JP2017194401A - Sensor device, portable equipment, electronic apparatus, and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor device capable of reducing the possibility of a reduction in detection characteristics of a sensor element.SOLUTION: A sensor device 1 comprises: a sensor element 10; an IC chip 60; a substrate 20 having an opening 25; a container 30 having an internal space 35 where the sensor element 10, the IC chip 60 and at least the opening 25 of the substrate 20 are disposed; and a filling member 40 being filled into the internal space 35 and covering the sensor element 10, the IC chip 60 and at least the opening 25 of the substrate 20. The sensor element 10 and the IC chip 60 are disposed so as to mutually have a first gap S1 in the opening 25 in a plan view. The first gap S1 overlaps with a center portion of an inner bottom surface 34 of the container 30 in the plan view. On the inner bottom surface 34, a projection portion 50 projecting at an internal space 35 side is disposed. The projection portion 50 overlaps with the first gap S1 in the plan view.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a sensor device, a portable device including the sensor device, an electronic device, and a moving object.

Conventionally, as a sensor device, a physical quantity sensor chip, an IC chip, a package having an internal space for housing the physical quantity sensor chip and the IC chip, a first wire connecting the package and the physical quantity sensor chip, A physical quantity sensor having a configuration in which the physical quantity sensor chip and the IC chip are anchored in the internal space by the first wire and the second wire, respectively. It is known (see, for example, Patent Document 1).
The physical quantity sensor includes a flexible wiring board at least partially protruding from the package in the internal space, and the first wire and the second wire are connected to the flexible wiring board in the internal space. .
In the physical quantity sensor, the internal space is filled with a gel-like filler, and the physical quantity sensor chip and the IC chip are covered with the filler together with the flexible wiring board, the first wire, and the second wire. .

JP-A-2006-3994

The physical quantity sensor has the following problems when the physical quantity sensor chip and the IC chip are arranged side by side in the opening of the flexible wiring board in a plan view in order to reduce the thickness, for example.
(1) The filler shrinks due to heating during the curing process of the filler, and a dent (sink) is generated in a portion between the physical quantity sensor chip and the IC chip corresponding to the central portion of the internal space in plan view. In some cases, the dent may go around to the detection unit (for example, the pressure receiving unit) of the physical quantity sensor chip.
In order to avoid the wraparound of the dent, it is necessary to fill a large amount of the filler and increase the distance from the upper surface of the physical quantity sensor chip to the upper surface of the filler.
Due to the large amount of filling of the filler, the physical quantity sensor is likely to hinder the propagation of pressure to the physical quantity sensor chip, and the detection characteristics may be deteriorated.
(2) During vacuum defoaming of the filler, a plurality of bubbles generated between the flexible wiring board, the physical quantity sensor chip and the IC chip and the inner bottom surface (inner bottom face) of the package are physical quantity sensor chips. A part of the filler may be lifted by being integrated while gathering in a gap between the IC chip and the IC chip, becoming large bubbles and rising toward the opening of the package.
Furthermore, in the physical quantity sensor, there is a risk that the lifted filler may jump out of the package from the opening of the package when the bubbles burst.
As a result, the physical quantity sensor may be difficult or impossible to measure the physical sensor chip.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A sensor device according to this application example includes a sensor element, an IC chip, a substrate having an opening, the sensor element, the IC chip, and at least the opening of the substrate. And a filling member that fills the internal space and covers the sensor element, the IC chip, and at least the opening of the substrate, the sensor element and the IC The chips are arranged side by side with a first gap in the opening in a plan view, and the first gap overlaps with a central portion of the inner bottom surface of the container in a plan view. Is characterized in that a protruding portion that protrudes toward the internal space is disposed, and the protruding portion overlaps the first gap in plan view.

According to this application example, the sensor device is filled with the filling member (corresponding to the filling material) filled on the protrusion along the shape of the protrusion by the protrusion overlapping the first gap in plan view. Therefore, for example, a recess formed in the first gap between the sensor element (corresponding to a physical quantity sensor chip) and the IC chip due to the shrinkage of the filling member during the curing process of the filling member is formed as a protrusion. It can be made smaller than when there is no.
Thereby, the sensor device can reduce the possibility that the detection characteristics of the sensor element are deteriorated due to the large amount of filling of the filling member as described above.

  Application Example 2 In the sensor device according to the application example described above, the sensor element has a plurality of sensor element end portions, and faces the IC chip between the opening and the sensor element end portions in a plan view. The IC chip has a plurality of IC chip end portions except for the sensor element end portion on the side to be connected, and the opening portion and the IC chip end portion in plan view. The first gap is disposed with a third gap except for the end of the IC chip on the side facing the sensor element. The distance of the first gap is the distance between the second gap and the second gap. It is preferable that the distance is larger than the distance of the third gap.

According to the application example, since the distance of the first gap is larger than the distance of the second gap and the distance of the third gap, for example, in the filling member during vacuum defoaming Bubbles generated between the substrate, the sensor element, the IC chip, and the inner bottom surface of the container gather near the first gap.
The collected bubbles are difficult to pass through the filling member in the vicinity of the first gap by the protrusions arranged so as to overlap with the first gap in plan view, and thus are prevented from being integrated into a large bubble. The
Thereby, the sensor device can reduce a possibility that the filling member is lifted by a large bubble and the bubble bursts and jumps out of the container (corresponding to the package).

