CN212740732U - Packaging structure of navigation module and electronic equipment - Google Patents
Packaging structure of navigation module and electronic equipment Download PDFInfo
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- CN212740732U CN212740732U CN202021543285.0U CN202021543285U CN212740732U CN 212740732 U CN212740732 U CN 212740732U CN 202021543285 U CN202021543285 U CN 202021543285U CN 212740732 U CN212740732 U CN 212740732U
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Abstract
The utility model discloses a packaging structure of a navigation module and an electronic device; the packaging structure of the navigation module comprises a substrate, a GPS chip, an air pressure sensor assembly, an auxiliary sensor assembly and a plastic package; the GPS chip is arranged in the substrate; the air pressure sensor assembly comprises an air pressure sensing chip and a waterproof layer, the air pressure sensing chip is arranged on the substrate, the waterproof layer is connected to the substrate and wraps the surface of the air pressure sensing chip, and the air pressure sensing chip senses external air pressure through the waterproof layer; the auxiliary sensor assembly is arranged on the substrate; the plastic package part is connected to the substrate and encapsulates the substrate, the auxiliary sensor assembly and the air pressure sensor assembly; the plastic package part is provided with an opening for communicating the waterproof layer with the outside. The utility model discloses technical scheme navigation module's packaging structure has realized reaching accurate navigation location, again can high waterproof function, and then has reached the effect that navigation module still can guarantee high navigation accuracy work under deep water.
Description
Technical Field
The utility model relates to a semiconductor package technical field, in particular to packaging structure and electronic equipment of navigation module.
Background
Along with the development of science and technology, electronic product is more and more intelligent and miniaturized, receives people's favor more and more like equipment such as wearing formula intelligence bracelet or wrist-watch, and navigation module in the electronic product has become people indispensable function.
Traditional navigation module includes GPS (Global Positioning System) chip, inertial device, relevant sensing chip such as acceleration sensor (Accelerometer sensor) and Gyroscope (gyro sensor) realizes the navigation Positioning function, and in order to be in harsher environment such as high altitude area or during the deep water, still have the location navigation function of higher accuracy, among the correlation technique, can add baroceptor in navigation module, but the current navigation equipment who has increased baroceptor's waterproof performance is relatively poor, can't satisfy the requirement of normal work under water.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a navigation module's packaging structure aims at improving waterproof performance to guarantee the location navigation precision of normal work under water.
In order to achieve the above object, the present invention provides a package structure of a navigation module, which includes a substrate, a GPS chip, a pressure sensor assembly, an auxiliary sensor assembly, and a plastic package; the GPS chip is arranged in the substrate; the air pressure sensor assembly comprises an air pressure sensing chip and a waterproof layer, the air pressure sensing chip is arranged on the substrate, the waterproof layer is connected to the substrate and wraps the surface of the air pressure sensing chip, and the air pressure sensing chip senses external air pressure through the waterproof layer; the auxiliary sensor assembly is arranged on the substrate; the plastic package part is connected to the substrate and encapsulates the substrate, the auxiliary sensor assembly and the air pressure sensor assembly; the plastic package part is provided with an opening for communicating the waterproof layer with the outside.
In an embodiment of the present invention, the air pressure sensor assembly further includes a housing disposed on the substrate, the housing is disposed around the waterproof layer and is encapsulated in the plastic package; the housing has an opening communicating with the opening.
The utility model discloses an in the embodiment, the shell include with a plurality of curb plates of base plate fixed connection, it is a plurality of the curb plate with the base plate encloses to close to form to have open inner chamber, the waterproof layer with the atmospheric pressure sensing chip all locates the inner chamber, just the waterproof layer with the curb plate laminating sets up.
In an embodiment of the present invention, the plastic-sealed part is connected to the waterproof layer, and partially covers the opening to form the opening.
In an embodiment of the present invention, a shell is disposed around the waterproof layer, and the shell is a metal shell;
the outer surface of the plastic package part is provided with a waterproof coating;
the waterproof layer is of a waterproof adhesive structure.
