頻信號發送基板 17‧‧‧High frequency signal transmission substrate

Claims (5)

一種電磁波吸收性導熱片,配置於電子機器內部的發送高頻信號之信號發送部附近,其特徵在於:於可撓性樹脂材料含有第1磁性金屬粒子及第2磁性金屬粒子,其中該第2磁性金屬粒子之平均粒徑與電阻率均小於該第1磁性金屬粒子。 An electromagnetic wave absorptive heat conductive sheet is disposed in the vicinity of a signal transmitting portion for transmitting a high frequency signal inside the electronic device, and is characterized in that the flexible resin material contains the first magnetic metal particles and the second magnetic metal particles, wherein the second The average particle diameter and the specific resistance of the magnetic metal particles are both smaller than the first magnetic metal particles. 如申請專利範圍第1項之電磁波吸收性導熱片,其中,該信號發送部,發送高於1GHz之高頻信號,該第1磁性金屬粒子之電阻率為0.5μΩm以上,該第2磁性金屬粒子之電阻率小於0.5μΩm。 The electromagnetic wave absorptive heat conductive sheet according to claim 1, wherein the signal transmitting unit transmits a high frequency signal higher than 1 GHz, and the first magnetic metal particles have a specific resistance of 0.5 μΩm or more, and the second magnetic metal particles The resistivity is less than 0.5 μΩm. 如申請專利範圍第1項之電磁波吸收性導熱片,其中,該第1磁性金屬粒子為球狀粒子。 The electromagnetic wave absorptive heat conductive sheet according to claim 1, wherein the first magnetic metal particles are spherical particles. 如申請專利範圍第3項之電磁波吸收性導熱片,其中,該第2磁性金屬粒子相對於該第1磁性金屬粒子之混合比率為10~60vol%,且,該第2磁性金屬粒子相對於該第1磁性金屬粒子之粒徑比率為5~50%。 The electromagnetic wave absorptive heat conductive sheet according to claim 3, wherein a mixing ratio of the second magnetic metal particles to the first magnetic metal particles is 10 to 60 vol%, and the second magnetic metal particles are opposed to the second magnetic metal particles. The particle diameter ratio of the first magnetic metal particles is 5 to 50%. 一種電子機器,具備:發送高頻信號之信號發送部;及配置於該信號發送部附近之電磁波吸收性導熱片,其中該電磁波吸收性導熱片於可撓性樹脂材料含有第1磁性金屬粒子及第2磁性金屬粒子,該第2磁性金屬粒子之平均粒徑與電阻率均小於該第1磁性金屬粒子。 An electronic device comprising: a signal transmitting unit that transmits a high-frequency signal; and an electromagnetic wave absorptive heat-conductive sheet disposed in the vicinity of the signal transmitting unit, wherein the electromagnetic wave-absorbing thermally conductive sheet contains the first magnetic metal particles in the flexible resin material and In the second magnetic metal particles, the average particle diameter and the specific resistance of the second magnetic metal particles are both smaller than the first magnetic metal particles.
TW101129487A 2011-08-18 2012-08-15 Electromagnetically absorbing, thermally conductive sheet and electronic instrument TW201320116A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011178854A JP2013042026A (en) 2011-08-18 2011-08-18 Electromagnetic wave-absorbing thermally conductive sheet and electronic device

Publications (1)

Publication Number Publication Date
TW201320116A true TW201320116A (en) 2013-05-16

Family

ID=47715128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101129487A TW201320116A (en) 2011-08-18 2012-08-15 Electromagnetically absorbing, thermally conductive sheet and electronic instrument

Country Status (3)

Country Link
JP (1) JP2013042026A (en)
TW (1) TW201320116A (en)
WO (1) WO2013024809A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107481829A (en) * 2016-05-17 2017-12-15 株式会社理研 Near field noise suppression sheet

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7005132B2 (en) * 2016-09-29 2022-02-04 大同特殊鋼株式会社 Electromagnetic wave absorption sheet
JP6461414B1 (en) * 2018-08-02 2019-01-30 加川 清二 Electromagnetic wave absorbing composite sheet
CN115335487B (en) * 2020-03-31 2024-03-08 3M创新有限公司 Heat-conducting electromagnetic absorbing material

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0527060A (en) * 1991-07-16 1993-02-05 Riken Corp Composite member for radio wave absorption
JP2002374092A (en) * 2001-06-15 2002-12-26 Polymatech Co Ltd Heat dissipating radio wave absorber
JP4764220B2 (en) * 2005-03-30 2011-08-31 地方独立行政法人 大阪市立工業研究所 Thermally conductive sheet
JP5048974B2 (en) * 2005-06-20 2012-10-17 アキレス株式会社 Acrylic resin composition and resin sheet having electromagnetic wave absorption and thermal conductivity
JP2010183033A (en) * 2009-02-09 2010-08-19 Sony Corp Composition for electromagnetic wave suppression and heat dissipation, and method for manufacturing the composition for electromagnetic wave suppression
JP2010186856A (en) * 2009-02-12 2010-08-26 Sony Chemical & Information Device Corp Heat conductive sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107481829A (en) * 2016-05-17 2017-12-15 株式会社理研 Near field noise suppression sheet

Also Published As

Publication number Publication date
JP2013042026A (en) 2013-02-28
WO2013024809A1 (en) 2013-02-21

Similar Documents

Publication Publication Date Title
JP4764220B2 (en) Thermally conductive sheet
US9251950B2 (en) Magnetic element for wireless power transmission and method for manufacturing same
US6716904B2 (en) Heat-radiating electromagnetic wave absorber
US7842381B2 (en) Thermally conductive EMI shield
US7994435B2 (en) Electromagnetic-wave suppressing radiator sheet and electronic apparatus
TWI278278B (en) Electromagnetic waves absorber
CN107836062A (en) Fin and the wireless power transmission module including the fin
CN106604606A (en) Thermally-conductive electromagnetic interference (EMI) absorbers
CN213951063U (en) Noise-suppressing graphite articles and assemblies
JP2019186310A (en) Semiconductor device
JP2009099753A (en) Heat sink
TW201320116A (en) Electromagnetically absorbing, thermally conductive sheet and electronic instrument
JP2006005365A (en) Magnetic shielding sheet for tag and tag
JP2010183033A (en) Composition for electromagnetic wave suppression and heat dissipation, and method for manufacturing the composition for electromagnetic wave suppression
JP4311653B2 (en) Electromagnetic wave absorber
US11329005B2 (en) Semiconductor device and method of producing the same
JP2010245407A (en) Electromagnetic wave absorbing heat conductive sheet
JP2014239236A (en) Thermally conductive sheet
JP2010186856A (en) Heat conductive sheet
KR102445111B1 (en) Semiconductor device and method of manufacturing semiconductor device
JP4543864B2 (en) Heat dissipation component and manufacturing method thereof
CN206077940U (en) Heat conduction electromagnetic interference EMI absorber
JP4311654B2 (en) Laminated electromagnetic wave absorber
KR101511417B1 (en) Thermally conductive sheet
TWI482940B (en) Thermally conductive