CN206457248U - A kind of MEMS chip - Google Patents
A kind of MEMS chip Download PDFInfo
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- CN206457248U CN206457248U CN201621461823.5U CN201621461823U CN206457248U CN 206457248 U CN206457248 U CN 206457248U CN 201621461823 U CN201621461823 U CN 201621461823U CN 206457248 U CN206457248 U CN 206457248U
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- 230000006698 induction Effects 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 230000000694 effects Effects 0.000 description 5
- 238000002955 isolation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Abstract
The utility model discloses a kind of MEMS chip.The chip includes substrate, the substrate includes induction zone, the first groove and footpath area, first groove is located at the surface where the induction zone, first groove is set around the induction zone, the footpath area passes through first groove, and the footpath area is configurable for the signal wire cabling of the chip component of the induction zone.A technical problem to be solved in the utility model is that existing MEMS chip contour structures are regular, is also easy to produce structural stress.A purposes of the present utility model is the structural stress for cutting down MEMS chip.
Description
Technical field
The utility model is related to field of micro electromechanical technology, more particularly, to a kind of MEMS chip.
Background technology
In order to comply with the minimizing of end product, lightening development trend, the more and more thinner that MEMS sensor chip is done,
Cause the influence for the structural stress that MEMS chip is subject to more and more obvious.Usual MEMS chip has well-regulated contour structures.This
Plant the release that result is unfavorable for stress so that the less reliable of product, even result in the failure of product.
Accordingly, it is desirable to provide a kind of MEMS chip new solution is to cut down stress.
Utility model content
A purpose of the present utility model is to provide a kind of new solution of MEMS chip.
According to first aspect of the present utility model, there is provided a kind of MEMS chip.The chip includes substrate, the substrate bag
Induction zone, the first groove and footpath area are included, first groove is located at the surface where the induction zone, and first groove encloses
Set around the induction zone, the footpath area passes through first groove, and the footpath area is configurable for the core of the induction zone
The signal wire cabling of piece element.
Alternatively, first groove is annular.
Alternatively, the width of first groove is 20-500um.
Alternatively, the width in the footpath area is 10-500um.
Alternatively, in addition to the connection end with the surface opposite where the induction zone, is provided with the connection end
Two grooves, second groove is corresponding with the position of the induction zone.
Alternatively, the depth of second groove is 0.2-0.5 times of thickness of the substrate.
Alternatively, second groove is circle, and the sectional area of second groove is more than the area of the induction zone.
Alternatively, in addition to for connecting the pressure release passage of second groove and external environment condition.
Alternatively, the width of the pressure release passage is 50-500um.
Alternatively, in addition to the structural area positioned at the outside of first groove, the structural area is provided with ASIC cores
Piece, the asic chip is connected with the chip component signal.
MEMS chip of the present utility model is provided with the first groove around induction zone, should so as to effectively relief features
Power.
It is of the present utility model other by referring to the drawings to the detailed description of exemplary embodiment of the present utility model
Feature and its advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiment of the present utility model, and
And be used to explain principle of the present utility model together with its explanation.
Fig. 1 is a kind of top view of MEMS chip of the utility model embodiment.
Fig. 2 is a kind of upward view of MEMS chip of the utility model embodiment.
Fig. 3 is a kind of sectional view of MEMS chip of the utility model embodiment.
Fig. 4 is the sectional view of another MEMS chip of the utility model embodiment.
In figure, 12：Induction zone；13：First groove；14：Footpath area；15：Connection end；16：Second groove；17：Pressure release passage；
18：Structural area；19：Stress isolation position；20；Asic chip；21：Chip component.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：Unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is not limited
Make scope of the present utility model.
The description only actually at least one exemplary embodiment is illustrative below, never as to this practicality
New and its application or any limitation used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
In order to solve the above-mentioned technical problem, the utility model provides a kind of MEMS chip.MEMS chip can be but not office
It is limited to MEMS microphone chip, pressure sensor chip, temperature sensor chip, gas sensor chip etc..
The chip includes substrate.Substrate includes induction zone 12, the first groove 13 and footpath area 14.First groove 13 is located at sense
The surface where area 12 is answered, the first groove 13 is set around induction zone 12.Footpath area 14 passes through the first groove 13, and footpath area 14 is configured
For the signal wire cabling of the chip component 21 for induction zone 12.
Here, substrate can be wafer, such as polysilicon handle wafer or monocrystalline silicon wafer crystal.Induction zone 12 is used to receive the external world
Signal is simultaneously converted into electric signal, and chip component 21 is provided with induction zone 12.For example, the chip component 21 includes constituting electric capacity
Positive and negative pole plate etc..First groove 13 can etch to be formed or etched by the particle beams to be formed by etching liquid.
