CN203407016U - Micro-electro-mechanic system (MEMS) microphone - Google Patents
Micro-electro-mechanic system (MEMS) microphone Download PDFInfo
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- CN203407016U CN203407016U CN201320517118.2U CN201320517118U CN203407016U CN 203407016 U CN203407016 U CN 203407016U CN 201320517118 U CN201320517118 U CN 201320517118U CN 203407016 U CN203407016 U CN 203407016U
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- mems microphone
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- wiring board
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- 238000006243 chemical reaction Methods 0.000 abstract description 10
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- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 5
- 230000000717 retained effect Effects 0.000 abstract 1
- 230000006872 improvement Effects 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model belongs to the acoustoelectric product technology field, in particular relates to an MEMS microphone. The MEMS microphone comprises an external packaging structure composed of a circuit board and a shell covering on the circuit board, the circuit board located inside the packaging structure is equipped with an MEMS chip and an application specific integrated circuit (ASIC) chip electrically connected with the MEMS chip. The MEMS microphone also comprises at least one sound aperture communicated with the interior of the packaging structure, a cushion chamber is arranged at the inner side of the packaging structure to correspond to the sound aperture, and a cover plate is fixed connected with the inner side of the packaging structure and is equipped with a plurality of micropores to correspond to the cushion chamber. When the MEMS microphone is used, firstly, an air flow is cushioned by the cushion chamber, and then only the micropores on the cover plate can act on a diaphragm of the MEMS chip. The cushion chamber can cushion the air flow, and the micropores enable the air flow to be mitigative and uniform, so that the problem that a frequency response curve of the conventional MEMS microphone is reduced obviously when a certain frequency is exceeded is solved, the acoustoelectric conversion performance of the MEMS microphone can be retained effectively. The cover plate also has the dustproof and waterproof effects.
Description
Technical field
The utility model belongs to acoustic-electric product technical field, particularly a kind of MEMS microphone.
Background technology
MEMS microphone is voice signal to be converted to the energy converter of the signal of telecommunication, and along with the develop rapidly of portable electric appts, MEMS microphone is widely used in portable electric appts in recent years.
The key technical indexes of MEMS microphone has sensitivity, frequency response, directional property, output impedance, dynamic range and signal to noise ratio etc., and wherein frequency response is to frequency distortion important indicator in reflection MEMS microphone acoustic-electric transfer process.Frequency response is MEMS microphone while receiving different frequency sound, and output signal can occur along with the variation of frequency to amplify or decay.Optimal frequency response curve is a horizontal line, represents that output signal can truly present the characteristic of original sound, but this ideal situation is difficult to realize.When the output frequency of MEMS microphone surpasses certain frequency, frequency response curve can significantly decline, and will affect the acoustic-electric conversion performance of microphone.
Utility model content
The purpose of this utility model is to provide a kind of MEMS microphone, and the problem that when output frequency that is intended to solve existing MEMS microphone surpasses certain frequency, frequency response curve can obviously decline can effectively keep the acoustic-electric conversion performance of MEMS microphone.
The utility model is to realize like this, a kind of MEMS microphone, described MEMS microphone comprises wiring board and is located at the outer enclosure structure that the shell on described wiring board forms, the described wiring board that is positioned at described encapsulating structure inside is provided with MEMS chip and the asic chip that is electrically connected to described MEMS chip also comprises: with at least one sound hole of described encapsulating structure internal communication, the place, corresponding described sound hole, inner side of described encapsulating structure is provided with cushion chamber, described encapsulating structure inner side is fixedly connected with cover plate, on described cover plate, the position of corresponding described cushion chamber is provided with some micropores.
As a kind of improvement, described sound hole is arranged on the top of described shell, and the place, corresponding described sound hole, inner side of described shell is provided with described cushion chamber, and described cover plate is fixedly connected with the inside top of described shell.
As a kind of improvement, described sound hole is arranged on the position of corresponding described MEMS chip on described wiring board, the inner side that to define a side that described wiring board combines with described shell be described wiring board, the place, corresponding described sound hole, inner side of described wiring board is provided with described cushion chamber, and described cover plate is fixedly connected with the inner side of described wiring board.
As a kind of improvement, described cover plate is arranged in described cushion chamber.
As further a kind of improvement, described some micropores and described sound hole are crisscross arranged.
