CN111147995A - Dustproof structure, microphone packaging structure and electronic equipment - Google Patents
Dustproof structure, microphone packaging structure and electronic equipment Download PDFInfo
- Publication number
- CN111147995A CN111147995A CN201911421956.8A CN201911421956A CN111147995A CN 111147995 A CN111147995 A CN 111147995A CN 201911421956 A CN201911421956 A CN 201911421956A CN 111147995 A CN111147995 A CN 111147995A
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- Prior art keywords
- carrier
- dustproof
- filter screen
- microphone
- stress buffering
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/001—Moulding aspects of diaphragm or surround
Abstract
The invention discloses a dustproof structure, a microphone packaging structure and electronic equipment. Wherein the dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part is arranged at one end of the carrier and covers the hollow structure; the net part comprises a filter screen, a stress buffering area and a fixing part, wherein the stress buffering area is arranged on the filter screen, the fixing part is arranged on the stress buffering area, the filter screen is opposite to the hollow structure, the fixing part is connected with the carrier, and the filter screen and the stress buffering area are arranged in a suspension mode. One technical effect of the invention is that: the filter screen in net portion can keep smooth state, and net portion can effectively the separation external particulate matter, foreign matter enter into microphone packaging structure's inside.
Description
Technical Field
The invention relates to the technical field of electroacoustic conversion, in particular to a dustproof structure, a microphone packaging structure and electronic equipment.
Background
With the rapid development of electroacoustic technology, various electroacoustic products are developed. A microphone, as a transducer for converting sound into an electrical signal, is one of the very important devices in electro-acoustic products. Nowadays, microphones have been widely applied to various types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smartwatches, and smart wearing. In recent years, for a microphone packaging structure, the design of the structure thereof has become an important point and a focus of research by those skilled in the art.
The existing microphone package structure is generally: the chip package comprises a shell with a containing cavity, and components such as a chip assembly (for example, a MEMS chip and an ASIC chip) are contained and fixed in the containing cavity; and a sound pickup hole is also arranged on the shell. However, in long-term application, it is found that external particles and foreign matters such as dust and impurities are easily introduced into the accommodating cavity of the microphone through the sound pickup hole, and the external particles and foreign matters cause certain damage to components such as a chip assembly in the accommodating cavity, and finally affect the acoustic performance and the service life of the microphone.
In view of the above problems, the prior art generally adopts a solution that a corresponding isolation component is disposed on a sound pickup hole of a microphone package structure to block the entry of external particles, foreign matters, and the like. The conventional spacer assembly, as shown in fig. 1 and 2, includes a support portion and a spacer mesh. When the isolation component is used, the isolation component is installed on the sound pickup hole. However, in the conventional insulation assembly, because the support portion 101 and the insulation mesh 102 have different sizes, materials, structures, etc., a certain internal stress difference is likely to be generated at the connecting position of the support portion and the insulation mesh 102, which may cause wrinkles or wrinkles on the mesh 103 on the insulation mesh 102, and the mesh 103 may not be ensured to be in a flat state, which may cause a reduction in product quality, and may even affect the airflow at the mesh 103.
Disclosure of Invention
An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone package structure, and an electronic device.
According to a first aspect of the present invention, there is provided a dustproof structure including a carrier and a mesh portion;
the carrier is of a hollow structure; the grid part is arranged at one end of the carrier and covers the hollow structure;
the net part comprises a filter screen, a stress buffering area and a fixing part, wherein the stress buffering area is arranged on the filter screen, the fixing part is arranged on the stress buffering area, the filter screen is opposite to the hollow structure, the fixing part is connected with the carrier, and the filter screen and the stress buffering area are arranged in a suspension mode.
Optionally, the stress buffering region is a ring structure having a predetermined width α, the predetermined width α > 0.
Optionally, the ratio η of the width of the filter mesh φ to the predetermined width α of the stress buffering region is 0% < η < 27%.
Optionally, the width of the hollow structure of the carrier is greater than the maximum breadth of the filter screen.
Optionally, the inner wall surface of the carrier is a bevel.
Optionally, the inner wall surface of the carrier is formed with at least two inclination angles.
Optionally, the inner wall surface of the carrier is a cambered surface.
Optionally, the fixing portion is fixedly connected to the carrier, the filter screen and the stress buffering area are arranged in a suspended manner, and the cross section of the stress buffering area is L-shaped.
