CN110933579A

CN110933579A - Dustproof structure, microphone packaging structure and electronic equipment

Info

Publication number: CN110933579A
Application number: CN201911415110.3A
Authority: CN
Inventors: 游振江; 畠山庸平; 林育菁
Original assignee: Goertek Inc
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-03-27
Also published as: WO2021135128A1

Abstract

The invention discloses a dustproof structure, a microphone packaging structure and electronic equipment, comprising: a grid structure; the supporting part comprises a connecting part and a carrier fixed with the connecting part, the connecting part is arranged around the grid structure, a first through hole is formed in the middle of the carrier, and the grid structure covers one end of the first through hole; and a stress concentration part formed at an inner side of the support part, the stress concentration part being for concentrating stress of the support part. The invention has the technical effects that the stress on the grid structure is reduced by arranging the stress concentration part when the dustproof structure is deformed, and disordered folds are prevented from being generated on the grid structure.

Description

Dustproof structure, microphone packaging structure and electronic equipment

Technical Field

The invention relates to the technical field of acoustoelectric technology, in particular to a dustproof structure, a microphone packaging structure and electronic equipment.

Background

The microphone is provided with a dust-proof structure, which is a device capable of preventing foreign substances such as powder, particles, etc. from entering to cause a false reaction of the microphone and allowing sound waves to pass through.

The dustproof structure is composed of different materials, and the thermal expansion coefficients of the different materials are different. In the mounting process of the dust-proof structure, the dust-proof structure is warped during heat treatment. In contrast, the amount of deformation of the carrier is large in the case where the dustproof structure is warped, and the amount of deformation of the film body is small. The stress generated after the deformation can extrude the membrane body, and the grid structure on the membrane body generates disordered folds.

Therefore, a new technical solution is needed to solve the above problems.

Disclosure of Invention

An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone package structure, and an electronic device.

According to a first aspect of the present invention, there is provided a dust-proof structure including:

a grid structure;

the supporting part comprises a connecting part and a carrier fixed with the connecting part, the connecting part is arranged around the grid structure, a first through hole is formed in the middle of the carrier, and the grid structure covers one end of the first through hole;

and a stress concentration part formed at an inner side of the support part, the stress concentration part being for concentrating stress of the support part.

Optionally, the stress concentration portion is formed inside the connection portion, the stress concentration portion surrounding the lattice structure.

Optionally, the stress concentration portion includes a first extension portion extending inward from the connection portion, and a plurality of second through holes are provided in the first extension portion and distributed along a circumferential direction of the first extension portion.

Optionally, the aperture ratio of the second through hole is smaller than or equal to the aperture ratio of the grid structure.

Optionally, the second through hole comprises a rectangular hole or an arc-shaped hole.

Optionally, the stress concentration portion includes a first extension portion extending inward from the connecting portion, a plurality of cuts are cut in the first extension portion, a neck portion connected to the first extension portion is formed between both end portions of each of the cuts, the cuts face the mesh structure, and the neck portion faces the support portion; a plurality of the notches are distributed along the circumference of the first extension.

Optionally, the stress concentration portion is formed on an inner side of the carrier, and the stress concentration portion is coaxially disposed with the first through hole.

Optionally, the stress concentration portion includes a second extension portion extending inward from the carrier, and the second extension portion includes a plurality of protrusions distributed along a circumferential direction of the second extension portion.

Optionally, the protrusion includes a rectangular protrusion having a rectangular edge shape or an arc-shaped protrusion having an arc-shaped edge shape, in a cross section perpendicular to the axial direction of the first through hole.

Optionally, the stress concentrator comprises a second extension extending medially from the carrier, the second extension comprising a plurality of arcuate walls; the two ends of the arc-shaped wall are connected with the carrier, and the middle of the arc-shaped wall is hollow; the plurality of arc-shaped walls are distributed along the circumferential direction of the second extension part, and the arc-shaped walls are arc-shaped along the section perpendicular to the axial direction of the first through hole.

