WO2021135128A1 - Dustproof structure, microphone packaging structure and electronic device - Google Patents

Abstract

Disclosed in the present invention are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises: a mesh structure; a support part, the support part comprising a connecting part and a carrier fixed to the connecting part, the connecting part surrounding the mesh structure, a first through hole being formed on the central portion of the carrier, and the mesh structure covering one end of the first through hole; and a stress concentration part, formed at the inner side of the support part, the stress concentration part being configured to concentrate stress of the support part. One technical effect of the present invention is reducing, by providing the stress concentration part, the stress generated on the mesh structure when the dustproof structure deforms, avoiding the generation of disordered folds on the mesh structure.

Description

Dustproof structure, microphone packaging structure and electronic equipment Technical field

The present invention relates to the field of acousto-electric technology, and more specifically, to a dust-proof structure, a microphone packaging structure, and an electronic device.

Background technique

The microphone is provided with a dust-proof structure. The dust-proof structure is a device that can prevent foreign objects such as powder and particles from entering and cause the microphone to produce a false reaction, and can allow sound waves to pass through.

The dust-proof structure is composed of different materials, and the thermal expansion coefficients of different materials are different. In the installation process of the dust-proof structure, the dust-proof structure will warp during heat treatment. In contrast, the deformation of the carrier is large when the dust-proof structure is warped, and the deformation of the membrane is small. This causes the stress generated after the deformation to squeeze the membrane body, resulting in messy wrinkles on the mesh structure on the membrane body.

Therefore, a new technical solution is needed to solve the above-mentioned problems.

Summary of the invention

An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone packaging structure, and an electronic device.

According to the first aspect of the present invention, there is provided a dust-proof structure, including:

Grid structure

The supporting part includes a connecting part and a carrier fixed to the connecting part, the connecting part is arranged around the grid structure, a first through hole is formed in the middle of the carrier, and the grid structure covers the One end of the first through hole;

The stress concentration part is formed on the inner side of the support part, and the stress concentration part is used to concentrate the stress of the support part.

Optionally, the stress concentration part is formed inside the connecting part, and the stress concentration part surrounds the grid structure.

Optionally, the stress concentration portion includes a first extension portion extending inward from the connecting portion, a plurality of second through holes are provided on the first extension portion, and a plurality of second through holes are arranged along the The circumferential distribution of the first extension.

Optionally, the aperture ratio of the second through hole is less than or equal to the aperture ratio of the grid structure.

Optionally, the second through hole includes a rectangular hole or an arc-shaped hole.

Optionally, the stress concentration portion includes a first extension portion extending inward from the connecting portion, a plurality of cuts are formed on the first extension portion, and a connection is formed between two ends of each of the cuts. On the neck of the first extension part, the cutout faces the grid structure, and the neck part faces the support part; a plurality of the cutouts are distributed along the circumferential direction of the first extension part.

Optionally, the stress concentration portion is formed inside the carrier, and the stress concentration portion is arranged coaxially with the first through hole.

Optionally, the stress concentration portion includes a second extension portion extending inwardly of the carrier, the second extension portion includes a plurality of protrusions, and the plurality of protrusions are along a circumferential direction of the second extension portion. distributed.

Optionally, along a cross-section perpendicular to the axial direction of the first through hole, the protrusion includes a rectangular protrusion with a rectangular edge shape or an arc-shaped protrusion with an arc edge shape.

Optionally, the stress concentration portion includes a second extension portion that extends inwardly of the carrier, and the second extension portion includes a plurality of arc-shaped walls; both ends of the arc-shaped wall are connected to the carrier, and the center of the arc-shaped wall is connected to the carrier. It is hollow; a plurality of the arc-shaped walls are distributed along the circumferential direction of the second extension portion, and the arc-shaped wall is arc-shaped along a section perpendicular to the axial direction of the first through hole.

Optionally, the stress concentration portion is formed on both the connecting portion and the inner side of the carrier;

The stress concentration part inside the connecting part is arranged around the grid structure, and the stress concentration part inside the carrier is arranged coaxially with the first through hole.

