CN212740733U

CN212740733U - Packaging structure of navigation module and electronic equipment

Info

Publication number: CN212740733U
Application number: CN202021543337.4U
Authority: CN
Inventors: 王德信; 许婧
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2020-07-29
Filing date: 2020-07-29
Publication date: 2021-03-19
Anticipated expiration: 2030-07-29
Also published as: WO2022022393A1

Abstract

The utility model discloses a navigation module's packaging structure and electronic equipment. The packaging structure of the navigation module comprises a substrate, a GPS chip, an auxiliary sensor assembly and a waterproof packaging piece; the GPS chip is arranged in the substrate; the auxiliary sensor assembly is arranged on the substrate and is electrically connected with the GPS chip through a wiring in the substrate; the waterproof package is connected to the substrate and encapsulates the substrate and the auxiliary sensor assembly. The utility model discloses technical scheme navigation module's packaging structure has realized improving waterproof nature's function when reducing packaging structure's overall dimension, has further guaranteed the navigation precision.

Description

Packaging structure of navigation module and electronic equipment

Technical Field

The utility model relates to a semiconductor package technical field, in particular to packaging structure and electronic equipment of navigation module.

Background

Along with the development of science and technology, electronic product is more and more intelligent and miniaturized, receives people's favor more and more like equipment such as wearing formula intelligence bracelet or wrist-watch, and navigation module in the electronic product has become people indispensable function.

In the related art, the navigation module includes a GPS (Global Positioning System) chip, an inertial device, an acceleration sensor (Accelerometer sensor) and a Gyroscope (gyro sensor) and other related sensing chips, and in the packaging process, the above chips are directly mounted on the substrate and are packaged by a plastic package, but the navigation module packaged in the above manner has a large overall size and poor waterproof performance, and when used in a water-encountering environment, the navigation accuracy is affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a navigation module's packaging structure, improve waterproof nature when aiming at reducing packaging structure's overall dimension to guarantee the navigation precision.

In order to achieve the above object, the present invention provides a package structure of a navigation module, which includes a substrate, a GPS chip, an auxiliary sensor assembly, and a waterproof package; the GPS chip is arranged in the substrate; the auxiliary sensor assembly is arranged on the substrate and is electrically connected with the GPS chip through a wiring in the substrate; the waterproof package is connected to the substrate and encapsulates the substrate and the auxiliary sensor assembly.

The utility model discloses an embodiment, navigation module's packaging structure is still including locating the shell of base plate, the shell encloses to be established the periphery of waterproof packaging part.

In an embodiment of the present invention, the housing includes a plurality of side plates fixedly connected to the substrate, a plurality of the side plates and the substrate enclose and form an inner cavity with an opening, the waterproof package and the auxiliary sensor assembly are all located in the inner cavity, and the waterproof package and the side plates are attached to each other.

In an embodiment of the present invention, the waterproof package is a waterproof adhesive; the outer periphery of the waterproof packaging piece is provided with a shell, and the shell is a metal shell.

In an embodiment of the present invention, the auxiliary sensor assembly includes a barometric sensor, and the barometric sensor passes through the wiring in the substrate and the GPS chip electrical connection.

The utility model discloses an in the embodiment, the baroceptor includes atmospheric pressure MEMS chip and atmospheric pressure ASIC chip, the atmospheric pressure MEMS chip is located the surface of base plate, the atmospheric pressure ASIC chip is located the inside of base plate, the atmospheric pressure MEMS chip with the atmospheric pressure ASIC chip passes through wiring electricity in the base plate is connected.

The utility model discloses an in the embodiment, the auxiliary sensor subassembly still includes acceleration sensor, gyroscope and inertial device, acceleration sensor the gyroscope inertial device and the GPS chip passes through wiring electricity in the base plate is connected.