Optionally, the stress concentration portion is formed on both the connecting portion and the inner side of the carrier;

the stress concentration part on the inner side of the connecting part is arranged around the grid structure, and the stress concentration part on the inner side of the carrier is coaxially arranged with the first through hole.

Optionally, an elastic telescopic structure is arranged on the grid structure, and the elastic telescopic structure can stretch along a plane where the grid structure is located.

Optionally, the elastic modulus of the elastically stretchable structure has anisotropy.

Optionally, the open area ratio varies throughout the lattice structure.

Optionally, the material of the grid structure and the connection portion comprises metallic glass.

Optionally, the material of the carrier comprises an epoxy resin.

According to a second aspect of the present invention, there is provided a microphone packaging structure, comprising the dust-proof structure described in any one of the above, the dust-proof structure being fixed on a sound hole of the microphone packaging structure;

or, the dustproof structure covers the MEMS chip in the microphone packaging structure.

According to a third aspect of the present invention, there is provided an electronic device including the microphone packaging structure described above.

According to one embodiment of the present disclosure, stress on the grid structure is reduced by providing the stress concentration portion when the dustproof structure is deformed, and disordered folds generated on the grid structure are avoided.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a schematic structural view of a stress concentration portion provided inside a support portion according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural view of a cross section of a stress concentration portion provided inside a connection portion according to an embodiment of the present disclosure.

Fig. 3 is a schematic structural view illustrating a stress concentration portion of an embodiment of the present disclosure, in which a rectangular hole is formed in a first extension portion.

Fig. 4 is a schematic structural view illustrating a stress concentration portion of an embodiment of the present disclosure, which is an arc-shaped hole formed on the first extension portion.

Fig. 5 is a schematic structural view of a stress concentration portion of an embodiment of the present disclosure, which is a notch formed on a first extension portion.

Fig. 6 is a schematic structural view of a cross section of a carrier with a stress concentration portion disposed inside the carrier according to an embodiment of the present disclosure.

Fig. 7 is a schematic structural view illustrating a stress concentration portion of an embodiment of the present disclosure, wherein a rectangular protrusion is disposed on a second extension portion.

Fig. 8 is a schematic structural view illustrating a stress concentration portion of an embodiment of the present disclosure, wherein an arc-shaped protrusion is disposed on the second extension portion.

FIG. 9 is a schematic view of a stress concentrator having an arcuate wall on a second extension according to an embodiment of the present disclosure.

Fig. 10 is a schematic structural view of a cross section of one embodiment of the present disclosure with stress concentrators located both inside the connection and inside the carrier.

Fig. 11 is a schematic structural diagram of a microphone package structure according to an embodiment of the present disclosure, where a dust-proof structure is disposed inside a sound hole on a substrate.

Fig. 12 is a schematic structural diagram of a dustproof structure disposed at a MEMS chip on a microphone packaging structure substrate according to an embodiment of the disclosure.

In the figure, 11 is a connecting portion, 12 is a grid structure, 2 is a carrier layer, 3 is a stress concentration portion, 31 is a first extending portion, 311 is a rectangular hole, 312 is an arc hole, 313 is a notch, 32 is a second extending portion, 321 is a rectangular protrusion, 322 is an arc protrusion, 323 is an arc wall, 4 is a sound hole, and 5 is a MEMS chip.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

According to an embodiment of the present disclosure, there is provided a dust-proof structure, as shown in fig. 1, including: a grid structure 12; the support part comprises a connecting part 11 and a carrier 2 fixed with the connecting part 11, the connecting part 11 is arranged around a grid structure 12, a first through hole is formed in the middle of the carrier 2, and one end of the first through hole is covered by the grid structure 12; the connection 11 and the grid structure 12 form a membrane of the dust-proof structure.

And a stress concentration portion 3 formed at an inner side of the support portion, the stress concentration portion 3 for concentrating stress of the support portion.

In this embodiment, the mesh structure 12 provides a dust-proof effect to the dust-proof structure, and allows sound waves to pass without affecting sound transmission. For example, the lattice structure 12 may be provided with holes having a circular, square, or the like shape.

The supporting part is used for supporting and fixing the dustproof structure at a set position. The support part comprises a connection part 11 and a carrier 2, the carrier 2 being intended to be connected to a set position, the connection part 11 being intended to connect the lattice structure 12 to the carrier 2.

On the inner side of the support part, a stress concentration part 3 is formed, which stress concentration part 3 is arranged around the lattice structure 12. For example, fig. 1, the stress concentrators 3 are disposed about the axis of the lattice structure 12.

The stress concentration portion 3 serves to concentrate stress of the support portion, for example, during manufacturing or installation of the dust-proof structure. The dust-proof structure is deformed by the heat treatment process or other factors in the above process, and stress is generated in the support portion. For example, the support portion may be warped in the heat treatment step, and the stress generated by the warping deformation may be transmitted to the mesh structure 12, which may cause the mesh structure 12 to be irregularly wrinkled. After the stress concentration portion 3 is provided, the stress concentration portion 3 concentrates the stress of the support portion, reducing the stress on the lattice structure 12. And the concentrated stress makes the generated folds concentrated on the stress concentration part and have regular shape and uniform distribution. This can prevent wrinkles from being generated in the mesh structure 12, protect the structure of the mesh structure 12 from being damaged, and improve the yield and reliability of the dustproof structure.

For example, as shown in fig. 2, the stress concentration portion 3 may be formed inside the connection portion 11, and the stress concentration portion 3 surrounds the lattice structure 12.

The stress concentration portion 3 is disposed inside the connection portion 11 of the support portion so that the connection portion 11, the stress concentration portion 3, and the lattice structure 12 are connected in this order. In this way, wrinkles generated on the grid structure 12 can be controlled by the film body, the structure of the grid structure 12 is protected from being damaged, and the yield and the reliability of the dustproof structure are improved.

In one example, as shown in fig. 3 and 4, the stress concentration portion 3 includes a first extension portion 31 extending inward from the connection portion 11, and a plurality of second through holes are provided in the first extension portion 31 and distributed in a circumferential direction of the first extension portion 31.

In this example, the stress concentration portion 3 includes a first extension portion 31 and a plurality of second through holes provided on the first extension portion 31. Thus, the generated stress can be concentrated at the position of the second through hole, and the position of the second through hole is deformed to form a wrinkle. Reducing stress on the lattice structure 12 and avoiding the stress causing the lattice structure 12 to generate disordered folds.

For example, the second through hole includes a rectangular hole 311 or an arc-shaped hole 312.

As shown in fig. 3, the second through hole is a rectangular hole 311. The first extension 31 is provided with a plurality of rectangular holes 311, so that stress can be concentrated at the positions of the plurality of rectangular holes 311. Avoiding stress forming wrinkles in the lattice structure 12.

For example, it is also possible to provide a portion of the single second through hole on the connecting portion 11 and another portion on the first extension 31. Such a structure can reduce the alignment error of the connection of the membrane body and the carrier 2 and optimize the structure of the dust-proof structure. Avoiding the dislocation of the structure between the carrier 2 and the membrane body caused by stress.

As shown in fig. 4, the second through hole is an arc-shaped hole 312. The arcuate apertures 312 are circumferentially spaced along the first extension 31 such that stress is concentrated at the arcuate apertures 312 and avoids wrinkling of the lattice structure 12. The arc holes 312 are uniformly distributed along the circumferential direction of the first extension part 31, so that the generated wrinkles are uniformly distributed along the circumferential direction, and the shape and structure of the generated wrinkles are effectively controlled.

In one example, the aperture ratio of the second via is equal to or less than the aperture ratio of the mesh structure 12.

In this example, the second through holes provided in the stress concentration portion 3 have a function of concentrating stress, and the stress concentration portion 3 also has a function of preventing dust of the mesh structure 12 by setting the aperture ratio of the second through holes to be smaller than or equal to the aperture ratio of the mesh structure 12.

In one embodiment, as shown in fig. 5, the stress concentration portion 3 includes a first extension portion 31 extending inward from the connection portion 11, a plurality of cuts 313 are cut on the first extension portion 31, a neck portion connected to the first extension portion 31 is formed between both end portions of each cut 313, the cuts 313 face the mesh structure 12, and the neck portion faces the support portion; the plurality of cutouts 313 are distributed along the circumferential direction of the first extension 31.

In this embodiment, a plurality of cuts 313 are cut on the first extension 31 to form the stress concentration portion 3. Such stress may create multiple locations for the cuts 313 to avoid the stress from creating a random fold in the lattice structure 12.

For example, a part of the single slit may be provided on the connection portion 11 and another part may be provided on the first extension portion 31. Such a structure can reduce the alignment error of the connection of the membrane body and the carrier 2 and optimize the structure of the dust-proof structure. Avoiding the dislocation of the structure between the carrier 2 and the membrane body caused by stress.

In one embodiment, as shown in fig. 6, a stress concentration portion 3 is formed on the inner side of the carrier 2, and the stress concentration portion 3 is disposed coaxially with the first through hole.

A stress concentration portion 3 is formed on the carrier 2, and stress can be controlled by the carrier 2 to be concentrated on the stress concentration portion 3. The formation of wrinkles on the stress concentration portion 3 will be controlled to avoid the formation of random wrinkles on the lattice structure 12.

For example, as shown in fig. 7 and 8, the stress concentration portion 3 includes a second extension portion 32 extending inward from the carrier 2, and the second extension portion 32 includes a plurality of protrusions distributed along a circumferential direction of the second extension portion 32.

By forming a plurality of projections, that is, the second extension portions 32, on the inner side of the carrier 2, stress is concentrated on the plurality of projections. The stress is applied to the protrusions, reducing the stress on the lattice structure 12 and avoiding the occurrence of random wrinkles on the lattice structure 12.

For example, the protrusions include a rectangular protrusion 321 whose edge is rectangular or an arc-shaped protrusion 322 whose edge is arc-shaped, in a cross section perpendicular to the axial direction of the first through hole.

As shown in fig. 7, the inside of the carrier 2 is formed with a plurality of rectangular protrusions 321, which can concentrate stress on the plurality of rectangular protrusions 321. Reducing stress on the lattice structure 12 and avoiding random wrinkles on the lattice structure 12.

As shown in fig. 8, the inner side of the carrier 2 is formed with a plurality of arc-shaped protrusions 322, so that stress can be concentrated on the plurality of arc-shaped protrusions 322. Reducing stress on the lattice structure 12 and avoiding random wrinkles on the lattice structure 12.

In one embodiment, as shown in fig. 9, the stress concentration portion 3 includes a second extension 32 extending inwardly of the carrier 2, the second extension 32 including a plurality of arcuate walls 323; two ends of the arc-shaped wall 323 are connected with the carrier 2, and the middle part is hollow; a plurality of arc-shaped walls 323 are distributed along the circumferential direction of the second extension 32, and the arc-shaped walls 323 are arc-shaped in a section perpendicular to the axial direction of the first through-hole.

In this embodiment, the arc-shaped walls 323 formed at the inner side of the carrier 2 can concentrate stress on each arc-shaped wall 323. Causing stress to be concentrated on each arcuate wall 323 in the circumferential direction. This reduces the stress on the lattice structure 12, and allows the pleats to be evenly distributed along the circumferential direction, thereby avoiding the occurrence of random pleats on the lattice structure 12. The yield and the reliability of the dustproof structure are improved.