The utility model discloses an in the embodiment, the auxiliary sensor subassembly includes acceleration sensor, gyroscope and inertia device, acceleration sensor the gyroscope the inertia device the GPS chip and the atmospheric pressure sensing chip passes through wiring electricity in the base plate is connected.
In an embodiment of the present invention, the air pressure sensing chip includes an air pressure MEMS chip and an air pressure ASIC chip, the air pressure MEMS chip is disposed on the surface of the substrate, the air pressure ASIC chip is disposed inside the substrate, and the air pressure MEMS chip and the air pressure ASIC chip are electrically connected through a wiring in the substrate; the acceleration sensor comprises an acceleration MEMS chip and an acceleration ASIC chip, the acceleration MEMS chip is arranged on the surface of the substrate, and the acceleration ASIC chip is arranged in the substrate; the gyroscope comprises a gyroscope MEMS chip and a gyroscope ASIC chip, the gyroscope MEMS chip is arranged on the surface of the substrate, and the gyroscope ASIC chip is arranged in the substrate.
In an embodiment of the present invention, the acceleration MEMS chip and the gyroscope MEMS chip are integrated into a MEMS module.
In an embodiment of the present invention, the air pressure ASIC chip, the acceleration ASIC chip, and the gyroscope ASIC chip can be combined into an integrated ASIC module at will.
In an embodiment of the present invention, the air pressure ASIC chip, the acceleration ASIC chip and the gyroscope ASIC chip can be integrated into an ASIC module.
In order to achieve the above object, the present invention further provides an electronic device, including the above encapsulation structure of the navigation module; the packaging structure of the navigation module comprises a substrate, a GPS chip, an air pressure sensor assembly, an auxiliary sensor assembly and a plastic package; the GPS chip is arranged in the substrate; the air pressure sensor assembly comprises an air pressure sensing chip and a waterproof layer, the air pressure sensing chip is arranged on the substrate, the waterproof layer is connected to the substrate and wraps the surface of the air pressure sensing chip, and the air pressure sensing chip senses external air pressure through the waterproof layer; the auxiliary sensor assembly is arranged on the substrate; the plastic package part is connected to the substrate and encapsulates the substrate, the auxiliary sensor assembly and the air pressure sensor assembly; the plastic package part is provided with an opening for communicating the waterproof layer with the outside.
The utility model discloses in the packaging structure of technical scheme navigation module, through setting up the GPS chip in the base plate, the auxiliary sensor subassembly is located the base plate to realize basic navigation positioning function, simultaneously through setting up the atmospheric pressure sensing subassembly, in order to improve the precision of navigation positioning, the atmospheric pressure sensing subassembly includes atmospheric pressure sensing chip and wraps up the waterproof layer on atmospheric pressure sensing chip surface, in order to realize the waterproof function of atmospheric pressure sensing chip, and the atmospheric pressure sensing chip can pass through the atmospheric pressure of waterproof layer perception external; the substrate, the auxiliary sensor assembly and the air pressure sensor assembly are packaged with the plastic package part, so that the whole waterproof protection effect of the packaging structure is achieved, meanwhile, the opening for communicating the waterproof layer with the outside is formed in the plastic package part, the air pressure sensing chip can be guaranteed to smoothly sense the pressure of the outside environment, accurate navigation and positioning can be achieved, the high-waterproof function can be achieved, and the effect that the navigation module can still guarantee high-navigation-precision work under deep water is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a packaging structure of a navigation module according to the present invention;
fig. 2 is a schematic structural view of an embodiment of the present invention in which a pneumatic ASIC chip is disposed in a substrate;
fig. 3 is a schematic structural diagram of an acceleration ASIC chip disposed in a substrate according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of the embodiment of the present invention in which the gyroscope ASIC chip is disposed in the substrate;
fig. 5 is a schematic structural view of the embodiment of the present invention in which the air pressure ASIC chip and the gyroscope ASIC chip are disposed in the substrate;
fig. 6 is a schematic structural diagram of the embodiment of the present invention in which the acceleration ASIC chip, the air pressure ASIC chip, and the gyroscope ASIC chip are disposed in the substrate.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
11 | |
| 2 | |
3 | Air |
| 31 | |
32 | Pneumatic ASIC |
| 4 | Water- |
5 | |
| 51 | Opening of the |
6 | |
| 61 | |
7 | Water- |
| 8 | |
81 | |
| 82 | Acceleration ASIC |
9 | Gyroscope |
| 91 | Gyroscope MEMS |
92 | Gyroscope ASIC chip |
| A | Inertial device |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a navigation module's packaging structure.
