CN105491493A - Directivity mems mic - Google Patents

Directivity mems mic Download PDF

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Publication number
CN105491493A
CN105491493A CN201511020207.6A CN201511020207A CN105491493A CN 105491493 A CN105491493 A CN 105491493A CN 201511020207 A CN201511020207 A CN 201511020207A CN 105491493 A CN105491493 A CN 105491493A
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CN
China
Prior art keywords
housing
terminal block
sheet
mems
sound hole
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Granted
Application number
CN201511020207.6A
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Chinese (zh)
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CN105491493B (en
Inventor
刘志永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gettop Acoustic Co Ltd
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Shandong Gettop Acoustic Co Ltd
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Priority to CN201511020207.6A priority Critical patent/CN105491493B/en
Publication of CN105491493A publication Critical patent/CN105491493A/en
Application granted granted Critical
Publication of CN105491493B publication Critical patent/CN105491493B/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)

Abstract

The present invention discloses a directivity MEMS MIC. The directivity MEMS MIC comprises a wiring board, an ASIC piece, an MEMS piece, a damping piece and a housing. The ASIC piece and the MEMS piece are both installed at the upper surface of the wiring board; the wiring board is provided with a tune-passing hole communicating with the inner cavity of the MENS piece; the housing includes a first housing installed at the upper surface of the wiring board and a second housing which is connected with the lower surface of the wiring board; the ASIC piece and the MEMS piece are both located at a first tune cavity formed by the wiring board and the first housing, and the inner cavity body of the second housing and the inner cavity of the MEMS piece form a second tune cavity through the sound-passing hole; the first housing is provided with a first tune hole, and the second is provided with a second tune hole. According to the invention, the assembly efficiency of the directivity MEMS MIC is improved.