According to a second aspect of the present invention, a microphone package structure is provided. The microphone packaging structure comprises a shell with an accommodating cavity, wherein a sound pickup hole is formed in the shell and is used for communicating the inside with the outside of the shell;
the microphone device is fixedly arranged in the accommodating cavity;
the dustproof structure is arranged on the sound pickup hole.
Optionally, the dust-proof structure is located outside the housing.
Optionally, the housing includes a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodation cavity;
the dustproof structure is accommodated in the accommodating cavity;
the microphone device includes a MEMS chip and a signal amplifier.
Optionally, the pickup hole is located on the encapsulation cover, and the dust-proof structure is fixedly connected with the encapsulation cover.
Optionally, the pickup hole is located on the package cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.
Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole.
Optionally, the pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.
According to a third aspect of the invention, an electronic device is provided. The electronic equipment comprises the microphone packaging structure.
According to the dustproof structure provided by the embodiment of the invention, the stress buffering area is specially designed, so that the filter screen on the grid part can be kept in a flat state, and the phenomenon that wrinkles or wrinkles are generated on the filter screen is avoided. The dustproof structure provided by the embodiment of the invention can effectively protect the pickup hole of the microphone packaging structure, and the grid part can prevent external particles and foreign matters from entering the microphone packaging structure, so that all components in the microphone can be effectively protected, the acoustic performance of the microphone is prevented from being influenced, and the service life of the microphone is prolonged. The technical task to be achieved or the technical problems to be solved by the present invention are never thought or not expected by those skilled in the art, and therefore the present invention is a new technical solution.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a side view of a prior art insulation assembly.
Fig. 2 is a schematic structural view of an isolation portion in a conventional isolation assembly.
Fig. 3 is a schematic structural diagram of a dust-proof structure according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a dustproof structure according to another embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a dustproof structure according to yet another embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a microphone package structure according to a first embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a microphone package structure according to a second embodiment of the invention.
Fig. 8 is a schematic structural diagram of a microphone package structure according to a third embodiment of the invention.
Fig. 9 is a schematic structural diagram of a microphone package structure according to a fourth embodiment of the invention.
Fig. 10 is a schematic structural diagram of a microphone package structure according to a fifth embodiment of the invention.
Description of reference numerals:
101-support part, 102-isolation mesh cloth, 103-net film;
1-carrier, 11-inner wall surface, 12-airflow channel, 2-grid part, 21-filter screen, 22-fixing part, 23-stress buffer area, 3-shell, 31-packaging cover, 32-substrate, 4-sound pickup hole, 5-MEMS chip and 6-signal amplifier.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
According to an embodiment of the present invention, there is provided a dust-proof structure. The dustproof structure can be applied to a microphone packaging structure. This dustproof construction can effectively the outside particulate matter of separation, foreign matter enter into microphone packaging structure's inside through the sound hole of picking up on the microphone packaging structure to can protect each components and parts of microphone inside effectively, in order to avoid influencing the acoustics performance and the life of microphone.
The specific structure of the dust-proof structure provided by the embodiment of the present invention is further described below. The dustproof structure provided by the embodiment of the invention, as shown in fig. 3-5, comprises a carrier 1 and a grid part 2. The carrier 1 is a hollow structure, and an airflow channel 12 is formed inside the hollow structure for airflow to pass through. The mesh part 2 is provided at one end of the carrier 1 and covers the hollow structure. Grid portion 2 is including filter screen 21, center on stress buffer area 23 that filter screen 21 set up and center on the fixed part 22 that stress buffer area 23 set up, and filter screen 21 with hollow structure is relative, fixed part 22 with carrier 1 is connected, filter screen 21 with stress buffer area 23 unsettled setting.
In the dustproof structure provided by the embodiment of the invention, the stress buffer area 23 is specially designed, so that the filter screen 21 on the grid part 2 can be kept in a flat state, and the phenomenon of generating wrinkles or wrinkles on the filter screen 21 is avoided. The dustproof structure provided by the embodiment of the invention can effectively protect the microphone packaging structure, and the grid part 2 can effectively prevent external particles and foreign matters from entering the microphone packaging structure, so that each component in the microphone packaging structure can be effectively protected, and the acoustic performance and the service life of the microphone are prevented from being influenced. In addition, because the filter screen 21 on the grid part 2 is in a flat state, the smooth flow of air at the position is facilitated, and the adverse effect on the movement of the air flow is avoided.
