CN113148942B - External packaging structure, MEMS sensor and electronic equipment - Google Patents
External packaging structure, MEMS sensor and electronic equipment Download PDFInfo
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- CN113148942B CN113148942B CN202110380151.4A CN202110380151A CN113148942B CN 113148942 B CN113148942 B CN 113148942B CN 202110380151 A CN202110380151 A CN 202110380151A CN 113148942 B CN113148942 B CN 113148942B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 76
- 239000002184 metal Substances 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000012858 packaging process Methods 0.000 abstract description 9
- 238000005520 cutting process Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 22
- 238000005538 encapsulation Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Abstract
The invention discloses an external packaging structure, an MEMS sensor applying the external packaging structure and electronic equipment applying the MEMS sensor. The external packaging structure comprises a circuit board, wherein the circuit board is provided with a device mounting surface, the device mounting surface is provided with a packaging area, and the outer sides of four corners of the packaging area are respectively provided with a stress concentration hole. The technical scheme of the invention can improve the deformation of the circuit board caused by cutting, baking and the like in the packaging process step, thereby improving the output precision of the MEMS sensor.
Description
Technical Field
The present invention relates to the field of sensors, and in particular, to an external packaging structure, a MEMS sensor using the external packaging structure, and an electronic device using the MEMS sensor.
Background
In recent years, with the rapid development of technology, microelectromechanical systems (Micro-Electro-Mechanical System, MEMS) have grown. Among them, MEMS sensors have been widely used as detection devices in electronic devices such as mobile phones, notebook computers, tablet computers, wearable devices, and the like.
Currently, MEMS sensors mostly use a circuit board as a package substrate to realize the package of devices such as MEMS chips, ASIC chips, and the like. However, the circuit board inevitably undergoes deformation due to, for example, dicing, baking, etc. in the packaging process step, and the inability to release deformation stress further results in further aggravation of deformation, thereby affecting the output accuracy of the MEMS sensor.
Disclosure of Invention
The invention mainly aims to provide an external packaging structure, an MEMS sensor applying the external packaging structure and electronic equipment applying the MEMS sensor, and aims to improve deformation of a circuit board caused by cutting, baking and other reasons in packaging process steps, so that the output precision of the MEMS sensor is improved.
An embodiment of the invention provides an external packaging structure, which comprises a circuit board, wherein the circuit board is provided with a device mounting surface, the device mounting surface is provided with a packaging area, and the outer sides of four corners of the packaging area are respectively provided with a stress concentration hole.
In one embodiment of the present invention, the stress concentrating hole is patterned on the device mounting surface with at least two adjacently disposed straight sides.
In one embodiment of the present invention, the stress concentrating hole is formed on the device mounting surface in a pattern of an inner polygon.
In an embodiment of the present invention, a stress collecting hole is formed between two adjacent stress concentrating holes.
In an embodiment of the present invention, the stress collecting hole is a rectangular hole.
In an embodiment of the invention, the rectangular hole extends in a direction away from the packaging area and penetrates to a side edge of the circuit board.
In an embodiment of the present invention, a first metal plating layer is respectively disposed at the outer sides of the four corners of the packaging region;
and a second metal coating is arranged on the surface of the circuit board, which is opposite to the device mounting surface, at a position corresponding to the first metal coating.
In an embodiment of the present invention, the first metal plating layer extends along an outer contour surrounding direction of the encapsulation area.
An embodiment of the present invention also proposes a MEMS sensor comprising a MEMS chip and an external packaging structure;
the external packaging structure comprises a circuit board, wherein the circuit board is provided with a device mounting surface, the device mounting surface is provided with a packaging area, and the outer sides of four corners of the packaging area are respectively provided with a stress concentration hole;
the MEMS chip is arranged in the packaging area.
An embodiment of the present invention also proposes an electronic device including a MEMS sensor including a MEMS chip and an external packaging structure;
the external packaging structure comprises a circuit board, wherein the circuit board is provided with a device mounting surface, the device mounting surface is provided with a packaging area, and the outer sides of four corners of the packaging area are respectively provided with a stress concentration hole;
the MEMS chip is arranged in the packaging area.
