CN201888066U - Electronic product and radiating assembly applied to electronic product - Google Patents
Electronic product and radiating assembly applied to electronic product Download PDFInfo
- Publication number
- CN201888066U CN201888066U CN2010206377085U CN201020637708U CN201888066U CN 201888066 U CN201888066 U CN 201888066U CN 2010206377085 U CN2010206377085 U CN 2010206377085U CN 201020637708 U CN201020637708 U CN 201020637708U CN 201888066 U CN201888066 U CN 201888066U
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- electronic product
- heat
- transfer device
- described heat
- radiating subassembly
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Abstract
The utility model discloses an electronic product and radiating assembly applied to the electronic product. The radiating assembly comprises a radiating device tightly attached to the shell of the electronic product, and a heat conduction device contacted with the radiating device through the opening on the shell of the electronic product and arranged inside the electronic product, wherein the heat conduction device is contacted with the heat elements in the electronic product. The radiating assembly conducts the heat in the electronic product out, and the radiating device disperses the heat out of the product, so that the problems of the product are lowered and the property of the product is improved.
Description
Technical field
The utility model relates to communication equipment field, particularly a kind of radiating subassembly and electronic product that is applied to electronic product.
Background technology
At present, the range of application of electronic equipment is more and more wider, a lot of electronic products, as flash disk, card reader etc. are portable in order to satisfy, requirements such as aesthetic property and become more and smaller and more exquisite, device housings adopts PP (polypropylene more, propylene CH2=CH-CH3) polymer, ABS (Acrylonitrile Butadiene Styrene, acrylonitrile-styrene-butadiene copolymer), PC (Polycarbonate, Merlon), PA (polyamide polyamide), PE (Polyethylene, polyethylene), PPS (Polyphenylene sulfide, polyphenylene sulfide) material such as, these materials are the non-conductor of heat: pyroconductivity only is 0.2W/mK.And, the product casing of electronic product such as flash disk, card reader is designed to closed mostly, and these electronic product inside all are provided with powerful heater members usually, in the heater members running, will certainly form high temperature in the enclosure space that is made of product casing.Add product casing and adopt the material of heat-conducting effect difference more, therefore, heat is not easy to distribute, and causes these electronic products when work, the product temperature inside is higher than extraneous natural environment temperature far away, to the stability of properties of product and can cause useful life and have a strong impact on.
Therefore, electronic product poor radiation such as flash disk of the prior art, card reader, temperature is too high during product work, causes properties of product to be affected.
The utility model content
The utility model provides a kind of radiating subassembly and electronic product that is applied to electronic product, and in order to solve electronic product poor radiation of the prior art, temperature is too high during product work, causes the affected technical problem of properties of product.
A kind of radiating subassembly that is applied to electronic product, comprise: the heat abstractor of being close to described electronic product casing, and contact with described heat abstractor and be positioned at the heat-transfer device of described electronic product inside by the opening on the described electronic product casing, wherein, described heat-transfer device contacts with the heater members of described electronic product inside.
A kind of electronic product comprises above-mentioned radiating subassembly.
Radiating subassembly among the utility model embodiment and electronic product are derived the heat of product inside by heat-transfer device, by heat abstractor heat are loose to the product outside, thereby have reduced product temperature, have improved properties of product.
Description of drawings
Fig. 1 is the radiating subassembly that is applied to electronic product among the utility model embodiment and the schematic diagram of electronic product.
Embodiment
The utility model embodiment provides a kind of radiating subassembly and electronic product that is applied to electronic product, and this radiating subassembly can be realized the heat radiation of electronic product inside fast, thereby reduces product temperature, enhances product performance.
Describe the radiating subassembly that is applied to electronic product that the utility model embodiment provides in detail with a preferred embodiment below, as shown in Figure 1, this radiating subassembly comprises: the heat abstractor 11 of being close to described electronic product casing, and contact with described heat abstractor 11 and be positioned at the heat-transfer device 12 of described electronic product inside by the opening on the described electronic product casing, wherein, described heat-transfer device 12 contacts with heater members 13 in the described electronic product.In order to increase the area of dissipation of heat abstractor 11,, can make the surface area of the surface area of heat abstractor 11 greater than heat-transfer device 12 to accelerate radiating rate.Wherein, described heat-transfer device can be fixed on described electronic product casing inboard and contact with described heat abstractor, also can be fixed on described heat abstractor inboard.