In the present invention, as shown in fig. 3, the stress buffering region 23 is a ring structure having a predetermined width α, and the predetermined width α should be greater than 0, it should be noted that the stress buffering region 23 may be, for example, a ring structure having a predetermined width α, a square ring structure having a predetermined width α, or another ring structure having a predetermined width α, and those skilled in the art can flexibly adjust the structure according to specific situations, which is not limited by the present invention.
In the present invention, as shown in fig. 3, the mesh part 2 includes a filter screen 21, a stress buffering region 23 surrounding the filter screen 21, and a fixing part 22 surrounding the stress buffering region 23. The filter screen 21 and the stress buffering area 23 are suspended. The fixing portion 22 may be used to connect the mesh portion 2 with the carrier 1, so that the mesh portion 2 can stably cover the carrier 1. Note that, when the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the fixing portion 22 is connected to an edge portion of the carrier 1. Specifically, the fixing portion 22 of the mesh portion 2 and the edge portion of the carrier 1 may be connected together by, for example, adhesive bonding, or may be connected together by a fastening member or welding, and those skilled in the art may flexibly select the fixing portion according to specific needs, which is not limited by the invention.
The filter screen 21 may be a metal mesh with a mesh aperture smaller than about 10 μm, for example, so as to allow the air flow to pass smoothly and effectively block particles such as dust and impurities from entering the filter screen. Moreover, the metal mesh has the characteristic of good durability, does not need to be frequently replaced, and has a long service life. Of course, the filter screen 21 may also be mesh cloth with other aperture sizes and other materials. The shape of the mesh on the filter screen 21 may be, for example, a circle, a square, a triangle, or the like. The person skilled in the art can flexibly adjust the device according to specific needs, without limitation.
Note that, in the mesh portion 2, the shape of the filter screen 21 itself may be, for example, a circle, a square, an ellipse, or the like, and the filter screen 21 may have other irregular shapes. Those skilled in the art can flexibly adjust the present invention according to the actual needs, and the present invention is not limited to this.
In the present invention, the size of the stress buffering area 23 should be appropriately adjusted and set according to the size of the filter screen 21 on the mesh part 2. for example, when the width of the filter screen 21 is defined as φ, the ratio η between the width φ of the filter screen 21 and the predetermined width α of the stress buffering area 23 should satisfy the relationship of 0% < η < 27%. the inventors of the present invention found that η within this range contributes to keeping the filter screen 21 in a flat state without generating wrinkles thereon.
In an alternative embodiment of the present invention, as shown in fig. 3, the filter mesh 21 of the mesh part 2 has a circular structure, and in this embodiment, the ratio η of the diameter aa' of the filter mesh 21 to the predetermined width α of the stress buffering area 23 should satisfy 0% < η < 27%, in which case the filter mesh 21 of the mesh part 2 can be kept flat without wrinkles or creases after the mesh part 2 is coupled to the carrier 1.
In the present invention, as shown in fig. 3 to 5, the width dimension of the hollow structure of the carrier 1 is larger than the width (or width) of the filter screen 21. When the filter screen 21 itself has an irregular shape, the width of the hollow structure of the carrier 1 should be larger than the maximum width of the filter screen 21. That is, the invention is designed such that the filter screen 21 itself cannot completely cover the hollow structure of the carrier 1. In the invention, the carrier 1 is improved, and the wall thickness of the carrier 1 is reduced so as to enlarge the width dimension of the hollow structure. This allows a space for stress buffering areas 23 to be formed at the edges of the connection points of the mesh part 2 when it is fixed to the carrier 1. The defect that the filter screen 21 is easy to wrinkle in the prior art is well improved through the stress buffering area 23.
In an alternative example of the invention, as shown in fig. 3, the inner wall surface 11 of the carrier 1 is beveled. That is, the wall surface of the hollow structure of the carrier 1 has a slope structure. The inner wall surface of the carrier 1 may be inclined at a predetermined angle, and the inner wall surface forms a conical surface structure, and those skilled in the art can appropriately adjust the inclined angle according to specific needs, which is not limited to this. In this example, as shown in fig. 3, the width dimension of the carrier 1 is relatively large at one end of the carrier 1 connected to the fixing portion 22 of the mesh portion 2; the carrier 1 is far away from one end of the grid part 2, and the width size of the carrier 1 is smaller. This design results in a hollow structure of the carrier 1 forming a conical gas flow channel 12. When the mesh part 2 is fixedly arranged on the carrier 1, the width of the carrier 1 is large due to the connection part of the mesh part 2 and the carrier 1, so that the firm and stable combination of the mesh part and the carrier is facilitated, and the airflow channel 12 with the conical structure is favorable for airflow flowing.