Description

Directive property MEMS MIC
Technical field
The present invention relates to technical field of electronic equipment, particularly a kind of directive property MEMSMIC.
Background technology
Along with the continuous progress of science and technology, electronic equipment is more and more frivolous, wherein the space of each assembly of electronic equipment is also compressed relatively, MEMSMIC (micro-electro-mechanical microphone, MicroelectromechanicalSystemsMicrophone) as a kind of device utilizing integrated circuit micromachine and electronic building brick can be integrated in silicon wafer panel, use more and more extensive, wherein directive property MEMSMIC is the one of micro-electro-mechanical microphone.
As shown in Figure 1, traditional directive property MEMSMIC comprises terminal block 01, ASIC (integrated circuit, ApplicationSpecificIntegratedCircuit) sheet 05, MEMS (MEMS (micro electro mechanical system), MicroelectromechanicalSystems) sheet 011, shell 08, first conduction element 014 and the second conduction element 015, wherein, shell 08 is arranged on terminal block 01 upper surface, first conduction element 014 is arranged on shell 01 lower surface, second conduction element 015 is arranged on the lower surface of the first conduction element 014, ASIC sheet 05 and MEMS sheet 011 are installed on terminal block 01 upper surface, and be positioned at the first cavity that shell 08 formed with terminal block 01.Terminal block 01 is provided with the first mistake sound hole 010 be communicated with the first cavity and be communicated with MEMS sheet 011 internal cavity second and crosses sound hole 02, second conduction element 015 is provided with the first tunnel 023 and the second tunnel 019 of separate setting, and the second conduction element 015 is provided with the first sound hole 021 that the first tunnel 023 is in communication with the outside and the second sound hole 022 that the second tunnel 019 is in communication with the outside.First conduction element 014 is provided with the 3rd mistake sound hole and the 4th and crosses sound hole, first mistake sound hole 010 is crossed sound hole by the 3rd and is communicated with the first tunnel 023, second mistake sound hole 02 is crossed sound hole by the 4th and is communicated with the second tunnel 019, wherein the first cavity, the first sound hole 010, the 3rd mistake sound hole and the first tunnel structure 023 form the first sound chamber, and MEMS sheet 011 internal cavity, second crosses sound hole 02, the 4th, and sound hole and the second tunnel 019 form the second sound chamber excessively.
As needs assembling directive property MEMSMIC, first MEMS sheet 011 is bonded on terminal block 01 by MEMS package glue 03, ASIC sheet 05 bonds on terminal block 1 by ASIC fixing glue 06, MEMS sheet 02 connects together with ASIC sheet 05 by gold thread 04, ASIC sheet 05 is connected with terminal block 01 by gold thread 04, delivered to by signal on PCB and export, shell is bonded on PCB by fluid sealant or tin cream 09, makes enclosure form annular seal space.The pad 020 of terminal block 01 bonded adhesives or tin cream are bonded on the pad on the first conduction element 014 (can be terminal block also can be lead plate), there is the pad 020 being used for drawing performance in terminal block or lead plate 14 simultaneously, first conduction element 014 bonded adhesives 017 is pasted onto on the second conduction element 015, second conduction element 015 is with the first sound hole 021 and the second sound hole 022, damping piece 013 is arranged on the first sound hole 021, these two sound holes are connected on MIC sheet by the first tunnel 023 and the second tunnel 019, in this way, change the passage of sound, have adjusted frequency response curve and the pole figure of MIC.
But, during above-mentioned directive property MEMSMIC assembling, first sound chamber and the second sound chamber, need terminal block 01, shell 08, first conduction element 014 to be all connected with the second conduction element 015 just can complete assembling, and it is corresponding to need each to cross sound hole position, make the built-up time of MEMSMIC longer, cause the packaging efficiency of MEMSMIC lower.
Therefore, how improving the packaging efficiency of directive property MEMSMIC, is those skilled in the art's technical problems urgently to be resolved hurrily.
Summary of the invention
The object of this invention is to provide a kind of directive property MEMSMIC, the packaging efficiency of this directive property MEMSMIC improves.
For achieving the above object, the invention provides a kind of directive property MEMSMIC, comprise terminal block, ASIC sheet, MEMS sheet, damping piece and shell, described ASIC sheet and described MEMS sheet are installed on the upper surface of described terminal block, described terminal block is provided with the sound hole be excessively communicated with described MENS sheet internal cavity, described shell comprises the first housing, described first housing is arranged on described terminal block upper surface, and described ASIC sheet and described MEMS sheet are all positioned at the first sound chamber that described terminal block and described first housing are formed, also comprise described shell and also comprise the second housing be connected with described terminal block lower surface, described second enclosure interior cavity passed through sound hole and described MEMS sheet internal cavity forms the second sound chamber, described first housing is provided with the first sound hole, described second housing is provided with the second sound hole.
Preferably, described first housing is integrated injection mo(u)lding.
Preferably, described second housing is integrated injection mo(u)lding.
Preferably, described damping piece is arranged on the first sound hole.
Preferably, described damping piece is arranged on the second sound hole.
Preferably, described first housing is connected with described terminal block by bonded adhesives or tin cream.
Preferably, described second housing is connected with described terminal block by bonded adhesives or tin cream.
In technique scheme, directive property MEMSMIC provided by the invention comprises terminal block, ASIC sheet, MEMS sheet, damping piece and shell, ASIC sheet and MEMS sheet are installed on terminal block upper surface, terminal block is provided with the sound hole be excessively communicated with MENS sheet internal cavity, the second housing that shell comprises the first housing and is connected with terminal block lower surface, first housing is arranged on the upper surface of terminal block, and ASIC sheet and MEMS sheet are all positioned at the first sound chamber that terminal block and the first housing are formed, second enclosure interior cavity passed through sound hole and MEMS sheet internal cavity forms the second sound chamber, first housing is provided with the first sound hole, second housing is provided with the second sound hole.As needs assembling directive property MEMSMIC, ASIC sheet and MEMS sheet are installed on terminal block, then the first housing and the second housing is arranged on terminal block.
Known by foregoing description, in directive property MEMSMIC provided by the invention, by housing being set to the first housing of being connected respectively with terminal block upper surface and lower surface and the second housing, and sound hole is offered on the first housing, the first housing is made to form the first sound chamber, MEMS sheet internal cavity and the second housing form the second sound chamber, first sound chamber and the second sound chamber simple structure, assembling directive property MEMSMIC step reduces, relative in above-mentioned background technology, need installation first conduction element and the second conduction element, and need to offer multiple sound hole excessively, and the situation that position aligns, the packaging efficiency of the directive property MEMSMIC that the application provides improves.
Accompanying drawing explanation
Fig. 1 is the structural representation of traditional directive property MEMSMIC;
The structural representation of the directive property MEMSMIC that Fig. 2 provides for the embodiment of the present invention.
In middle Fig. 1-2: 01-terminal block, 02-second crosses sound hole, 03-MEMS packaging plastic, 04-gold thread, 05-ASIC sheet, 06-ASIC fixing glue, 07-ASIC fluid sealant, 08-shell, 09-tin cream, 010-first crosses sound hole, 011-MEMS sheet, 012-damping bonded adhesives, 013-damping piece, 014-first conduction element, 015-second conduction element, 016-first bonded adhesives, 017-interlayer bonded adhesives, 018-second bonded adhesives, 019-second tunnel, 020-pad, 021-first sound hole, 022-second sound hole, 023-first tunnel,
1-terminal block, 2-1-first sound hole, 2-2-cross sound hole, 3-MEMS bonded adhesives, 4-gold thread, 5-ASIC sheet, 6-ASIC bonded adhesives, 7-ASIC fluid sealant, 8-1-first housing, 8-2-second housing, 9-tin cream, 10-second sound hole, 11-MEMS sheet, 12-damping piece.
Embodiment
Core of the present invention is to provide a kind of directive property MEMSMIC, and the packaging efficiency of this directive property MEMSMIC improves.
In order to make those skilled in the art understand technical scheme of the present invention better, below in conjunction with drawings and embodiments, the present invention is described in further detail.
Please refer to Fig. 2, in a kind of embodiment, directive property MEMSMIC provided by the invention comprises terminal block 1, ASIC sheet 5, MEMS sheet, damping piece 12 and shell, ASIC sheet 5 and MEMS sheet 11 are installed on the upper surface of terminal block 1, terminal block 1 is provided with the sound hole 2-2 be excessively communicated with MENS sheet internal cavity, the second housing 8-2 that shell comprises the first housing 8-1 and is connected with terminal block 1 lower surface, first housing 8-1 is arranged on terminal block 1 upper surface, and ASIC sheet 5 and MEMS sheet 11 are all positioned at the first sound chamber that terminal block 1 and the first housing 8-1 are formed, second housing 8-2 internal cavity passed through sound hole 2-2 and MEMS sheet 11 internal cavity forms the second sound chamber, first housing 8-1 is provided with the first sound hole 2-1, second housing 8-2 is provided with the second sound hole 10.Concrete, according to the actual requirements, staff can in being arranged on damping piece 12 on first sound hole 2-1 or on the second sound hole 10, concrete, is arranged on the first housing 8-1 corresponding to the first sound hole 2-1 or on the second housing 8-2 of the second sound hole 10 correspondence.In order to shorten the process time of shell, preferably, the first housing 8-1 is integrated injection mo(u)lding, and more preferably, the second housing 8-2 is integrated injection mo(u)lding.
Install stability to improve directive property MEMSMIC, preferably, the first housing 8-1 is connected with terminal block 1 by bonded adhesives or tin cream.More preferred, the second housing 8-2 is connected with terminal block 1 by bonded adhesives or tin cream.
As needs assembling directive property MEMSMIC, ASIC sheet 5 and MEMS sheet 11 are installed on terminal block 1, then the first housing 8-1 and the second housing 8-2 is arranged on terminal block 1.Concrete, MEMS sheet 11 is bonded on terminal block 1 by MEMS bonded adhesives 3, MEMS bonded adhesives 3 around MEMS sheet 11 1 weeks, make MEMS sheet 11 and circumferential cavity airtight; ASIC sheet 5 is connected on terminal block 1 by the gluing glue of ASIC 6 is bonding; Be connected with gold thread with MEMS sheet 11 by ASIC sheet 5, ASIC sheet 5 is connected with terminal block gold thread; ASIC sheet 5 is covered by ASIC fluid sealant 7; Draw tin cream/glue around terminal block, the first housing 8-1 is bonded on terminal block by tin cream 9; Printed by SMT at the terminal block back side or draw tin cream, make a circle in week tin cream; Second housing 8-2 is bonded on terminal block; Damping 13 is bonded on the first housing 8-1 or the second housing 8-2, completes the assembling of directive property MEMSMIC.
Known by foregoing description, in the directive property MEMSMIC that the specific embodiment of the invention provides, by housing being set to the first housing 8-1 of being connected respectively with terminal block 1 upper surface and lower surface and the second housing 8-2, and sound hole is offered on the first housing 8-1, the first housing 8-1 is made to form the first sound chamber, MEMS sheet 11 internal cavity and the second housing 8-2 form the second sound chamber, first sound chamber and the second sound chamber simple structure, assembling directive property MEMSMIC step reduces, relative in above-mentioned background technology, need installation first conduction element and the second conduction element, and need to offer multiple situation crossed sound hole 2-2 and align, the packaging efficiency of the directive property MEMSMIC that the application provides improves.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims (7)

1. a directive property MEMSMIC, comprise terminal block (1), ASIC sheet (5), MEMS sheet (11), damping piece (12) and shell, described ASIC sheet (5) and described MEMS sheet (11) are installed on described terminal block (1) upper surface, described terminal block (1) is provided with the sound hole (2-2) be excessively communicated with described MENS sheet internal cavity, described shell comprises the first housing (8-1), described first housing (8-1) is arranged on the upper surface of described terminal block (1), and described ASIC sheet (5) and described MEMS sheet (11) are all positioned at the first sound chamber that described terminal block (1) is formed with described first housing (8-1), it is characterized in that, also comprise described shell and also comprise the second housing (8-2) be connected with described terminal block (1) lower surface, described second housing (8-2) internal cavity passed through sound hole (2-2) and formed the second sound chamber with described MEMS sheet (11) internal cavity, described first housing (8-1) is provided with the first sound hole (2-1), described second housing (8-2) is provided with the second sound hole (10).
2. directive property MEMSMIC according to claim 1, is characterized in that, described first housing (8-1) is integrated injection mo(u)lding.
3. directive property MEMSMIC according to claim 2, is characterized in that, described second housing (8-2) is integrated injection mo(u)lding.
4. directive property MEMSMIC according to claim 1, is characterized in that, described damping piece (12) is arranged on the first sound hole (2-1).
5. directive property MEMSMIC according to claim 1, is characterized in that, described damping piece (12) is arranged on the second sound hole (10).
6. the directive property MEMSMIC according to any one of claim 1-5, is characterized in that, described first housing (8-1) is connected with described terminal block (1) by bonded adhesives or tin cream (9).
7. directive property MEMSMIC according to claim 6, is characterized in that, described second housing (8-2) is connected with described terminal block (1) by bonded adhesives or tin cream.
CN201511020207.6A 2015-12-29 2015-12-29 Directive property MEMS MIC Active CN105491493B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201511020207.6A CN105491493B (en) 2015-12-29 2015-12-29 Directive property MEMS MIC