Concrete, in order to realize the secure fixation of heat abstractor 11 and electronic product, an opening that coincide with heat abstractor 11 shapes can be set in a side of the close electronic product inner heat device of the electronic product casing of using this radiating subassembly, embed for heat abstractor 11.Like this, the outside of heat abstractor 11 is exposed in the air, can realize heat radiation; The inboard of heat abstractor 11 is fixed with heat-transfer device 12, this heat-transfer device is positioned at described electronic product casing inside, and this heat-transfer device 12 contacts with the heater members of electronic product inside, derive through heat-transfer device 12 with the heat of realizing heater members is distributed, and pass through the purpose of heat abstractor 11 heat radiations.And, not tight in order to prevent between heat-transfer device 12 and the heater members contact, can also coat heat-conducting silicone grease in heat-transfer device 12 and the contacted part of heater members, by heat-conducting silicone grease, realize tight contact the between heat-transfer device 12 and the heater members 13.
The concrete structure relation of radiating subassembly and electronic product can be referring to shown in Figure 1, need in the specific implementation the heat-transfer device among Fig. 1 12 is fixed on the heat abstractor 11, electronic product upper case 14 is provided with the opening that is used to embed heat abstractor 11 among Fig. 1, electronic product inside also comprises electronic device 15 and heater members 13, in addition, this electronic product also comprises product lower case 16.Figure 1 shows that the figure in bulk of electronic product and radiating subassembly, when specifically implementing, only need each component-assembled among Fig. 1 is got final product together.
About the concrete shape of heat abstractor 11 and heat-transfer device 12, can be not limited to shown in Figure 1 in conjunction with the characteristics flexible design of electronic product.For example, heat abstractor 11 can be designed to shapes such as circle, rectangle, rhombus, profile characteristics that also can bonded products are designed to it irregularly shaped, in a word, should adapt to the profile characteristics of product, consider the demand of abundant heat radiation again.Heat-transfer device 12 can be designed as rectangular block, cylindrical, prismatic or cuboid etc., also can be designed to as required irregularly shaped, as long as can realize the purpose of heat conduction.
About the material of heat abstractor 11 and heat-transfer device 12, all should select the material of good heat conductivity.For example, heat abstractor 11 can be selected material such as copper, aluminium, carbon fiber or native graphite, wherein, native graphite can be selected eGRAF anisotropy native graphite, perhaps, can also be by in plastic material, adding Heat Conduction Material efficiently, next synthesizing has the structural composites of high thermal conductivity coefficient, as the material of heat abstractor or heat-transfer device.For example, pyroconductivity can be added to up to the carbon fibre material of 1500W/mK in the plastic material such as PC, form compound, again by technology such as static, make carbon fiber in this compound, arrange in order, thereby reach the purpose of heat conduction direction anisotropic.The material of heat-transfer device 12 can be identical with heat abstractor, also can be different.Heat-transfer device 12 can adopt material such as copper, aluminium, pottery or carbon fiber.At fixing heat-transfer device 12 during, can adopt modes such as gluing, welding or crimping with heat abstractor 11.
And when specific design, the heat-transfer device 12 in the radiating subassembly can for example, can be provided with two or three heat-transfer devices 12 and fix with heat abstractor 11, thereby realize better heat-conducting effect as required for a plurality of.
In addition, can also will use the electronic product shell of this radiating subassembly also to adopt the above-mentioned material that possesses heat conductivility, thereby electronic product can better be dispelled the heat.
By the radiating subassembly that adopts the utility model embodiment to provide, utilize heat-transfer device that the heat of product inside is derived, and by surface area the big and good heat abstractor of heat dispersion sheds heat, thereby reduced the product working temperature, improved properties of product.
The utility model embodiment also provides a kind of electronic product that comprises above-mentioned radiating subassembly, and the position that described heat abstractor is installed on the described electronic product casing is provided with opening.This electronic product can be small-sized or micromodule equipments such as flash disk, USB Key or wireless Internet card.
By above-mentioned radiating subassembly is installed, make this electronic product heat radiation fully, thereby reduced product temperature, improved properties of product.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (10)
1. radiating subassembly that is applied to electronic product, it is characterized in that, comprise: the heat abstractor of being close to described electronic product casing, and contact with described heat abstractor and be positioned at the heat-transfer device of described electronic product inside by the opening on the described electronic product casing, wherein, described heat-transfer device contacts with the heater members of described electronic product inside.
2. radiating subassembly as claimed in claim 1 is characterized in that, described heat-transfer device is fixed on described electronic product casing inboard and contacts with described heat abstractor, or described heat-transfer device is fixed on described heat abstractor inboard.
3. radiating subassembly as claimed in claim 1 is characterized in that, the heater members of described heat-transfer device and described electronic product inside is fixed together by heat conductive silica gel.
4. radiating subassembly as claimed in claim 1 is characterized in that the surface area of described heat abstractor is greater than the surface area of described heat-transfer device.
5. radiating subassembly as claimed in claim 1 is characterized in that, the shape of described heat-transfer device comprises: cylindrical, cuboid or prismatic; The material of described heat-transfer device comprises: copper, aluminium, pottery or carbon fiber.
