CN203535561U - Laptop cooling system and laptop - Google Patents

Laptop cooling system and laptop Download PDF

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Publication number
CN203535561U
CN203535561U CN201320599509.3U CN201320599509U CN203535561U CN 203535561 U CN203535561 U CN 203535561U CN 201320599509 U CN201320599509 U CN 201320599509U CN 203535561 U CN203535561 U CN 203535561U
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CN
China
Prior art keywords
heat
conducting strip
cooling system
notebook computer
heat pipe
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320599509.3U
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Chinese (zh)
Inventor
孔程
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN BITLAND INFORMATION TECHNOLOGY CO LTD
Original Assignee
HEFEI BITLAND INFORMATION TECHNOLOGY Co Ltd
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Priority to CN201320599509.3U priority Critical patent/CN203535561U/en
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Publication of CN203535561U publication Critical patent/CN203535561U/en
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Abstract

The utility model provides a laptop cooling system and a laptop. The cooling system comprises at least one set of heat pipe cooling modules connected with a mainboard of the laptop, each heat pipe cooling module comprises a first heat conducting piece, a heat pipe and a second heat conducting piece, and the second heat conducting pieces are connected with the first heat conducting pieces through the heat pipes. The laptop comprises a bottom shell with an accommodating space, the mainboard in the accommodating space, a keyboard support and the cooling system. The first heat conducting pieces in the cooling system cover and are fixed on the mainboard, and the second heat conducting pieces are fixed on the keyboard support. The cooling system is not provided with a fan, cooling space of the laptop is fully utilized, and the cooling system has a good cooling effect.