In an alternative example of the present invention, as shown in fig. 4, the inner wall surface 11 of the carrier 1 is formed with at least two inclination angles. It should be noted that, when the inner wall surface of the carrier 1 forms two or more inclination angles, the inclination angles of different inclination angles may be the same, and certainly may be different, and those skilled in the art may flexibly adjust the inclination angles according to specific situations, which is not limited to this. In this example, as shown in fig. 4, the width dimension of the carrier 1 is relatively large at the end where the carrier 1 is connected to the fixing portion 22 of the mesh portion 2; the carrier 1 is far away from one end of the grid part 2, and the width size of the carrier 1 is smaller. When the mesh part 2 is fixed on the carrier 1, the width dimension of the carrier 1 is also relatively large due to the connection of the mesh part 2 and the carrier 1, which also contributes to a firm and stable combination of the two.
Of course, in the present invention, the inner wall surface 11 of the carrier 1 is not limited to the above-described two structures. The inner wall surface 11 of the carrier 1 can also be of arcuate configuration, i.e. form an arcuate surface, for example. This structure is relatively simple to implement.
In an alternative example of the present invention, as shown in fig. 5, the fixing portion 22 of the mesh portion 2 is fixedly connected to the edge portion of the carrier 1, wherein the filter screen 21 and the stress buffering area 23 are suspended, and the cross section of the stress buffering area 23 is L-shaped.
The fixing portion 22 of the mesh portion 2 may be connected to the carrier 1 by means of, for example, adhesive, welding, or fastening, and may be flexibly adjusted by a person skilled in the art according to specific needs, without limitation.
In the present invention, the thickness of the mesh part 2 may be 0.5 μm, for example. The height of the support 1 can be, for example, 40 μm. This size is suitable for most microphone packages. Of course, the size of the assembly can be adjusted by those skilled in the art according to the specific assembly requirement, and the assembly is not limited to this.
According to another embodiment of the invention, a microphone packaging structure is also provided. The microphone packaging structure can be applied to various electronic products such as mobile phones, notebook computers, Ipad and VR equipment and intelligent wearable equipment, and is widely applied. The microphone packaging structure provided by the embodiment of the invention can effectively avoid the phenomenon that components such as an internal chip assembly and the like are damaged due to the influence of particles and foreign matters such as external dust and impurities, can prolong the service life of the microphone, and can ensure that the microphone keeps excellent acoustic performance.
The following further describes a specific structure of the microphone package structure provided in the embodiment of the present invention.
As shown in fig. 6 to 10, a microphone package structure provided by an embodiment of the present invention includes a housing 3 having a receiving cavity, and a sound pickup hole 4 is provided on the housing 3. The sound pickup hole 4 is used to communicate the inside and outside of the housing 3. A microphone device is accommodated and fixed in the accommodation chamber of the housing 3. The microphone packaging structure further comprises the dustproof structure, and the dustproof structure is fixedly installed on the sound pickup hole 4. The dustproof structure can effectively protect components inside the microphone packaging structure.
In the present invention, the sound pickup hole 4 may have a circular, square, triangular, or elliptical shape, for example. The pickup hole 4 may be provided in one or more as required. The specific setting position of the sound pickup hole 4 can also be flexibly adjusted according to the specific condition of the microphone packaging structure, which is not limited by the present invention.
In an alternative example of the present invention, as shown in fig. 6, the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dust-proof structure is mounted outside the microphone package to cover the sound pickup hole 4, and does not occupy the space inside the microphone package. When the dustproof structure is installed, the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned to the sound pickup hole 4, and external particles and foreign matters can be prevented from being introduced into the microphone packaging structure through the sound pickup hole 4.
Of course, the present invention is not limited to the dustproof structure provided outside the housing 3, and the dustproof structure may be provided in the housing cavity of the housing 3. The technical personnel in the field can flexibly adjust the arrangement position of the dustproof structure according to specific needs.
The microphone packaging structure of the invention, the structure of its outer cover 3 is: the substrate 32 and the packaging cover 31 are included, and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dust-proof structure is accommodated in the accommodating cavity of the housing 3. The microphone device comprises a MEMS chip 5 and a signal amplifier 6.
