CN105491493B - Directive property MEMS MIC - Google Patents
Directive property MEMS MIC Download PDFInfo
- Publication number
- CN105491493B CN105491493B CN201511020207.6A CN201511020207A CN105491493B CN 105491493 B CN105491493 B CN 105491493B CN 201511020207 A CN201511020207 A CN 201511020207A CN 105491493 B CN105491493 B CN 105491493B
- Authority
- CN
- China
- Prior art keywords
- shell
- pieces
- mems
- terminal plate
- directive property
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a kind of directive property MEMS MIC, including terminal plate, ASIC pieces, MEMS pieces, damping piece and shell, ASIC pieces and MEMS pieces are installed on the upper surface of terminal plate, terminal plate crosses sound hole equipped with what is be connected to MENS piece internal cavities, shell includes first shell and the second shell that is connect with terminal plate lower surface, first shell is mounted on terminal plate upper surface, and ASIC pieces and MEMS pieces are respectively positioned on the first sound intracavitary that terminal plate is formed with first shell, the internal cavity of second shell forms the second sound chamber by crossing sound hole with MEMS piece internal cavities, first shell is equipped with the first sound hole, second shell is equipped with the second sound hole.The packaging efficiency of directive property MEMS MIC improves.
Description
Technical field
The present invention relates to technical field of electronic equipment, more particularly to a kind of directive property MEMS MIC.
Background technology
With being constantly progressive for science and technology, electronic equipment is more and more frivolous, wherein the space of each component of electronic equipment also phase
To compression, MEMS MIC (micro-electro-mechanical microphone, Microelectromechanical Systems Microphone) are used as one
Micromachine and electronic building brick can be integrated in the device of silicon wafer panel using integrated circuit by kind, and use is more and more extensive,
Middle directive property MEMS MIC are one kind of micro-electro-mechanical microphone.
As shown in Figure 1, traditional directive property MEMS MIC include terminal plate 01, ASIC (integrated circuit, Application
Specific Integrated Circuit) piece 05, MEMS (MEMS, Microelectromechanical
Systems) piece 011, shell 08, the first conduction element 014 and the second conduction element 015, wherein shell 08 is mounted on terminal plate 01
On surface, the first conduction element 014 is mounted on 01 lower surface of shell, and the second conduction element 015 is mounted under the first conduction element 014
On surface, ASIC pieces 05 and MEMS pieces 011 are installed on 01 upper surface of terminal plate, and positioned at shell 08 and the formation of terminal plate 01
The first cavity in.Terminal plate 01 be equipped be connected to the first cavity first mistake sound hole 010 and with 011 internal cavity of MEMS pieces
The second of connection crosses sound hole 02, and the second conduction element 015 is equipped with the first tunnel 023 and the second tunnel 019 being arranged independently of each other, and
Second conduction element 015 is equipped with the first sound hole 021 that the first tunnel 023 is in communication with the outside and the second tunnel 019 is in communication with the outside
The second sound hole 022.First conduction element 014 crosses sound hole and the 4th equipped with third and crosses sound hole, and first, which crosses sound hole 010, passes through third
It crosses sound hole to be connected to the first tunnel 023, the second sound hole 02 excessively is connected to by the 4th sound hole excessively with the second tunnel 019, wherein first
Cavity, the first sound hole 010, third cross sound hole and the first tunnel structure 023 constitutes the first sound chamber, 011 internal cavity of MEMS pieces, second
It crosses sound hole the 02, the 4th and crosses sound hole and the second tunnel 019 the second sound chamber of composition.
When needing to assemble directive property MEMS MIC, MEMS pieces 011 are adhered to terminal plate by MEMS package glue 03 first
On 01, ASIC pieces 05 are adhered on terminal plate 1 by ASIC fixing glues 06, and MEMS pieces 02 and ASIC pieces 05 are connected to one by gold thread 04
It rises, ASIC pieces 05 are connect by gold thread 04 with terminal plate 01, and signal is sent on PCB and is exported, and fluid sealant or tin cream 09 are by shell
It is bonded on PCB, enclosure is made to form seal chamber.The bonded adhesives of pad 020 or tin cream of terminal plate 01 are adhered to
On pad on one conduction element 014 (can be terminal plate can also be lead plate), existed simultaneously on terminal plate or lead plate 14
For drawing the pad 020 of performance, the first conduction element 014 bonded adhesives 017 is pasted onto on the second conduction element 015, second leads
Parts 015 carry the first sound hole 021 and the second sound hole 022, and damping piece 013 is mounted on the first sound hole 021, the two sound holes are logical
It crosses the first tunnel 023 and the second tunnel 019 and is connected to MIC on pieces, in this way, change the channel of sound, have adjusted
The frequency response curve and pole figure of MIC.