Description

A kind of laptop radiating system and notebook computer
Technical field
The utility model relates to notebook computer field, the notebook computer that relates in particular to a kind of cooling system for notebook computer and have this cooling system.
Background technology
At present, that notebook computer be take is slim, high-performance, extremely long continuation of the journey are development trend, high-strength performance means higher system power dissipation, produce a large amount of heats, and in prior art, the cooling system of notebook is generally fan cooling structure, volume is larger, cannot meet the slim requirement of notebook simultaneously, and need to consume the extra electric power of notebook computer, noise is large, has a strong impact on the performance of notebook computer.Therefore, how in limited space, notebook computer temperature to be controlled to reasonable interval and to guarantee that its high-performance becomes the technical bottleneck that is relatively difficult to realization.
Utility model content
Technical problem to be solved in the utility model is, larger for prior art fan cooling structural volume, cannot meet the problem of the slim and high performance requirements of notebook computer simultaneously, a kind of fan-free cooling system simple in structure is provided, institute takes up space less, can meet the slim and high performance requirement of notebook computer simultaneously; A kind of notebook computer with this cooling system is provided simultaneously.
The utility model solves the technical scheme that its technical matters adopts: a kind of cooling system, and for notebook computer, cooling system comprises at least one group of heat pipe heat radiation module for being connected with the mainboard of notebook computer; Heat pipe heat radiation module comprises the first conducting strip, heat pipe and the second conducting strip; The second conducting strip is connected with the first conducting strip by heat pipe.
In the cooling system providing at the utility model, in heat pipe heat radiation module, comprise at least one heat pipe.
In the cooling system providing at the utility model, comprise at least two heat pipes in heat pipe heat radiation module, interval is parallel is respectively arranged between the first conducting strip and the second conducting strip for each heat pipe.
In the cooling system providing at the utility model, the first conducting strip and the second conducting strip are metal conducting strip.
In the cooling system providing at the utility model, the first conducting strip and the second conducting strip are aluminium flake or copper sheet.
At the utility model, also provide a kind of notebook computer, comprise in the drain pan, spatial accommodation with spatial accommodation mainboard and keyboard holder are installed, also comprise above-mentioned cooling system, the first conducting strip in cooling system covers and is fixed on mainboard, and the second conducting strip is fixed on keyboard holder.
In the notebook computer providing at the utility model, heat pipe heat radiation module also comprises and is filled in the first heat-conducting medium between the first conducting strip and mainboard and is filled in the second heat-conducting medium between the second conducting strip and keyboard holder.
In the notebook computer providing at the utility model, the first heat-conducting medium and the second heat-conducting medium are that nonmetallic heat conductive material is made.
In the notebook computer providing at the utility model, notebook computer also comprises the temperature-uniforming plate of being made by uniform temperature material, and temperature-uniforming plate is positioned at mainboard below, and is close to drain pan inwall.
In the notebook computer providing at the utility model, keyboard holder is that metal material is made.
Implement laptop radiating system and notebook computer that the utility model provides, can reach following beneficial effect: the utility model adopts Fanless radiation structure, and utilize the heat conductivility that heat pipe, metal conducting strip and heat-conducting medium are stronger, and heat pipe radiating system runs through notebook computer drain pan, area of dissipation is maximized, all thermal effect is preferably changed, thereby realizes quick heat radiating, improves the performance of notebook computer; And Fanless radiation structure can extend the service time of notebook computer, reduce noise, more meet the requirement of user to notebook.
Accompanying drawing explanation
Fig. 1 is a kind of laptop heat-dissipation system of the utility model scheme of installation;
Fig. 2 is the structural representation of heat pipe radiating system in a kind of laptop heat-dissipation system of the utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 2, the cooling system for notebook computer that the utility model provides, comprises at least one group of heat pipe heat radiation module for being connected with the mainboard of notebook computer; Heat pipe heat radiation module comprises the first conducting strip 4, heat pipe 5 and the second conducting strip 6; The second conducting strip 6 is connected with the first conducting strip 4 by heat pipe 5.
Preferably, comprising a heat pipe 5 in heat pipe heat radiation module, can certainly be other quantity; When heat pipe heat radiation module comprises more than two and two heat pipe 5, interval is parallel is respectively arranged between the first conducting strip 4 and the second conducting strip 6 for each heat pipe 5, and the evaporator section of heat pipe 5 is all connected with the first conducting strip 4, and condensation segment is all connected with the second conducting strip 6.
As shown in Figure 1, the notebook computer that the utility model provides, comprise the drain pan 1 with spatial accommodation, mainboard 2 and keyboard holder 3 are installed in spatial accommodation, also comprise the temperature-uniforming plate (not shown) being arranged in drain pan 1 and at least one group of heat pipe heat radiation module being connected with mainboard 2.Temperature-uniforming plate is made by uniform temperature material (as graphite etc.), be positioned at mainboard 2 belows, and tiling is pasted on notebook computer drain pan 1 inwall.Heat pipe heat radiation module comprises the first conducting strip 4, heat pipe 5 and the second conducting strip 6.The first conducting strip 4 covers on main board for notebook computer 2, and fixes by modes such as screw or welding; The second conducting strip 6 is connected with the first conducting strip 4 by heat pipe 5, and heat pipe 5 evaporator sections are connected with the first conducting strip 4, and heat pipe 5 condensation segments are connected with the second conducting strip 6, and the second conducting strip 6 is fixed on keyboard holder 3.In order to shorten heat-dissipating distance between the first conducting strip 4 and mainboard 2 and the heat-dissipating distance between the second conducting strip 6 and keyboard holder 3, between the first conducting strip 4 and mainboard 2, be filled with the first heat-conducting medium 7, between the second conducting strip 6 and keyboard holder 3, being filled with the second heat-conducting medium 8, the first heat-conducting mediums 7 and the second heat-conducting medium 8 all fixes by the mode of hot melt.
The first conducting strip 4 and the second conducting strip 6 are metal material, preferably, are the stronger aluminium flake of heat conductivility or copper sheet; The first heat-conducting medium 7 and the second heat-conducting medium 8 are thermal conductivity better and have flexible nonmetallic heat conductive material, comprise heat-conducting silicone grease, heat conductive silica gel, Graphite pad etc., there are good heat conduction and insulating property, for strengthening the heat conductivility of heat radiation module, fill up the gap between device, reduce thermal resistance, have buffering shockproof properties concurrently, alleviate the frictionally damage between device.
When notebook computer moves, the heat that mainboard 2 produces is passed to the first conducting strip 4 through the first heat-conducting medium 7 by heat, the evaporator section that is reached heat pipe 5 by the first conducting strip 4 is absorbed, then the condensation segment at heat pipe 5 carries out condensation heat release, by the second conducting strip 6, heat is passed to the second heat-conducting medium 8, and then is passed to keyboard holder 3, because keyboard holder 3 is the good hardware of thermal conductivity, and near notebook drain pan, thereby heat is passed.In addition, the temperature-uniforming plate of mainboard 2 belows makes heat tile and spread out effectively and uniformly, and by natural convection and the heat loss through radiation of computer bottom surface, effectively heat is discharged, and further strengthens heat radiation.Because heat pipe heat radiation module extends and arranges along drain pan 1 sidewall direction, and run through drain pan, effectively utilize the heat-dissipating space in drain pan, like this, the heat that mainboard 2 produces can be dispelled the heat by the heat radiation module of mainboard 2 tops and the temperature-uniforming plate of below simultaneously, the useful area that makes to dispel the heat maximizes, and all thermal effect is preferably changed; In practice, can many group heat pipe heat radiation modules be set according to the performance of notebook computer.
In sum, the utility model is by being distributed in temperature-uniforming plate and the heat pipe heat radiation module in drain pan, and utilize metal, the heat conductivility that heat-conducting medium and heat pipe are good, effectively utilize the heat-dissipating space of notebook computer, the spread heat that notebook computer is produced comes, avoid heat to concentrate on mainboard region, affect the performance of notebook computer, due to heat pipe heat radiation module and temperature-uniforming plate thickness less, so even slim notebook computer is suitable for this cooling system too, not only there is good radiating effect, guaranteed the high performance requirements of notebook computer, Fanless radiation structure can effectively reduce system noise again simultaneously, reduce power consumption, more meet the requirement of user to notebook.In addition, this cooling system can be suitable for desktop computer equally.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, can need suitably to adjust according to notebook computer self general location of mainboard, heat radiation module, also can be according to the actual heat source state of product, position and performance to heat radiation module and uniform temperature material are modified, to reach a kind of equilibrium state.The utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in claim scope of the present utility model.