In an alternative example of the present invention, as shown in fig. 7, the sound pickup hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the package cover 32. Dustproof construction's position corresponds to pickup hole 4, can avoid outside particulate matter, foreign matter to introduce inside microphone packaging structure through pickup hole 4.
In an alternative example of the present invention, as shown in fig. 8, the sound pickup hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the substrate 32 at a position corresponding to the sound pickup hole 4, and at the same time, the dust-proof structure also covers the MEMS chip 5, so as to effectively protect the chip in the microphone package structure.
In the present invention, the sound collecting hole 4 is not limited to be formed in the sealing cover 31 of the housing 3, and may be formed in the substrate 32. For example, as shown in fig. 9, the sound collecting hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4. For another example, as shown in fig. 10, the sound collecting hole 4 is located on the substrate 32, the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4, and the MEMS chip 5 is provided on the dust-proof structure. It should be noted that, when the sound-collecting hole 4 is formed in the substrate 32, a person skilled in the art may adjust the installation position of the dust-proof structure according to specific situations, as long as the person can prevent external particles and foreign matters from entering or can protect the internal chip, and the invention is not limited thereto.
Wherein the package cover 31 has a dish-shaped structure with an open end. The material of the package cover 31 may be, for example, a metal material, a plastic material, or a PCB. The shape of the sealing cap 31 may be, for example, a cylindrical shape or a rectangular parallelepiped shape. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.
The substrate 32 may be a circuit board known in the art, such as a PCB, without limitation. The package cover 31 and the substrate 32 may be fixed together by, for example, adhesive bonding or solder paste welding, and those skilled in the art can flexibly select the combination according to the needs without limitation.
The microphone packaging structure provided by the invention is characterized in that a microphone device is fixedly accommodated in an accommodating cavity of the shell 3. Specifically, as shown in fig. 6 to 10, the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.
The MEMS chip 5 includes a substrate and an inductive film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the housing chamber, the MEMS chip 5 may be attached to the substrate 32. Of course, the MEMS chip 5 may also be attached to the package cover 31, for example, a special adhesive may be used to adhere the MEMS chip 5 to the package cover 31. The MEMS chip 5 can also be turned on by a circuit pattern in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art, and the present invention will not be described in detail herein.
The signal amplifier 6 may be mounted on the package cover 31, or may be mounted on the substrate 32. The signal amplifier 6 may be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed by the ASIC chip, and output. The MEMS chip 5 and the ASIC chip 6 may be electrically connected through a metal wire (bonding wire) to realize mutual conduction therebetween.
Further, the MEMS chip 5 and/or the signal amplifier 6 may be embedded in the substrate 32 or may be semi-embedded in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductors are, for example, metallized through holes provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 via a conductor. The design in which the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32 contributes to miniaturization of the microphone.
When the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 for constituting a shielding structure together with the above-mentioned metal layers. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat protective glue on the surface of the signal amplifier 6, thus simplifying the process and improving the optical noise resistance of the product.
On the other hand, the invention also provides electronic equipment. The electronic device comprises the microphone packaging structure.
The electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, an intelligent wearable device, and the like, which is not limited in this respect.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (16)
1. A dustproof construction which characterized in that: comprises a carrier and a grid part;
the carrier is of a hollow structure; the grid part is arranged at one end of the carrier and covers the hollow structure;
the net part comprises a filter screen, a stress buffering area and a fixing part, wherein the stress buffering area is arranged on the filter screen, the fixing part is arranged on the stress buffering area, the filter screen is opposite to the hollow structure, the fixing part is connected with the carrier, and the filter screen and the stress buffering area are arranged in a suspension mode.
2. The dustproof structure according to claim 1, wherein the stress buffering region is a ring structure having a predetermined width α, and the predetermined width α > 0.
3. The dustproof structure according to claim 2, wherein the ratio η of the width φ of the filter mesh to the predetermined width α of the stress buffering region is 0% < η < 27%.
4. The dustproof structure according to claim 1, characterized in that: the width of the hollow structure of the carrier is larger than the maximum breadth of the filter screen.
5. The dustproof structure according to claim 1, characterized in that: the inner wall surface of the carrier is an inclined surface.
6. The dustproof structure according to claim 1, characterized in that: the inner wall surface of the carrier is formed with at least two inclination angles.
7. The dustproof structure according to claim 1, characterized in that: the inner wall surface of the carrier is an arc surface.