In the embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 3, the package structure of the navigation module includes a substrate 1, a GPS chip 2, an air pressure sensor assembly, an auxiliary sensor chip and a plastic package 5; the GPS chip 2 is arranged in the substrate 1; the air pressure sensor assembly comprises an air pressure sensing chip 3 and a waterproof layer 4, the air pressure sensing chip 3 is arranged on the substrate 1, the waterproof layer 4 is connected to the substrate 1 and wraps the surface of the air pressure sensing chip 3, and the air pressure sensing chip 3 senses external air pressure through the waterproof layer 4; the auxiliary sensor assembly is arranged on the substrate 1; the plastic package piece 5 is connected to the substrate 1 and encapsulates the substrate 1, the auxiliary sensor assembly and the air pressure sensor assembly; the plastic package 5 is provided with an opening 51 for communicating the waterproof layer 4 with the outside.
The navigation module mainly provides accurate positioning and the effect of direction, can adopt GPS chip 2 and some other auxiliary sensor to carry out accurate location in the navigation module, still have higher location navigation accuracy in order to can be under the higher or deep water of height above sea level, can set up the baroceptor subassembly in the packaging structure of navigation module, make this navigation module can be through the weather variation of perception external environment, atmospheric pressure change when different height above sea level and the pressure variation when the different degree of depth under water, confirm the measurement of corresponding height above sea level, thereby realize further improving the function of navigation accuracy.
In the packaging structure of the navigation module, the GPS chip 2 is arranged in the substrate 1, the auxiliary sensor component is arranged on the substrate 1, and the auxiliary sensor component is electrically connected with the GPS chip 2 through the wiring 11 in the substrate 1, so that the basic positioning and navigation functions are ensured. The air pressure sensor assembly comprises an air pressure sensing chip 3 and a waterproof layer 4 wrapped on the surface of the air pressure sensing chip 3, and the waterproof layer 4 plays a role in protecting the air pressure sensing chip 3 so as to achieve a waterproof effect. On this basis, this packaging structure gets up auxiliary sensor subassembly and baroceptor subassembly encapsulation through plastic-sealed piece 5 to reach the inside holistic water-proof effects of protection, simultaneously, this plastic-sealed piece 5 is offered and is used for communicateing waterproof layer 4 and external opening 51, so that baroceptor chip 3 can communicate with the external world, thereby can perceive the pressure variation in the external environment smoothly, and then make navigation positioning function more accurate.
It can be understood that the waterproof layer 4 wrapped on the surface of the air pressure sensing chip 3 is waterproof glue, and the air pressure sensing chip 3 can sense the external air pressure or pressure through the deformation of the waterproof glue by the external pressure. The waterproof glue can play waterproof effect simultaneously, can not feel external pressure to atmospheric pressure sensing chip 3 and produce the influence, so plastic-sealed piece 5 sets up opening 51 when the encapsulation in order to let the waterproof layer 4 of parcel on atmospheric pressure sensing chip 3 expose to guaranteed navigation module's packaging structure's holistic waterproof performance, can also guarantee atmospheric pressure sensing chip 3's normal work simultaneously. Optionally, the waterproof glue may be PS glue, PC glue, PA glue, PP glue, PE glue, rubber glue, polyurethane glue, or the like.
In the practical application process, the air pressure sensing chip 3 can be wrapped by the waterproof layer 4, then the whole air pressure sensing chip is packaged in a plastic package mode, so that a device pasted on the surface of the substrate 1 is wrapped, external interference is avoided, then the plastic package part 5 corresponding to the air pressure sensing chip 3 is drilled, the waterproof layer 4 is exposed, and the manufacturing process of the packaging structure of the navigation module is completed.
In the packaging structure of the navigation module of the technical scheme of the utility model, the GPS chip 2 is arranged in the substrate 1, the auxiliary sensor assembly is arranged on the substrate 1 to realize the basic navigation positioning function, and meanwhile, the air pressure sensing assembly is arranged to improve the navigation positioning precision, and comprises an air pressure sensing chip 3 and a waterproof layer 4 wrapped on the surface of the air pressure sensing chip 3 to realize the waterproof function of the air pressure sensing chip 3; the substrate 1, the auxiliary sensor assembly and the air pressure sensor assembly are packaged with the plastic package member 5, so that the whole waterproof protection effect of the packaging structure is achieved, meanwhile, the opening 51 which is communicated with the waterproof layer 4 and the outside is formed in the plastic package member 5, the air pressure sensing chip 3 can be guaranteed to smoothly sense the pressure of the outside environment, the accurate navigation and positioning can be achieved, the high-waterproof function can be achieved, and the effect that the navigation module can still guarantee high-navigation-precision work in deep water is achieved.
In order to make the waterproof function of the encapsulation structure of the navigation module more stable and reliable, referring to fig. 1, fig. 2 and fig. 3, in an embodiment of the present invention, the air pressure sensor assembly further includes a housing 6 disposed on the substrate 1, the housing 6 is enclosed around the waterproof layer 4 and encapsulated in the plastic package 5; the housing 6 has an opening communicating with the opening 51.
The shell 6 plays a supporting role, so that the structure of the air pressure sensor assembly is more stable and reliable. It can be understood that, the shell 6 is installed first, and then the waterproof layer 4 is filled in the shell 6, and the shell 6 plays a role in blocking the waterproof layer 4, so as to prevent the waterproof layer 4 from shunting to other places in the filling process, and the effect of wrapping the air pressure sensing chip 3 cannot be achieved. The shell 6 is encapsulated in the plastic package 5, and the waterproof performance is further improved.
Optionally, referring to fig. 1, fig. 2, and fig. 3, the housing 6 includes a plurality of side plates 61 fixedly connected to the substrate 1, the side plates 61 and the substrate 1 enclose to form an inner cavity with an opening, the waterproof layer 4 and the air pressure sensing chip 3 are both disposed in the inner cavity, and the waterproof layer 4 and the side plates 61 are attached to each other. The air pressure sensing chip 3 and the waterproof layer 4 are arranged in the inner cavity enclosed by the side plates 61 and the substrate 1, and the waterproof layer 4 is exposed outside the opening, so that the normal work of the air pressure sensing chip 3 can be guaranteed, and the function of higher waterproof performance is realized.
Alternatively, referring to fig. 1, 2 and 3, the molding 5 is partially covered to open to form an opening 51. And part of the plastic package part 5 covers the opening, so that the waterproof layer 4 is wrapped by the part of the plastic package part 5, and the waterproof performance of the waterproof layer 4 is further enhanced.
Optionally, the shell 6 is a metal shell, so that the reliability of the air pressure sensor assembly is guaranteed while the waterproof effect is improved.
In order to further improve the waterproof performance of the packaging structure of the navigation module, referring to fig. 3, 4 and 5, the outer surface of the plastic package 5 is provided with a waterproof coating 7. Alternatively, the waterproof coating 7 may be a stainless steel coating, which serves to further improve the waterproof effect and the structural reliability.
In an embodiment of the present invention, referring to fig. 1, fig. 2 and fig. 3, the auxiliary sensor assembly includes an acceleration sensor 8, a gyroscope 9 and an inertial device a, the acceleration sensor 8 the gyroscope 9 the inertial device a the GPS chip 2 and the air pressure sensing chip 3 are connected through the wiring 11 in the substrate 1.