The MEMS chip is provided with the first groove 13 around induction zone 12, so as to effectively relief features stress.
The structural stress of MEMS chip may be from all directions, and stress intensity is different.In one example,
One groove 13 is annular.First groove 13 of annular can effectively cut down the structural stress from all directions.Here,
Annular includes the first groove 13 of the annular being made up of multiple circular arcs.
Certainly, the first groove 13 is it can also be provided that other shapes, such as square ring, other regular polygon ring-types,
First groove 13 can be that continuous structure can also be discrete distribution, as long as can be set around induction zone 12.
The effect of the more big then abatement stress of the width and depth of first groove 13 is better, but the structural strength of substrate is lower；
The effect of the smaller then abatement stress of width and depth of first groove 13 is poorer, but the structural strength of substrate is higher.Therefore, Ying Jun
Weighing apparatus sets the depth and width of the first groove 13, in one example, and the width of the first groove 13 is 20-500um.The width is simultaneous
The effect of relief features stress and the structural strength of base material are turned round and look at.The depth of first groove 13 can be entered according to the thickness of base material
Row is set.
In one example, the width of the first groove 13 gradually increases from bottom to openend, this structure just with processing.
In addition to can be with cabling, footpath area 14 also acts the effect of enhancing board structure intensity.In one example, footpath area
14 width is 10-500um.The width can ensure that substrate has higher structural strength, and the first groove 13 is not interfered with again
Cut down the effect of stress.In order to meet the cabling requirement of many signal lines, in one example, footpath area 14 is multiple.It is preferred that
It is that footpath area 14 is uniformly distributed in around induction zone 12, so ensure that the structure equilibrium of substrate.For example, footpath area 14 is 4
90 ° are spaced between 2 individual and adjacent Ge Jing areas 14.
MEMS chip also includes connection end 15.Connection end 15 is used to MEMS chip being fixedly attached to other electronic equipments
On, for example, binding agent is coated with connection end 15, in use, MEMS chip is adhered on electronic equipment.Lian Jie ends can be by
It is arranged on the either side of substrate or bottom surface, as long as being easy to connection, and does not influence the performance of sensor.Connection
When, structural stress can be equally produced, the stress can be adversely affected to chip.In order to solve the technical problem.In an example
In son, the second groove 16 is additionally provided with connection end 15, the second groove 16 is corresponding with the position of induction zone 12.In the structure
In, even if producing structural stress, the structural stress can also act on stress isolation position 19, without being applied to induction zone upwards
12, so as to form the protection to induction zone 12.
Similarly, the second groove 16 can etch to be formed or etched by the particle beams to be formed by etching liquid.
In the structure shown here, structural stress together, is focused on stress isolation position 19 by the first groove 13 and the second groove 16.
So as to avoid stress to induction zone 12.
In one example, the second groove 16 is circle, and the sectional area of the second groove 16 is more than the area of induction zone 12.Circle
Shape is easy to processing, and can ensure that substrate has enough structural strengths.In the structure shown here, bonding pad surrounds the second groove 16
Set, that is, bonding pad is located at the outside of induction zone 12.So, even if producing structural stress during due to connection, the stress can be
Bonding pad is cut down, without reaching induction zone 12.In addition, the smaller then elasticity of the thickness of bonding pad is big, deformability is stronger,
So more structural stress is conducive to cut down.
Certainly, the shape of the second groove 16 can also be square, triangle, ellipse, other positive shape changeables etc., as long as energy
Play a part of relief features stress.
In one example, the depth of the second groove 16 is 0.2-0.5 times of thickness of substrate.The depth both can guarantee that base
The structural strength of plate again can effectively relief features stress.
When MEMS chip is connected in other electronic components, when being bonded in particular by binding agent, second is recessed
Groove 16 can form closing space together with electronic component.In connection procedure, or because variation of ambient temperature can cause closing
Space inside and outside differential pressure, the pressure difference can reduce bonding strength, and make substrate formation structural stress.In order to solve the technical problem,
In one example, MEMS chip also includes the pressure release passage 17 for being used to connect the second groove 16 and exterior space.For example, pressure release
One end of passage 17 is connected with the second groove 16, and the other end is passed from the sidepiece of substrate.The setting of pressure release passage 17 can be effective
Cut down closing space inside and outside differential pressure, so that ensure the bonding strength between substrate and electronic component, and abatement is made by inside and outside differential pressure
Into structural stress.Preferably, multiple pressure release passages 17 are equably provided with around the second groove 16, for example, four pressure releases
Passage 17.Further, the width of pressure release passage 17 is 50-500um.