As a kind of improvement, described sound hole is set to one or three.
As a kind of improvement, described some micropores and described sound hole are crisscross arranged.
Owing to having adopted technique scheme, while using the MEMS microphone that the utility model provides, air-flow enters MEMS microphone by sound hole, first through cushion chamber, cushion, and then by the micropore on cover plate, can act on the diaphragm of MEMS chip, complete the conversion of acoustic-electric, cushion chamber can cushion air-flow, micropore becomes air-flow to relax evenly, while having solved existing MEMS microphone over certain frequency, frequency response curve is understood the problem obviously declining, and can effectively keep the acoustic-electric conversion performance of MEMS microphone; Cover plate also has the effect of dustproof and waterproof; Avoid air-flow directly to impact the diaphragm of MEMS chip, MEMS chip has been played to protective effect, effectively reduce the spoilage of MEMS chip, extended the useful life of MEMS microphone.
Accompanying drawing explanation
Fig. 1 is the structural representation of the MEMS microphone of the utility model the first embodiment;
Fig. 2 is the structural representation of the MEMS microphone of the utility model the second embodiment;
Fig. 3 is the structural representation of the MEMS microphone of the utility model the 3rd embodiment;
Fig. 4 is the plan structure schematic diagram of Fig. 3;
Fig. 5 is the structural representation of the MEMS microphone of the utility model the 4th embodiment;
Fig. 6 is the structural representation of the MEMS microphone of the utility model the 5th embodiment;
Fig. 7 is the structural representation of the MEMS microphone of the utility model the 6th embodiment;
Fig. 8 is the structural representation of the MEMS microphone of the utility model the 7th embodiment;
Fig. 9 is the structural representation of looking up of Fig. 8;
Figure 10 is the structural representation of the MEMS microphone of the utility model the 8th embodiment;
Wherein, 1, wiring board, 11a, sound hole, 11b, sound hole, 12, cushion chamber, 2, shell, 21a, sound hole, 21b, sound hole, 22, cushion chamber, 3, MEMS chip, 4, asic chip, 5, cover plate, 51a, micropore, 51b, micropore.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The first embodiment
As shown in Figure 1, this MEMS microphone comprises: wiring board 1, be located at the shell 2 on wiring board 1, this wiring board 1 and shell 2 surround the outer enclosure structure of MEMS microphone, the wiring board 1 that is positioned at encapsulating structure inside is provided with MEMS chip 3, on wiring board 1, be also provided with the asic chip 4 being electrically connected to MEMS chip 3, the cover top of shell 2 is provided with a sound hole 21a, the inner side of shell 2 is provided with cushion chamber 22 to hole 21a place at the sound, this cushion chamber 22 is for being arranged on the groove on shell 2, the cover plate 5 being fixedly connected with the cover inside top of shell 2, on this cover plate 5, the position of corresponding cushion chamber 22 is provided with some micropore 51a.
During use, air-flow enters MEMS microphone by sound hole 21a, first through cushion chamber 22, cushion, and then can act on the diaphragm of MEMS chip 3 by the micropore 51a on cover plate 5, complete the conversion of acoustic-electric, cushion chamber 22 can cushion air-flow, and micropore 51a becomes air-flow to relax evenly, while having solved existing MEMS microphone over certain frequency, frequency response curve is understood the problem obviously declining, and can effectively keep the acoustic-electric conversion performance of MEMS microphone; Cover plate 5 also has the effect of dustproof and waterproof; Avoid air-flow directly to impact the diaphragm of MEMS chip 3, MEMS chip 3 has been played to protective effect, effectively reduce the spoilage of MEMS chip 3, extended the useful life of MEMS microphone.
In the present embodiment, some micropore 51a and sound hole 21a are crisscross arranged.The regulating action that can strengthen like this cushion chamber 22 and micropore 51a, makes MEMS microphone have more excellent acoustic-electric conversion performance.
In the present embodiment, the bonding connection of cover inside top of cover plate 5 and shell 2.
In the present embodiment, asic chip 4 is bonded on wiring board 1 by fluid sealant.
The second embodiment
As shown in Figure 2, this embodiment and the first embodiment are basic identical, and its difference is:
In the present embodiment, some micropore 51a and sound hole 21a are crisscross arranged.