8. The dustproof structure according to claim 1, characterized in that: the fixed part is fixedly connected with the carrier, the filter screen and the stress buffering area are arranged in a suspended mode, and the cross section of the stress buffering area is L-shaped.
9. A microphone packaging structure is characterized in that: the shell is provided with a sound pickup hole, and the sound pickup hole is used for communicating the inside with the outside of the shell;
the microphone device is fixedly arranged in the accommodating cavity;
further comprising the dust-proof structure of any one of claims 1-8, the dust-proof structure being disposed over the sound pickup aperture.
10. The microphone package structure of claim 9, wherein: the dust-proof structure is located outside the housing.
11. The microphone package structure of claim 9, wherein: the shell comprises a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodating cavity;
the dustproof structure is accommodated in the accommodating cavity;
the microphone device includes a MEMS chip and a signal amplifier.
12. The microphone package structure of claim 11, wherein: the pickup hole is located on the encapsulation cover, the dustproof construction with encapsulation cover fixed connection.
13. The microphone package structure of claim 11, wherein: the pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate so as to cover the MEMS chip.
14. The microphone package structure of claim 11, wherein: the sound pickup hole is positioned on the substrate, and the dustproof structure is fixedly arranged on the substrate corresponding to the position of the sound pickup hole.
15. The microphone package structure of claim 11, wherein: the pickup hole is positioned on the substrate, the dustproof structure is fixedly arranged on the substrate corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.
16. An electronic device, characterized in that: comprising a microphone package according to any of claims 9-15.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911421956.8A CN111147995A (en) | 2019-12-31 | 2019-12-31 | Dustproof structure, microphone packaging structure and electronic equipment |
| PCT/CN2020/099179 WO2021135113A1 (en) | 2019-12-31 | 2020-06-30 | Dustproof structure, microphone packaging structure, and electronic device |
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| CN201911421956.8A CN111147995A (en) | 2019-12-31 | 2019-12-31 | Dustproof structure, microphone packaging structure and electronic equipment |
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| CN111147995A true CN111147995A (en) | 2020-05-12 |
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| CN201911421956.8A Pending CN111147995A (en) | 2019-12-31 | 2019-12-31 | Dustproof structure, microphone packaging structure and electronic equipment |
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| WO (1) | WO2021135113A1 (en) |
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| CN111711907A (en) * | 2020-06-30 | 2020-09-25 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
| CN111711905A (en) * | 2020-06-24 | 2020-09-25 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
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| CN112492481A (en) * | 2020-12-02 | 2021-03-12 | 潍坊歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
| WO2021135128A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure and electronic device |
| WO2021135110A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure and mems microphone packaging structure used for mems device |
| WO2021135113A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure, and electronic device |
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| CN104760924B (en) * | 2015-04-20 | 2017-06-06 | 歌尔股份有限公司 | A kind of MEMS microphone chip and its encapsulating structure |
| CN206341428U (en) * | 2016-10-25 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | Mems microphone |
| CN206878932U (en) * | 2017-05-22 | 2018-01-12 | 维沃移动通信有限公司 | A kind of microphone and mobile terminal |
| CN108796435B (en) * | 2018-05-28 | 2020-06-16 | 昆山国显光电有限公司 | Mask and manufacturing method thereof |
| CN110602602A (en) * | 2019-09-18 | 2019-12-20 | 歌尔股份有限公司 | Electronic equipment and audio module thereof |
| CN111147993A (en) * | 2019-12-31 | 2020-05-12 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111147995A (en) * | 2019-12-31 | 2020-05-12 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111163410A (en) * | 2019-12-31 | 2020-05-15 | 歌尔股份有限公司 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
| CN111147992A (en) * | 2019-12-31 | 2020-05-12 | 歌尔股份有限公司 | A dustproof construction and MEMS microphone packaging structure for MEMS device |
| CN111147994A (en) * | 2019-12-31 | 2020-05-12 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111050257A (en) * | 2019-12-31 | 2020-04-21 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111131986A (en) * | 2019-12-31 | 2020-05-08 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
-
2019
- 2019-12-31 CN CN201911421956.8A patent/CN111147995A/en active Pending
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2020
- 2020-06-30 WO PCT/CN2020/099179 patent/WO2021135113A1/en active Application Filing
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| CN111711905A (en) * | 2020-06-24 | 2020-09-25 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
| CN111711903A (en) * | 2020-06-24 | 2020-09-25 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
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