CN105228416A - A kind of electronic devices and components radiator structure - Google Patents
A kind of electronic devices and components radiator structure Download PDFInfo
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- CN105228416A CN105228416A CN201510679362.2A CN201510679362A CN105228416A CN 105228416 A CN105228416 A CN 105228416A CN 201510679362 A CN201510679362 A CN 201510679362A CN 105228416 A CN105228416 A CN 105228416A
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- electronic devices
- thermal conductive
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- heat conduction
- conductive metal
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of electronic devices and components radiator structure, comprise shield shell, two quiet fan, heat conduction glue-line and thermal conductive metal plates, shield shell is built-in with pcb board, and this pcb board is provided with electronic devices and components; On the top that two quiet fan are arranged on shield shell and sidepiece cornerwise position, cross-ventilation can be formed; The top of electronic devices and components is provided with heat conduction glue-line, and the top of heat conduction glue-line is provided with thermal conductive metal plate; Thermal conductive metal plate is provided with thermal trough, and this thermal trough is formed primarily of some strip metal bar arranged in parallel.After adopting said structure, the setting of thermal trough on above-mentioned thermal conductive metal plate, conductive structure is lightweight, and thermal conductive contact area is large, and heat conduction is quick.Meanwhile, the heat that thermal conductive metal plate can be drawn by two quiet fan, takes away with the form of convection current.In addition, the setting of shield shell and thermal conductive silicon glue-line, while heat conduction, can make between electronic devices and components mutually isolated, and no signal is disturbed.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of electronic devices and components radiator structure.
Background technology
Electronic devices and components, since innovation and creation, have been used in the middle of modern industry and the modern life more and more, for modern industry, and the fields such as particularly mining, chemical industry, electric power, industry manufacture.As on pcb board the electronic devices and components that attach, while work, produce thermal effect, temperature can constantly raise.If these heats are not taken away in time, then can cause heat accumulation, temperature wafts liter, finally burn out other components and parts on electronic devices and components itself and pcb board, or the normal work of pcb board may be affected.
At present, the radiating mode of electronic devices and components mainly contains: heat conduction, convection current and radiation.Heat conduction refers to, by heat-conducting medium, heat is passed to low temperature place from high temperature.Convection current refers to be taken away heat by the fluid media (medium) of gas or liquid etc.Radiation refers to dispels the heat by smearing specific color on heater.
In above-mentioned three kinds of modes, the radiating efficiency of heat-conducting mode is the highest, and convection type takes second place, and the radiating efficiency of radiation mode is minimum.Because convection type needs the motion of motor drive fluid, therefore it can send noise.Because pcb board is all be installed in box body usually, be not subject to the irradiation of light, therefore, the radiating effect of radiation mode on electronic devices and components is not good.Weigh its advantages against its disadvantages, the electronic devices and components on pcb board use the mode of heat conduction to dispel the heat usually.
In heat-conducting mode, usually adopt copper as the medium of heat conduction.But copper is as heat sink material, although its radiating rate is very fast, its weight is large, and contact area is little, dispels the heat not ideal enough.
Summary of the invention
The technical problem to be solved in the present invention is for above-mentioned the deficiencies in the prior art, and a kind of electronic devices and components radiator structure is provided, this electronic devices and components radiator structure can take into account heat conduction and convection current two kinds of radiating modes, and lightweight, area of dissipation is large, rapid heat dissipation.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of electronic devices and components radiator structure, comprise shield shell, two quiet fan, heat conduction glue-line and thermal conductive metal plates, shield shell is built-in with pcb board, and this pcb board is provided with electronic devices and components; On the top that two quiet fan are arranged on shield shell and sidepiece cornerwise position, cross-ventilation can be formed; The top of electronic devices and components is provided with heat conduction glue-line, and the top of heat conduction glue-line is provided with thermal conductive metal plate; Thermal conductive metal plate is provided with thermal trough, and this thermal trough is formed primarily of some strip metal bar arranged in parallel.
The madial wall of described shield shell is provided with thermal conductive silicon glue-line.
The side that described pcb board deviates from electronic devices and components is provided with silica gel radiating gasket.
Described thermal conductive metal plate surrounding is provided with reinforcement.
Described thermal conductive metal plate is heat conduction copper sheet or heat conduction aluminium flake, and bonding jumper is copper bar or aluminum strip.
After the present invention adopts said structure, the setting of thermal trough on above-mentioned thermal conductive metal plate, makes conductive structure lightweight on the one hand, and on the other hand, thermal conductive contact area is large, and heat conduction is quick.Meanwhile, the heat that thermal conductive metal plate can be drawn by above-mentioned two quiet fan, takes away with the form of convection current.In addition, the setting of shield shell and thermal conductive silicon glue-line, while heat conduction, can make between electronic devices and components mutually isolated, and no signal is disturbed.
Accompanying drawing explanation
Fig. 1 shows the structural representation of a kind of electronic devices and components radiator structure of the present invention;
Fig. 2 shows the structural representation of shield shell.
Wherein have:
1. shield shell;
11. quiet fan;
2.PCB plate;
21. silica gel radiating gaskets
3. electronic devices and components;
4. heat conduction glue-line;
5. thermal conductive metal plate;
51. thermal troughs;
6. thermal conductive silicon glue-line.
Embodiment
Below in conjunction with accompanying drawing and concrete better embodiment, the present invention is further detailed explanation.
As depicted in figs. 1 and 2, a kind of electronic devices and components radiator structure, comprises shield shell 1, two quiet fan 11, heat conduction glue-line 4 and thermal conductive metal plates 5.