The 3rd embodiment
From Fig. 3, Fig. 4, this embodiment and the first embodiment are basic identical, and its difference is:
The cover top of shell 2 is provided with three sound hole 21b, and corresponding three the sound hole 21b of cushion chamber 22 of shell 2 cover inside top arrange, and the some micropore 51b on cover plate 5 are crisscross arranged with three sound hole 21b respectively.
The 4th embodiment
As shown in Figure 5, this embodiment and the 3rd embodiment are basic identical, and its difference is:
The 5th embodiment
As shown in Figure 6, this embodiment and the first embodiment are basic identical, and its difference is:
In wiring board 1 region that MEMS chip 3 covers are established, be provided with a sound hole 11a, the side that definition wiring board 1 combines with shell 2 is the inner side of wiring board 1, the inner side of wiring board 1 is provided with cushion chamber 12 to hole 11a place at the sound, this cushion chamber 12 is for being arranged on the inboard groove of wiring board 1, with the cover plate 5 that the inner side of wiring board 1 is fixedly connected with, on this cover plate 5, the position of corresponding cushion chamber 12 is provided with some micropore 51a.
In the present embodiment, some micropore 51a and sound hole 11a are crisscross arranged.
The 6th embodiment
As shown in Figure 7, this embodiment and the 5th embodiment are basic identical, and its difference is:
The 7th embodiment
From Fig. 8, Fig. 9, this embodiment and the 5th embodiment are basic identical, and its difference is:
In wiring board 1 region that MEMS chip 3 covers are established, be provided with three sound hole 11b, corresponding three the sound hole 11b of cushion chamber 12 of wiring board 1 inner side arrange, and the some micropore 51b on cover plate 5 are crisscross arranged with three sound hole 11b respectively.
The 8th embodiment
As shown in Figure 10, this embodiment and the 7th embodiment are basic identical, and its difference is:
The MEMS microphone that the utility model provides comprises: wiring board, be located at the shell on wiring board, this wiring board and shell surround the outer enclosure structure of MEMS microphone, the wiring board that is positioned at encapsulating structure inside is provided with MEMS chip, on wiring board, be also provided with the asic chip being electrically connected to MEMS chip, at least one sound hole with encapsulating structure internal communication, encapsulating structure inner side is provided with cushion chamber to place, hole at the sound, with the cover plate that encapsulating structure inner side is fixedly connected with, on this cover plate, the position of corresponding cushion chamber is provided with some micropores; During use, air-flow enters MEMS microphone by sound hole, first through cushion chamber, cushion, and then by the micropore on cover plate, can act on the diaphragm of MEMS chip, complete the conversion of acoustic-electric, cushion chamber can cushion air-flow, and micropore becomes air-flow to relax evenly, while having solved existing MEMS microphone over certain frequency, frequency response curve is understood the problem obviously declining, and can effectively keep the acoustic-electric conversion performance of MEMS microphone; Cover plate also has the effect of dustproof and waterproof; Avoid air-flow directly to impact the diaphragm of MEMS chip, MEMS chip has been played to protective effect, effectively reduce the spoilage of MEMS chip, extended the useful life of MEMS microphone.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (7)
1.MEMS microphone, comprise wiring board and be located at the outer enclosure structure that the shell on described wiring board forms, be positioned at the asic chip that the described wiring board of described encapsulating structure inside is provided with MEMS chip and is electrically connected to described MEMS chip, it is characterized in that, also comprise: with at least one sound hole of described encapsulating structure internal communication, the place, corresponding described sound hole, inner side of described encapsulating structure is provided with cushion chamber, described encapsulating structure inner side is fixedly connected with cover plate, and on described cover plate, the position of corresponding described cushion chamber is provided with some micropores.
2. MEMS microphone according to claim 1, is characterized in that, described sound hole is arranged on the top of described shell, and the place, corresponding described sound hole, inner side of described shell is provided with described cushion chamber, and described cover plate is fixedly connected with the inside top of described shell.
3. MEMS microphone according to claim 1, it is characterized in that, described sound hole is arranged on the position of corresponding described MEMS chip on described wiring board, the inner side that to define a side that described wiring board combines with described shell be described wiring board, the place, corresponding described sound hole, inner side of described wiring board is provided with described cushion chamber, and described cover plate is fixedly connected with the inner side of described wiring board.