In an embodiment of the present invention, the acceleration sensor includes an acceleration MEMS chip and an acceleration ASIC chip, and the gyroscope includes a gyroscope MEMS chip and a gyroscope ASIC chip; the acceleration MEMS chip and the gyroscope MEMS chip are arranged on the surface of the substrate; the acceleration ASIC chip and the gyroscope ASIC chip are arranged inside the substrate.

In an embodiment of the present invention, the acceleration MEMS chip and the gyroscope MEMS chip are integrated into a MEMS module.

In an embodiment of the present invention, the acceleration ASIC chip and the gyroscope ASIC chip integrate an ASIC module.

In order to achieve the above object, the present invention further provides an electronic device, including the above encapsulation structure of the navigation module; the packaging structure of the navigation module comprises a substrate, a GPS chip, an auxiliary sensor assembly and a waterproof packaging piece; the GPS chip is arranged in the substrate; the auxiliary sensor assembly is arranged on the substrate and is electrically connected with the GPS chip through a wiring in the substrate; the waterproof package is connected to the substrate and encapsulates the substrate and the auxiliary sensor assembly.

The utility model discloses among the technical scheme navigation module's the packaging structure, through setting up the GPS chip in the inside of base plate, the base plate is located to the auxiliary sensor subassembly, and be connected with the GPS chip electricity through the base plate, in the time of in order to realize reducing the holistic size of navigation module packaging structure, guarantee the function that navigation module can accurate location navigation, set up waterproof packaging part and pack base plate and auxiliary sensor subassembly in this packaging structure simultaneously, in order to improve navigation module packaging structure's waterproof nature, thereby improved waterproof nature's function when having realized reducing packaging structure's overall dimension, the navigation precision has further been guaranteed.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of a packaging structure of a navigation module according to the present invention;

fig. 2 is a schematic structural view of an embodiment of the package structure of the navigation module according to the present invention, in which an acceleration ASIC chip is disposed in a substrate;

fig. 3 is a schematic structural view of the embodiment of the packaging structure of the navigation module of the present invention in which the acceleration ASIC chip and the gyroscope ASIC chip are disposed in the substrate;

fig. 4 is a schematic structural diagram of the acceleration ASIC chip and the gyroscope ASIC chip integrated module disposed inside the substrate in the embodiment of the package structure of the navigation module of the present invention;

fig. 5 is a schematic structural view of the embodiment of the packaging structure of the navigation module of the present invention in which an acceleration ASIC chip, a gyroscope ASIC chip, and a pneumatic ASIC chip are disposed in a substrate;

fig. 6 is a schematic structural diagram of the embodiment of the package structure of the navigation module of the present invention in which the acceleration ASIC chip, the gyroscope ASIC chip, and the air pressure ASIC chip integrated module are disposed inside the substrate.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a navigation module's packaging structure.

In the embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, the packaging structure of the navigation module includes a substrate 1, a GPS chip 2, an auxiliary sensor assembly and a waterproof package 3; the GPS chip 2 is arranged in the substrate 1; the auxiliary sensor assembly is arranged on the substrate 1 and is electrically connected with the GPS chip 2 through a wiring 11 in the substrate 1; a waterproof package 3 is connected to the substrate 1 and encapsulates the substrate 1 and the auxiliary sensor assembly.

The navigation module mainly provides accurate location and the effect of direction, can adopt GPS chip 2 and some other auxiliary sensor to carry out accurate location among the navigation module, and in this navigation module's packaging structure, GPS chip 2 sets up in base plate 1, has reduced navigation module's packaging structure's overall size. The auxiliary sensor assembly is arranged on the substrate 1 and is electrically connected with the GPS chip 2 through wiring in the substrate 1 to realize communication connection among the sensing chips, so that the navigation function is realized, meanwhile, the substrate 1 and the auxiliary sensor assembly are packaged through the waterproof packaging part 3 to improve the waterproof property of the packaging structure of the navigation module, and therefore the function of improving the waterproof property while reducing the whole size is realized.

