CN205283817U

CN205283817U - Directive property MEMS MIC

Info

Publication number: CN205283817U
Application number: CN201521130992.6U
Authority: CN
Inventors: 刘志永
Original assignee: Shandong Gettop Acoustic Co Ltd
Current assignee: Shandong Gettop Acoustic Co Ltd
Priority date: 2015-12-29
Filing date: 2015-12-29
Publication date: 2016-06-01
Anticipated expiration: 2025-12-29

Abstract

The utility model discloses a directive property MEMS MIC, including the wiring board, the ASIC piece, the MEMS piece, damping piece and shell, ASIC piece and MEMS piece are all installed on the upper surface of wiring board, be equipped with the sound hole of crossing with the inside cavity intercommunication of MENS piece on the wiring board, the shell includes first casing and the second casing of being connected with the wiring board lower surface, first casing is installed on the wiring board upper surface, and ASIC piece and MEMS piece all are located the first sound intracavity of wiring board and the formation of first casing, the inside cavity of second casing passed through the sound hole and formed supertonic chamber with the inside cavity of MEMS piece, first casing is equipped with first sound hole, be equipped with the second sound hole on the second casing. This directive property MEMS MIC's packaging efficiency improves.

Description

Directive property MEMS MIC

Technical field

The utility model relates to technical field of electronic equipment, in particular to a kind of directive property MEMSMIC.

Background technology

Along with the continuous progress of science and technology, electronics is more and more frivolous, wherein the space of each assembly of electronics is also compressed relatively, MEMSMIC (micro-electro-mechanical microphone, MicroelectromechanicalSystemsMicrophone) as a kind of device utilizing unicircuit that micromachine and electronic package can be integrated in silicon crystal panel, using more and more extensive, wherein directive property MEMSMIC is the one of micro-electro-mechanical microphone.

As shown in Figure 1, traditional directive property MEMSMIC comprises wiring board 01, ASIC (unicircuit, ApplicationSpecificIntegratedCircuit) sheet 05, MEMS (MEMS (micro electro mechanical system), MicroelectromechanicalSystems) sheet 011, shell 08, first conduction element 014 and the 2nd conduction element 015, wherein, shell 08 is arranged on wiring board 01 upper surface, first conduction element 014 is arranged on shell 01 lower surface, 2nd conduction element 015 is arranged on the lower surface of the first conduction element 014, ASIC sheet 05 and MEMS sheet 011 are installed on wiring board 01 upper surface, and it is positioned at first cavity of shell 08 with wiring board 01 formation. wiring board 01 is provided with the first mistake sound hole 010 being connected with the first cavity and the be connected with MEMS sheet 011 internal cavity the 2nd and crosses sound hole 02,2nd conduction element 015 is provided with the first tunnel 023 and the 2nd tunnel 019 of separate setting, and the 2nd conduction element 015 is provided with the first sound hole 021 that the first tunnel 023 is in communication with the outside and the 2nd sound hole 022 that the 2nd tunnel 019 is in communication with the outside. first conduction element 014 is provided with the 3rd mistake sound hole and the 4th and crosses sound hole, first mistake sound hole 010 is crossed sound hole by the 3rd and is connected with the first tunnel 023,2nd mistake sound hole 02 is crossed sound hole by the 4th and is connected with the 2nd tunnel 019, wherein the first cavity, the first sound hole 010, the 3rd mistake sound hole and the first tunnel structure 023 form the first sound chamber, and MEMS sheet 011 internal cavity, the 2nd crosses sound hole 02, the 4th, and sound hole and the 2nd tunnel 019 form the 2nd sound chamber excessively.