The inertial device a can obtain information such as velocity, yaw angle and position in the navigation coordinate system mainly by measuring the motion of the carrier in the inertial reference system, integrating the motion with time, and transforming the motion into the navigation coordinate system. The acceleration sensor 8 functions to measure acceleration. The gyroscope 9 functions as angular motion detection. The air pressure sensing chip 3 plays a role in sensing the pressure change of the external environment. The above components are electrically connected with each other to ensure the normal navigation function of the whole navigation module and further improve the navigation positioning precision.
In an embodiment of the present invention, referring to fig. 2, fig. 5 and fig. 6, the air pressure sensing chip 3 includes an air pressure MEMS chip 31 and an air pressure ASIC chip 32, the air pressure MEMS chip 31 is located on the surface of the substrate 1, the air pressure ASIC chip 32 is located inside the substrate 1, the air pressure MEMS chip 31 and the air pressure ASIC chip 32 pass through the wiring 11 in the substrate 1 is electrically connected. The air pressure ASIC chip 32 is arranged inside the substrate 1, and the air pressure MEMS chip 31 is arranged on the surface of the substrate 1, so that the whole size of the packaging structure is reduced. The air pressure MEMS chip 31 and the air pressure ASIC chip 32 are electrically connected through the wiring 11 in the substrate 1 to ensure the normal operation of the air pressure sensing chip 3.
Alternatively, the wirings 11 in the substrate 1 may be disposed on the upper and lower sides of the pneumatic ASIC chip 32 to perform a shielding function, so as to block electromagnetic interference of the pneumatic ASIC chip 32 to the pneumatic MEMS chip 31.
In an embodiment of the present invention, referring to fig. 3 and 6, the acceleration sensor 8 includes an acceleration MEMS chip 81 and an acceleration ASIC chip 82, the acceleration MEMS chip 81 is disposed on the surface of the substrate 1, and the acceleration ASIC chip 82 is disposed inside the substrate 1. The acceleration ASIC chip 82 is disposed inside the substrate 1, so as to further reduce the overall size of the package structure, and optionally, the wires 11 inside the substrate 1 may be disposed on the upper and lower sides of the acceleration ASIC chip 82, so as to achieve the effect of shielding and resisting interference.
In an embodiment of the present invention, referring to fig. 4, 5 and 6, the gyroscope 9 includes a gyroscope MEMS chip 91 and a gyroscope ASIC chip 92, the gyroscope MEMS chip 91 is disposed on the surface of the substrate 1, and the gyroscope ASIC chip 92 is disposed inside the substrate 1. The gyroscope ASIC chip 92 is disposed inside the substrate 1, so that the overall size of the package structure is further reduced, and optionally, the wires 11 inside the substrate 1 are respectively disposed on the upper side and the lower side of the gyroscope ASIC chip 92, so as to achieve the effect of shielding and resisting interference.
Alternatively, on the basis of the above-described embodiment, the acceleration MEMS chip 81 and the gyro MEMS chip 91 are both provided on the surface of the substrate 1, and the two chips may be provided on the surface of the substrate 1 separately or may be provided on the surface of the substrate 1 as a single MEMS module.
Optionally, on the basis of the foregoing embodiment, the air pressure ASIC chip 32, the acceleration ASIC chip 82, and the gyroscope ASIC chip 92 are all disposed in the substrate 1, and then the three chips may be disposed in the substrate 1 respectively, or may be integrated into a module and disposed in the substrate 1 together, or of course, a case where only two chips are disposed in the substrate 1 as a module may also be integrated, for example, the air pressure ASIC chip 32 and the acceleration ASIC chip 82 may be integrated into a module, the acceleration ASIC chip 82 and the gyroscope ASIC chip 92 may be integrated into a module, or the air pressure ASIC chip 32 and the gyroscope ASIC chip 92 may be integrated into a module.