Optionally, an elastic telescoping structure is provided on the grid structure, and the elastic telescoping structure can expand and contract along the plane where the grid structure is located.

Optionally, the elastic coefficient of the elastic stretchable structure is anisotropic.

Optionally, the aperture ratios of the grid structure are different everywhere.

Optionally, the material of the grid structure and the connecting portion includes metallic glass.

Optionally, the material of the carrier includes epoxy resin.

According to a second aspect of the present invention, there is provided a microphone packaging structure, including the dust-proof structure described in any one of the above, and the dust-proof structure is fixed on the sound hole of the microphone packaging structure;

Alternatively, the dust-proof structure covers the MEMS chip in the microphone packaging structure.

According to a third aspect of the present invention, there is provided an electronic device including the aforementioned microphone packaging structure.

According to an embodiment of the present disclosure, the stress concentration portion is provided to reduce the stress on the grid structure when the dust-proof structure is deformed, and avoid messy wrinkles on the grid structure.

Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.

Description of the drawings

The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present invention, and together with the description are used to explain the principle of the present invention.

Fig. 1 is a schematic structural diagram of a stress concentration part arranged inside a support part according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural view of a cross-section of a stress concentration part arranged inside a connecting part according to an embodiment of the present disclosure.

Fig. 3 is a structural schematic diagram of a stress concentration part of an embodiment of the present disclosure in which a rectangular hole is provided on a first extension part.

Fig. 4 is a structural schematic diagram of a stress concentration part of an embodiment of the present disclosure in which an arc-shaped hole is provided on the first extension part.

Fig. 5 is a structural schematic diagram of a stress concentration part of an embodiment of the present disclosure in which a notch is provided on the first extension part.

Fig. 6 is a schematic structural view of a cross-section of a stress concentration portion provided inside a carrier according to an embodiment of the present disclosure.

Fig. 7 is a structural schematic diagram of a stress concentration part of an embodiment of the present disclosure in which a rectangular protrusion is provided on a second extension part.

Fig. 8 is a structural schematic diagram of an arc-shaped protrusion provided on the second extension part of the stress concentration part of an embodiment of the present disclosure.

Fig. 9 is a structural schematic diagram of the stress concentration part of an embodiment of the present disclosure in which an arc-shaped wall is provided on the second extension part.

FIG. 10 is a schematic structural view of a cross-section of a stress concentration portion provided on the inner side of the connecting portion and the inner side of the carrier according to an embodiment of the present disclosure.

FIG. 11 is a schematic diagram of a dustproof structure provided inside the sound hole on the microphone packaging structure substrate according to an embodiment of the present disclosure.

FIG. 12 is a schematic diagram of a dustproof structure provided at the MEMS chip on the microphone packaging structure substrate according to an embodiment of the present disclosure.

In the figure, 11 is the connection part, 12 is the grid structure, 2 is the carrier layer, 3 is the stress concentration part, 31 is the first extension part, 311 is the rectangular hole, 312 is the arc hole, 313 is the cutout, and 32 is the first extension. Two extension parts, 321 is a rectangular protrusion, 322 is an arc-shaped protrusion, 323 is an arc-shaped wall, 4 is a sound hole, and 5 is a MEMS chip.

Detailed ways

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.

The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.

In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further discussed in the subsequent drawings.

According to an embodiment of the present disclosure, there is provided a dust-proof structure, as shown in FIG. 1, the dust-proof structure includes: a grid structure 12; a support portion, the support portion includes a connecting portion 11 and a carrier fixed to the connecting portion 11 2. The connecting portion 11 is arranged around the grid structure 12, a first through hole is formed in the middle of the carrier 2, and the grid structure 12 covers one end of the first through hole; the connecting portion 11 and the grid structure 12 form a dust-proof structure film body.

The stress concentration part 3 forms a stress concentration part 3 inside the support part, and the stress concentration part 3 is used to concentrate the stress of the support part.

In this embodiment, the grid structure 12 provides the dust-proof structure with a dust-proof effect, and can pass sound waves without affecting sound transmission. For example, the grid structure 12 may be provided with holes in the shape of a circle, a square, or the like.