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Application Number Priority Date Filing Date Title
CN201511020207.6A CN105491493B (en) 2015-12-29 2015-12-29 Directive property MEMS MIC

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CN105491493A true CN105491493A (en) 2016-04-13
CN105491493B CN105491493B (en) 2018-10-26

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110463223A (en) * 2017-03-21 2019-11-15 微软技术许可有限责任公司 Electronic equipment including orienting MEMS microphone assembly
CN110662148A (en) * 2019-09-06 2020-01-07 歌尔股份有限公司 MEMS microphone
CN110955011A (en) * 2018-09-26 2020-04-03 苹果公司 Damper arrangement for actuator damping

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101296531A (en) * 2007-04-29 2008-10-29 歌尔声学股份有限公司 Silicon capacitor microphone array
JP2010136406A (en) * 2010-01-06 2010-06-17 Panasonic Corp Microphone device
CN203407016U (en) * 2013-08-22 2014-01-22 歌尔声学股份有限公司 Micro-electro-mechanic system (MEMS) microphone
CN205283817U (en) * 2015-12-29 2016-06-01 山东共达电声股份有限公司 Directive property MEMS MIC

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101296531A (en) * 2007-04-29 2008-10-29 歌尔声学股份有限公司 Silicon capacitor microphone array
JP2010136406A (en) * 2010-01-06 2010-06-17 Panasonic Corp Microphone device
CN203407016U (en) * 2013-08-22 2014-01-22 歌尔声学股份有限公司 Micro-electro-mechanic system (MEMS) microphone
CN205283817U (en) * 2015-12-29 2016-06-01 山东共达电声股份有限公司 Directive property MEMS MIC

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110463223A (en) * 2017-03-21 2019-11-15 微软技术许可有限责任公司 Electronic equipment including orienting MEMS microphone assembly
CN110463223B (en) * 2017-03-21 2021-08-06 微软技术许可有限责任公司 Electronic device including directional MEMS microphone assembly
CN110955011A (en) * 2018-09-26 2020-04-03 苹果公司 Damper arrangement for actuator damping
US11119333B2 (en) 2018-09-26 2021-09-14 Apple Inc. Damper arrangement for actuator damping
CN110955011B (en) * 2018-09-26 2022-06-03 苹果公司 Damper arrangement for actuator damping
US11681158B2 (en) 2018-09-26 2023-06-20 Apple Inc. Damper arrangement for actuator damping
CN110662148A (en) * 2019-09-06 2020-01-07 歌尔股份有限公司 MEMS microphone
CN110662148B (en) * 2019-09-06 2021-11-26 潍坊歌尔微电子有限公司 MEMS microphone

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Address after: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province

Patentee after: Gongda Electroacoustics Co., Ltd.

Address before: 261000 Fengshan Road, Fangzi District, Weifang, Shandong Province, No. 68

Patentee before: Shandong Gettop Acoustic Co.,Ltd.

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