CN106852068A - Housing, radiating subassembly and mobile terminal - Google Patents
Housing, radiating subassembly and mobile terminal Download PDFInfo
- Publication number
- CN106852068A CN106852068A CN201611105406.1A CN201611105406A CN106852068A CN 106852068 A CN106852068 A CN 106852068A CN 201611105406 A CN201611105406 A CN 201611105406A CN 106852068 A CN106852068 A CN 106852068A
- Authority
- CN
- China
- Prior art keywords
- housing
- radiating part
- radiating
- mobile terminal
- heater element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 229910000846 In alloy Inorganic materials 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Abstract
The invention discloses a kind of housing, radiating subassembly and mobile terminal.Housing is used for mobile terminal, and housing includes body and radiating part.Body offers embedded hole.Radiating part is embedded in embedded hole.Thermal conductivity factor of the thermal conductivity factor of radiating part more than body.The housing of embodiment of the present invention, radiating part can be correspondingly arranged with the heater element of mobile terminal, and the heat that heater element is produced rapidly is distributed, such that it is able to reduce the temperature of heater element, it is ensured that mobile terminal constantly normal work.
Description
Technical field
The present invention relates to field of electronic devices, more particularly to a kind of housing, radiating subassembly and mobile terminal.
Background technology
At present, the mobile terminal such as mobile phone can produce substantial amounts of heat during use, on the mainboard of mobile terminal
Component only can ensure that component constantly normal work within the scope of suitable temperature, therefore, how preferably by ground
The temperature for reducing component turns into the technical issues that need to address.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, the present invention provides a kind of shell
Body, a kind of radiating subassembly and a kind of mobile terminal.
The housing of embodiment of the present invention is used for mobile terminal, and housing includes body and radiating part.The body is offered
Embedded hole.Radiating part is embedded in the embedded hole.Thermal conductivity factor of the thermal conductivity factor of the radiating part more than the body.
In some embodiments, the radiating part is fixed by snap fit and is housed in the embedded hole.
In some embodiments, the radiating part includes what heat radiator body and the periphery from the heat radiator body extended
The multiple fixture blocks being spaced, the embedded hole includes receiving space for housing the heat radiator body and houses empty with described
Between multiple engaging spaces for connecting, the multiple fixture block is fastened in the multiple engaging space.
In some embodiments, the engaging space is trapezoidal, in the engaging space away from the receiving space
On direction, the size in the engaging space gradually increases.
In some embodiments, the material of the body includes appointing in stainless steel, magnesium alloy, aluminium alloy and carbon fiber
Meaning is a kind of.
In some embodiments, the housing is center, fore shell or the bonnet of the mobile terminal.
In some embodiments, the material of the radiating part includes any one in copper, silver and gold.
The radiating subassembly of embodiment of the present invention includes the housing and circuit board of any of the above implementation method.Circuit board with dissipate
Hot portion's correspondence.Heater element is provided with circuit board, the heater element is located between the circuit board and the radiating part simultaneously
It is connected with the radiating part.
In some embodiments, heater element orthographic projection on the housing is located in the radiating part.
In some embodiments, the heater element includes processor chips.
In some embodiments, the radiating subassembly also includes heat conducting element, and the heater element is by the heat conduction
Element is connected with the radiating part.
In some embodiments, the heat conducting element includes any one in heat-conducting glue, copper sheet or silver strip.
The mobile terminal of embodiment of the present invention includes the radiating subassembly of any of the above implementation method.
Heater element and radiating part in the housing of embodiment of the present invention, radiating subassembly and mobile terminal are correspondingly arranged,
Rapidly distributed with the heat for producing heater element, such that it is able to reduce the temperature of heater element, it is ensured that mobile terminal
Constantly normal work.
Additional aspect of the invention and advantage will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by practice of the invention.