The supporting part is used to support and fix the dust-proof structure at a set position. The supporting part includes a connecting part 11 and a carrier 2, the carrier 2 is used to connect to a set position, and the connecting part 11 is used to connect the grid structure 12 to the carrier 2.

A stress concentration part 3 is formed inside the support part, and the stress concentration part 3 is arranged around the grid structure 12. For example, in FIG. 1, the stress concentration part 3 is arranged around the axis of the grid structure 12.

The stress concentration part 3 is used to concentrate the stress of the support part, for example, in the process of manufacturing or installing a dust-proof structure. The dust-proof structure will be deformed by the heat treatment process or other factors in the above process, and stress will be generated in the support part. For example, the heat treatment process may warp the support part, and the stress caused by the warping deformation will be transferred to the mesh structure 12 and the mesh structure 12 will produce disorderly wrinkles. After the stress concentration part 3 is provided, the stress concentration part 3 concentrates the stress of the support part and reduces the stress on the grid structure 12. And, the concentrated stress causes the generated wrinkles to be concentrated on the stress concentration part with regular shapes and uniform distribution. This will control the generation of wrinkles on the grid structure 12, protect the structure of the grid structure 12 from damage, and improve the yield and reliability of the dust-proof structure.

For example, as shown in FIG. 2, the stress concentration part 3 may be formed inside the connecting part 11, and the stress concentration part 3 surrounds the grid structure 12.

The stress concentration part 3 is arranged inside the connecting part 11 of the support part, so that the connecting part 11, the stress concentration part 3 and the grid structure 12 are connected in sequence. In this way, it is possible to control the generation of wrinkles on the mesh structure 12 through the membrane body, protect the structure of the mesh structure 12 from damage, and improve the yield and reliability of the dust-proof structure.

In an example, as shown in Figures 3 and 4, the stress concentration portion 3 includes a first extension portion 31 extending inward from the connecting portion 11, a plurality of second through holes are provided on the first extension portion 31, and a plurality of second through holes are provided on the first extension portion 31. The two through holes are distributed along the circumferential direction of the first extension portion 31.

In this example, the stress concentration portion 3 includes a first extension portion 31 and a plurality of second through holes provided on the first extension portion 31. In this way, the generated stress can be concentrated on the position of the second through hole, and the position of the second through hole can be deformed to form wrinkles. The stress on the grid structure 12 is reduced, and the grid structure 12 is prevented from causing messy folds due to the stress.

For example, the second through hole includes a rectangular hole 311 or an arc-shaped hole 312.

As shown in FIG. 3, the second through hole is a rectangular hole 311. A plurality of rectangular holes 311 are provided on the first extension portion 31, so that stress can be concentrated on the positions of the plurality of rectangular holes 311. Avoid stress forming wrinkles on the grid structure 12.

For example, it is also possible to provide a part of the single second through hole on the connecting part 11 and another part on the first extension part 31. Such a structure can reduce the alignment error of the connection between the membrane body and the carrier 2 and optimize the structure of the dust-proof structure. The structural dislocation between the carrier 2 and the membrane body caused by stress is avoided.

As shown in FIG. 4, the second through hole is an arc-shaped hole 312. The arc-shaped holes 312 are distributed along the circumferential direction of the first extension portion 31, so that stress can be concentrated on the arc-shaped holes 312, and the stresses can prevent the grid structure 12 from forming wrinkles. The arc-shaped holes 312 are evenly distributed along the circumferential direction of the first extension portion 31, so that the generated wrinkles are also evenly distributed along the circumferential direction, effectively controlling the shape and structure of the generated wrinkles.

In an example, the aperture ratio of the second through hole is less than or equal to the aperture ratio of the grid structure 12.

In this example, in addition to the function of concentrating stress, the second through hole provided on the stress concentration part 3 also sets the aperture ratio of the second through hole to be less than or equal to the aperture ratio of the mesh structure 12, so that the stress concentration part 3 is also It has the dustproof function of the grid structure 12.