It can be understood that the GPS chip 2 is disposed in the substrate 1 and can be electrically connected to the auxiliary sensor assembly through the wiring 11 in the substrate 1, so that the package structure is more compact, and optionally, the wiring 11 in the substrate 1 can be disposed on the upper and lower sides of the GPS chip 2 to play a role of shielding, thereby further improving the anti-interference capability of the navigation module.

In the practical application process, when the navigation module is applied, the auxiliary sensor assembly provides a more precise positioning function for the GPS chip 2, and optionally, the auxiliary sensor assembly may include an inertial device 8, an acceleration sensor 6, a gyroscope 7, and the like.

In order to make the waterproof effect of the packaging structure of the navigation module better, the waterproof packaging part 3 is waterproof glue.

The utility model discloses among technical scheme navigation module's the packaging structure, through setting up GPS chip 2 in base plate 1's inside, base plate 1 is located to the auxiliary sensor subassembly, and be connected with GPS chip 2 electricity through base plate 1, in the time of in order to realize reducing the holistic size of navigation module packaging structure, guarantee navigation module can accurate location navigation's function, set up waterproof packaging part 3 and encapsulate base plate 1 and auxiliary sensor subassembly in this packaging structure simultaneously, in order to improve navigation module packaging structure's waterproof nature, thereby improved waterproof nature's function when having realized reducing packaging structure's overall dimension, the navigation precision has further been guaranteed.

In order to improve the waterproof effect of the packaging structure of the navigation module, referring to fig. 1 and 2, the packaging structure of the navigation module further includes a housing 4 disposed on the substrate 1, and the housing 4 is surrounded on the periphery of the waterproof packaging member 3. It can be understood that the housing 4 is enclosed in the periphery of the waterproof package 3, and then in the process of packaging the navigation module, the housing 4 can be installed on the substrate 1, and then the waterproof package 3 is injected into a cavity formed by enclosing the housing 4 and the substrate 1, so as to realize the waterproof packaging function, and meanwhile, the housing 4 enhances the stability of the overall strength of the packaging structure.

Further, referring to fig. 1 and 2, the housing 4 includes a plurality of side plates 41 fixedly connected to the substrate 1, the side plates 41 and the substrate 1 enclose to form an inner cavity with an opening, the waterproof package 3 and the auxiliary sensor assembly are both disposed in the inner cavity, and the waterproof package 3 and the side plates 41 are attached to each other. The shell 4 includes a plurality of curb plates 41, these a plurality of curb plates 41 all are connected with base plate 1, and enclose to close with base plate 1 and form and have open inner chamber, the auxiliary sensor subassembly is located this intracavity, waterproof packaging part 3 encapsulates in this intracavity, in order to realize the function of packaging substrate 1 and auxiliary sensor subassembly, this waterproof packaging part 3 and curb plate 41 laminating simultaneously, in order to prevent to have the clearance between waterproof packaging part 3 and the curb plate 41, waterproof packaging's leakproofness has further been guaranteed, and waterproof performance is improved.

Optionally, the shell 4 is a metal shell, so that the reliability of the packaging structure is ensured while the waterproof effect is improved.

In order to further improve the navigation accuracy of the navigation module, referring to fig. 1 and fig. 2, in an embodiment of the present invention, the auxiliary sensor assembly includes an air pressure sensor 5, and the air pressure sensor 5 is electrically connected to the GPS chip 2 through a wiring 11 in the substrate 1. Baroceptor 5 plays the effect of perception external pressure, has set up baroceptor 5 among this packaging structure for atmospheric pressure when this navigation module can change and the pressure variation of different degree of depth under water through the weather change of perception external environment, atmospheric pressure change, different height above sea level, confirm the measurement of the height above sea level that corresponds, thereby realize further improving the function of navigation precision.

It can be understood that, since the air pressure sensor 5 needs to sense the external pressure change, on the basis of the above embodiment, the air pressure sensor 5 can sense the external air pressure or pressure through the deformation effect of the external pressure on the waterproof adhesive.

In an embodiment of the present invention, referring to fig. 1 and 5, the air pressure sensor 5 includes an air pressure MEMS chip 51 and an air pressure ASIC chip 52, the air pressure MEMS chip 51 is disposed on the surface of the substrate 1, the air pressure ASIC chip 52 is disposed inside the substrate 1, the air pressure MEMS chip 51 is electrically connected to the air pressure ASIC chip 52 through the wiring 11 in the substrate 1. The air pressure ASIC chip is arranged in the substrate 1, and the air pressure MEMS chip 51 is arranged on the surface of the substrate 1, so that the whole size of the packaging structure is reduced. The pneumatic MEMS chip 51 and the pneumatic ASIC chip 52 are electrically connected through the wiring 11 in the substrate 1 to ensure the normal operation of the pneumatic sensor 5.

Alternatively, the wirings 11 in the substrate 1 may be disposed on the upper and lower sides of the pneumatic ASIC chip 52 to perform a shielding function, so as to block electromagnetic interference of the pneumatic ASIC chip 52 to the pneumatic MEMS chip 51.

In an embodiment of the present invention, referring to fig. 3, fig. 4, fig. 5 and fig. 6, the auxiliary sensor assembly further includes an acceleration sensor 6, a gyroscope 7 and an inertial device 8, the acceleration sensor 6, the gyroscope 7, the inertial device 8 and the GPS chip 2 are electrically connected through a wiring 11 in the substrate 1.

The inertial device 8 is able to obtain information such as velocity, yaw angle and position in the navigation coordinate system, mainly by measuring the motion of the carrier in the inertial reference system, integrating it over time, and transforming it into the navigation coordinate system. The acceleration sensor 6 functions to measure acceleration. The gyroscope 7 functions as angular motion detection. The above-mentioned all devices are connected electrically each other to guarantee the normal navigation function of whole navigation module.

In an embodiment of the present invention, referring to fig. 2, fig. 3, fig. 5 and fig. 6, the acceleration sensor 6 includes an acceleration MEMS chip 61 and an acceleration ASIC chip 62, the acceleration MEMS chip 61 is disposed on the surface of the substrate 1, and the acceleration ASIC chip 62 is disposed inside the substrate 1. The acceleration ASIC chip 62 is disposed inside the substrate 1, so as to further reduce the overall size of the package structure, and optionally, the wires 11 inside the substrate 1 may be disposed on the upper and lower sides of the acceleration ASIC chip 62, so as to achieve the shielding and anti-interference effects.

Alternatively, on the basis of the foregoing embodiment, the air pressure ASIC chip 52 and the acceleration ASIC chip 62 are both provided in the substrate 1, and the two chips may be provided in the substrate 1 separately or may be provided in the substrate 1 together as a module.

Alternatively, on the basis of the foregoing embodiment, the air pressure MEMS chip 51 and the acceleration MEMS chip 61 are both disposed on the surface of the substrate 1, and the two chips may be disposed on the surface of the substrate 1 separately, or may be disposed on the surface of the substrate 1 together as a module.

In an embodiment of the present invention, referring to fig. 3, 4, 5 and 6, the gyroscope 7 includes a gyroscope MEMS chip 71 and a gyroscope ASIC chip 72, the gyroscope MEMS chip 71 is disposed on the surface of the substrate 1, and the gyroscope ASIC chip 72 is disposed inside the substrate 1. The gyroscope ASIC chip 72 is disposed inside the substrate 1, so that the overall size of the package structure is further reduced, and optionally, the wires 11 inside the substrate 1 are respectively disposed on the upper and lower sides of the gyroscope ASIC chip 72, so as to achieve the effect of shielding and resisting interference.

Alternatively, on the basis of the foregoing embodiment, the pneumatic ASIC chip 52, the acceleration ASIC chip 62, and the gyro ASIC chip 72 are all disposed in the substrate 1, and these three chips may be disposed in the substrate 1 respectively, or may be integrated into a module and disposed in the substrate 1 together, or of course, only two chips may be integrated in a case where one module is disposed in the substrate 1, such as the pneumatic ASIC chip 52 and the acceleration ASIC chip 62 may be integrated into one module, the acceleration ASIC chip 62 and the gyro ASIC chip 72 may be integrated into one module, or the pneumatic ASIC chip 52 and the gyro ASIC chip 72 may be integrated into one module.