When directive property MEMSMIC assembled by needs, first MEMS sheet 011 is bonded on wiring board 01 by MEMS package glue 03, ASIC sheet 05 is bonded on wiring board 1 by ASIC fixing glue 06, MEMS sheet 02 is connected together by gold thread 04 with ASIC sheet 05, ASIC sheet 05 is connected by gold thread 04 with wiring board 01, being delivered to by signal and export on PCB, shell is bonded on PCB by seal gum or tin cream 09, makes enclosure form annular seal space. the pad 020 of wiring board 01 bonded adhesives or tin cream are bonded on the pad on the first conduction element 014 (can be wiring board can also be lead plate), there is the pad 020 being used for drawing performance in wiring board or lead plate 14 simultaneously, first conduction element 014 bonded adhesives 017 is pasted onto on the 2nd conduction element 015, 2nd conduction element 015 is with the first sound hole 021 and the 2nd sound hole 022, damping part 013 is arranged on the first sound hole 021, these two sound holes are connected on MIC sheet by the first tunnel 023 and the 2nd tunnel 019, in this way, change the passage of sound, have adjusted the frequency response curve of MIC and pole diagram.

But, when above-mentioned directive property MEMSMIC assembles, first sound chamber and the 2nd sound chamber, need all to connect wiring board 01, shell 08, first conduction element 014 and the 2nd conduction element 015 and just can complete assembling, and it is corresponding to need each to cross sound hole position, make the built-up time of MEMSMIC longer, cause the packaging efficiency of MEMSMIC lower.

Therefore, how to improve the packaging efficiency of directive property MEMSMIC, it is those skilled in the art's technical problems urgently to be resolved hurrily.

Practical novel content

The packaging efficiency that the purpose of this utility model is to provide a kind of directive property MEMSMIC, this directive property MEMSMIC improves.

For achieving the above object, the utility model provides a kind of directive property MEMSMIC, comprise wiring board, ASIC sheet, MEMS sheet, damping part and shell, described ASIC sheet and described MEMS sheet are installed on the upper surface of described wiring board, described wiring board is provided with the sound hole excessively being connected with described MENS sheet internal cavity, described shell comprises the first housing, described first housing is arranged on described wiring board upper surface, and the first sound chamber that described ASIC sheet and described MEMS sheet are all positioned at described wiring board and described first housing is formed, also comprise described shell and also comprise the 2nd housing being connected with described wiring board lower surface, described 2nd enclosure interior cavity passed through sound hole and described MEMS sheet internal cavity forms the 2nd sound chamber, described first housing is provided with the first sound hole, described 2nd housing is provided with the 2nd sound hole.

Preferably, described first housing is integrated injection moulding.

Preferably, described 2nd housing is integrated injection moulding.

Preferably, described damping part is arranged on the first sound hole.

Preferably, described damping part is arranged on the 2nd sound hole.

Preferably, described first housing is connected with described wiring board by bonded adhesives or tin cream.

Preferably, described 2nd housing is connected with described wiring board by bonded adhesives or tin cream.

In technique scheme, the directive property MEMSMIC that the utility model provides comprises wiring board, ASIC sheet, MEMS sheet, damping part and shell, ASIC sheet and MEMS sheet are installed on wiring board upper surface, wiring board is provided with the sound hole excessively being connected with MENS sheet internal cavity, the 2nd housing that shell comprises the first housing and is connected with wiring board lower surface, first housing is arranged on the upper surface of wiring board, and the first sound chamber that ASIC sheet and MEMS sheet are all positioned at wiring board and the first housing is formed, 2nd enclosure interior cavity passed through sound hole and MEMS sheet internal cavity forms the 2nd sound chamber, first housing is provided with the first sound hole, 2nd housing is provided with the 2nd sound hole. when directive property MEMSMIC assembled by needs, ASIC sheet and MEMS sheet are installed on wiring board, then the first housing and the 2nd housing is arranged on wiring board.

