CN205546388U

CN205546388U - Lead heat pipe cooling module

Info

Publication number: CN205546388U
Application number: CN201620248548.2U
Authority: CN
Inventors: 胡利新; 王云根; 王翰君; 李仁广
Original assignee: Shanghai Railway Communication Co Ltd
Current assignee: Shanghai Railway Communication Co Ltd
Priority date: 2016-03-29
Filing date: 2016-03-29
Publication date: 2016-08-31
Anticipated expiration: 2026-03-29

Abstract

The utility model relates to a lead heat pipe cooling module, including frame (1) and conduction bottom plate (2) of setting on frame (1), conduction bottom plate (2) is the airtight device that generates heat of installing upward, frame (1) on still be equipped with grid group (4), grid group (4) still is connected through at least a set of heat pipe (3) between bottom plate (2) with conducting. Compared with the prior art, the utility model has the advantages of the heat dissipation space utilizes fully, heat dispersion is good, the structure is light.

Description

A kind of heat pipe heat radiation module

Technical field

This utility model relates to a kind of heat radiation module, especially relates to a kind of heat pipe heat radiation module.

Background technology

Size along with the development of the development of electronic technology, especially microelectric technique, electronic devices and components and equipment Reduce the most rapidly, and power is increasing always.The heat that unit volume is accommodated gets more and more, and particularly exists It must be totally enclosed that electronic product under adverse circumstances requires so that the heat dissipation environment of electronic product is worse, in order to Reach the temperature allowed, designer's radiating efficiency to be improved, improve heat exchange environment.Therefore the heat of electronic equipment sets Meter occupies increasingly consequence in the design of whole product.

By traditional Thermal design, the heat radiation module designed (is called for short: fin), mainly uses Aluminum material is extruded, owing to being affected by space size, material thermal conductivity and thermal conduction rate, and heat radiation Usefulness is difficult to be obviously improved again, and the heat radiation being difficult to effectively solve electronic equipment heat flow density exponential increase is asked Topic.

Utility model content

Defect that the purpose of this utility model is contemplated to overcome above-mentioned prior art to exist and a kind of heat pipe is provided Heat radiation module.

The purpose of this utility model can be achieved through the following technical solutions:

A kind of heat pipe heat radiation module, including framework and the conductive back plane being arranged on framework, airtight on conductive back plane Heater members is installed, described framework is additionally provided with grid group, also by least between grid group and conductive back plane One group of heat pipe connects.

Described grid group is made up of the laminar fin splicing that multi-disc is parallel.So can effectively increase heat radiation sky Between, thus improve radiating efficiency.

Louvre also it is evenly distributed with on described fin.The setting of louvre can improve the convection current energy in grid group Power, thus improve radiating efficiency.

Described fin is aluminium fin.

Described conductive back plane is conduction copper soleplate.

Described heat pipe is U-shaped heat-conducting copper pipe.U-shaped heat-conducting copper pipe can sufficiently utilize electronic devices and components Interior limited space, strengthens the contact area with grid group, and then can transfer heat to grid the most rapidly Group, and dissipate.

Described framework is aluminum section bar frame.

Graphene thermal conductive material layer also it is coated with on the surface of described conductive back plane, grid group and heat pipe.Graphite Alkene thermal conductive material layer can be greatly improved the thermal radiation capability in closed environment such as conductive back plane, thus improves relatively The heat dispersion of confined space.

Compared with prior art, this utility model has the advantage that

(1) this utility model uses heat pipe technology, utilizes the quick of heat pipe heat-conduction principle and refrigeration filling Thermal transport property, conducts to grid group rapidly by the heat of heater members, and by grid group cooling, so Just achieve and be delivered to the heat of heater members rapidly to have in the grid group of more high heat dispersion, reach good Heat dispersion.

(2) cell structure being made up of aluminium fin splicing is used, it is possible to maximize in limited space as far as possible and dissipate Heat space, improves area of dissipation, and then improves heat dispersion.

(3) heat radiation module surface all carries out Graphene Heat Conduction Material spraying, and then can improve heat radiation module close The domestic thermal radiation capability of closed loop, thus combine with the grid group three of hot pipe technique, heat radiation, carry from many aspects High heat-sinking capability.

(4) heat radiation module uses the higher copper coin of heat conductivity at the conductive back plane directly contacted with heater members, Be positioned at heat radiation terminal and the big grid group of material usage then uses the lightest aluminium section bar, the most comprehensive the most in many ways Just the heat-sinking capability of heat radiation module and the portability of structure are considered.

Accompanying drawing explanation

Fig. 1 is structural representation of the present utility model；

In figure, 1-framework, 2-conductive back plane, 3-heat pipe, 4-grid group.

Detailed description of the invention

With specific embodiment, this utility model is described in detail below in conjunction with the accompanying drawings.

Embodiment 1

A kind of heat pipe 3 dispels the heat module, and its structure is as it is shown in figure 1, include framework 1 and be arranged on framework 1 Conductive back plane 2, framework 1 is aluminum section bar frame, and conductive back plane 2 is conduction copper soleplate, airtight on conductive back plane 2 Being provided with heater members, framework 1 is additionally provided with grid group 4, grid group 4 is by parallel laminar fin splicing Composition, fin is aluminium fin, and fin is also evenly distributed with louvre, between grid group 4 and conductive back plane 2 also Being connected by three groups of heat pipes 3, heat pipe 3 is U-shaped heat-conducting copper pipe.In conductive back plane 2, grid group 4 Graphene thermal conductive material layer also it is coated with the surface of heat pipe 3.

The above-mentioned description to embodiment is to be understood that for ease of those skilled in the art and use reality With novel.These embodiments obviously easily can be made various amendment, and handle by person skilled in the art General Principle described herein is applied in other embodiments without through performing creative labour.Therefore, this practicality The novel above-described embodiment that is not limited to, those skilled in the art are according to announcement of the present utility model, new without departing from this practicality Improvement and amendment that type category is made all should be within protection domains of the present utility model.

Claims

1. a heat pipe heat radiation module, it is characterised in that include framework (1) and be arranged on framework (1) Conductive back plane (2), the upper airtight heater members that is provided with of conductive back plane (2), described framework (1) also sets There is grid group (4), between grid group (4) and conductive back plane (2) also by least one set heat pipe (3) even Connect.

A kind of heat pipe heat radiation module the most according to claim 1, it is characterised in that described grid group (4) it is made up of the laminar fin splicing that multi-disc is parallel.

A kind of heat pipe heat radiation module the most according to claim 2, it is characterised in that on described fin Also it is evenly distributed with louvre.

A kind of heat pipe heat radiation module the most according to claim 2, it is characterised in that described fin is Aluminium fin.

A kind of heat pipe heat radiation module the most according to claim 1, it is characterised in that at the bottom of described conduction Plate (2) is conduction copper soleplate.

A kind of heat pipe heat radiation module the most according to claim 1, it is characterised in that described heat pipe (3) it is U-shaped heat-conducting copper pipe.

A kind of heat pipe heat radiation module the most according to claim 1, it is characterised in that described framework (1) For aluminum section bar frame.

8. according to the arbitrary described a kind of heat pipe heat radiation module of claim 1～7, it is characterised in that described The surface of conductive back plane (2), grid group (4) and heat pipe (3) be also coated with Graphene thermal conductive material layer.