  Application Example 3 In the sensor device according to the application example described above, the distance from the inner bottom surface to the apex of the protrusion is smaller than the distance from the inner bottom surface to the bottom surface facing the inner bottom surface of the sensor element. Is preferred.

According to the application example, since the distance from the inner bottom surface to the top of the protrusion is smaller than the distance from the inner bottom surface to the bottom surface facing the inner bottom surface of the sensor element, the sensor device has the first from the inner bottom surface side. The passage to the gap can be narrowed appropriately.
Thereby, the sensor device can inhibit, for example, the bubbles gathered from the inner bottom surface to the vicinity of the first gap from being integrated into a large bubble during vacuum defoaming.
As a result, the sensor device can reduce the possibility that the filling member lifted by the bubbles jumps out of the container when the bubbles burst.

  Application Example 4 In the sensor device according to the application example described above, the outer periphery of the protrusion in plan view forms the first gap, and the sensor element end of the sensor element and the IC chip end of the IC chip. It is preferable to cross at least one of the parts.

According to the application example described above, in the sensor device, the outer periphery of the protrusion intersects at least one of the sensor element end of the sensor element and the IC chip end of the IC chip forming the first gap in plan view. Therefore, for example, if a recess is generated in the first gap due to the hardening process of the filling member and the contour of the recess intersects the outer periphery of the protrusion, the outer periphery of the protrusion through the recess in plan view. Will appear distorted.
Thereby, the sensor device can detect a dent having a size that affects the detection characteristics of the sensor element, for example, by an image recognition device or the like.

  Application Example 5 A sensor device according to this application example includes a sensor element, an IC chip, a substrate having an opening, the sensor element, the IC chip, and at least the opening of the substrate. And a filling member that fills the internal space and covers the sensor element, the IC chip, and at least the opening of the substrate, the sensor element and the IC The chip is arranged side by side with a first gap in the opening in a plan view, the sensor element has a plurality of sensor element ends, and the opening and the sensor element end in a plan view. The sensor chip is disposed with a second gap, except for the sensor element end on the side facing the IC chip, and the IC chip has a plurality of IC chip end portions in plan view. so Between the opening portion and the IC chip end portion, except for the IC chip end portion on the side facing the sensor element, a third gap is disposed, and the distance between the second gap and At least one of the distances of the third gap is larger than the distance of the first gap, and a protruding portion that protrudes toward the inner space is disposed on the inner bottom surface of the container. The second gap and the third gap are arranged at a position overlapping with at least one of the second gap and the third gap larger than the first gap.

According to this application example, in the sensor device, the protrusion disposed on the inner bottom surface of the container has at least one of the second gap and the third gap having a distance larger than the first gap in plan view. Since they are arranged at the overlapping positions, for example, during vacuum defoaming, bubbles that have gathered from the inner bottom surface to the vicinity of at least one of the second gap and the third gap are integrated into a large bubble. Can be inhibited.
Thereby, the sensor device can reduce a possibility that the filling member lifted by the bubbles may jump out of the container when the bubbles burst.

  Application Example 6 A mobile device according to this application example includes the sensor device according to any one of the application examples described above.

  According to this application example, since the mobile device includes the sensor device described in any one of the above application examples, the effect described in any one of the above application examples is achieved, and excellent performance is exhibited. can do.

  Application Example 7 An electronic apparatus according to this application example includes the sensor device according to any one of the application examples described above.

  According to this application example, since the electronic device includes the sensor device described in any one of the above application examples, the effect described in any one of the above application examples is achieved, and excellent performance is exhibited. can do.

  Application Example 8 A moving object according to this application example includes the sensor device according to any one of the application examples described above.

  According to this application example, since the mobile body includes the sensor device described in any one of the above application examples, the effect described in any one of the above application examples is achieved, and excellent performance is exhibited. can do.

The schematic plan view which shows schematic structure of the sensor device of 1st Embodiment. Sectional drawing in the AA of FIG. The schematic plan view which shows schematic structure of a sensor element. Sectional drawing in the BB line of FIG. The circuit diagram for pressure detection of a sensor element. The schematic plan view which shows schematic structure of the sensor device of the modification of 1st Embodiment. Sectional drawing in the AA of FIG. The schematic plan view which shows schematic structure of the sensor device of 2nd Embodiment. Sectional drawing in the DD line | wire of FIG. The model perspective view which shows the altimeter as an example of the portable apparatus provided with the sensor device. The schematic front view which shows the navigation system as an example of the electronic device provided with the sensor device. The model perspective view which shows the motor vehicle as an example of the mobile body provided with the sensor device.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. Also, not all of the configurations described below are essential constituent requirements of the present invention.

(First embodiment)
First, the sensor device according to the first embodiment will be described.
FIG. 1 is a schematic diagram illustrating a schematic configuration of the sensor device according to the first embodiment, and is a plan view of the sensor device viewed from above the opening of the device. 2 is a cross-sectional view taken along line AA in FIG. In the following drawings including FIG. 1 and FIG. 2, some components are omitted in the plan view for convenience. Moreover, in each drawing, the dimensional ratio of each component is different from the actual for easy understanding.