Claims (10)

1. a cooling system, for notebook computer, is characterized in that, described cooling system comprises at least one group of heat pipe heat radiation module for being connected with the mainboard of described notebook computer; Described heat pipe heat radiation module comprises the first conducting strip (4), heat pipe (5) and the second conducting strip (6); Described the second conducting strip (6) is connected with described the first conducting strip (4) by described heat pipe (5).
2. cooling system according to claim 1, is characterized in that, comprises heat pipe (5) described at least one in described heat pipe heat radiation module.
3. cooling system according to claim 2, it is characterized in that, in described heat pipe heat radiation module, comprise at least two described heat pipes (5), interval is parallel is respectively arranged between described the first conducting strip (4) and the second conducting strip (6) for heat pipe described in each (5).
4. cooling system according to claim 3, is characterized in that, described the first conducting strip (4) and the second conducting strip (6) are metal conducting strip.
5. cooling system according to claim 4, is characterized in that, described the first conducting strip (4) and the second conducting strip (6) are aluminium flake or copper sheet.
6. a notebook computer, comprise having mainboard (2) and keyboard holder (3) are installed in the drain pan (1) of spatial accommodation, described spatial accommodation, it is characterized in that, also comprise the cooling system as described in claim 1-5 any one, in described cooling system, the first conducting strip (4) covers and is fixed on mainboard (2) above, and described the second conducting strip (6) is fixed on described keyboard holder (3).
7. notebook computer according to claim 6, it is characterized in that, described heat pipe heat radiation module also comprise be filled in the first heat-conducting medium (7) between described the first conducting strip (4) and described mainboard (2) and be filled in described the second conducting strip (6) and described keyboard holder (3) between the second heat-conducting medium (8).
8. notebook computer according to claim 7, is characterized in that, described the first heat-conducting medium (7) and the second heat-conducting medium (8) are made for nonmetallic heat conductive material.
9. notebook computer according to claim 6, is characterized in that, described notebook computer also comprises the temperature-uniforming plate of being made by uniform temperature material, and described temperature-uniforming plate is positioned at described mainboard (2) below, and is close to described drain pan (1) inwall.
10. notebook computer according to claim 6, is characterized in that, described keyboard holder (3) is made for metal material.
CN201320599509.3U 2013-09-26 2013-09-26 Laptop cooling system and laptop Expired - Lifetime CN203535561U (en)

Priority Applications (1)

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CN201320599509.3U CN203535561U (en) 2013-09-26 2013-09-26 Laptop cooling system and laptop

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Application Number Priority Date Filing Date Title
CN201320599509.3U CN203535561U (en) 2013-09-26 2013-09-26 Laptop cooling system and laptop

Publications (1)

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CN203535561U true CN203535561U (en) 2014-04-09

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107643815A (en) * 2017-11-10 2018-01-30 山东超越数控电子股份有限公司 A kind of fan-free laptop heat-dissipation system
CN111813199A (en) * 2020-06-23 2020-10-23 常艺馨 Notebook computer cooling system
CN111913547A (en) * 2020-08-10 2020-11-10 山东超越数控电子股份有限公司 Method for achieving high-power-consumption fan-free uniform-temperature heat dissipation
CN113885678A (en) * 2021-10-26 2022-01-04 深圳微步信息股份有限公司 Heat radiation assembly and notebook computer with same
CN116048194A (en) * 2022-07-07 2023-05-02 荣耀终端有限公司 Notebook computer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107643815A (en) * 2017-11-10 2018-01-30 山东超越数控电子股份有限公司 A kind of fan-free laptop heat-dissipation system
CN111813199A (en) * 2020-06-23 2020-10-23 常艺馨 Notebook computer cooling system
CN111913547A (en) * 2020-08-10 2020-11-10 山东超越数控电子股份有限公司 Method for achieving high-power-consumption fan-free uniform-temperature heat dissipation
CN113885678A (en) * 2021-10-26 2022-01-04 深圳微步信息股份有限公司 Heat radiation assembly and notebook computer with same
CN113885678B (en) * 2021-10-26 2023-09-19 深圳微步信息股份有限公司 Radiating assembly and notebook computer with same
CN116048194A (en) * 2022-07-07 2023-05-02 荣耀终端有限公司 Notebook computer
CN116048194B (en) * 2022-07-07 2024-03-19 荣耀终端有限公司 Notebook computer

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C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20220113

Address after: 518000 5c104, floor 5, plant 4, Bangkai science and Technology Industrial Park, south of sightseeing road and west of Bangkai Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen, Guangdong

Patentee after: SHENZHEN BITLAND INFORMATION TECHNOLOGY Co.,Ltd.

Address before: 230601 factory building 2-A, Furong Road North, economic and Technological Development Zone, Hefei, Anhui Province

Patentee before: HEFEI BITLAND INFORMATION TECHNOLOGY Co.,Ltd.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20140409

CX01 Expiry of patent term