However, when above-mentioned directive property MEMS MIC assemblings, the first sound chamber and the second sound chamber are needed terminal plate 01, shell
08, the first conduction element 014 and the second conduction element 015, which are all connected with, could complete assembling, and each sound hole position of crossing is needed to correspond to, and make
The built-up time for obtaining MEMS MIC is longer, causes the packaging efficiency of MEMS MIC relatively low.
Therefore, the packaging efficiency for how improving directive property MEMS MIC is those skilled in the art's technology urgently to be resolved hurrily
Problem.
Invention content
The object of the present invention is to provide a kind of directive property MEMS MIC, the packaging efficiency of directive property MEMS MIC improves.
To achieve the above object, the present invention provides a kind of directive property MEMS MIC, including terminal plate, ASIC pieces, MEMS pieces,
Damping piece and shell, the ASIC pieces and the MEMS pieces are installed on the upper surface of the terminal plate, on the terminal plate
Sound hole is crossed equipped with what is be connected to the MENS pieces internal cavity, the shell includes first shell, and the first shell is mounted on
On the terminal plate upper surface, and the ASIC pieces and the MEMS pieces are respectively positioned on the terminal plate and are formed with the first shell
The first sound intracavitary, further include the shell further include the second shell being connect with the terminal plate lower surface, the second shell
Body internal cavity forms the second sound chamber by crossing sound hole and the MEMS pieces internal cavity, and the first shell is equipped with the first sound
Hole, the second shell are equipped with the second sound hole.
Preferably, the first shell is integrated injection molding.
Preferably, the second shell is integrated injection molding.
Preferably, the damping piece is mounted on the first sound hole.
Preferably, the damping piece is mounted on the second sound hole.
Preferably, the first shell is connect by bonded adhesives or tin cream with the terminal plate.
Preferably, the second shell is connect by bonded adhesives or tin cream with the terminal plate.
In the above-mentioned technical solutions, directive property MEMS MIC provided by the invention include terminal plate, ASIC pieces, MEMS pieces,
Damping piece and shell, ASIC pieces and MEMS pieces are installed on terminal plate upper surface, and terminal plate is equipped with and MENS piece inner chambers
Sound hole is crossed in body connection, and shell includes first shell and the second shell that is connect with terminal plate lower surface, and first shell is mounted on
On the upper surface of terminal plate, and the first sound intracavitary that ASIC pieces and MEMS pieces are respectively positioned on terminal plate and first shell is formed, second
Enclosure interior cavity forms the second sound chamber by crossing sound hole and MEMS piece internal cavities, and first shell is equipped with the first sound hole, and second
Shell is equipped with the second sound hole.When needing to assemble directive property MEMS MIC, ASIC pieces and MEMS pieces are installed on terminal plate, so
First shell and second shell are mounted on terminal plate afterwards.
By foregoing description it is found that in directive property MEMS MIC provided by the invention, by setting and connecing shell to
The first shell and second shell that line plate upper and lower surface is separately connected, and sound hole is opened up on the first shell so that the
One shell forms the first sound chamber, and MEMS pieces internal cavity and second shell form the second sound chamber, the first sound chamber and the second sound chamber structure
Make simple, assembling directive property MEMS MIC steps are reduced, relative in above-mentioned background technology, needing to install the first conduction element and the
Two conduction elements, and need to open up multiple sound holes excessively, and position is to positive situation, the group of directive property MEMS MIC provided by the present application
Efficiency is filled to improve.
Description of the drawings
Fig. 1 is the structural schematic diagram of traditional directive property MEMSMIC；
The structural schematic diagram for the directive property MEMSMIC that Fig. 2 is provided by the embodiment of the present invention.
In middle Fig. 1-2：01- terminal plates, 02- second cross sound hole, 03-MEMS packaging plastics, 04- gold threads, 05-ASIC pieces, 06-
ASIC fixing glues, 07-ASIC fluid sealants, 08- shells, 09- tin creams, 010- first, which cross sound hole, 011-MEMS pieces, 012- and damp, to be glued
Connect glue, 013- damping pieces, the first conduction elements of 014-, the second conduction elements of 015-, the first bonded adhesives of 016-, 017- interlayers bonded adhesives,
The second bonded adhesives of 018-, the second tunnels 019-, 020- pads, the first sound holes of 021-, the second sound holes of 022-, the first tunnels 023-；
1- terminal plates, the first sound holes of 2-1-, 2-2- cross sound hole, 3-MEMS bonded adhesives, 4- gold threads, 5-ASIC pieces, 6-ASIC
Bonded adhesives, 7-ASIC fluid sealants, 8-1- first shells, 8-2- second shells, 9- tin creams, the second sound holes of 10-, 11-MEMS pieces,
12- damping pieces.
Specific implementation mode
Core of the invention is to provide a kind of directive property MEMS MIC, and the packaging efficiency of directive property MEMS MIC improves.