The utility model also provides an electronic equipment, this electronic equipment include navigation module's packaging structure, and this navigation module's packaging structure's concrete structure refers to above-mentioned embodiment, because this electronic equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer repeated here one by one. Optionally, the electronic device may be a wearable device such as a watch or a bracelet, or may be a mobile terminal device such as a mobile phone and a tablet computer.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A packaging structure of a navigation module is characterized by comprising:
a substrate;
the GPS chip is arranged in the substrate;
the air pressure sensor assembly comprises an air pressure sensing chip and a waterproof layer, the air pressure sensing chip is arranged on the substrate, the waterproof layer is connected to the substrate and wraps the surface of the air pressure sensing chip, and the air pressure sensing chip senses external air pressure through the waterproof layer;
the auxiliary sensor assembly is arranged on the substrate; and
the plastic package is connected to the substrate and encapsulates the substrate, the auxiliary sensor assembly and the air pressure sensor assembly; the plastic package part is provided with an opening for communicating the waterproof layer with the outside.
2. The packaging structure of the navigation module according to claim 1, wherein the air pressure sensor assembly further comprises a housing disposed on the substrate, the housing is disposed around the waterproof layer and is packaged in the plastic package; the housing has an opening communicating with the opening.
3. The package structure of a navigation module according to claim 2, wherein the housing includes a plurality of side plates fixedly connected to the substrate, the plurality of side plates and the substrate enclose an inner cavity having the opening, the waterproof layer and the air pressure sensing chip are both disposed in the inner cavity, and the waterproof layer is attached to the side plates.
4. The packaging structure of claim 3, wherein the molding member is connected to the waterproof layer and partially covers the opening to form the opening.
5. The encapsulation structure of the navigation module according to any one of claims 1 to 4, wherein a shell is provided around the waterproof layer, and the shell is a metal shell;
the outer surface of the plastic package part is provided with a waterproof coating;
the waterproof layer is of a waterproof adhesive structure.
6. The navigation module package structure of any one of claims 1 to 4, wherein the auxiliary sensor assembly includes an acceleration sensor, a gyroscope, and an inertial device, and the acceleration sensor, the gyroscope, the inertial device, the GPS chip, and the air pressure sensing chip are electrically connected by wiring within the substrate.
7. The package structure of the navigation module of claim 6, wherein the air pressure sensing chip comprises an air pressure MEMS chip and an air pressure ASIC chip, the air pressure MEMS chip is disposed on the surface of the substrate, the air pressure ASIC chip is disposed inside the substrate, and the air pressure MEMS chip and the air pressure ASIC chip are electrically connected through a wiring in the substrate;
the acceleration sensor comprises an acceleration MEMS chip and an acceleration ASIC chip, the acceleration MEMS chip is arranged on the surface of the substrate, and the acceleration ASIC chip is arranged in the substrate;
the gyroscope comprises a gyroscope MEMS chip and a gyroscope ASIC chip, the gyroscope MEMS chip is arranged on the surface of the substrate, and the gyroscope ASIC chip is arranged in the substrate.
8. The packaging structure of a navigation module of claim 7, wherein the acceleration MEMS chip and the gyroscope MEMS chip are integrated into a MEMS module.
9. The navigation module package structure of claim 7, wherein any two of the barometric ASIC chip, the acceleration ASIC chip, and the gyroscope ASIC chip are integrated into an ASIC module;
or the air pressure ASIC chip, the acceleration ASIC chip and the gyroscope ASIC chip are integrated into an ASIC module.
10. An electronic device characterized by comprising a packaging structure of a navigation module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021543285.0U CN212740732U (en) | 2020-07-29 | 2020-07-29 | Packaging structure of navigation module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021543285.0U CN212740732U (en) | 2020-07-29 | 2020-07-29 | Packaging structure of navigation module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212740732U true CN212740732U (en) | 2021-03-19 |
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ID=75024122
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021543285.0U Active CN212740732U (en) | 2020-07-29 | 2020-07-29 | Packaging structure of navigation module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212740732U (en) |
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2020
- 2020-07-29 CN CN202021543285.0U patent/CN212740732U/en active Active
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