  As shown in FIGS. 1 and 2, the sensor device 1 according to the first embodiment includes a sensor element 10, an IC chip 60, a substrate 20 having an opening 25, a sensor element 10, an IC chip 60, and a substrate. A container 30 having an internal space 35 in which at least a portion having an opening 25 is disposed, the internal space 35 is filled, the sensor element 10, the IC chip 60, and at least the opening 25 of the substrate 20. And a filling member 40 for covering.

The sensor element 10 and the IC chip 60 of the sensor device 1 are arranged side by side with a first gap S1 in the opening 25 of the substrate 20 in plan view. The first gap S1 overlaps the central portion (portion including the center C1) of the inner bottom surface (inner bottom surface) 34 of the container 30 in plan view. The inner bottom surface 34 is provided with a protruding portion 50 protruding toward the inner space 35, and the protruding portion 50 overlaps the first gap S1 in plan view.
Hereinafter, each component will be described in detail.

<Container>
The container 30 includes a first container 31 having an opening 33 and a second container 32 located on the opposite side of the first container 31 from the opening 33 side. The first container 31 is formed in a cylindrical shape on the opening 33 side, and the second container 32 side following the opening 33 is formed in a substantially square cylindrical shape. The second container 32 is formed in a substantially square tray shape having a recess.
Inside the container 30, an internal space 35 in which the sensor element 10, the IC chip 60, and at least the opening 25 of the substrate 20 are disposed is formed.

On the inner bottom surface 34 of the second container 32, a protrusion 50 that protrudes toward the internal space 35 is disposed.
The protrusion 50 protrudes in a substantially hemispherical shape from the center of the inner bottom surface 34 and overlaps the first gap S1 in plan view. The protrusion 50 protrudes in a substantially hemispherical shape, and has a substantially circular shape in plan view.
The outer periphery (outline) 51 of the protrusion 50 includes a first side 10a as a sensor element end of the sensor element 10 that forms the first gap S1 in plan view and a first side as an IC chip end of the IC chip 60. It is preferable to cross at least one of 60a (in FIG. 1, the structure which cross | intersects both the 1st edge | side 10a and the 1st edge | side 60a is illustrated).
The distance H1 from the inner bottom surface 34 to the apex of the protrusion 50 is preferably smaller than the distance H2 from the inner bottom surface 34 to the bottom surface 10b facing the inner bottom surface 34 of the sensor element 10.

The material of the first container 31 and the second container 32 is preferably a resin material from the viewpoints of cost, workability (formability), affinity with the filling member 40, and the like. For example, PBT (polybutylene terephthalate) resin, PPS (Polyphenylene sulfide) resin, PC (polycarbonate) resin, etc. are mentioned. Note that the second container 32 may be made of metal.
In addition, the planar shape of the container 30 is not limited to the substantially quadrangular shape shown in the figure, and may be a circle, an ellipse, or a pentagon or more polygon.
The protrusion 50 can be formed integrally with the second container 32 by, for example, injection molding in the case of a resin material, and can be formed integrally with the second container 32 by, for example, drawing processing in the case of a metal material. It is. Note that the protrusion 50 may be formed of a member different from the second container 32.

<Board>
A substrate 20 is disposed between the first container 31 and the second container 32.
The substrate 20 is, for example, a flexible substrate in which a lead pattern layer (wiring layer) 22 made of copper foil is laminated on a base layer 21 made of polyimide resin.
The material of the base layer 21 is not limited to a polyimide resin, but a flexible resin such as a PET (polyethylene terephthalate) resin, a PEN (polyethylene naphthalate) resin, or a PES (polyethersulfone) resin. Is mentioned.
The substrate 20 may include an insulating layer (not shown) that covers the non-connection portion of the lead pattern layer 22.

The substrate 20 is sandwiched between the first container 31 and the second container 32, and has a substantially rectangular mounting part 23 that is partly accommodated in the internal space 35 of the container 30. The board 20 extends from the mounting part 23 to the right side in FIG. And a connecting portion 24 that protrudes.
As shown in FIG. 1, the mounting portion 23 of the substrate 20 is provided with a substantially rectangular opening 25 that is long in the left-right direction on the paper surface in the center, and the sensor element 10 (on the right side of the paper) in the opening 25 in plan view. And the IC chip 60 (left side of the sheet) are arranged side by side.
The sensor element 10 and the IC chip 60 of the sensor device 1 have a rectangular planar shape, and are disposed with a first gap S1 in the opening 25 of the substrate 20 in plan view. The first gap S1 overlaps the central portion (the portion including the center C1) of the inner bottom surface 34 of the container 30 in plan view.

The sensor element 10 has a first side 10a, a second side 10c, a third side 10d, and a fourth side 10e as a plurality of sensor element end portions, and between the opening 25 of the substrate 20 in a plan view. Except for the first side 10a on the side facing the IC chip 60, the second gap S2 is provided.
In addition, the IC chip 60 has a first side 60a, a second side 60b, a third side 60c, and a fourth side 60d as a plurality of IC chip end portions, and between the opening 25 of the substrate 20 in a plan view. The third gap S3 is arranged except for the first side 60a on the side facing the sensor element 10.
Here, the distance L1 of the first gap S1 (the distance between the first side 10a of the sensor element 10 and the first side 60a of the IC chip 60) is the distances L2a, L2b, L2c of the second gap S2, and It is preferable to be larger than the distances L3a, L3b, and L3c of the third gap S3.