In order to make those skilled in the art more fully understand technical scheme of the present invention, below in conjunction with the accompanying drawings and embodiment party
The present invention is described in further detail for formula.
Referring to FIG. 2, in a specific embodiment, directive property MEMS MIC provided by the invention include terminal plate 1,
ASIC pieces 5, MEMS pieces, damping piece 12 and shell, ASIC pieces 5 and MEMS pieces 11 are installed on the upper surface of terminal plate 1, wiring
Plate 1 be equipped be connected to MENS piece internal cavities mistake sound hole 2-2, shell include first shell 8-1 and with 1 lower surface of terminal plate
The second shell 8-2 of connection, first shell 8-1 are mounted on 1 upper surface of terminal plate, and ASIC pieces 5 and MEMS pieces 11 are respectively positioned on
The first sound intracavitary that terminal plate 1 is formed with first shell 8-1, second shell 8-2 internal cavities are by crossing sound hole 2-2 and MEMS pieces
11 internal cavities form the second sound chamber, and first shell 8-1 is equipped with the first sound hole 2-1, and second shell 8-2 is equipped with the second sound hole
10.Specifically, according to actual demand, staff can be mounted on the first sound hole 2-1 or the second sound hole 10 in by damping piece 12
On, specifically, on the corresponding first shell 8-1 of the first sound hole 2-1 or 10 corresponding second shell 8-2 of the second sound hole
On.In order to shorten the process time of shell, it is preferable that first shell 8-1 is integrated injection molding, more preferably, second shell
8-2 is integrated injection molding.
In order to improve directive property MEMS MIC mounting stabilities, it is preferable that first shell 8-1 by bonded adhesives or tin cream with connect
Line plate 1 connects.More preferably, second shell 8-2 is connect by bonded adhesives or tin cream with terminal plate 1.
When needing to assemble directive property MEMS MIC, ASIC pieces 5 and MEMS pieces 11 are installed on terminal plate 1, then by the
One shell 8-1 and second shell 8-2 is mounted on terminal plate 1.Specifically, MEMS pieces 11 are bonded in by MEMS bonded adhesives 3
On terminal plate 1, MEMS bonded adhesives 3 surrounds MEMS pieces 11 1 weeks, keeps MEMS pieces 11 and circumferential cavity airtight；ASIC pieces 5 are led to
ASIC gluings glue 6 is crossed to be connected on terminal plate 1；ASIC pieces 5 are connect with MEMS pieces 11 with gold thread, ASIC pieces 5 and terminal plate
It is connected with gold thread；ASIC fluid sealants 7 are covered ASIC pieces 5；Tin cream/glue is drawn around terminal plate, and first shell 8-1 is passed through into tin
Cream 9 is bonded on terminal plate；Wiring back is printed to by SMT or is drawn tin cream, make a circle in week tin cream；By second shell 8-
2 are bonded on terminal plate；Damping 13 is bonded on first shell 8-1 or second shell 8-2, completes directive property MEMS MIC's
Assembling.
By foregoing description it is found that in the directive property MEMS MIC that the specific embodiment of the invention is provided, by by shell
Body is set as the first shell 8-1 being separately connected with 1 upper and lower surface of terminal plate and second shell 8-2, and in first shell
Sound hole is opened up on body 8-1 so that first shell 8-1 forms the first sound chamber, and 11 internal cavity of MEMS pieces and second shell 8-2 are formed
Second sound chamber, the first sound chamber and the second sound chamber simple structure, assembling directive property MEMS MIC steps are reduced, relative to above-mentioned background
It in technology, needs that the first conduction element and the second conduction element are installed, and needs to open up multiple sound hole 2-2 that cross to positive situation, this Shen
The packaging efficiency for the directive property MEMS MIC that please be provided improves.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, just to refer each other for identical similar portion between each embodiment.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (7)
1. a kind of directive property MEMS MIC, including terminal plate (1), ASIC pieces (5), MEMS pieces (11), damping piece (12) and shell,
The ASIC pieces (5) and the MEMS pieces (11) are installed on the terminal plate (1) upper surface, are set on the terminal plate (1)
There is what is be connected to the MEMS pieces internal cavity to cross sound hole (2-2), the shell includes first shell (8-1), the first shell
Body (8-1) is mounted on the upper surface of the terminal plate (1), and the ASIC pieces (5) and the MEMS pieces (11) are respectively positioned on institute
State the first sound intracavitary that terminal plate (1) is formed with the first shell (8-1), which is characterized in that further include that the shell also wraps
The second shell (8-2) being connect with the terminal plate (1) lower surface is included, second shell (8-2) internal cavity is by crossing sound
Hole (2-2) forms the second sound chamber with MEMS pieces (11) internal cavity, and the first shell (8-1) is equipped with the first sound hole (2-
1), the second shell (8-2) is equipped with the second sound hole (10).