Brief description of the drawings
Of the invention above-mentioned and/or additional aspect and advantage will become from description of the accompanying drawings below to implementation method is combined
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the floor map of the mobile terminal of embodiment of the present invention；
Fig. 2 is the structural representation of the radiating subassembly of embodiment of the present invention；
Fig. 3 is the decomposing schematic representation of the radiating subassembly of Fig. 2；
Fig. 4 is the decomposing schematic representation of the housing of embodiment of the present invention.
Main element symbol description：
Mobile terminal 1 02, display screen 1022；
Radiating subassembly 100；
Housing 10, body 12, embedded hole 122, receiving space 1221, engaging space 1223, radiating part 14, heat radiator body
142nd, fixture block 144；
Circuit board 20, heater element 22；
Heat conducting element 30.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the implementation method is shown in the drawings, wherein ad initio
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The implementation method for examining Description of Drawings is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention is described with simplified, must have specific orientation, Yi Te rather than the device or element for indicating or imply meaning
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Company ", " connection " should be interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or be integrally connected；Can
Being to mechanically connect, or electrically connect or can mutually communicate；Can be joined directly together, it is also possible to by between intermediary
Connect connected, can be two element internals connection or two interaction relationships of element.For the ordinary skill of this area
For personnel, above-mentioned term concrete meaning in the present invention can be as the case may be understood.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
The first and second feature directly contacts can be included, it is also possible to including the first and second features be not directly contact but by it
Between other characterisation contact.And, fisrt feature second feature " on ", " top " and " above " include that first is special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different implementation methods or example is used for realizing different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting to specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.Additionally, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various implementation methods itself not being indicated and/or being set
Relation.Additionally, the invention provides various specific technique and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1 and Fig. 3 is referred to, the radiating subassembly 100 of the mobile terminal 1 02 of embodiment of the present invention includes housing 10, electricity
Road plate 20 and heat conducting element 30.
Incorporated by reference to Fig. 2, housing 10 includes body 12 and radiating part 14.The thermal conductivity factor of radiating part 14 is led more than body 12
Hot coefficient.Body 12 can be made up of the larger material of intensity, support be provided with for mobile terminal 1 02, so as to improve mobile terminal
102 impact resistance.For example, the material of body 12 is metal or carbon fiber.Metal material is, for example, stainless steel, magnesium alloy, aluminium
Alloy or titanium alloy.Not only intensity preferably, also helps housing 10 and radiates the body 12 being made up of metal material.
Housing 10 is center, fore shell or the bonnet of mobile terminal 1 02.It is appreciated that when housing 10 is mobile terminal 1 02
During center, housing 10 can provide support for the parts of mobile terminal 1 02, for example, the display screen 1022 of mobile terminal 1 02 can
To install on the housing 10.
When bonnet of the housing 10 for mobile terminal 1 02, housing 10 can cover the inner body of mobile terminal 1 02, example
Such as battery.Now, radiating part 14 is directly exposed to the outside of mobile terminal 1 02, is connect with the air around mobile terminal 1 02
Touch, so as to the heat exchange efficiency of radiating 14 can be improved.The antenna of mobile terminal 1 02 is covered after can also being arranged on, to realize moving
The communication function of dynamic terminal 102.
Housing 10 includes body 12 and radiating part 14.Specifically, the thickness of body 12 is equal with the thickness of radiating part 14, this
Two opposite surfaces of body 12, two flushes opposite with radiating part 14, so that housing 10 forms smooth opposite two
Surface.Radiating part 14 is made up of the preferable material of heat conductivility, and such as material of radiating part 14 is copper, silver or gold.
Incorporated by reference to Fig. 4, body 12 offers embedded hole 122, and radiating part 14 is embedded in embedded hole 122.In an example
In, radiating part 14 is fixed by snap fit and is housed in embedded hole 122.For example, radiating part 14 is formed with projection, embedded hole
122 include the hole clipping matched with projection, and projection is housed in hole clipping so that the engaging of radiating part 14 is housed in embedded hole 122
In.