Here, the distance L2a is a distance between the second side 10c on the upper side of the paper of the sensor element 10 and the first long side 25a on the upper side of the paper of the opening 25, and the distance L2b is below the paper surface of the sensor element 10. The distance L2c is the distance between the third side 10d on the side and the second long side 25b on the lower side of the opening 25, and the distance L2c is the fourth side 10e on the right side of the sensor element 10 and the opening 25. This is the distance from the second short side 25d on the right side of the page.
The distances L2a, L2b, and L2c may be the same as each other or different from each other.

The distance L3a is a distance between the second side 60b on the upper surface of the IC chip 60 and the first long side 25a on the upper surface of the opening 25, and the distance L3b is the lower side of the IC chip 60 on the paper surface. The distance L3c is the distance between the fourth side 60d on the left side of the paper surface of the IC chip 60 and the paper surface of the opening 25. This is the distance between the left first short side 25c.
The distances L3a, L3b, and L3c may be the same as each other or different from each other.

The sensor element 10 is supported by the substrate 20 by connecting the plurality of terminal portions 11 to the plurality of connection terminal portions 26 of the lead pattern layer 22 of the substrate 20 with bonding wires 70.
The IC chip 60 is supported by the substrate 20 by connecting a plurality of terminal portions 61 to the plurality of connection terminal portions 26 of the lead pattern layer 22 with bonding wires 70.
The board | substrate 20 becomes a structure electrically connected with an external apparatus, when the front-end | tip part of the connection part 24 is inserted in the connector (connection apparatus) etc. of an external apparatus, for example.

<Sensor element>
FIG. 3 is a schematic plan view showing a schematic configuration of the sensor element, and FIG. 4 is a cross-sectional view taken along the line BB of FIG. FIG. 5 is a circuit diagram for detecting the pressure of the sensor element.
As shown in FIGS. 3 and 4, the sensor element 10 is a pressure sensor element having a rectangular planar shape, for example, a diaphragm type pressure sensor element using a semiconductor.
Specifically, the sensor element 10 includes a semiconductor substrate (SOI substrate) 12, a substantially rectangular diaphragm portion 13 formed on the semiconductor substrate 12, and piezoresistive elements provided on each of the four sides of the diaphragm portion 13. 14 (in the case of individual identification, reference numerals are denoted as 14a, 14b, 14c, and 14d) and a wall portion 16 having a hollow portion 15 facing the diaphragm portion 13.

Each component of the sensor element 10 is formed as follows using a semiconductor process, for example.
The semiconductor substrate 12 is formed by laminating a second silicon layer 12c, a silicon oxide film 12b, and a first silicon layer 12a in this order from the lower side in the drawing of FIG.
The piezoresistive element 14 is formed by doping (diffusing or implanting) impurities such as phosphorus and boron into the first silicon layer 12 a of the semiconductor substrate 12.
The diaphragm portion 13 is formed by etching the central portion of the second silicon layer 12c of the semiconductor substrate 12 up to the silicon oxide film 12b in a substantially rectangular shape in plan view.
Thereby, the diaphragm part 13 functions as a diaphragm which bends by receiving pressure.
The wall portion 16 is formed by stacking a plurality of insulating layers (not shown) and metal layers (wiring layers) (not shown) on the semiconductor substrate 12. The wall portion 16 is located at a position facing the diaphragm portion 13 in the insulating layer, and a cavity portion 15 is formed by etching a portion surrounded by the metal layer as a sacrificial layer.
A plurality of terminal portions 11 are provided on the upper surface of the wall portion 16, and are connected to a pressure detection circuit described later via a metal layer.

As shown in FIG. 5, the sensor element 10 uses a piezoresistive element 14 whose resistance value changes according to the pressure applied to the diaphragm unit 13, and serves as a Wheatstone bridge circuit (hereinafter referred to as a bridge circuit) as a pressure detection circuit. ) 17 is configured.
The piezoresistive elements 14a, 14b, 14c, and 14d are configured to have the same resistance value when no pressure is applied to the diaphragm portion 13.
The bridge circuit 17 is connected to a drive circuit (not shown) that supplies a drive voltage AVDC.
The bridge circuit 17 is configured such that a potential difference corresponding to the pressure applied to the diaphragm unit 13 is output from the terminal unit 11 as a detection signal.
In addition, the inside of the cavity 15 is in a vacuum state (for example, 10 Pa or less), and the sensor element 10 functions as an absolute pressure sensor.

<IC chip>
The IC chip 60 has a rectangular planar shape, includes a semiconductor circuit (not shown), and is connected to the sensor element 10 via the terminal portion 61, the bonding wire 70, and the lead pattern layer 22.
The semiconductor circuit of the IC chip 60 includes a driving circuit that supplies the driving voltage AVDC to the bridge circuit 17 of the sensor element 10, and an A that converts the detection signal from the bridge circuit 17 of the sensor element 10 into analog / digital (A / D). The output signal from the A / D conversion circuit and the A / D conversion circuit is compensated according to the temperature of the sensor element 10, and the output signal from the temperature compensation circuit is replaced with pressure data in a desired format and output to the outside. Output circuit.
A part of the semiconductor circuit may be provided in the sensor element 10.

