CN205726262U - A kind of digital earphone - Google Patents
A kind of digital earphone Download PDFInfo
- Publication number
- CN205726262U CN205726262U CN201620362738.7U CN201620362738U CN205726262U CN 205726262 U CN205726262 U CN 205726262U CN 201620362738 U CN201620362738 U CN 201620362738U CN 205726262 U CN205726262 U CN 205726262U
- Authority
- CN
- China
- Prior art keywords
- earphone
- digital earphone
- fin
- parts
- thermal source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This utility model embodiment provides a kind of digital earphone, and this digital earphone includes mainboard, has thermal source components and parts in described mainboard, is provided with the fin contacted with described thermal source components and parts in described digital earphone.By this utility model embodiment, can be by the heat away of point type thermal source components and parts, to reach the effect of uniform heat, quick heat radiating, efficiently solve digital earphone internal close little space because of during using temperature raise and the problem of fragile device that causes.
Description
Technical field
This utility model relates to ear phone technology field, particularly relates to a kind of digital earphone.
Background technology
Digital earphone is to use digital signal interface (such as Lightning interface, USB interface etc.) design
Earphone, its pass through built-in decoding chip and amplifier, digital information being converted to can be by ear recognition
Analog information, and export to earphone after processing and amplifying.
USB Type-C interface is the one in digital signal interface, is just gradually applied in digital earphone.
Type-C is a kind of connecting interface of USB interface, all can be inserted into regardless of tow sides.Type-C interface
As the interface of a new generation, in addition to charging is transmitted with data, it is also possible to as sides such as display and audio frequency
The coffret in face.
Current Type-C digital earphone, though having the tonequality of shock, but because himself power consumption is big, from
And cause the Type-C end mainboard device heating being connected with smart machine serious, have and damage the potential of device
Risk.
Utility model content
In view of this, this utility model embodiment provides a kind of digital earphone, makes solving digital earphone
By the middle problem easily causing device failure because of intensification.
In order to solve the problems referred to above, this utility model embodiment provides a kind of digital earphone, wherein, institute
State digital earphone and include mainboard, described mainboard is provided with thermal source components and parts, described digital earphone is arranged
There is the fin contacted with described thermal source components and parts.
Alternatively, described fin is bonded on described thermal source components and parts by cohesive material.
Alternatively, described digital earphone also includes interior upper casing and interior lower casing, described interior upper casing and interior lower casing button
Conjunction arranges formation earphone inner shell, and described mainboard is positioned in described earphone inner shell.
Alternatively, being provided with muscle position in described interior upper casing and/or described interior lower casing, described muscle position is for by institute
State fin and be fixed on the position contacted with described thermal source components and parts.
Alternatively, described fin is made up of heat sink material, or, described fin is attached with heat radiation
Material.
Alternatively, described heat sink material is graphite.
Alternatively, described jointing material is double faced adhesive tape.
Alternatively, described double faced adhesive tape thickness is 0.01-0.03 millimeter.
Alternatively, described fin side is provided with flexible material.
Alternatively, described flexible material is foam.
Alternatively, the thermal source components and parts of described mainboard side arrange described fin, or, in institute
State and on the thermal source components and parts of mainboard both sides, be respectively provided with described fin.
From above technical scheme, this utility model is by arranging heat radiation on the thermal source components and parts of mainboard
Sheet, can be by the heat away of point type thermal source components and parts, to reach the effect of uniform heat, quick heat radiating,
Efficiently solve digital earphone internal close little space because of during using temperature raise and cause fragile
The problem of device.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will
The accompanying drawing used required in embodiment or description of the prior art is briefly described, it should be apparent that,
Accompanying drawing in describing below is only some embodiments described in this utility model, common for this area
From the point of view of technical staff, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is each modular construction schematic diagram after a kind of digital earphone fractionation of this utility model embodiment；
Fig. 2 is that the thermal source components and parts in a kind of digital earphone of this utility model embodiment assemble with fin
After structural representation；
Fig. 3 is the structural representation after a kind of digital earphone assembling inner shell of this utility model embodiment；
Fig. 4 is the structural representation after a kind of digital earphone completed assembled of this utility model embodiment.
Detailed description of the invention
For the technical scheme making those skilled in the art be more fully understood that in this utility model embodiment, below
The accompanying drawing in this utility model embodiment will be combined, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model,
Rather than whole embodiments.Based on the embodiment in this utility model, those of ordinary skill in the art institute
The every other embodiment obtained, all should belong to the scope of this utility model protection.
Digital earphone uses the data line interface interface as earphone of terminal unit such as mobile phone, such as Android
The Micro USB interface of equipment or the currently used Lightning interface of ios device, terminal unit
Provide only digital signal and power supply, by the built-in corresponding device including decoder of earphone products, carry out
Audio frequency exports.Above-mentioned device is generally arranged on earphone mainboard, during earphone work, and some device on mainboard
Part, is all regarded as this practicality such as microprocessor, decoder etc. because of power consumption heat production, the device of these heat production
Thermal source components and parts in new embodiment, if these thermal source components and parts can not be dispelled the heat in time, will be right
Device in earphone produces harmful effect.
To this end, in the digital earphone of this utility model embodiment offer, the thermal source components and parts in mainboard are adopted
With cooling measure, digital earphone arranges the fin contacted with the thermal source components and parts on mainboard.
Each modular construction after a kind of digital earphone fractionation being provided with fin is as shown in Figure 1.In Fig. 1,
4 is mainboard, is provided with thermal source components and parts, and 3 and 7 is fin, and 2 is interior upper casing, 8 be interior under
Shell, 5 is bottom, and 6 is end cap, and 1 is shell.It should be noted that in the example shown in Fig. 1, main
It is provided with fin on the thermal source components and parts of plate both sides, such as fin 3 and 7, but in actual applications,
Fin on the thermal source components and parts of mainboard side can be only set, as only arranged fin 3, or,
Fin 7 is only set.Being compared to one side and arrange fin, bilateral is respectively provided with fin and is more conducive to carry
High radiating effect.
In the present embodiment, fin 3 and 7 is bonded on the thermal source components and parts of mainboard by cohesive material,
To guarantee the close laminating with thermal source components and parts.Alternatively, this cohesive material can be double faced adhesive tape.Preferably
Ground, this double faced adhesive tape thickness is 0.01-0.03 millimeter.The double faced adhesive tape of this thickness is so that fin and thermal source
Components and parts preferably contact, effectively to dispel the heat.But being not limited to this, other cohesive material is too
It is suitable for.
Air is the non-conductor of heat, and therefore fin must contact with thermal source components and parts.Pass through cohesive material
Such as double faced adhesive tape, on the one hand fin and thermal source components and parts good bond can be reached heat sink material and heat
The effect of source components and parts contact；On the other hand, heat sink material can be glued on a heat sink by cohesive material,
And the medium pasting heat sink material without other, reduce fin realizes cost.
In this utility model embodiment, fin can be made up of heat sink material, or, on a heat sink
Attachment heat sink material.Wherein, the preferred graphite of heat sink material.Graphite radiating is effective, and cost is relatively low,
But being not limited to this, other heat sink material, such as Nanometer Copper carbon, Copper Foil is equally applicable.
Preferably, it is also possible in fin side, flexible material is set.Fin side laminating flexible material,
This flexible material can ensure that fin is not pressed down when by local compression, simultaneously the most also can by with inner shell
Interference assemble make fin reach good contacting with mainboard thermal source.It is further preferred that this soft material
Material can be foam.
In the present embodiment, structure after fin and thermal source components and parts being assembled is as in figure 2 it is shown, in Fig. 2
Fin 3 and 7 on all with cohesive material, fin 3 and 7 is pasted onto master by this cohesive material
On the thermal source components and parts of plate, so that fin can firmly be fitted with thermal source components and parts, effectively dispel the heat.
It should be noted that fin can also be fixed to by the interior upper casing shown in Fig. 1 and interior lower casing
The position contacted with thermal source components and parts.In such cases, as shown in fig. 1, digital earphone also includes
Interior upper casing 2 and interior lower casing 8, after interior upper casing and interior lower casing assemble, interior upper casing and interior lower casing fasten and arrange
Forming earphone inner shell, the mainboard of digital earphone is i.e. positioned in this earphone inner shell.Wherein, interior upper casing 2 and/
Or interior lower casing 8 can be provided with muscle position, this muscle position is for being fixed on fin 3 and/or fin 7
The position contacted with thermal source components and parts.Wherein, muscle position position is set and shape can be by this area skill
Art personnel be appropriately arranged with according to actual needs, to be effectively fixed to fin contact with thermal source components and parts
Position, carrying out heat radiation most effectively for principle.
By above-mentioned various ways fin and thermal source components and parts fixed and carry out the structure after inner shell assembling
As shown in Figure 3.
After inner shell sections is completed, bottom 5, end cap 6 and shell 1 are also assembled in relevant position,
So far, the structure after the present embodiment digital earphone completed assembled is as shown in Figure 4.
The radiator structure of the digital earphone provided in this utility model embodiment can be widely applied to all kinds
Digital earphone, be particularly suited for Type-C digital earphone.The number provided in this utility model embodiment
In word earphone, monolithic or multi-disc fin are fitted at thermal source components and parts, can be with viscous on fin
Property material, to guarantee and the close laminating of fin and thermal source components and parts, then package shell housing, end cap
Deng assembly, complete the assembling of one integral piece product.By fin, by the heat away of point type thermal source, reach
Uniform heat, the effect of quick heat radiating, solve the internal problem of temperature rise closing little space of digital earphone,
Effectively protection mainboard electronic device.
Although having been described for preferred embodiment of the present utility model, but those skilled in the art once obtain
The substantially creative concept of cicada, then can make other change and amendment to these embodiments.So, institute
Attached claim is intended to be construed to include preferred embodiment and fall into all changes of this utility model scope
And amendment.Obviously, those skilled in the art this utility model can be carried out various change and modification and
Without departing from spirit and scope of the present utility model.So, if of the present utility model these are revised and modification
Belong within the scope of this utility model claim and equivalent technologies thereof, then this utility model is also intended to bag
Change and including modification containing these.
Claims (11)
1. a digital earphone, wherein, described digital earphone includes mainboard, and described mainboard is provided with heat
Source components and parts, it is characterised in that be provided with in described digital earphone and contact with described thermal source components and parts
Fin.
Digital earphone the most according to claim 1, it is characterised in that described fin passes through viscosity
Material is bonded on described thermal source components and parts.
Digital earphone the most according to claim 1, it is characterised in that described digital earphone also includes
Interior upper casing and interior lower casing, described interior upper casing and interior lower casing fasten and arrange formation earphone inner shell, described mainboard position
In described earphone inner shell.
Digital earphone the most according to claim 3, it is characterised in that
Being provided with muscle position in described interior upper casing and/or described interior lower casing, described muscle position is for by described fin
It is fixed on the position contacted with described thermal source components and parts.
5. according to the digital earphone described in any one of Claims 1-4, it is characterised in that described heat radiation
Sheet is made up of heat sink material, or, described fin is attached with heat sink material.
Digital earphone the most according to claim 5, it is characterised in that described heat sink material is graphite.
Digital earphone the most according to claim 2, it is characterised in that described cohesive material is two-sided
Glue.
Digital earphone the most according to claim 7, it is characterised in that described double faced adhesive tape thickness is
0.01-0.03 millimeter.
Digital earphone the most according to claim 2, it is characterised in that described fin side is arranged
There is flexible material.
Digital earphone the most according to claim 9, it is characterised in that described flexible material is bubble
Cotton.
11. digital earphones according to claim 1, it is characterised in that in described mainboard side
Described fin is set on thermal source components and parts, or, the thermal source components and parts of described mainboard both sides are all provided with
Put described fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620362738.7U CN205726262U (en) | 2016-04-26 | 2016-04-26 | A kind of digital earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620362738.7U CN205726262U (en) | 2016-04-26 | 2016-04-26 | A kind of digital earphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205726262U true CN205726262U (en) | 2016-11-23 |
Family
ID=57293747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620362738.7U Expired - Fee Related CN205726262U (en) | 2016-04-26 | 2016-04-26 | A kind of digital earphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205726262U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105898640A (en) * | 2016-04-26 | 2016-08-24 | 乐视控股（北京）有限公司 | Digital headset |
-
2016
- 2016-04-26 CN CN201620362738.7U patent/CN205726262U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105898640A (en) * | 2016-04-26 | 2016-08-24 | 乐视控股（北京）有限公司 | Digital headset |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204947033U (en) | Lithium secondary battery module | |
| CN203851283U (en) | Loudspeaker diaphragm assembly | |
| CN202979570U (en) | Shielding case and electronic product thereof | |
| CN209593511U (en) | A kind of terminal device | |
| CN205726262U (en) | A kind of digital earphone | |
| CN204598564U (en) | A kind of heat radiation foam cushion | |
| CN105898640A (en) | Digital headset | |
| CN203984674U (en) | Loud speaker module | |
| CN208385225U (en) | A kind of secondary capacitor that electrical insulation strength is high | |
| CN203720822U (en) | Novel connecting structure of flexible touch screen and printed circuit board (PCB) | |
| CN207736773U (en) | The compaction mold of PET film is pasted on pcb board | |
| CN202473985U (en) | Solar junction box | |
| CN204840686U (en) | Low frequency treatment is pasted in solar energy power supply | |
| CN205987670U (en) | Novel graphite thermal film | |
| CN207340141U (en) | A kind of Novel earphone | |
| CN206338011U (en) | The Sound-proof material assembling structure of home appliance | |
| CN203192784U (en) | Enhanced high-thermal-conductivity graphite film structure in electronic terminal | |
| CN204031597U (en) | There is the flexible circuit board of burying and holding and burying resistance | |
| CN220078962U (en) | High-elastic heat dissipation foam adhesive tape | |
| CN219287986U (en) | High-quality and smooth-attached fireproof heat-conducting buffer gasket | |
| CN207365989U (en) | A kind of energy consumption measure device | |
| CN203984816U (en) | Plastic shell and sheet metal syndeton | |
| CN202679882U (en) | Heat dissipation apparatus | |
| CN203301939U (en) | Semicircular conductive foam | |
| CN208478139U (en) | High efficiency and heat radiation capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20170426 |