Specifically, embedded hole 122 includes receiving space 1221 and multiple engaging spaces 1223.In present embodiment, house
Space 1221 is rectangular.It is appreciated that in other embodiments, receiving space 1221 can with rounded, hexagon etc. other
Shape.
Multiple engaging space 1223 connects with receiving space 1221.Engaging space 1223 is trapezoidal, in engaging space 1223
Away from the direction of receiving space 1221, the size for engaging space 1223 gradually increases.
Radiating part 14 includes heat radiator body 142 and multiple fixture blocks 144.Heat radiator body 142 is housed in receiving space 1221,
The shape of heat radiator body 142 coordinates with receiving space 1221.In present embodiment, heat radiator body 142 is also rectangular.Certainly, exist
In other embodiment, heat radiator body 142 can be the shape that circle, hexagon etc. coordinate with receiving space 1221.Multiple card
Block 144 extends and is spaced from the periphery of heat radiator body 142.Multiple fixture blocks 144 are fastened in multiple engaging spaces 1223.
Circuit board 20 is corresponding with radiating part 14, so that the heat produced by circuit board 20 is distributed by radiating part 14.
Heater element 22 is provided with circuit board 20, heater element 22 is located at and connects between circuit board 20 and radiating part 14 and with radiating part 14
Connect, heater element 22 is, for example, the components such as processor chips or transistor.
It is preferred that the orthographic projection on the housing 10 of heater element 22 is located in radiating part 14.In other words, radiating part 14 is covered
Heater element 22, so that the area that radiating part 14 receives the heat that heater element 22 is produced is larger, is conducive to rapidly dropping
The temperature of low heater element 22.Further, heater element 22 can be connected by heat conducting element 30 with radiating part 14.Heat conducting element
30 include any one in heat-conducting glue, copper sheet or silver strip.Heat-conducting glue is, for example, silicone grease.
It is appreciated that be can be set on circuit board 20 have other components, such as electric capacity, resistance etc., so that mobile terminal 1 02
Corresponding function can be realized.
In one example, when housing 10 is manufactured, then will first from two kinds of materials that thermal conductivity factor is different can lead
The larger material manufacture of hot coefficient is in radiating part 14, by the less material manufacture of thermal conductivity factor into body 12, afterwards by radiating part
14 are embedded into embedded hole 122, are finally rigidly secured together body 12 and radiating part 14 using the mode of welding, so that
Form housing 10.
In one example, viscose glue can be first coated in the periphery of radiating part 14, then causes that radiating part 14 is adhesively fixed on
On body 12.
The housing 10 of embodiment of the present invention, radiating part 14 can be correspondingly arranged with the heater element 22 of mobile terminal 1 02,
Rapidly distributed with by the heat that heater element 22 is produced, such that it is able to reduce the temperature of component, it is ensured that mobile terminal
102 constantly normal works.
Further, radiating part 14 by snap fit fix be housed in embedded hole 122 so that radiating part 14 be difficult from
Come off in embedded hole 122.
In addition, the orthographic projection on the housing 10 of heater element 22 is located in radiating part 14, it is ensured that heater element 22
Heat is passed in radiating part 14 in time, and the external world is passed to by radiating part 14, so as to further reduce the temperature of heater element 22
Degree.
In other embodiments, engaging space 1223 can be other shapes, for example, fan-shaped, arc or the shape such as square
Shape.
In other embodiments, body 12 and radiating part 14 are connected can also make housing 10 form the opposite of out-of-flatness
Two surfaces, for example, radiating part 14 is convexly equipped in body 12.
The mobile terminal 1 02 of embodiment of the present invention includes radiating subassembly 100, the and of display screen 1022 of embodiment of above
Battery (not shown).Mobile terminal 1 02 is, for example, mobile phone or panel computer.Display screen 1022 is connected with circuit board 20, Yong Huke
To be checked by display screen 1022 it should be understood that information.Battery is connected with for mobile terminal 1 02 provides electric energy with circuit board 20.