2. directive property MEMS MIC according to claim 1, which is characterized in that the first shell (8-1) is integrated note
It is moulded into type.
3. directive property MEMS MIC according to claim 2, which is characterized in that the second shell (8-2) is integrated note
It is moulded into type.
4. directive property MEMS MIC according to claim 1, which is characterized in that the damping piece (12) is mounted on the first sound
On hole (2-1).
5. directive property MEMS MIC according to claim 1, which is characterized in that the damping piece (12) is mounted on the second sound
On hole (10).
6. directive property MEMS MIC according to any one of claims 1-5, which is characterized in that the first shell (8-
1) it is connect with the terminal plate (1) by bonded adhesives or tin cream (9).
7. directive property MEMS MIC according to claim 6, which is characterized in that the second shell (8-2) passes through bonding
Glue or tin cream are connect with the terminal plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511020207.6A CN105491493B (en) | 2015-12-29 | 2015-12-29 | Directive property MEMS MIC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511020207.6A CN105491493B (en) | 2015-12-29 | 2015-12-29 | Directive property MEMS MIC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105491493A CN105491493A (en) | 2016-04-13 |
| CN105491493B true CN105491493B (en) | 2018-10-26 |
Family
ID=55678146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511020207.6A Active CN105491493B (en) | 2015-12-29 | 2015-12-29 | Directive property MEMS MIC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105491493B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10313798B2 (en) * | 2017-03-21 | 2019-06-04 | Microsoft Technology Licensing, Llc | Electronic device including directional MEMS microphone assembly |
| US11119333B2 (en) | 2018-09-26 | 2021-09-14 | Apple Inc. | Damper arrangement for actuator damping |
| CN110662148B (en) * | 2019-09-06 | 2021-11-26 | 潍坊歌尔微电子有限公司 | MEMS microphone |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101296531B (en) * | 2007-04-29 | 2012-08-08 | 歌尔声学股份有限公司 | Silicon capacitor microphone array |
| JP2010136406A (en) * | 2010-01-06 | 2010-06-17 | Panasonic Corp | Microphone device |
| CN203407016U (en) * | 2013-08-22 | 2014-01-22 | 歌尔声学股份有限公司 | Micro-electro-mechanic system (MEMS) microphone |
| CN205283817U (en) * | 2015-12-29 | 2016-06-01 | 山东共达电声股份有限公司 | Directive property MEMS MIC |
-
2015
- 2015-12-29 CN CN201511020207.6A patent/CN105491493B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105491493A (en) | 2016-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105491493B (en) | Directive property MEMS MIC | |
| US9573800B2 (en) | Pre-molded MEMS device package having conductive column coupled to leadframe and cover | |
| TW201442940A (en) | Top port MEMS cavity package and method of manufacture thereof | |
| US9120668B2 (en) | Microphone package and mounting structure thereof | |
| CN203788459U (en) | Mems microphone | |
| CN203984661U (en) | A kind of sheet metal fixed structure of loud speaker module | |
| CN108322861A (en) | Loud speaker | |
| CN203748006U (en) | MEMS microphone | |
| CN205283817U (en) | Directive property MEMS MIC | |
| CN202663538U (en) | Mems microphone | |
| WO2012122868A1 (en) | Micro-electro-mechanical system microphone packaging structure and forming method therefor | |
| CN205622875U (en) | MEMS microphone | |
| CN102118674A (en) | MEMS microphone and encapsulation method thereof | |
| CN102595293B (en) | Micro-electromechanical system (MEMS) microphone and packaging method thereof | |
| CN204675827U (en) | A kind of encapsulating structure of chip | |
| CN205987348U (en) | Loudspeaker module group | |
| CN105813003B (en) | Installation shell, manufacturing method and the mounting structure of loudspeaker and microphone | |
| CN204131729U (en) | A kind of MEMS microphone | |
| CN203788460U (en) | Mems microphone | |
| CN208675538U (en) | A kind of MEMS chip and the MEMS microphone including the chip | |
| CN201947418U (en) | Micro Electro Mechanical Systems (MEMS) microphone | |
| CN203788457U (en) | Mems microphone | |
| CN202019450U (en) | Micro-electromechanical system (MEMS) microphone | |
| CN205726426U (en) | The installation housing of speaker and mike and mounting structure | |
| CN104168530B (en) | A kind of MEMS MIC and its production technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 261200 No. 68 Fengshan Road, Fangzi District, Weifang City, Shandong Province Patentee after: Gongda Electroacoustics Co., Ltd. Address before: 261000 Fengshan Road, Fangzi District, Weifang, Shandong Province, No. 68 Patentee before: Shandong Gettop Acoustic Co.,Ltd. |