By foregoing description, in the directive property MEMSMIC that the utility model provides, by housing being set to the first housing of being connected respectively with wiring board upper surface and lower surface and the 2nd housing, and offer sound hole on the first housing, the first housing is made to form the first sound chamber, MEMS sheet internal cavity and the 2nd housing form the 2nd sound chamber, first sound chamber and the 2nd sound chamber simple structure, assembling directive property MEMSMIC step reduces, relative in above-mentioned background technology, need the first conduction element and the 2nd conduction element are installed, and need to offer multiple sound hole excessively, and the situation that position aligns, the packaging efficiency of the directive property MEMSMIC that the application provides improves.

Accompanying drawing explanation

Fig. 1 is the structural representation of traditional directive property MEMSMIC;

The structural representation of the directive property MEMSMIC that Fig. 2 provides for the utility model embodiment.

In middle Fig. 1-2: 01-wiring board, 02-the 2nd crosses sound hole, 03-MEMS packaging plastic, 04-gold thread, 05-ASIC sheet, 06-ASIC fixing glue, 07-ASIC seal gum, 08-shell, 09-tin cream, 010-first crosses sound hole, 011-MEMS sheet, 012-damping bonded adhesives, 013-damping part, 014-first conduction element, 015-the 2nd conduction element, 016-first bonded adhesives, 017-interlayer bonded adhesives, 018-the 2nd bonded adhesives, 019-the 2nd tunnel, 020-pad, 021-first sound hole, 022-the 2nd sound hole, 023-first tunnel,

1-wiring board, 2-1-first sound hole, 2-2-cross sound hole, 3-MEMS bonded adhesives, 4-gold thread, 5-ASIC sheet, 6-ASIC bonded adhesives, 7-ASIC seal gum, 8-1-first housing, 8-2-the 2nd housing, 9-tin cream, 10-the 2nd sound hole, 11-MEMS sheet, 12-damping part.

Embodiment

The packaging efficiency that core of the present utility model is to provide a kind of directive property MEMSMIC, this directive property MEMSMIC improves.

In order to make the technician of this area understand the technical solution of the utility model better, below in conjunction with drawings and embodiments, the utility model is described in further detail.

Please refer to Fig. 2, in a kind of embodiment, the directive property MEMSMIC that the utility model provides comprises wiring board 1, ASIC sheet 5, MEMS sheet, damping part 12 and shell, ASIC sheet 5 and MEMS sheet 11 are installed on the upper surface of wiring board 1, wiring board 1 is provided with the sound hole 2-2 excessively being connected with MENS sheet internal cavity, the 2nd housing 8-2 that shell comprises the first housing 8-1 and is connected with wiring board 1 lower surface, first housing 8-1 is arranged on wiring board 1 upper surface, and the first sound chamber that ASIC sheet 5 and MEMS sheet 11 are all positioned at wiring board 1 and the first housing 8-1 is formed, 2nd housing 8-2 internal cavity passed through sound hole 2-2 and MEMS sheet 11 internal cavity forms the 2nd sound chamber, first housing 8-1 is provided with the first sound hole 2-1, 2nd housing 8-2 is provided with the 2nd sound hole 10. concrete, according to actual demand, staff can in damping part 12 being arranged on the first sound hole 2-1 or on the 2nd sound hole 10, concrete, be arranged on the first housing 8-1 corresponding to the first sound hole 2-1 or on the 2nd housing 8-2 of the 2nd sound hole 10 correspondence. in order to shorten the process period of shell, it is preferable that, the first housing 8-1 is integrated injection moulding, and more preferably, the 2nd housing 8-2 is integrated injection moulding.

In order to improve directive property MEMSMIC, stability is installed, it is preferable that, the first housing 8-1 is connected with wiring board 1 by bonded adhesives or tin cream. More preferred, the 2nd housing 8-2 is connected with wiring board 1 by bonded adhesives or tin cream.