It is pointed out that other not deployed parts of the mobile terminal 1 02 of invention embodiment, refer to above implementation
The same or similar part of radiating subassembly 100 of mode, will not be repeated here.
In the description of this specification, reference term " implementation method ", " some implementation methods ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means to combine the implementation method or example describes
Specific features, structure, material or feature are contained at least one implementation method of the invention or example.In this specification
In, the schematic representation to above-mentioned term is not necessarily referring to identical implementation method or example.And, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in one or more any implementation methods or example.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include at least one this feature.In the description of the invention, " multiple " is meant that at least two, such as two, three
It is individual etc., unless otherwise expressly limited specifically.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
These implementation methods can be carried out with various changes, modification, replacement in the case of not departing from principle of the invention and objective and become
Type, the scope of the present invention is limited by claim and its equivalent.
Claims (13)
1. a kind of housing, for mobile terminal, it is characterised in that the housing includes：
Body, the body offers embedded hole；With
It is embedded the radiating part in the embedded hole, the thermal conductivity factor of the thermal conductivity factor more than the body of the radiating part.
2. housing as claimed in claim 1, it is characterised in that the radiating part fixed by snap fit be housed in it is described embedding
Enter in hole.
3. housing as claimed in claim 1, it is characterised in that the radiating part includes heat radiator body and from the heat radiator body
The multiple fixture blocks being spaced that extend of periphery, the embedded hole includes the receiving space for housing the heat radiator body
And the multiple connected with the receiving space engages spaces, the multiple fixture block is fastened in the multiple engaging space.
4. housing as claimed in claim 3, it is characterised in that the engaging space is trapezoidal, the engaging space away from
On the direction of the receiving space, the size in the engaging space gradually increases.
5. the housing as described in claim 1-4 any one, it is characterised in that the material of the body includes stainless steel, magnesium
In alloy, aluminium alloy and carbon fiber any one.
6. the housing as described in claim 1-4 any one, it is characterised in that during the housing is the mobile terminal
Frame, fore shell or bonnet.
7. the housing as described in claim 1-4 any one, it is characterised in that the material of the radiating part include copper, silver and
In gold any one.
8. a kind of radiating subassembly, it is characterised in that including：
Housing as described in claim 1-7 any one；With
Circuit board corresponding with the radiating part, is provided with heater element on the circuit board, the heater element is located at described
It is connected between circuit board and the radiating part and with the radiating part.
9. radiating subassembly as claimed in claim 8, it is characterised in that heater element orthographic projection position on the housing
In in the radiating part.
10. radiating subassembly as claimed in claim 8, it is characterised in that the heater element includes processor chips.
11. radiating subassemblies as claimed in claim 8, it is characterised in that the radiating subassembly also includes heat conducting element, the hair
Thermal element is connected by the heat conducting element with the radiating part.
12. radiating subassemblies as claimed in claim 11, it is characterised in that the heat conducting element includes heat-conducting glue, copper sheet and silver
Any one in piece.