In order to improve the integrated level of MEMS chip, in one example, MEMS chip is also included positioned at the first groove 13
The structural area 18 in outside.Structural area 18 is used to carry other electronic components.For example, structural area 18 is provided with asic chip 20,
Asic chip 20 is connected with the signal of chip component 21, for example, being connected by bonding wire or PCB signals.Asic chip 20 is used
It is amplified in by the electric signal from chip in chip component 21.MEMS chip is integrated into by this structure with asic chip 20
Together, the performance of MEMS chip is substantially increased.
Certainly, other chips can also be set in structural area 18, such as various types of environmental sensor chips.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that example above is merely to illustrate, rather than in order to limit scope of the present utility model.This
Field it is to be understood by the skilled artisans that can be in the case where not departing from scope and spirit of the present utility model, to above example
Modify.Scope of the present utility model is defined by the following claims.
Claims (10)
1. a kind of MEMS chip, it is characterised in that including substrate, the substrate include induction zone (12), the first groove (13) with
And footpath area (14), first groove (13) is located at the surface where the induction zone (12), and first groove (13) surrounds
The induction zone (12) is set, and the footpath area (14) passes through first groove (13), and the footpath area (14) is configurable for
The signal wire cabling of the chip component (21) of the induction zone (12).
2. MEMS chip according to claim 1, it is characterised in that first groove (13) is annular.
3. MEMS chip according to claim 1, it is characterised in that the width of first groove (13) is 20-
500um。
4. MEMS chip according to claim 1, it is characterised in that the width of the footpath area (14) is 10-500um.
5. MEMS chip according to claim 1, it is characterised in that also including connection end (15), in the connection end
(15) the second groove (16) is provided with, second groove (16) is corresponding with the position of the induction zone (12).
6. MEMS chip according to claim 5, it is characterised in that the depth of second groove (16) is the substrate
0.2-0.5 times of thickness.
7. MEMS chip according to claim 5, it is characterised in that second groove (16) is circle, described second
The sectional area of groove (16) is more than the area of the induction zone (12).
8. MEMS chip according to claim 5, it is characterised in that also including for connect second groove (16) with
The pressure release passage (17) of external environment condition.
9. MEMS chip according to claim 8, it is characterised in that the width of the pressure release passage (17) is 50-
500um。
10. the MEMS chip described in any one in claim 1-9, it is characterised in that also including positioned at described
The structural area (18) in the outside of one groove (13), asic chip (20), the asic chip are provided with the structural area (18)
(20) it is connected with the chip component (21) signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621461823.5U CN206457248U (en) | 2016-12-28 | 2016-12-28 | A kind of MEMS chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621461823.5U CN206457248U (en) | 2016-12-28 | 2016-12-28 | A kind of MEMS chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206457248U true CN206457248U (en) | 2017-09-01 |
Family
ID=59696619
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621461823.5U Active CN206457248U (en) | 2016-12-28 | 2016-12-28 | A kind of MEMS chip |
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| Country | Link |
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| CN (1) | CN206457248U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108358160A (en) * | 2018-04-18 | 2018-08-03 | 中国兵器工业集团第二四研究所苏州研发中心 | The MEMS device encapsulating structure of the releasable stress of lift-on/lift-off type |
| CN108769881A (en) * | 2018-06-26 | 2018-11-06 | 常州元晶电子科技有限公司 | Improve the ventilation hole structure and its manufacturing method of MEMS microphone acoustic characteristic |
| CN113148942A (en) * | 2021-04-08 | 2021-07-23 | 青岛歌尔智能传感器有限公司 | External packaging structure, MEMS sensor and electronic equipment |
-
2016
- 2016-12-28 CN CN201621461823.5U patent/CN206457248U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108358160A (en) * | 2018-04-18 | 2018-08-03 | 中国兵器工业集团第二四研究所苏州研发中心 | The MEMS device encapsulating structure of the releasable stress of lift-on/lift-off type |
| CN108358160B (en) * | 2018-04-18 | 2023-08-01 | 中国兵器工业集团第二一四研究所苏州研发中心 | Hoisting type MEMS device packaging structure capable of releasing stress |
| CN108769881A (en) * | 2018-06-26 | 2018-11-06 | 常州元晶电子科技有限公司 | Improve the ventilation hole structure and its manufacturing method of MEMS microphone acoustic characteristic |
| CN113148942A (en) * | 2021-04-08 | 2021-07-23 | 青岛歌尔智能传感器有限公司 | External packaging structure, MEMS sensor and electronic equipment |
| CN113148942B (en) * | 2021-04-08 | 2023-11-14 | 青岛歌尔智能传感器有限公司 | External packaging structure, MEMS sensor and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |