GB2594105B - Apparatus to provide improved cooling of data signal processing apparatus - Google Patents

Apparatus to provide improved cooling of data signal processing apparatus Download PDF

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Publication number
GB2594105B
GB2594105B GB2011894.9A GB202011894A GB2594105B GB 2594105 B GB2594105 B GB 2594105B GB 202011894 A GB202011894 A GB 202011894A GB 2594105 B GB2594105 B GB 2594105B
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GB
United Kingdom
Prior art keywords
signal processing
data signal
provide improved
improved cooling
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2011894.9A
Other versions
GB2594105A (en
GB202011894D0 (en
Inventor
Avramis Evangelos
Buchan Stephen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Global Skyware Ltd
Original Assignee
Global Skyware Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Global Skyware Ltd filed Critical Global Skyware Ltd
Publication of GB202011894D0 publication Critical patent/GB202011894D0/en
Publication of GB2594105A publication Critical patent/GB2594105A/en
Application granted granted Critical
Publication of GB2594105B publication Critical patent/GB2594105B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB2011894.9A 2020-04-16 2020-07-30 Apparatus to provide improved cooling of data signal processing apparatus Active GB2594105B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB2005524.0A GB202005524D0 (en) 2020-04-16 2020-04-16 Improving cooling of data signal processing apparatus

Publications (3)

Publication Number Publication Date
GB202011894D0 GB202011894D0 (en) 2020-09-16
GB2594105A GB2594105A (en) 2021-10-20
GB2594105B true GB2594105B (en) 2024-04-03

Family

ID=70860135

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB2005524.0A Ceased GB202005524D0 (en) 2020-04-16 2020-04-16 Improving cooling of data signal processing apparatus
GB2011894.9A Active GB2594105B (en) 2020-04-16 2020-07-30 Apparatus to provide improved cooling of data signal processing apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB2005524.0A Ceased GB202005524D0 (en) 2020-04-16 2020-04-16 Improving cooling of data signal processing apparatus

Country Status (1)

Country Link
GB (2) GB202005524D0 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616421A (en) * 1991-04-08 1997-04-01 Aluminum Company Of America Metal matrix composites containing electrical insulators
WO2000067541A1 (en) * 1999-04-30 2000-11-09 Pacific Aerospace And Electronics, Inc. Composite electronics packages and methods of manufacture
US20100046172A1 (en) * 2008-08-20 2010-02-25 H-Tech, Llc Electronics package including heat sink in the housing and related methods
CN106852068A (en) * 2016-12-05 2017-06-13 广东欧珀移动通信有限公司 Housing, radiating subassembly and mobile terminal
US20170215271A1 (en) * 2014-09-29 2017-07-27 Hitachi Automotive Systems, Ltd. In-Vehicle Controller

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616421A (en) * 1991-04-08 1997-04-01 Aluminum Company Of America Metal matrix composites containing electrical insulators
WO2000067541A1 (en) * 1999-04-30 2000-11-09 Pacific Aerospace And Electronics, Inc. Composite electronics packages and methods of manufacture
US20100046172A1 (en) * 2008-08-20 2010-02-25 H-Tech, Llc Electronics package including heat sink in the housing and related methods
US20170215271A1 (en) * 2014-09-29 2017-07-27 Hitachi Automotive Systems, Ltd. In-Vehicle Controller
CN106852068A (en) * 2016-12-05 2017-06-13 广东欧珀移动通信有限公司 Housing, radiating subassembly and mobile terminal

Also Published As

Publication number Publication date
GB2594105A (en) 2021-10-20
GB202005524D0 (en) 2020-06-03
GB202011894D0 (en) 2020-09-16

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