In one embodiment, as shown in FIG. 5, the stress concentration portion 3 includes a first extension portion 31 extending inward from the connecting portion 11, and a plurality of slits 313 are formed on the first extension portion 31, and two of each slit 313 A neck portion connected to the first extension portion 31 is formed between the ends, the cutout 313 faces the grid structure 12, and the neck portion faces the support portion; a plurality of cutouts 313 are distributed along the circumference of the first extension portion 31.

In this embodiment, a plurality of notches 313 are cut on the first extension portion 31 to form the stress concentration portion 3. In this way, the stress will cause the positions of multiple cuts 313 to avoid messy wrinkles of the grid structure 12 caused by the stress.

For example, it is also possible to provide a part of the single cutout on the connecting portion 11 and the other part on the first extension portion 31. Such a structure can reduce the alignment error of the connection between the membrane body and the carrier 2 and optimize the structure of the dust-proof structure. The structural dislocation between the carrier 2 and the membrane body caused by stress is avoided.

In one embodiment, as shown in FIG. 6, a stress concentration part 3 is formed inside the carrier 2, and the stress concentration part 3 is arranged coaxially with the first through hole.

The stress concentration part 3 is formed on the carrier 2, and the stress can be controlled by the carrier 2 to concentrate the stress on the stress concentration part 3. The control wrinkles are formed on the stress concentration part 3 to avoid the formation of messy wrinkles on the grid structure 12.

For example, as shown in FIGS. 7 and 8, the stress concentration portion 3 includes a second extension portion 32 extending inwardly of the carrier 2. The second extension portion 32 includes a plurality of protrusions, and the plurality of protrusions are along the circumferential direction of the second extension portion 32. distributed.

By forming a plurality of protrusions on the inner side of the carrier 2, stress is concentrated on the plurality of protrusions, and the plurality of protrusions are the second extension portions 32. The stress acts on the protrusions, reducing the stress on the grid structure 12 and avoiding messy wrinkles on the grid structure 12.

For example, along a cross-section perpendicular to the axial direction of the first through hole, the protrusion includes a rectangular protrusion 321 with a rectangular edge shape or an arc-shaped protrusion 322 with an arc edge shape.

As shown in FIG. 7, a plurality of rectangular protrusions 321 are formed on the inner side of the carrier 2, so that stress can be concentrated on the plurality of rectangular protrusions 321. The stress on the grid structure 12 is reduced, and messy folds on the grid structure 12 are avoided.

As shown in FIG. 8, a plurality of arc-shaped protrusions 322 are formed on the inner side of the carrier 2, so that stress can be concentrated on the plurality of arc-shaped protrusions 322. The stress on the grid structure 12 is reduced, and messy folds on the grid structure 12 are avoided.

In one embodiment, as shown in FIG. 9, the stress concentration portion 3 includes a second extension portion 32 extending inwardly of the carrier 2, and the second extension portion 32 includes a plurality of arc-shaped walls 323; both ends of the arc-shaped wall 323 and The carrier 2 is connected with a hollow in the middle; a plurality of arc-shaped walls 323 are distributed along the circumferential direction of the second extension portion 32, and the arc-shaped wall 323 is arc-shaped along a section perpendicular to the axial direction of the first through hole.

In this embodiment, the arc-shaped wall 323 formed on the inner side of the carrier 2 can concentrate stress on each arc-shaped wall 323. The stress is concentrated on each arc-shaped wall 323 in the circumferential direction. In this way, the stress on the grid structure 12 can be reduced, the wrinkles can be evenly distributed along the circumferential direction, and the messy wrinkles on the grid structure 12 can be avoided. The yield and reliability of the dust-proof structure are improved.

In one embodiment, as shown in FIG. 10, the stress concentration part 3 is formed on the inner side of the connecting part 11 and the carrier 2; the stress concentration part 3 inside the connecting part 11 is arranged around the grid structure 12, and the stress concentration inside the carrier 2 The part 3 is arranged coaxially with the first through hole.

In this embodiment, the stress concentration portion 3 provided on the inner side of the carrier 2 and the stress concentration portion 3 provided on the inner side of the connecting portion 11 concentrate the stress, and the appearance of wrinkles on the stress concentration portion 3 is controlled. The stress on the grid structure 12 is effectively reduced. Avoid messy folds on the grid structure 12.

In one embodiment, an elastic telescoping structure is provided on the grid structure 12, and the elastic telescoping structure can expand and contract along the plane where the grid structure 12 is located.

In this embodiment, the grid structure 12 has the ability to expand and contract along the plane by setting an elastic expansion structure. In this way, when stress occurs, the grid structure 12 can also eliminate the stress through the expansion and contraction of the elastic stretchable structure, which avoids the appearance of wrinkles on the grid structure 12.

For example, the elastically stretchable structure may be a grid-like structure capable of elastically stretchable. This not only satisfies the ability of elastic expansion and contraction, but also has the same dustproof function as the grid structure 12.

In one example, the elastic coefficient of the elastic stretch structure is anisotropic.

The elastic coefficient of the elastic stretchable structure is anisotropic, so that the elastic stretchable structure has different elastic stretchability in different directions. For example, the elasticity coefficient on the plane where the grid structure 12 is located enables the other-row telescoping structure to meet the set telescoping capacity. The wrinkles caused by the stress on the grid structure 12 can be effectively eliminated. Protect the grid structure from being destroyed.

Moreover, the ability of elastic expansion and contraction can improve the ability of the dust-proof structure to resist external forces. Enhance the mechanical strength of the dust-proof structure.

In one example, the aperture ratios of the mesh structure 12 are different.

By controlling the aperture ratio at various places of the mesh structure 12, the mechanical strength of the mesh structure 12 is improved. In this way, the grid structure 12 can protect itself from being damaged when it is subjected to stress or external force. It can improve the yield of dust-proof structure and the reliability of installation.

For example, by controlling the aperture ratio of each location of the mesh structure 12, the strength of each location can be adjusted.

In an example, the material of the mesh structure 12 and the connecting portion 11 includes metallic glass.

The metallic glass has excellent mechanical strength, and the film body made of metallic glass can improve the mechanical strength of the mesh structure 12 and the connecting portion 11. It can improve the yield rate of manufacturing dust-proof structure and reduce the damage rate during installation.

In one example, the material of the carrier 2 includes epoxy resin.

The addition of epoxy resin to manufacture the carrier 2 can reduce the thickness of the carrier 2 on the premise of satisfying the function of the carrier 2 such as supporting the membrane body. This can contribute to the thinning of the dust-proof structure.

According to an embodiment of the present invention, a microphone packaging structure is provided. The microphone packaging structure includes the above-mentioned dust-proof structure, and the dust-proof structure is fixed on the sound hole 4 of the microphone packaging structure;

Alternatively, the dust-proof structure covers the MEMS chip 5 in the microphone packaging structure.

Generally, the microphone packaging structure includes a housing forming a accommodating cavity and a substrate fixed to the housing. The sound hole 4 can be provided on the substrate or on the housing.

In this embodiment, it may be that the dust-proof structure is fixed on the sound hole 4 from the outside of the microphone packaging structure to protect the components in the microphone packaging structure from the outside.

Alternatively, as shown in FIG. 11, the dust-proof structure is fixed on the sound hole 4 from the inside of the microphone packaging structure to protect the components of the microphone packaging structure from the inside.

Alternatively, as shown in FIG. 12, the dust-proof structure is fixed on the substrate to protect the sound hole 31 and the inside of the microphone packaging structure. The MEMS chip 5 is fixed to the dust-proof structure.

It is also possible that the dust-proof structure is fixed inside the microphone packaging structure and covers the MEMS chip 5. In this way, the MEMS chip 5 can be protected. In this structure, the dust-proof structure can be fixed on the substrate where the MEMS chip 5 is located to form a coating. It is also possible to fix the dust-proof structure on the substrate of the MEMS chip 5 to form a coating. All of the above structures can form a protective effect on the MEMS chip 5.

The microphone packaging structure can effectively prevent damage to the dust-proof structure caused by heat during the installation and use of the microphone. And it can protect the components in the microphone. For example, the MEMS chip 5 is protected from contamination by external dust and other pollutants.