4. according to the MEMS microphone described in claim 2 or 3, it is characterized in that, described cover plate is arranged in described cushion chamber.
5. MEMS microphone according to claim 4, is characterized in that, described some micropores and described sound hole are crisscross arranged.
6. MEMS microphone according to claim 1, is characterized in that, described sound hole is set to one or three.
7. according to the MEMS microphone described in claim 1,2,3 or 6, it is characterized in that, described some micropores and described sound hole are crisscross arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320517118.2U CN203407016U (en) | 2013-08-22 | 2013-08-22 | Micro-electro-mechanic system (MEMS) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320517118.2U CN203407016U (en) | 2013-08-22 | 2013-08-22 | Micro-electro-mechanic system (MEMS) microphone |
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| CN203407016U true CN203407016U (en) | 2014-01-22 |
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| CN201320517118.2U Expired - Lifetime CN203407016U (en) | 2013-08-22 | 2013-08-22 | Micro-electro-mechanic system (MEMS) microphone |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902409A (en) * | 2014-03-04 | 2015-09-09 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone acoustic structure |
| CN105491493A (en) * | 2015-12-29 | 2016-04-13 | 山东共达电声股份有限公司 | Directivity mems mic |
| US9369788B1 (en) | 2014-12-05 | 2016-06-14 | Industrial Technology Research Institute | MEMS microphone package |
| CN105940682A (en) * | 2014-12-16 | 2016-09-14 | 华为技术有限公司 | Microphone kit and electronic device |
| US9491531B2 (en) | 2014-08-11 | 2016-11-08 | 3R Semiconductor Technology Inc. | Microphone device for reducing noise coupling effect |
| CN109788416A (en) * | 2017-11-14 | 2019-05-21 | 美商楼氏电子有限公司 | With the microphone apparatus for entering protection |
| CN110049419A (en) * | 2019-04-12 | 2019-07-23 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone |
| WO2019153916A1 (en) * | 2018-02-12 | 2019-08-15 | 歌尔股份有限公司 | Loudspeaker module |
| CN111295894A (en) * | 2017-09-12 | 2020-06-16 | 美商楼氏电子有限公司 | Microphone package |
| CN112714388A (en) * | 2020-12-25 | 2021-04-27 | 歌尔微电子有限公司 | Directional microphone and electronic device |
| CN113811747A (en) * | 2019-03-22 | 2021-12-17 | 挪威商声熙贝尔公司 | Optical microphone assembly |
-
2013
- 2013-08-22 CN CN201320517118.2U patent/CN203407016U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902409A (en) * | 2014-03-04 | 2015-09-09 | 钰太芯微电子科技（上海）有限公司 | MEMS microphone acoustic structure |
| US9491531B2 (en) | 2014-08-11 | 2016-11-08 | 3R Semiconductor Technology Inc. | Microphone device for reducing noise coupling effect |
| US9369788B1 (en) | 2014-12-05 | 2016-06-14 | Industrial Technology Research Institute | MEMS microphone package |
| CN105940682A (en) * | 2014-12-16 | 2016-09-14 | 华为技术有限公司 | Microphone kit and electronic device |
| CN105491493A (en) * | 2015-12-29 | 2016-04-13 | 山东共达电声股份有限公司 | Directivity mems mic |
| CN111295894A (en) * | 2017-09-12 | 2020-06-16 | 美商楼氏电子有限公司 | Microphone package |
| CN109788416A (en) * | 2017-11-14 | 2019-05-21 | 美商楼氏电子有限公司 | With the microphone apparatus for entering protection |
| WO2019153916A1 (en) * | 2018-02-12 | 2019-08-15 | 歌尔股份有限公司 | Loudspeaker module |
| US11265646B2 (en) | 2018-02-12 | 2022-03-01 | Goertek Inc. | Loudspeaker module |
| CN113811747A (en) * | 2019-03-22 | 2021-12-17 | 挪威商声熙贝尔公司 | Optical microphone assembly |
| CN110049419A (en) * | 2019-04-12 | 2019-07-23 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone |
| CN112714388A (en) * | 2020-12-25 | 2021-04-27 | 歌尔微电子有限公司 | Directional microphone and electronic device |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140122 |
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| CX01 | Expiry of patent term |