CN101827492A - Circuit board module, manufacturing method thereof and electronic device applying same - Google Patents
Circuit board module, manufacturing method thereof and electronic device applying same Download PDFInfo
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- CN101827492A CN101827492A CN200910118691A CN200910118691A CN101827492A CN 101827492 A CN101827492 A CN 101827492A CN 200910118691 A CN200910118691 A CN 200910118691A CN 200910118691 A CN200910118691 A CN 200910118691A CN 101827492 A CN101827492 A CN 101827492A
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- base plate
- circuit substrate
- chip
- circuit board
- board module
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Abstract
The invention discloses a circuit board module, a manufacturing method thereof and an electronic device applying the same. The circuit board module comprises an encapsulating structure, a circuit base plate and a plurality of welding tin balls, wherein the encapsulating structure comprises an encapsulating base plate and a chip; the chip is arranged on the encapsulating base plate; the circuit base plate is provided with at least one long hole; the encapsulating structure is arranged on a rectangular welding area of the circuit base plate; the long hole penetrates through the circuit base plate and is adjacent to a corner of the rectangular welding area; the minimum inner diameter of the long hole is within the range of +/-2 millimeters of 1/3 of a short edge of the chip; and the welding tin balls are arranged between the circuit base plate and the encapsulating base plate for electrically connecting the encapsulating structure and the circuit base plate. The invention can avoid generating the condition of cracking the welding tin balls caused by directly transferring outer force on the circuit base plate to the encapsulating structure positioned on the rectangular welding area.
Description
Technical field
The invention relates to its electronic installation of a kind of circuit board module and manufacture method thereof and application, and particularly prevent to weld its electronic installation of circuit board module that the tin ball bursts apart and manufacture method thereof and application relevant for a kind of.
Background technology
In general, circuit board module is welded in South Bridge chip or north bridge chips on the circuit board with the tin ball usually.So, when circuit board module was subjected to a external force as downward bending, this external force will directly act on chip and circuit board and make the tin ball burst apart (crack) or damage chip.
Prevent the purpose damaged in order to reach, circuit board module on the market is usually with sealing fixed chip and circuit board, to increase the rigidity between chip and the circuit board at present.Yet the crystallized ability that sealing provided is quite limited.Thus, when external force acts on the circuit board module, this external force still can act on chip and circuit board, and makes tin ball or chip damage.Moreover this kind be in the mode of sealing fixed chip and circuit board, the degree of difficulty when having reduced the production efficiency of circuit board module and having increased the dismounting chip.
Summary of the invention
The present invention is relevant for its electronic installation of a kind of circuit board module and manufacture method thereof and application, form microscler hole at the rectangle welding region that is adjacent to circuit substrate, directly be passed to the encapsulating structure that is positioned on the rectangle welding region with the external force of avoiding circuit substrate to be subjected to and caused the situation that welding tin ball bursts apart to produce.
The invention discloses a kind of circuit board module, comprise an encapsulating structure, a circuit substrate and a plurality of welding tin ball.Encapsulating structure comprises a base plate for packaging and a chip.Chip is arranged on the base plate for packaging.Circuit substrate has at least one microscler hole.Encapsulating structure is arranged at a rectangle welding region of circuit substrate.Microscler hole runs through circuit substrate and is adjacent to a corner of rectangle welding region.Welding tin ball is arranged between circuit substrate and the base plate for packaging, in order to electrically connect encapsulating structure and circuit substrate.
The invention discloses a kind of electronic installation, comprise a circuit board module and an electronic building brick.Circuit board module comprises an encapsulating structure, a circuit substrate and a plurality of welding tin ball.Encapsulating structure comprises a base plate for packaging and a chip.Chip is arranged on the base plate for packaging.Circuit substrate has at least one microscler hole.Encapsulating structure is arranged at a rectangle welding region of circuit substrate.Microscler hole runs through circuit substrate and is adjacent to a corner of rectangle welding region.Welding tin ball is arranged between circuit substrate and the base plate for packaging, in order to electrically connect encapsulating structure and circuit substrate.Electronic building brick is electrically connected at circuit board module, a signal that sends in order to receiving chip.
The invention discloses a kind of manufacture method of circuit board module, the method may further comprise the steps.At first, provide a circuit substrate.Then, an encapsulating structure is arranged at a rectangle welding region of circuit substrate.Encapsulating structure comprises a base plate for packaging and a chip.Chip is sealed on the base plate for packaging and with base plate for packaging with sealing and electrically connects.Afterwards, run through circuit substrate to form a long row hole.Microscler hole is adjacent to a corner of rectangle welding region.Secondly, electrically connect base plate for packaging and circuit substrate.
The external force that the present invention can avoid circuit substrate to be subjected to directly is passed to the encapsulating structure that is positioned on the rectangle welding region and causes the situation that welding tin ball bursts apart to produce.
For foregoing of the present invention can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Fig. 1 is the schematic diagram according to the electronic installation of a preferred embodiment of the present invention;
Fig. 2 is the profile of the electronic installation of Fig. 1 along 1A-1B;
Fig. 3 is the schematic diagram of the circuit substrate of Fig. 2 when stressed;
Fig. 4 is the schematic diagram of the circuit substrate of another embodiment;
Fig. 5 is again the schematic diagram of the circuit substrate of an embodiment;
Fig. 6 is an example of the flow chart of the method for manufacturing circuit board of preferred embodiment of the present invention.
Wherein, Reference numeral:
10: electronic installation 100: circuit board module
110: encapsulating structure 112: base plate for packaging
114: chip 116: conductive projection
118: sealing 120,220,320: circuit substrate
122,222,322: microscler hole 124,224,324: rectangle welding region
130: welding tin ball 200: electronic building brick
210: winding displacement 322a: bending place
D1: inside diameter D 2: distance
F: external force
Embodiment
Electronic installation of the present invention comprises a circuit board module and an electronic building brick.Circuit board module comprises an encapsulating structure, a circuit substrate and a plurality of welding tin ball.Encapsulating structure comprises a base plate for packaging, a chip, a plurality of conductive projection and a sealing.Chip is arranged on the base plate for packaging.Conductive projection is arranged between base plate for packaging and the chip, in order to electrically connect base plate for packaging and chip.Sealing is arranged on the base plate for packaging and covers chip.Circuit substrate has at least one microscler hole.Encapsulating structure is arranged at a rectangle welding region of circuit substrate.Microscler hole runs through circuit substrate and is adjacent to a corner of rectangle welding region.The minimum diameter of microscler hole be in chip a minor face 1/3rd the plus-minus 2mm scope in.Welding tin ball is arranged between circuit substrate and the base plate for packaging, in order to electrically connect encapsulating structure and circuit substrate.Electronic building brick is electrically connected at circuit board module, a signal that sends in order to receiving chip.Now be described as follows for an embodiment.
Please be simultaneously with reference to Fig. 1 and Fig. 2, Fig. 1 is the schematic diagram according to the electronic installation of a preferred embodiment of the present invention, Fig. 2 is the profile of the electronic installation of Fig. 1 along 1A-1B.Electronic installation 10 for example is a notebook computer, and comprises a circuit board module 100 and an electronic building brick 200.Circuit board module 100 comprises an encapsulating structure 110, a circuit substrate 120 and a plurality of welding tin ball 130.Encapsulating structure 110 comprises a base plate for packaging 112, a chip 114, a plurality of conductive projection 116 and a sealing 118.Chip 114 for example is a South Bridge chip or a north bridge chips, and is arranged on the base plate for packaging 112.Conductive projection 116 is arranged between base plate for packaging 112 and the chip 114, in order to electrically connect base plate for packaging 112 and chip 114.Sealing 118 is arranged on the base plate for packaging 112 and covers chip 114, is subjected to the pollution of dust or steam with isolated chip 114.
Please refer to Fig. 3, it is the circuit substrate of Fig. 2 schematic diagram when stressed.When circuit substrate 120 is subjected to an external force F of bending downwards, microscler hole 122 can disperse external force F.Thus, external force F will can directly not be passed to encapsulating structure 110, prevent that chip 114 is damaged and will prevent that the situation that generation welding tin ball 130 bursts apart (crack) from producing to reach.
As shown in Figure 1, in present embodiment, four microscler holes 122 are rectangular configuration, and two the microscler holes 122 in relative two corners that are adjacent to rectangle welding region 124 are with the equidirectional setting, but are not to be defined in this.In other embodiment, four microscler holes 122 are with the equidirectional setting.Moreover, though present embodiment is that example explains with the circuit substrate 120 with four microscler holes 122, be not in order to limit the present invention.Please refer to Fig. 4, it is the schematic diagram of the circuit substrate of another embodiment.Circuit substrate 220 has two microscler holes 222, and this two microscler hole 222 is respectively adjacent to relative two corners in rectangle weld zone 224.
Please refer to Fig. 5, it is again the schematic diagram of the circuit substrate of an embodiment.Four microscler holes 322 of circuit substrate 320 are L shaped structure, and a bending place 322a of microscler hole 322 is adjacent to a corner of rectangle welding region 324, further protect so that this corner to be provided.
In addition, as shown in Figure 1, in present embodiment, electronic installation 10 more comprises a winding displacement 210, in order to connect electronic building brick 200 and circuit board module 100.
Please be simultaneously with reference to Fig. 6, it is an example of the flow chart of the method for manufacturing circuit board of preferred embodiment of the present invention.At first, shown in step S610, provide circuit substrate 120.Then, shown in step S620, encapsulating structure 110 is arranged at the rectangle welding region 124 of circuit substrate 120.Encapsulating structure 110 comprises base plate for packaging 112 and chip 114.Chip 114 is sealed on the base plate for packaging 112 and with base plate for packaging 112 with sealing and electrically connects.
Afterwards, shown in step S630, run through circuit substrate 120 to form microscler hole 122.Preferably be formed at four corners of proximate circuitry substrate 120.The minimum diameter D1 of microscler hole 122 is in the scope of 1/3rd plus-minus 2mm of a minor face of chip 114, and the distance at the edge of the edge of microscler hole 122 and rectangle welding region 124 is essentially 3mm.In other embodiment, form the microscler hole of L shaped structure, and the bending place of the microscler hole of L shaped structure is adjacent to a corner of rectangle welding region.Moreover, in other embodiment, form two microscler holes in relative two corners of contiguous rectangle welding region.Secondly, shown in step S640, electrically connect base plate for packaging 112 and circuit substrate 120.
Its electronic installation of disclosed circuit board module of the above embodiment of the present invention and manufacture method thereof and application forms microscler hole at the rectangle welding region that is adjacent to circuit substrate.By this, when circuit substrate was subjected to an external force, microscler hole can disperse external force, and avoided external force to directly act on being positioned at the encapsulating structure on the rectangle welding region.Wherein, the minimum diameter of microscler hole equal or about and equal (or less than) chip a minor face 1/3rd.Thus, can avoid the welding tin ball between encapsulating structure and the circuit substrate to produce the situation of bursting apart.Microscler hole can be rectangular configuration or L shaped structure.In addition, the distance at the edge of the edge of microscler hole and rectangle welding region is essentially 3mm.
In sum, though the present invention with preferred embodiment openly as above, it is not in order to limit the present invention.The technical staff of the technical field of the invention, without departing from the spirit and scope of the present invention, when doing various changes and modification.Therefore, protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (10)
1. a circuit board module is characterized in that, comprising:
One encapsulating structure comprises: a base plate for packaging and a chip, this chip are arranged on this base plate for packaging;
One circuit substrate has at least one microscler hole, and this encapsulating structure is arranged at a rectangle welding region of this circuit substrate, and this microscler hole runs through this circuit substrate and is adjacent to a corner of this rectangle welding region; And
A plurality of welding tin balls are arranged between this circuit substrate and this base plate for packaging, in order to electrically connect this encapsulating structure and this circuit substrate.
2. circuit board module as claimed in claim 1 is characterized in that, this microscler hole is L shaped structure, and a bending place of this microscler hole is adjacent to a corner of this rectangle welding region.
3. circuit board module as claimed in claim 1 is characterized in that, this circuit substrate comprises at least two these microscler holes, and those microscler holes are respectively adjacent to two the relative corners in this rectangle welding region.
4. circuit board module as claimed in claim 1 is characterized in that, this circuit substrate comprises at least four these microscler holes, and those microscler holes are respectively adjacent to four corners in this rectangle welding region.
5. as arbitrary described circuit board module in the claim 1 to 4, it is characterized in that the minimum diameter of this microscler hole is in 2 millimeters the scope of 1/3rd plus-minuss of a bond length of this chip.
6. an electronic installation is characterized in that, comprising:
One circuit board module and an electronic building brick;
This circuit board module comprises:
One encapsulating structure comprises: a base plate for packaging and a chip, this chip are arranged on this base plate for packaging;
One circuit substrate has at least one microscler hole, and this encapsulating structure is arranged at a rectangle welding region of this circuit substrate, and this microscler hole runs through this circuit substrate and is adjacent to a corner of this rectangle welding region; And
A plurality of welding tin balls are arranged between this circuit substrate and this base plate for packaging, in order to electrically connect this encapsulating structure and this circuit substrate;
This electronic building brick is electrically connected at this circuit board module, and in order to receive the signal that this chip sends.
7. electronic installation as claimed in claim 6 is characterized in that, this microscler hole is L shaped structure, and a bending place of this microscler hole is adjacent to a corner of this rectangle welding region.
8. as claim 6 or 7 described electronic installations, it is characterized in that the minimum diameter of this microscler hole is in 2 millimeters the scope of 1/3rd plus-minuss of a bond length of this chip.
9. the manufacture method of a circuit board module is characterized in that, comprising:
One circuit substrate is provided;
One encapsulating structure is arranged at a rectangle welding region of this circuit substrate, and this encapsulating structure comprises a base plate for packaging and a chip, and this chip is sealed on this base plate for packaging and with this base plate for packaging with sealing and electrically connects;
Run through this circuit substrate to form a microscler hole, this microscler hole is adjacent to a corner of this rectangle welding region; And
Electrically connect this base plate for packaging and this circuit substrate.
10. the manufacture method of circuit board module as claimed in claim 9 is characterized in that, this microscler hole is L shaped structure, and a bending place of this microscler hole is adjacent to a corner of this rectangle welding region of this circuit substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910118691A CN101827492A (en) | 2009-03-03 | 2009-03-03 | Circuit board module, manufacturing method thereof and electronic device applying same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910118691A CN101827492A (en) | 2009-03-03 | 2009-03-03 | Circuit board module, manufacturing method thereof and electronic device applying same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101827492A true CN101827492A (en) | 2010-09-08 |
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ID=42691126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910118691A Pending CN101827492A (en) | 2009-03-03 | 2009-03-03 | Circuit board module, manufacturing method thereof and electronic device applying same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101827492A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114531772A (en) * | 2022-01-25 | 2022-05-24 | 日月光半导体制造股份有限公司 | Electronic system and drop test method thereof |
| WO2022213681A1 (en) * | 2021-04-08 | 2022-10-13 | 青岛歌尔智能传感器有限公司 | External packaging structure, mems sensor, and electronic device |
-
2009
- 2009-03-03 CN CN200910118691A patent/CN101827492A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022213681A1 (en) * | 2021-04-08 | 2022-10-13 | 青岛歌尔智能传感器有限公司 | External packaging structure, mems sensor, and electronic device |
| CN114531772A (en) * | 2022-01-25 | 2022-05-24 | 日月光半导体制造股份有限公司 | Electronic system and drop test method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100908 |