Optionally, the pneumatic MEMS chip 51, the acceleration MEMS chip 61, and the gyroscope MEMS chip 71 are all disposed on the surface of the substrate 1, and the three chips may be disposed on the surface of the substrate 1 respectively, or may be integrated into a module and disposed on the surface of the substrate 1, or of course, any two chips may be integrated into a module and disposed on the surface of the substrate 1, for example, the pneumatic MEMS chip 51 and the acceleration MEMS chip 61 may be integrated into a module, the acceleration MEMS chip 61 and the gyroscope MEMS chip 71 may be integrated into a module, or the pneumatic MEMS chip 51 and the gyroscope MEMS chip 71 may be integrated into a module.

The utility model also provides an electronic equipment, this electronic equipment include navigation module's packaging structure, and this navigation module's packaging structure's concrete structure refers to above-mentioned embodiment, because this electronic equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer repeated here one by one. Optionally, the electronic device may be a wearable device such as a watch or a bracelet, or may be a mobile terminal device such as a mobile phone and a tablet computer.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A packaging structure of a navigation module is characterized by comprising:

a substrate;

the GPS chip is arranged in the substrate;

the auxiliary sensor assembly is arranged on the substrate and is electrically connected with the GPS chip through a wiring in the substrate; and

a waterproof package connected to the substrate and encapsulating the substrate and the auxiliary sensor assembly.

2. The packaging structure of a navigation module according to claim 1, further comprising a housing disposed on the substrate, wherein the housing surrounds the waterproof packaging member.

3. The packaging structure of claim 2, wherein the housing comprises a plurality of side plates fixedly connected to the substrate, the side plates and the substrate enclose an inner cavity with an opening, the waterproof packaging member and the auxiliary sensor assembly are both disposed in the inner cavity, and the waterproof packaging member is attached to the side plates.

4. The packaging structure of a navigation module according to claim 1, wherein the waterproof packaging member is a waterproof glue; the outer periphery of the waterproof packaging piece is provided with a shell, and the shell is a metal shell.

5. The packaging structure of the navigation module according to any one of claims 1 to 4, wherein the auxiliary sensor assembly includes a barometric pressure sensor electrically connected to the GPS chip through a wiring in the substrate.

6. The package structure of a navigation module according to claim 5, wherein the air pressure sensor comprises an air pressure MEMS chip and an air pressure ASIC chip, the air pressure MEMS chip is disposed on the surface of the substrate, the air pressure ASIC chip is disposed inside the substrate, and the air pressure MEMS chip and the air pressure ASIC chip are electrically connected through a wiring in the substrate.

7. The navigation module package structure of claim 6, wherein the auxiliary sensor assembly further comprises an acceleration sensor, a gyroscope, and an inertial device, the acceleration sensor, the gyroscope, the inertial device, and the GPS chip being electrically connected by wiring within the substrate.

8. The packaging structure of a navigation module of claim 7, wherein the acceleration sensor includes an acceleration MEMS chip and an acceleration ASIC chip, and the gyroscope includes a gyroscope MEMS chip and a gyroscope ASIC chip; the acceleration MEMS chip and the gyroscope MEMS chip are arranged on the surface of the substrate; the acceleration ASIC chip and the gyroscope ASIC chip are arranged inside the substrate.

9. The packaging structure of a navigation module according to claim 8, wherein the acceleration MEMS chip and the gyro MEMS chip are integrated into a MEMS module; and/or the acceleration ASIC chip and the gyroscope ASIC chip are integrated into an ASIC module.

10. An electronic device characterized by comprising a packaging structure of a navigation module according to any one of claims 1 to 9.