According to an embodiment of the present invention, there is provided an electronic device including the aforementioned microphone packaging structure.

The electronic device includes the above-mentioned microphone packaging structure and has all the advantages of the above-mentioned microphone packaging structure. For example, the electronic equipment can be audio equipment, mobile phones, computers and other products.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims (18)

1. A dust-proof structure, which is characterized in that it comprises:

   Grid structure

   The supporting part includes a connecting part and a carrier fixed to the connecting part, the connecting part is arranged around the grid structure, a first through hole is formed in the middle of the carrier, and the grid structure covers the One end of the first through hole;

   The stress concentration part is formed on the inner side of the support part, and the stress concentration part is used to concentrate the stress of the support part.
2. The dust-proof structure according to claim 1, wherein the stress concentration part is formed inside the connecting part, and the stress concentration part surrounds the grid structure.
3. The dust-proof structure according to claim 2, wherein the stress concentration portion includes a first extension portion extending inward from the connecting portion, and a plurality of second through holes are provided on the first extension portion , A plurality of the second through holes are distributed along the circumferential direction of the first extension part.
4. The dust-proof structure according to claim 3, wherein the aperture ratio of the second through hole is less than or equal to the aperture ratio of the grid structure.
5. The dust-proof structure according to claim 3, wherein the second through hole comprises a rectangular hole or an arc-shaped hole.
6. The dust-proof structure according to claim 2, wherein the stress concentration portion includes a first extension portion extending inward from the connecting portion, and a plurality of incisions are formed on the first extension portion, each A neck connected to the first extension is formed between the two ends of the cut, the cut faces the grid structure, and the neck faces the support part; a plurality of the cuts are along the The circumferential distribution of the first extension.
7. The dust-proof structure according to claim 1, wherein the stress concentration portion is formed inside the carrier, and the stress concentration portion is arranged coaxially with the first through hole.
8. The dust-proof structure according to claim 7, wherein the stress concentration portion includes a second extension portion of the carrier extending inward, the second extension portion includes a plurality of protrusions, and a plurality of the protrusions The ridges are distributed along the circumferential direction of the second extension portion.
9. The dust-proof structure according to claim 7, characterized in that, along a cross-section perpendicular to the axial direction of the first through hole, the protrusions include rectangular protrusions with rectangular edges or arc-shaped edges. Curved convex.
10. The dust-proof structure according to claim 7, wherein the stress concentration portion includes a second extension portion extending inwardly of the carrier, and the second extension portion includes a plurality of arc-shaped walls; the arc-shaped The two ends of the wall are connected with the carrier, and the middle is hollow; a plurality of the arc-shaped walls are distributed along the circumferential direction of the second extension, and the arc-shaped wall is perpendicular to the axial direction of the first through hole The section is curved.
11. The dust-proof structure according to claim 1, wherein the stress concentration part is formed on both the connecting part and the inner side of the carrier;

    The stress concentration part inside the connecting part is arranged around the grid structure, and the stress concentration part inside the carrier is arranged coaxially with the first through hole.
12. The dust-proof structure according to any one of claims 1-11, wherein an elastic telescopic structure is provided on the grid structure, and the elastic telescopic structure can expand and contract along the plane where the grid structure is located.
13. The dust-proof structure according to claim 12, wherein the elastic coefficient of the elastic stretchable structure is anisotropic.
14. The dust-proof structure according to any one of claims 1-11, wherein the aperture ratio of the grid structure is different everywhere.
15. The dust-proof structure according to any one of claims 1-11, wherein the material of the grid structure and the connecting part comprises metallic glass.
16. The dust-proof structure according to any one of claims 1-11, wherein the material of the carrier comprises epoxy resin.
17. A microphone packaging structure, comprising the dust-proof structure according to any one of claims 1-16, the dust-proof structure being fixed on the sound hole of the microphone packaging structure;

    Alternatively, the dust-proof structure covers the MEMS chip in the microphone packaging structure.
18. An electronic device, characterized by comprising the microphone packaging structure of claim 17.

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