According to the technical scheme, deformation stress in the circuit board is concentrated in the region with abrupt structural change, and stress concentration holes distributed around the packaging region become a 'stress release structure', so that the deformation stress in the circuit board is concentrated in a specific position (namely, the stress concentration holes) outside the packaging region; therefore, a packaging area for mounting and fixing devices such as MEMS chips, ASIC chips and the like is avoided, and deformation stress of the packaging area is reduced; and further, the flatness of the packaging area is greatly improved, and the interference of deformation stress on devices such as MEMS chips, ASIC chips and the like is reduced. That is, the deformation of the circuit board caused by the reasons of cutting, baking and the like in the packaging process step is improved, and the output precision of the MEMS sensor is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an embodiment of a MEMS sensor according to the present invention;
FIG. 2 is a top view of the MEMS sensor of FIG. 1 with the housing removed;
fig. 3 is a bottom view of the MEMS sensor of fig. 1.
Reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the name |
| 100 | MEMS sensor | 115 | Stress collecting hole |
| 10 | External packaging structure | 117 | First metal coating |
| 11 | Circuit board | 119 | Second metal coating |
| 111 | Device mounting surface | 13 | Housing shell |
| 1111 | Encapsulation area | 10a | Storage cavity |
| 113 | Stress concentration hole | 30 | MEMS chip |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality", "a number" or "a plurality" is at least two, such as two, three, etc., unless specifically defined otherwise.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, the technical solutions of the embodiments of the present invention may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present invention.
Currently, MEMS sensors mostly use a circuit board as a package substrate to realize the package of devices such as MEMS chips, ASIC chips, and the like. However, the circuit board inevitably undergoes deformation due to, for example, dicing, baking, etc. in the packaging process step, and the inability to release deformation stress further results in further aggravation of deformation, thereby affecting the output accuracy of the MEMS sensor.
Meanwhile, in the application process of the MEMS sensor, the common circuit board also deforms due to the influence of the change of the external environment, such as temperature, humidity, gas and the like, and the output precision of the MEMS sensor is also influenced.
In view of the above technical problems, the present invention provides an external packaging structure 10, which aims to improve the deformation of a circuit board 11 caused by the reasons of cutting, baking, etc. in the packaging process step and the deformation generated in the application process, so as to improve the output precision of the MEMS sensor 100.
It is to be understood that the external packaging structure 10 proposed by the present invention may be applied to the MEMS sensor 100, and the MEMS sensor 100 may be, but is not limited to, an inertial sensor, a pressure sensor, a geomagnetic sensor, a gas sensor, etc.
The specific structure of the external package structure 10 of the present invention will be described in the following in the specific embodiment:
as shown in fig. 1 and 2, in an embodiment of the external package structure 10 of the present invention, the external package structure 10 includes a circuit board 11, the circuit board 11 has a device mounting surface 111, the device mounting surface 111 is provided with a package region 1111, and stress concentration holes 113 are respectively formed at outer sides of four corners of the package region 1111.
In this embodiment, the encapsulation area 1111 is a rectangular area, and four corners of the rectangular area are four corners of the encapsulation area 1111. It is understood that the encapsulated area 1111 may be used to mount and secure devices such as MEMS chip 30, ASIC chip, and the like.
In the present embodiment, the circuit board 11 is a rectangular board, that is, the device mounting surface 111 of the circuit board 11 is rectangular, that is, the region constituted by the device mounting surface 111 of the circuit board 11 is a rectangular region. At this time, the package region 1111 is located at the center of the device mounting surface 111, that is, two rectangular regions formed by the package region 1111 and the device mounting surface 111 are arranged in such a manner that the centers coincide and the sides are parallel (as shown in fig. 2).
Further, in the present embodiment, the outer sides of the four corners of the encapsulation area 1111 are respectively provided with a stress concentration hole 113. At this time, since the deformation stress inside the circuit board 11 is concentrated in the region of abrupt structural change, the stress concentration holes 113 distributed around the encapsulation region 1111 become "stress release structures", so that the deformation stress inside the circuit board 11 is concentrated at specific positions (i.e., at the stress concentration holes 113) outside the encapsulation region 1111; thereby avoiding the packaging region 1111 for mounting and fixing devices such as the MEMS chip 30, ASIC chip, etc., and reducing the deformation stress of the packaging region 1111; and further greatly improves the flatness of the package region 1111, and reduces the interference of deformation stress to devices such as the MEMS chip 30, ASIC chip, etc. That is, deformation of the circuit board 11 due to, for example, dicing, baking, etc. in the packaging process step is improved, and the output accuracy of the MEMS sensor 100 is improved.
In addition, the arrangement of the stress concentration hole 113 can effectively reduce the interference of external acting force on devices such as the MEMS chip 30, the ASIC chip and the like, and gives the MEMS sensor 100 a relatively safe measuring environment, thereby further improving the measuring precision and the output precision of the MEMS sensor 100. That is, the arrangement of the stress concentration holes 113 can also greatly reduce stress interference caused by deformation of the circuit board 11 in the use process of the MEMS sensor 100, improve the output precision and long-term reliability of the MEMS sensor 100, and help the MEMS sensor 100 to improve performance indexes such as test precision, thereby expanding the application of the MEMS sensor 100 in various fields such as aircraft navigation, marine vessels, automotive electronics, consumer electronics, and wearable.
Furthermore, the technical scheme of the embodiment can be realized only by punching holes at the corresponding positions of the circuit board 11, and has the advantages of high process standardization, strong compatibility, suitability for mass production and the like. In addition, the circuit board 11 is kept to be selected without changing the material of the packaging substrate, and the method has the advantages of high compatibility with the subsequent process, low cost, good consistency and the like.
In addition, in this embodiment, the external packaging structure 10 further includes a housing 13, where the housing 13 is covered on the circuit board 11 and forms a housing cavity 10a with the circuit board 11 to house the device such as the MEMS chip 30 and the ASIC chip therein, so as to achieve better protection of the device such as the MEMS chip 30 and the ASIC chip. And, the housing 13 is made of metal material to function as electromagnetic shielding, thereby reducing the possibility that the operation performance of devices such as the MEMS chip 30, the ASIC chip, etc. is affected by the outside.
Of course, it will be appreciated that in other embodiments, the external packaging structure 10 may have other configurations, such as: the external package structure 10 includes, in addition to the aforementioned circuit board 11, a plastic sealing layer disposed on the device mounting surface 111 of the circuit board 11 to encapsulate devices such as the MEMS chip 30, ASIC chip, etc. therein, thereby achieving better protection of the devices such as the MEMS chip 30, ASIC chip, etc.
In one embodiment of the external package structure 10 of the present invention, as shown in fig. 2, the stress concentrating hole 113 is formed in a pattern on the device mounting surface 111 with at least two straight edges disposed adjacently. At this time, the connection position of the two straight edges can become a better "structure abrupt change point", so that the deformation stress is more convenient to concentrate, so as to further reduce the deformation stress of the packaging region 1111, improve the flatness of the packaging region 1111, and reduce the interference of the deformation stress on devices such as the MEMS chip 30, the ASIC chip and the like.
Of course, it will be appreciated that in other embodiments, the pattern of stress concentrating apertures 113 formed on device mounting surface 111 may also be configured in other ways, such as: the stress concentration hole 113 is formed in a polygonal pattern on the device mounting surface 111.
As shown in fig. 2, in an embodiment of the external package structure 10 of the present invention, the stress concentration holes 113 are further configured in the following manner:
the stress concentration hole 113 is formed in the device mounting surface 111 in a pattern of an inner polygon.
At this time, the pattern formed by the stress concentration holes 113 on the device mounting surface 111 has a plurality of better "structure abrupt points", so as to help better concentrate the deformation stress, so as to further reduce the deformation stress of the packaging region 1111, improve the flatness of the packaging region 1111, and reduce the interference of the deformation stress on devices such as the MEMS chip 30 and the ASIC chip.
In addition, the size of the packaging region 1111 can be expanded by adopting the configuration form of an 'inner polygon', so that the compression of the packaging region 1111 caused by the arrangement of the stress concentration holes 113 is avoided, and the subsequent packaging of the MEMS chip 30 and the like is facilitated.
As shown in fig. 2, in an embodiment of the external package structure 10 of the present invention, a stress collecting hole 115 is formed between two adjacent stress concentrating holes 113.
At this time, by further disposing the stress collecting holes 115 around the sealing region 1111, the region where the structure outside the sealing region 1111 is suddenly changed can be increased, and the stress collecting holes 115 distributed around the sealing region 1111 also become a "stress releasing structure"; so that the deformation stress inside the circuit board 11 can be better concentrated to a specific position outside the package region 1111 (i.e., at the stress concentrating hole 113 and at the stress concentrating hole 115); further, the deformation stress of the packaging region 1111 is further reduced, the flatness of the packaging region 1111 is further improved, and the interference of the deformation stress on devices such as the MEMS chip 30 and the ASIC chip is further reduced; finally, the deformation of the circuit board 11 due to the reasons such as dicing, baking, etc. in the packaging process step is better improved, and the output accuracy of the MEMS sensor 100 is further improved.
In addition, the arrangement of the stress collecting hole 115 can further reduce the interference of external acting force on devices such as the MEMS chip 30 and the ASIC chip, and provide a safer measuring environment for the MEMS sensor 100, thereby further improving the measuring precision and the output precision of the MEMS sensor 100.
Specifically, in one embodiment of the external package structure 10 of the present invention, the stress concentrating hole 115 is configured as follows, as shown in fig. 2: the stress riser 115 is a rectangular hole.
At this time, there are a plurality of "structure abrupt points" on the hole wall of the stress collecting hole 115, which can realize the concentration of the deformation stress, so as to help the deformation stress to be better concentrated outside the packaging region 1111, thereby further reducing the deformation stress of the packaging region 1111, further improving the flatness of the packaging region 1111, and further reducing the interference of the deformation stress on devices such as the MEMS chip 30, ASIC chip, etc.
Further, in an embodiment of the external package structure 10 of the present invention, the stress concentrating hole 115 is further configured as follows, as shown in fig. 2: the rectangular hole extends in a direction away from the encapsulation area 1111 and penetrates to a side of the circuit board 11.
In this way, the abrupt structural changes at the stress concentration holes 115 can be further deepened, thereby helping to better concentrate the deformation stress outside the encapsulated region 1111; meanwhile, the circuit board 11 can also be helped to better resist deformation and deformation stress caused by external acting force; finally, the deformation stress of the package region 1111 may be further reduced, the flatness of the package region 1111 may be further improved, and the interference of the deformation stress to devices such as the MEMS chip 30, ASIC chip, etc. may be further reduced.
As shown in fig. 2 and 3, in an embodiment of the external packaging structure 10 of the present invention, the outer sides of the four corners of the packaging region 1111 are respectively provided with a first metal plating layer 117;
a second metal plating layer 119 is further provided on the surface of the circuit board 11 facing away from the device mounting surface 111 at a position corresponding to the first metal plating layer 117.
At this time, by further disposing the first metal plating layer 117 around the encapsulation region 1111 and disposing the second metal plating layer 119 on the surface of the circuit board 11 facing away from the device mounting surface 111 at a position corresponding to the first metal plating layer 117, the region in which the structure outside the encapsulation region 1111 is suddenly changed can be increased, so that the deformation stress inside the circuit board 11 can be better concentrated to a specific position outside the encapsulation region 1111 (i.e., at the stress concentration hole 113, at the stress concentration hole 115, and at the metal plating layer); further, the deformation stress of the packaging region 1111 is further reduced, the flatness of the packaging region 1111 is further improved, and the interference of the deformation stress on devices such as the MEMS chip 30 and the ASIC chip is further reduced; finally, the deformation of the circuit board 11 due to the reasons such as dicing, baking, etc. in the packaging process step is better improved, and the output accuracy of the MEMS sensor 100 is further improved.
In addition, the arrangement of the first metal plating layer 117 and the second metal plating layer 119 can further reduce the interference of external acting force on devices such as the MEMS chip 30, the ASIC chip and the like, and provide a safer measuring environment for the MEMS sensor 100, thereby further improving the measuring precision and the output precision of the MEMS sensor 100.
In practical applications, the shape of the first metal plating layer 117 may be rectangular, square, diamond, triangle, etc. Similarly, the second metal plating layer 119 may have a rectangular shape, a square shape, a diamond shape, a triangle shape, or the like. The above-mentioned "a second metal plating layer 119 is further provided on the surface of the circuit board 11 facing away from the device mounting surface 111 at a position corresponding to the first metal plating layer 117" means a configuration in which the projection of each second metal plating layer 119 on the device mounting surface 111 of the circuit board 11 overlaps with one first metal plating layer 117.
As shown in fig. 2 and 3, in an embodiment of the external packaging structure 10 of the present invention, the first metal plating layer 117 extends along the outer contour surrounding direction of the packaging region 1111.
In this way, the abrupt structural change at the metal coating layer can be further deepened, so as to help the deformation stress to be better concentrated outside the packaging region 1111; meanwhile, the circuit board 11 can also be helped to better resist deformation and deformation stress caused by external acting force; finally, the deformation stress of the package region 1111 may be further reduced, the flatness of the package region 1111 may be further improved, and the interference of the deformation stress to devices such as the MEMS chip 30, ASIC chip, etc. may be further reduced.
The present invention also proposes a MEMS sensor 100, the MEMS sensor 100 comprising a MEMS chip 30 and an external packaging structure 10, the specific structure of the external packaging structure 10 being referred to the previous embodiments. Since the MEMS sensor 100 adopts all the technical solutions of all the embodiments, at least all the beneficial effects of all the technical solutions of all the embodiments are provided, and will not be described in detail herein. Wherein the MEMS chip 30 is disposed in the packaging region 1111.
It is understood that MEMS sensor 100 may be, but is not limited to, an inertial sensor, a pressure sensor, a geomagnetic sensor, a gas sensor, etc.
The invention also proposes an electronic device comprising a MEMS sensor 100 as described above, the specific structure of the MEMS sensor 100 being referred to the previous embodiments. Because the electronic device adopts all the technical schemes of all the embodiments, the electronic device at least has all the beneficial effects brought by all the technical schemes of all the embodiments, and the detailed description is omitted.
It is understood that the electronic device may be a cell phone, a notebook computer, a tablet computer, a personal digital assistant (Personal Digital Assistant, PDA), an electronic book reader, an MP3 (moving picture experts compression standard audio layer 3,Moving Picture Experts Group Audio Layer III) player, an MP4 (moving picture experts compression standard audio layer 4,Moving Picture Experts Group Audio Layer IV) player, a wearable device, a navigator, a palm game machine, etc.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (10)
1. The external packaging structure is applied to the MEMS sensor and is characterized by comprising a circuit board, wherein the circuit board is provided with a device mounting surface, the device mounting surface is provided with a packaging area, and the outer sides of four corners of the packaging area are respectively provided with a stress concentration hole penetrating through the circuit board.
2. The external packaging structure of claim 1, wherein the stress concentrating hole is patterned on the device mounting surface with at least two adjacently disposed straight sides.
3. The external packaging structure of claim 2, wherein the stress concentrating holes are formed in an inner polygon pattern on the device mounting surface.
4. The external packaging structure of claim 1, wherein a stress concentrating hole is formed between two adjacent stress concentrating holes.
5. The external packaging structure of claim 4, wherein the stress concentrating hole is a rectangular hole.
6. The external packaging structure of claim 5, wherein the rectangular hole extends in a direction away from the packaging region and penetrates to a side of the circuit board.
7. The external packaging structure according to any one of claims 1 to 6, wherein the outer sides of the four corners of the packaging region are respectively provided with a first metal plating layer;
and a second metal coating is arranged on the surface of the circuit board, which is opposite to the device mounting surface, at a position corresponding to the first metal coating.
8. The external packaging structure according to claim 7, wherein the first metal plating layer is disposed to extend along an outer contour surrounding direction of the packaging region.
9. A MEMS sensor comprising a MEMS chip and an external packaging structure according to any one of claims 1 to 8, said MEMS chip being provided in said packaging region.
10. An electronic device comprising the MEMS sensor of claim 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110380151.4A CN113148942B (en) | 2021-04-08 | 2021-04-08 | External packaging structure, MEMS sensor and electronic equipment |
| PCT/CN2021/143225 WO2022213681A1 (en) | 2021-04-08 | 2021-12-30 | External packaging structure, mems sensor, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110380151.4A CN113148942B (en) | 2021-04-08 | 2021-04-08 | External packaging structure, MEMS sensor and electronic equipment |
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| Publication Number | Publication Date |
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| CN113148942A CN113148942A (en) | 2021-07-23 |
| CN113148942B true CN113148942B (en) | 2023-11-14 |
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| CN202110380151.4A Active CN113148942B (en) | 2021-04-08 | 2021-04-08 | External packaging structure, MEMS sensor and electronic equipment |
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| WO (1) | WO2022213681A1 (en) |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206457248U (en) * | 2016-12-28 | 2017-09-01 | 歌尔科技有限公司 | A kind of MEMS chip |
| CN209065411U (en) * | 2018-08-01 | 2019-07-05 | 歌尔科技有限公司 | MEMS sensor |
| CN209841242U (en) * | 2019-05-13 | 2019-12-24 | 龙微科技无锡有限公司 | MEMS pressure sensor packaging structure with stress relief structure |
| CN111504526A (en) * | 2020-05-29 | 2020-08-07 | 西安交通大学 | Piezoresistive pressure sensor chip with stress concentration structure and preparation method thereof |
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| CN113148942A (en) | 2021-07-23 |
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