Shield shell is built-in with pcb board, and this pcb board is provided with electronic devices and components.
On the top that two quiet fan are arranged on shield shell and sidepiece cornerwise position, cross-ventilation can be formed.
The top of electronic devices and components is provided with heat conduction glue-line, and the top of heat conduction glue-line is provided with thermal conductive metal plate; Thermal conductive metal plate is provided with thermal trough, and this thermal trough is formed primarily of some strip metal bar arranged in parallel.
The madial wall of described shield shell is provided with thermal conductive silicon glue-line.
The side that described pcb board deviates from electronic devices and components is provided with silica gel radiating gasket.
Described thermal conductive metal plate surrounding is provided with reinforcement.
Described thermal conductive metal plate is heat conduction copper sheet or heat conduction aluminium flake, and bonding jumper is preferably copper bar or aluminum strip.
After adopting said structure, the setting of thermal trough on above-mentioned thermal conductive metal plate, makes conductive structure lightweight on the one hand, and on the other hand, thermal conductive contact area is large, and heat conduction is quick.Meanwhile, the heat that thermal conductive metal plate can be drawn by above-mentioned two quiet fan, takes away with the form of convection current.In addition, the setting of shield shell and thermal conductive silicon glue-line, while heat conduction, can make between electronic devices and components mutually isolated, and no signal is disturbed.
More than describe the preferred embodiment of the present invention in detail; but the present invention is not limited to the detail in above-mentioned execution mode, within the scope of technical conceive of the present invention; can carry out multiple equivalents to technical scheme of the present invention, these equivalents all belong to protection scope of the present invention.
Claims (5)
1. an electronic devices and components radiator structure, is characterized in that: comprise shield shell, two quiet fan, heat conduction glue-line and thermal conductive metal plates, shield shell is built-in with pcb board, and this pcb board is provided with electronic devices and components; On the top that two quiet fan are arranged on shield shell and sidepiece cornerwise position, cross-ventilation can be formed; The top of electronic devices and components is provided with heat conduction glue-line, and the top of heat conduction glue-line is provided with thermal conductive metal plate; Thermal conductive metal plate is provided with thermal trough, and this thermal trough is formed primarily of some strip metal bar arranged in parallel.
2. electronic devices and components radiator structure according to claim 1, is characterized in that: the madial wall of described shield shell is provided with thermal conductive silicon glue-line.
3. electronic devices and components radiator structure according to claim 1, is characterized in that: the side that described pcb board deviates from electronic devices and components is provided with silica gel radiating gasket.
4. electronic devices and components radiator structure according to claim 1, is characterized in that: described thermal conductive metal plate surrounding is provided with reinforcement.
5. electronic devices and components radiator structure according to claim 1, is characterized in that: described thermal conductive metal plate is heat conduction copper sheet or heat conduction aluminium flake, and bonding jumper is copper bar or aluminum strip.
Priority Applications (1)
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CN201510679362.2A CN105228416A (en) | 2015-10-19 | 2015-10-19 | A kind of electronic devices and components radiator structure |
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CN201510679362.2A CN105228416A (en) | 2015-10-19 | 2015-10-19 | A kind of electronic devices and components radiator structure |
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CN105228416A true CN105228416A (en) | 2016-01-06 |
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CN201510679362.2A Pending CN105228416A (en) | 2015-10-19 | 2015-10-19 | A kind of electronic devices and components radiator structure |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108488939A (en) * | 2018-04-03 | 2018-09-04 | 吴江市莘塔前进五金厂 | A kind of cleaning type fan assembly |
CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
CN113386497A (en) * | 2021-06-30 | 2021-09-14 | 中国地质大学(武汉) | Exhaust temperature-adjusting backing plate for wood board pyrograph |
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CN101668410A (en) * | 2009-09-25 | 2010-03-10 | 上海微电子装备有限公司 | Heat dissipation system of heating modules |
CN101969754A (en) * | 2010-10-01 | 2011-02-09 | 苏州佳世达电通有限公司 | Cooler |
CN201773341U (en) * | 2010-08-11 | 2011-03-23 | 山东科技大学 | Novel computer monitor |
CN203633032U (en) * | 2013-10-31 | 2014-06-04 | 芜湖市安曼特微显示科技有限公司 | Heat-radiating device for electronic parts and components |
CN205124212U (en) * | 2015-10-19 | 2016-03-30 | 吴江市莘塔前进五金厂 | Heat radiation structure for electronic components |
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2015
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20040156180A1 (en) * | 2003-02-11 | 2004-08-12 | Microsoft Corporation | Computer system with noiseless cooling |
CN101668410A (en) * | 2009-09-25 | 2010-03-10 | 上海微电子装备有限公司 | Heat dissipation system of heating modules |
CN201773341U (en) * | 2010-08-11 | 2011-03-23 | 山东科技大学 | Novel computer monitor |
CN101969754A (en) * | 2010-10-01 | 2011-02-09 | 苏州佳世达电通有限公司 | Cooler |
CN203633032U (en) * | 2013-10-31 | 2014-06-04 | 芜湖市安曼特微显示科技有限公司 | Heat-radiating device for electronic parts and components |
CN205124212U (en) * | 2015-10-19 | 2016-03-30 | 吴江市莘塔前进五金厂 | Heat radiation structure for electronic components |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108488939A (en) * | 2018-04-03 | 2018-09-04 | 吴江市莘塔前进五金厂 | A kind of cleaning type fan assembly |
CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
CN113386497A (en) * | 2021-06-30 | 2021-09-14 | 中国地质大学(武汉) | Exhaust temperature-adjusting backing plate for wood board pyrograph |
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Application publication date: 20160106 |