13. a kind of mobile terminals, it is characterised in that including the radiating subassembly as described in claim 8-12 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611105406.1A CN106852068A (en) | 2016-12-05 | 2016-12-05 | Housing, radiating subassembly and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611105406.1A CN106852068A (en) | 2016-12-05 | 2016-12-05 | Housing, radiating subassembly and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106852068A true CN106852068A (en) | 2017-06-13 |
Family
ID=59145414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611105406.1A Pending CN106852068A (en) | 2016-12-05 | 2016-12-05 | Housing, radiating subassembly and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106852068A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110740611A (en) * | 2018-07-20 | 2020-01-31 | 深圳富泰宏精密工业有限公司 | Radiator and electronic device with same |
| CN111465286A (en) * | 2020-05-05 | 2020-07-28 | 深圳市慧为智能科技股份有限公司 | Ultra-thin mobile terminal heat abstractor and ultra-thin mobile terminal |
| CN112449029A (en) * | 2019-08-30 | 2021-03-05 | 北京小米移动软件有限公司 | Housing assembly in terminal, assembling method of housing assembly and terminal |
| GB2594105A (en) * | 2020-04-16 | 2021-10-20 | Global Skyware Ltd | Apparatus to provide improved cooling of data signal processing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000196266A (en) * | 1998-12-24 | 2000-07-14 | Furukawa Electric Co Ltd:The | Exothermic electronic part storage unit |
| JP2007035843A (en) * | 2005-07-26 | 2007-02-08 | Hitachi Ltd | Electronic circuit device |
| US20070195503A1 (en) * | 2006-02-21 | 2007-08-23 | 3Com Corporation | Apparatus for dissipating heat from electronic components in an enclosed housing |
| CN101578033A (en) * | 2008-05-09 | 2009-11-11 | 莱尔德电子材料(深圳)有限公司 | Shielding device and manufacturing method thereof |
| CN201888066U (en) * | 2010-12-01 | 2011-06-29 | 北京握奇数据系统有限公司 | Electronic product and radiating assembly applied to electronic product |
| CN103929518A (en) * | 2014-04-30 | 2014-07-16 | 深圳市中兴移动通信有限公司 | Mobile terminal |
| CN206251554U (en) * | 2016-12-05 | 2017-06-13 | 广东欧珀移动通信有限公司 | Housing, radiating subassembly and mobile terminal |
-
2016
- 2016-12-05 CN CN201611105406.1A patent/CN106852068A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000196266A (en) * | 1998-12-24 | 2000-07-14 | Furukawa Electric Co Ltd:The | Exothermic electronic part storage unit |
| JP2007035843A (en) * | 2005-07-26 | 2007-02-08 | Hitachi Ltd | Electronic circuit device |
| US20070195503A1 (en) * | 2006-02-21 | 2007-08-23 | 3Com Corporation | Apparatus for dissipating heat from electronic components in an enclosed housing |
| CN101578033A (en) * | 2008-05-09 | 2009-11-11 | 莱尔德电子材料(深圳)有限公司 | Shielding device and manufacturing method thereof |
| CN201888066U (en) * | 2010-12-01 | 2011-06-29 | 北京握奇数据系统有限公司 | Electronic product and radiating assembly applied to electronic product |
| CN103929518A (en) * | 2014-04-30 | 2014-07-16 | 深圳市中兴移动通信有限公司 | Mobile terminal |
| CN206251554U (en) * | 2016-12-05 | 2017-06-13 | 广东欧珀移动通信有限公司 | Housing, radiating subassembly and mobile terminal |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110740611A (en) * | 2018-07-20 | 2020-01-31 | 深圳富泰宏精密工业有限公司 | Radiator and electronic device with same |
| CN112449029A (en) * | 2019-08-30 | 2021-03-05 | 北京小米移动软件有限公司 | Housing assembly in terminal, assembling method of housing assembly and terminal |
| CN112449029B (en) * | 2019-08-30 | 2023-08-29 | 北京小米移动软件有限公司 | Housing assembly in terminal, assembly method of housing assembly and terminal |
| GB2594105A (en) * | 2020-04-16 | 2021-10-20 | Global Skyware Ltd | Apparatus to provide improved cooling of data signal processing apparatus |
| GB2594105B (en) * | 2020-04-16 | 2024-04-03 | Global Skyware Ltd | Apparatus to provide improved cooling of data signal processing apparatus |
| CN111465286A (en) * | 2020-05-05 | 2020-07-28 | 深圳市慧为智能科技股份有限公司 | Ultra-thin mobile terminal heat abstractor and ultra-thin mobile terminal |
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