6. radiating subassembly as claimed in claim 1 is characterized in that, the shape of described heat abstractor comprises: circle, rectangle or rhombus; The material of described heat abstractor comprises: copper, aluminium, carbon fiber or native graphite.
7. radiating subassembly as claimed in claim 2 is characterized in that, that described heat-transfer device adopts is gluing, welding or crimping mode and described heat abstractor are fixed.
8. an electronic product is characterized in that, comprises as the arbitrary described radiating subassembly of claim 1 to 7.
9. electronic product as claimed in claim 8 is characterized in that, the position that described heat abstractor is installed on the described electronic product casing is provided with opening.
10. electronic product as claimed in claim 8 is characterized in that, described electronic product is flash disk, USB Key or wireless Internet card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206377085U CN201888066U (en) | 2010-12-01 | 2010-12-01 | Electronic product and radiating assembly applied to electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206377085U CN201888066U (en) | 2010-12-01 | 2010-12-01 | Electronic product and radiating assembly applied to electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201888066U true CN201888066U (en) | 2011-06-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206377085U Expired - Lifetime CN201888066U (en) | 2010-12-01 | 2010-12-01 | Electronic product and radiating assembly applied to electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201888066U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661489A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Heat-dissipation unit of handheld electronic device |
| CN104918457A (en) * | 2014-03-14 | 2015-09-16 | 欧姆龙株式会社 | Electronic equipment |
| CN105447562A (en) * | 2016-01-18 | 2016-03-30 | 广州龙媒计算机科技有限公司 | A heat radiation type USB flash disk |
| CN106852068A (en) * | 2016-12-05 | 2017-06-13 | 广东欧珀移动通信有限公司 | Housing, radiating subassembly and mobile terminal |
| CN109922635A (en) * | 2017-12-12 | 2019-06-21 | 云辉科技有限公司 | The cooling system of enclosed type electric submodule with single/multiple active parts |
| US10602642B2 (en) | 2013-12-11 | 2020-03-24 | Asia Vital Components Co., Ltd. | Back cover unit applied to portable device and having heat conduction function |
| US10788869B2 (en) | 2013-12-11 | 2020-09-29 | Asia Vital Components Co., Ltd. | Heat-conducting case unit for handheld electronic device |
| CN112243600A (en) * | 2018-06-06 | 2021-01-19 | 艾思玛太阳能技术股份公司 | Electrical or electronic device comprising a housing having two areas electromagnetically shielded from each other |
-
2010
- 2010-12-01 CN CN2010206377085U patent/CN201888066U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661489A (en) * | 2013-11-22 | 2015-05-27 | 奇鋐科技股份有限公司 | Heat-dissipation unit of handheld electronic device |
| CN110022666A (en) * | 2013-11-22 | 2019-07-16 | 奇鋐科技股份有限公司 | Portable electric device heat-sink unit |
| US10602642B2 (en) | 2013-12-11 | 2020-03-24 | Asia Vital Components Co., Ltd. | Back cover unit applied to portable device and having heat conduction function |
| US10788869B2 (en) | 2013-12-11 | 2020-09-29 | Asia Vital Components Co., Ltd. | Heat-conducting case unit for handheld electronic device |
| CN104918457A (en) * | 2014-03-14 | 2015-09-16 | 欧姆龙株式会社 | Electronic equipment |
| CN104918457B (en) * | 2014-03-14 | 2017-12-01 | 欧姆龙株式会社 | Electronic equipment |
| CN105447562A (en) * | 2016-01-18 | 2016-03-30 | 广州龙媒计算机科技有限公司 | A heat radiation type USB flash disk |
| CN106852068A (en) * | 2016-12-05 | 2017-06-13 | 广东欧珀移动通信有限公司 | Housing, radiating subassembly and mobile terminal |
| CN109922635A (en) * | 2017-12-12 | 2019-06-21 | 云辉科技有限公司 | The cooling system of enclosed type electric submodule with single/multiple active parts |
| CN112243600A (en) * | 2018-06-06 | 2021-01-19 | 艾思玛太阳能技术股份公司 | Electrical or electronic device comprising a housing having two areas electromagnetically shielded from each other |
| CN112243600B (en) * | 2018-06-06 | 2022-09-16 | 艾思玛太阳能技术股份公司 | Electrical or electronic device comprising a housing having two areas electromagnetically shielded from each other |
| US11470750B2 (en) | 2018-06-06 | 2022-10-11 | Sma Solar Technology Ag | Electrical or electronic device comprising a housing with two regions shielded electromagnetically from each other |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100015 Beijing city Chaoyang District Dongzhimen West eight Street No. 2 room Wanhong Yan Dong Business Garden Patentee after: Beijing Watchdata Limited by Share Ltd Address before: 100015 Beijing city Chaoyang District Dongzhimen West eight Street No. 2 room Wanhong Yan Dong Business Garden Patentee before: Beijing Woqi Data System Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110629 |