When directive property MEMSMIC assembled by needs, ASIC sheet 5 and MEMS sheet 11 are installed on wiring board 1, then the first housing 8-1 and the 2nd housing 8-2 is arranged on wiring board 1. Concrete, MEMS sheet 11 is bonded on wiring board 1 by MEMS bonded adhesives 3, MEMS bonded adhesives 3, around MEMS sheet 11 1 weeks, makes MEMS sheet 11 and circumferential cavity airtight; ASIC sheet 5 is connected on wiring board 1 by the gluing glue of ASIC 6 is bonding; Being connected with gold thread with MEMS sheet 11 by ASIC sheet 5, ASIC sheet 5 is connected with wiring board gold thread; ASIC sheet 5 is covered by ASIC seal gum 7; Draw tin cream/glue around wiring board, the first housing 8-1 is bonded on wiring board by tin cream 9; The wiring board back side is printed by SMT or draws tin cream, around a circle tin cream; 2nd housing 8-2 is bonded on wiring board; Damping 13 is bonded on the first housing 8-1 or the 2nd housing 8-2, completes the assembling of directive property MEMSMIC.

By foregoing description, in the directive property MEMSMIC that the utility model specific embodiment provides, by housing being set to the first housing 8-1 of being connected respectively with wiring board 1 upper surface and lower surface and the 2nd housing 8-2, and offer sound hole on the first housing 8-1, the first housing 8-1 is made to form the first sound chamber, MEMS sheet 11 internal cavity and the 2nd housing 8-2 form the 2nd sound chamber, first sound chamber and the 2nd sound chamber simple structure, assembling directive property MEMSMIC step reduces, relative in above-mentioned background technology, need the first conduction element and the 2nd conduction element are installed, and need to offer multiple situation crossed sound hole 2-2 and align, the packaging efficiency of the directive property MEMSMIC that the application provides improves.

In this specification sheets, each embodiment adopts the mode gone forward one by one to describe, and what each embodiment emphasis illustrated is the difference with other embodiments, between each embodiment identical similar portion mutually see.

To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are enable to realize or use the utility model. To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments. Therefore, the utility model can not be limited in these embodiments shown in this article, but be met the widest scope consistent with principle disclosed herein and features of novelty.

Claims

1. a directive property MEMSMIC, comprise wiring board (1), ASIC sheet (5), MEMS sheet (11), damping part (12) and shell, described ASIC sheet (5) and described MEMS sheet (11) are installed on described wiring board (1) upper surface, described wiring board (1) is provided with the sound hole (2-2) excessively being connected with described MENS sheet internal cavity, described shell comprises the first housing (8-1), described first housing (8-1) is arranged on the upper surface of described wiring board (1), and described ASIC sheet (5) and described MEMS sheet (11) are all positioned at the first sound chamber that described wiring board (1) formed with described first housing (8-1), it is characterized in that, also comprise described shell and also comprise the 2nd housing (8-2) being connected with described wiring board (1) lower surface, described 2nd housing (8-2) internal cavity passed through sound hole (2-2) and formed the 2nd sound chamber with described MEMS sheet (11) internal cavity, described first housing (8-1) is provided with the first sound hole (2-1), described 2nd housing (8-2) is provided with the 2nd sound hole (10).

2. directive property MEMSMIC according to claim 1, it is characterised in that, described first housing (8-1) is integrated injection moulding.

3. directive property MEMSMIC according to claim 2, it is characterised in that, described 2nd housing (8-2) is integrated injection moulding.

4. directive property MEMSMIC according to claim 1, it is characterised in that, described damping part (12) is arranged on the first sound hole (2-1).

5. directive property MEMSMIC according to claim 1, it is characterised in that, described damping part (12) is arranged on the 2nd sound hole (10).

6. directive property MEMSMIC according to any one of claim 1-5, it is characterised in that, described first housing (8-1) is connected with described wiring board (1) by bonded adhesives or tin cream (9).

7. directive property MEMSMIC according to claim 6, it is characterised in that, described 2nd housing (8-2) is connected with described wiring board (1) by bonded adhesives or tin cream.