As shown in FIG. 2, the mounting portion 23 of the substrate 20 on which the sensor element 10 and the IC chip 60 are mounted is hermetically fixed to the first container 31 on the lead pattern layer 22 side by the bonding member 80, and the lead pattern layer 22. The side opposite to the side is airtightly fixed to the second container 32.
The joining member 80 is not particularly limited, and examples thereof include silicone-based, epoxy-based, and polyimide-based adhesives.

<Filling member>
A filling member 40 is filled in the internal space 35 of the container 30 in which the first container 31 and the second container 32 are hermetically joined via the substrate 20.
The filling member 40 filled in the internal space 35 covers the sensor element 10, the IC chip 60, the opening 25 and the connection terminal portion 26 of the substrate 20, and the bonding wire 70.
The filling member 40 is filled into the internal space 35 of the container 30 from the opening 33 of the first container 31 by a discharge nozzle (not shown). At that time, the filling member 40 is centered on the first gap S1 in the opening 25 of the substrate 20 and the second container 32 from the first container 31 side through the second gap S2 and the third gap S3. The sensor element 10, the IC chip 60, the substrate 20, and the like in the internal space 35 are covered.

  In addition, although it does not specifically limit as a material of the filling member 40, a fluorine gel, a fluoro silicone gel, a silicone gel, etc. are mentioned.

  In the sensor device 1, the sensor element 10, the IC chip 60, the substrate 20, and the like disposed in the internal space 35 of the container 30 are protected from the external environment by the filling member 40, and the pressure applied from the outside is It is the structure which detects a pressure by propagating to the sensor element 10 via.

As described above, in the sensor device 1 according to the first embodiment, the filling member 40 filled on the protrusion 50 is formed in the shape of the protrusion 50 by the protrusion 50 overlapping the first gap S1 in plan view. For example, the depression 41 generated in the first gap S1 between the sensor element 10 and the IC chip 60 due to the shrinkage of the filling member 40 during the curing process of the filling member 40, It can be made smaller than when there is no protrusion 50.
Thereby, since the sensor device 1 does not require a large amount of filling member 40 as described above, the detection characteristics of the sensor element 10 caused by the attenuation of pressure propagation due to the large amount of filling member 40 are reduced. The possibility of a reduction can be reduced.

In addition, since the sensor device 1 has the distance L1 of the first gap S1 larger than the distances L2a, L2b, L2c of the second gap S2, and the distances L3a, L3b, L3c of the third gap S3, for example, During the vacuum defoaming, bubbles generated between the substrate 20, the sensor element 10 and the IC chip 60, and the inner bottom surface 34 of the container 30 gather in the vicinity of the first gap S1.
More specifically, when the distances L2a, L2b, L2c of the second gap S2 are larger than the distances L3a, L3b, L3c of the third gap S3 as shown in the figure, when filling the filling member 40, Since the filling member 40 easily goes around from the sensor element 10 to the lower side of the IC chip 60, a large amount of bubbles are generated at the lower side of the IC chip 60 (particularly the left side of the paper). Become.
Most of the bubbles generated below the IC chip 60 cannot pass through the third gap S3 because the distances L3a, L3b, and L3c of the third gap S3 are smaller than the distances of the other gaps. To the first gap S1.

When the distances L3a, L3b, and L3c of the third gap S3 are larger than the distances L2a, L2b, and L2c of the second gap S2, the filling member 40 is an IC chip when the filling member 40 is filled. Since it becomes easy to wrap around from the 60 side to the lower side of the sensor element 10, many bubbles are generated at the lower side of the sensor element 10 (particularly at the right side of the drawing).
Most of the bubbles generated below the sensor element 10 cannot pass through the second gap S2 because the distances L2a, L2b, and L2c of the second gap S2 are smaller than the distances of the other gaps. To the first gap S1.
As described above, in any case, bubbles generated between the substrate 20, the sensor element 10, the IC chip 60, and the inner bottom surface 34 of the container 30 are collected in the vicinity of the first gap S1. Become.

The collected air bubbles are difficult to pass through the filling member 40 in the vicinity of the first gap S1 by the protrusion 50 arranged so as to overlap the first gap S1 in a plan view, so that the integrated bubbles become large bubbles. Is hindered.
The sensor device 1 can reduce the possibility that the filling member 40 lifted by the bubbles jumps out of the container 30 when the bubbles burst due to the small bubbles that are prevented from becoming large bubbles.
As a result, the sensor device can reduce the possibility that measurement (detection) of the sensor element 10 is difficult or impossible.

In the sensor device 1, the distance H <b> 1 from the inner bottom surface 34 of the second container 32 to the apex of the protrusion 50 is smaller than the distance H <b> 2 from the inner bottom surface 34 to the bottom surface 10 b facing the inner bottom surface 34 of the sensor element 10. Therefore, the passage from the inner bottom surface 34 side to the first gap S1 can be appropriately narrowed.
Thereby, the sensor device 1 can inhibit, for example, the bubbles gathered from the inner bottom surface 34 side to the vicinity of the first gap S1 from being integrated into a large bubble during vacuum defoaming.
The sensor device 1 can reduce the possibility that the filling member 40 lifted by the bubbles jumps out of the container 30 when the bubbles burst due to the small bubbles that are prevented from becoming large bubbles.
As an example, the distance H1 is preferably about 1/3 of the distance H2 in order to inhibit the bubbles from being integrated into a large bubble.

Further, in the sensor device 1, the outer periphery (contour) 51 of the protrusion 50 in plan view is at least one of the first side 10a of the sensor element 10 and the first side 60a of the IC chip 60 that form the first gap S1. Crossed.
For this reason, in the sensor device 1, for example, a recess 41 is generated in the first gap S <b> 1 along with the curing process of the filling member 40, and the contour (not shown) of the recess 41 intersects the outer periphery 51 of the protrusion 50. If it is about a size, the outer periphery 51 of the protrusion 50 appears to be distorted through the recess 41 in a plan view.
Thereby, the sensor device 1 can detect the dent 41 having a size that affects the detection characteristics of the sensor element 10 by, for example, an image recognition device.

  Note that the protrusion 50 may be at least partially overlapped with the first gap S1 in a plan view and may not protrude concentrically with the center C1 of the inner bottom surface 34.

(Modification)
Next, a modification of the first embodiment will be described.
FIG. 6 is a schematic diagram illustrating a schematic configuration of a sensor device according to a modification of the first embodiment, and is a plan view of the sensor device viewed from above the opening of the device. 7 is a cross-sectional view taken along line AA in FIG.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As illustrated in FIGS. 6 and 7, the sensor device 2 according to the modification of the first embodiment is different in the shape of the protrusion 50 from the first embodiment.
The protruding portion 50 protrudes from the central portion of the inner bottom surface 34 in a substantially semi-cylindrical shape (substantially half-roll shape), and overlaps the first gap S1 in plan view.
The protrusion 50 is provided in a substantially rectangular shape in plan view, and is arranged such that the long side is along the first side 10 a of the sensor element 10 (or the first side 60 a of the IC chip 60).
FIG. 6 illustrates a configuration in which the length in the long side direction of the protrusion 50 is longer than the length of the first side 60a of the IC chip 60. However, the length in the long side direction is the length of the first side 60a. It may be shorter than the length.

As described above, in the sensor device 2 according to the modification of the first embodiment, the protrusion 50 protrudes from the central portion of the inner bottom surface 34 in a substantially semi-cylindrical shape and overlaps the first gap S1 in plan view.
Further, the protrusion 50 is provided in a substantially rectangular shape in plan view, and the long side is arranged so as to be along the first side 10 a of the sensor element 10 (or the first side 60 a of the IC chip 60).
Accordingly, the sensor device 2 can expand the range in which the filling member 40 filled on the protruding portion 50 is filled along the shape of the protruding portion 50 as compared with the case where the protruding portion 50 is substantially hemispherical. Become.
As a result, the sensor device 2 has the dent 41 generated in the first gap S1 between the sensor element 10 and the IC chip 60 during the curing process of the filling member 40 over a wider range than in the case of a substantially hemispherical shape. Can be small.

  As a result, since the sensor device 2 does not require a large amount of filling member 40 as described above, the detection characteristics of the sensor element 10 caused by the attenuation of pressure propagation due to the large amount of filling member 40 are reduced. The possibility of a reduction can be reduced.

In the sensor device 2, since the shape of the protrusion 50 is substantially semi-cylindrical, the passage from the inner bottom surface 34 side to the first gap S1 can be narrowed over a wider range than in the case of a substantially hemispherical shape. .
Thereby, the sensor device 2, for example, during vacuum defoaming, may inhibit a wide range of bubbles that have gathered from the inner bottom surface 34 side to the vicinity of the first gap S1 and become large bubbles. it can.
The sensor device 2 may reduce the possibility that the filling member 40 lifted by the bubbles jumps out of the container 30 when the bubbles burst due to the small bubbles that are prevented from becoming large bubbles over a wide range. it can.
Note that the configuration of the modified example can also be applied to the following embodiments.

(Second Embodiment)
Next, a sensor device according to a second embodiment will be described.
FIG. 8 is a schematic diagram illustrating a schematic configuration of the sensor device according to the second embodiment, and is a plan view of the sensor device viewed from above the opening of the device. 9 is a cross-sectional view taken along the line DD of FIG.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIGS. 8 and 9, the sensor device 3 of the second embodiment differs from the first embodiment in the position of the protrusion 50 and the like.
In the sensor device 3, at least one of the distances L2a, L2b, and L2c of the second gap S2 and the distances L3a, L3b, and L3c of the third gap S3 is larger than the distance L1 of the first gap S1.
In the present embodiment, when the IC chip 60 is increased in size and extends to the right side of the drawing, the distance L1 of the first gap S1 is smaller than that of the first embodiment, and the distances L2a and L2b of the second gap S2 are The structure which is larger than the distance L1 of the first gap S1 is illustrated.
Here, the distance L2c of the second gap S2 and the distances L3a, L3b, L3c of the third gap S3 remain smaller than the distance L1 of the first gap S1.

In the sensor device 3, the protrusion 50 has at least one of the second gap S2 and the third gap S3 that is larger than the first gap S1 in the plan view (here, the second gap S2). It is arranged at the position that overlaps.
Here, if at least one of the distances L2a, L2b, L2c of the second gap S2 and the distances L3a, L3b, L3c of the third gap S3 is larger than the distance L1 of the first gap S1, The distance of the gap is assumed to be larger than the distance of the first gap S1.
Thereby, in this embodiment, the distance of 2nd clearance gap S2 is larger than the distance of 1st clearance gap S1.

Two protrusions 50 protrude in a substantially hemispherical shape toward the inner space 35 from a position overlapping the second gap S <b> 2 on the inner bottom surface 34 of the container 30.
One of the protrusions 50 is disposed on the second side 10c side (the distance L2a side larger than the distance L1) of the sensor element 10 in the second gap S2, and the other one of the protrusions 50 is the second side It is arranged on the third side 10d side (the distance L2b side larger than the distance L1) of the sensor element 10 in the gap S2.
Each protrusion 50 protrudes in a substantially hemispherical shape, and has a substantially circular shape in plan view.

As described above, in the sensor device 3 according to the second embodiment, the two protrusions 50 arranged on the inner bottom surface 34 of the container 30 have a distance within the second gap S2 and the third gap S3 in plan view. Is arranged at a position overlapping at least one (here, the second gap S2) larger than the first gap S1.
The sensor device 3 has gathered from the inner bottom surface 34 side to the vicinity of the second gap S2 by the passage to the second gap S2 narrowed by the two protrusions 50, for example, during vacuum defoaming. It is possible to inhibit the bubbles from being integrated into a large bubble.
The sensor device 3 can reduce the possibility that the filling member 40 lifted by the bubbles jumps out of the container 30 when the bubbles burst due to the bubbles that have become smaller and become smaller.

In addition to the second gap S2, in addition to the second gap S2, the sensor device 3 has an inner diameter when at least one of the distances L3a, L3b, L3c of the third gap S3 is larger than the distance L1 of the first gap S1. The protrusion 50 may be additionally arranged at a position overlapping the portion of the third gap on the bottom surface 34 that is larger than the distance L1 of the first gap S1.
According to this, the sensor device 3 can further reduce the size of the bubbles, and can further reduce the possibility that the filling member 40 lifted by the bubbles will jump out of the container 30 when the bubbles burst. .
In the present embodiment, a configuration in which there are two protrusions 50 is illustrated, but any one of the protrusions 50 may be provided.

(Mobile device)
Next, a portable device provided with the above-described sensor device will be described.
FIG. 10 is a schematic perspective view showing an altimeter as an example of a portable device including a sensor device.

As shown in FIG. 10, the altimeter 200 is also a multi-function watch and can be worn on the wrist. In addition, the sensor device 1 (or any one of 2 and 3) is mounted inside the altimeter 200, and the display unit 201 displays the sea level at the current location or the atmospheric pressure at the current location.
In addition to the altitude and atmospheric pressure, the display unit 201 displays various information such as the current time, the user's heart rate, and weather.

As described above, since the altimeter 200 of this configuration includes the sensor device 1 (or any one of 2 and 3), the effects described in the above embodiments and modifications are achieved, and excellent performance ( For example, highly sensitive altitude detection performance can be exhibited.
In addition to the altimeter, examples of the mobile device including the sensor device described above include a mobile phone, a wristwatch type multifunction terminal, a tablet type multifunction terminal, and the like.

(Electronics)
Next, an electronic apparatus including the above-described sensor device will be described.
FIG. 11 is a schematic front view illustrating a navigation system as an example of an electronic apparatus including a sensor device.

  As shown in FIG. 11, the navigation system 300 includes map information (not shown), position information acquisition means from a GPS (Global Positioning System), self-contained navigation means using a gyro sensor, an acceleration sensor, and vehicle speed data. And a sensor device 1 (or any one of 2 and 3), and a display unit 301 that displays predetermined position information or course information.

The navigation system 300 can acquire altitude information by the sensor device 1 (or any one of 2 and 3) in addition to the acquired position information.
In conventional navigation systems that do not have altitude information, when general roads and elevated roads are overlapped, it is impossible to distinguish between general roads and elevated roads, so priority information is available even when traveling on elevated roads. There was a problem that navigation information in general road driving was provided to the user.
On the other hand, in the navigation system 300, by acquiring altitude information, it becomes possible to discriminate between ordinary roads and elevated roads, so that navigation information on elevated road traveling can be reliably given to the user during elevated road traveling. Can be provided.

  Note that the display unit 301 of the navigation system 300 is configured to be small and thin by using, for example, a liquid crystal panel display, an organic EL (Organic Electro-Luminescence) display, or the like.

  As described above, since the navigation system 300 of this configuration includes the sensor device 1 (or any one of 2 and 3), the effects described in the above embodiments and modifications are achieved, and the performance is excellent. (For example, providing navigation information with high accuracy by acquiring highly sensitive altitude information).

  In addition to the navigation system, the electronic device including the above-described sensor device includes, for example, a personal computer, a medical device (for example, an electronic thermometer, a blood pressure monitor, a blood glucose meter, an electrocardiogram measuring device, an ultrasonic diagnostic device, an electronic device) Endoscope), various measuring instruments, instruments (for example, instruments for vehicles, aircraft, ships), flight simulators, and the like.

(Moving body)
Next, the moving body provided with the sensor device described above will be described.
FIG. 12 is a schematic perspective view illustrating an automobile as an example of a moving object including a sensor device.

As shown in FIG. 12, an automobile 400 includes a vehicle body 401 and four wheels 402, and is configured to rotate the wheels 402 by a power source (engine) (not shown) provided in the vehicle body 401. ing.
The automobile 400 uses the sensor device 1 (or any one of 2 and 3) as, for example, an altitude detection sensor such as an installed navigation device or an attitude control device, an air pressure detection sensor of the wheel 402, or the like.
According to this, since the automobile 400 includes the sensor device 1 (or any one of 2 and 3), the effects described in the above embodiments and modifications are achieved, and excellent performance (for example, high altitude) High-accuracy navigation performance, high-responsive attitude control performance according to altitude, high-sensitivity air pressure management performance, etc.).

  The sensor device described above is not limited to the automobile 400, and is preferably used as, for example, an altitude detection sensor of a mobile body including a self-propelled robot, a self-propelled transport device, a train, a ship, an airplane, an artificial satellite, and the like. In any case, the effects described in the above embodiments and modifications can be achieved, and a moving body that exhibits excellent performance can be provided.

  The present invention includes substantially the same configuration (for example, a configuration having the same function, method, and result, or a configuration having the same purpose and effect) as the configuration described in the above embodiment. In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that achieves the same effect as the configuration described in the embodiment or a configuration that can achieve the same object. In addition, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

  1, 2, 3 ... Sensor device, 10 ... Sensor element, 10a ... First side as sensor element end, 10b ... Bottom, 10c ... Second side as sensor element end, 10d ... As sensor element end 3rd side, 10e ... 4th side as sensor element end part, 11 ... terminal part, 12 ... semiconductor substrate, 12a ... 1st silicon layer, 12b ... silicon oxide film, 12c ... 2nd silicon layer, 13 ... diaphragm part 14, 14a, 14b, 14c, 14d ... piezoresistive element, 15 ... cavity, 16 ... wall, 17 ... bridge circuit, 20 ... substrate, 21 ... base layer, 22 ... lead pattern layer, 23 ... mounting part, 24 ... connection part, 25 ... opening, 25a ... first long side, 25b ... second long side, 25c ... first short side, 25d ... second short side, 26 ... connection terminal part, 30 ... container, 31 ... First container, 32 2nd container, 33 ... opening, 34 ... inner bottom, 35 ... inner space, 40 ... filling member, 41 ... dent, 50 ... projection, 51 ... outer periphery of projection, 60 ... IC chip, 60a ... end of IC chip First side as part, 60b ... Second side as IC chip end, 60c ... Third side as IC chip end, 60d ... Fourth side as IC chip end, 61 ... Terminal part, 70 ... Bonding wire, 80 ... joining member, 200 ... altimeter as portable device, 201 ... display unit, 300 ... navigation system as electronic device, 301 ... display unit, 400 ... automobile as moving body, 401 ... vehicle body, 402 ... wheel .

Claims (8)

A sensor element;
IC chip,
A substrate having an opening;
A container having an internal space in which the sensor element, the IC chip, and at least the opening of the substrate are disposed;
A filling member that fills the internal space and covers the sensor element, the IC chip, and at least the opening of the substrate;
The sensor element and the IC chip are arranged side by side with a first gap in the opening in a plan view,
The first gap overlaps a central portion of the inner bottom surface of the container in plan view,
On the inner bottom surface, a protrusion protruding to the inner space side is arranged,
The sensor device, wherein the protrusion overlaps the first gap in plan view. The sensor element has a plurality of sensor element end portions, and a second portion excluding the sensor element end portion on the side facing the IC chip between the opening portion and the sensor element end portion in a plan view. Arranged with a gap of
The IC chip has a plurality of IC chip end portions, and a third portion excluding the IC chip end portion on the side facing the sensor element between the opening portion and the IC chip end portion in a plan view. Arranged with a gap of
The sensor device according to claim 1, wherein a distance of the first gap is larger than a distance of the second gap and a distance of the third gap.   The distance from the said inner bottom face to the vertex of the said projection part is smaller than the distance from the said inner bottom face to the bottom face facing the said inner bottom face of the said sensor element, The Claim 1 or Claim 2 characterized by the above-mentioned. Sensor device.   The outer periphery of the protrusion portion in a plan view intersects at least one of the sensor element end portion of the sensor element and the IC chip end portion of the IC chip forming the first gap. The sensor device according to claim 2 or claim 3. A sensor element;
IC chip,
A substrate having an opening;
A container having an internal space in which the sensor element, the IC chip, and at least the opening of the substrate are disposed;
A filling member that fills the internal space and covers the sensor element, the IC chip, and at least the opening of the substrate;
The sensor element and the IC chip are arranged side by side with a first gap in the opening in a plan view,
The sensor element has a plurality of sensor element end portions, and a second portion excluding the sensor element end portion on the side facing the IC chip between the opening portion and the sensor element end portion in a plan view. Arranged with a gap of
The IC chip has a plurality of IC chip end portions, and a third portion excluding the IC chip end portion on the side facing the sensor element between the opening portion and the IC chip end portion in a plan view. Arranged with a gap of
At least one of the distance of the second gap and the distance of the third gap is larger than the distance of the first gap,
On the inner bottom surface of the container, a protrusion protruding to the inner space side is disposed,
The projecting portion is arranged at a position overlapping at least one of the second gap and the third gap, the distance of which is larger than the first gap, in a plan view. .   A portable device comprising the sensor device according to any one of claims 1 to 5.   An electronic apparatus comprising the sensor device according to any one of claims 1 to 5.   A moving body comprising the sensor device according to any one of claims 1 to 5.

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