In one embodiment, as shown in fig. 10, the stress concentration portion 3 is formed at both the connection portion 11 and the inner side of the carrier 2; the stress concentration portion 3 inside the connecting portion 11 is provided around the lattice structure 12, and the stress concentration portion 3 inside the carrier 2 is provided coaxially with the first through hole.

In this embodiment, the occurrence of wrinkles on the stress concentration portions 3 is controlled by concentrating the stress by the stress concentration portions 3 provided inside the carrier 2 and the stress concentration portions 3 provided inside the connection portions 11. The stress on the grid structure 12 is effectively reduced. The occurrence of random wrinkles in the lattice structure 12 is avoided.

In one embodiment, the lattice structure 12 is provided with an elastic telescopic structure, which can be extended and retracted along the plane of the lattice structure 12.

In this embodiment, the lattice structure 12 is provided with the ability to stretch along the plane by providing an elastically stretchable structure. Thus, when stress occurs, the grid structure 12 can also eliminate stress through the stretching of the elastic stretching structure, and wrinkles on the grid structure 12 are avoided.

For example, the elastically stretchable structure may be a lattice-like structure capable of elastic stretching. Thus, the elastic expansion and contraction capacity is satisfied, and the dustproof function is the same as that of the grid structure 12.

In one example, the elastic modulus of the elastically stretchable structure has anisotropy.

The elastic coefficient of the elastic telescopic structure has anisotropy, so that the elastic telescopic capacity of the elastic telescopic structure in different directions is different. For example, the elastic modulus in the plane of the lattice structure 12 is such that the set stretching capacity of the stretching structure is met. Wrinkles generated in the lattice structure 12 by the stress can be effectively eliminated. The grid structure is protected from damage.

Moreover, the elastic expansion and contraction capacity can improve the capacity of the dustproof structure for resisting external applied force. The mechanical strength of the dustproof structure is enhanced.

In one example, the open area ratio varies throughout the lattice structure 12.

The mechanical strength of the lattice structure 12 is improved by controlling the aperture ratio at each location of the lattice structure 12. This protects the lattice structure 12 from damage when subjected to stress or external forces. The yield of the dustproof structure and the reliability of installation can be improved.

For example, the strength at each position is adjusted by controlling the opening ratio at each position of the lattice structure 12.

In one example, the material of the grid structure 12 and the connection 11 comprises metallic glass.

The metallic glass has excellent mechanical strength, and the film body made of the metallic glass can improve the mechanical strength of the grid structure 12 and the connecting part 11. The yield of manufacturing the dustproof structure can be improved, and the damage rate in the installation process can be reduced.

In one example, the material of the carrier 2 includes an epoxy resin.

The addition of the epoxy resin to manufacture the carrier 2 can reduce the thickness of the carrier 2 on the premise of satisfying the functions of the carrier 2 such as supporting the film body. This can contribute to thinning of the dust-proof structure.

According to an embodiment of the present invention, there is provided a microphone packaging structure, including the above-mentioned dustproof structure, the dustproof structure being fixed on the sound hole 4 of the microphone packaging structure;

or, the dustproof structure covers the MEMS chip 5 in the microphone packaging structure.

Generally, a microphone package structure includes a case forming a receiving cavity and a substrate fixed to the case. The sound hole 4 may be provided in the substrate or in the housing.

In this embodiment, the dustproof structure may be fixed to the sound hole 4 from the outside of the microphone package structure, so as to protect components in the microphone package structure from the outside.

As shown in fig. 11, the dust-proof structure may be fixed to the sound hole 4 from inside the microphone package structure, and may protect components of the microphone package structure from inside.

As shown in fig. 12, the dust-proof structure may be fixed to the substrate to protect the sound hole 31 and the inside of the microphone package. The MEMS chip 5 is fixed to the dust-proof structure.

Alternatively, the dustproof structure is fixed inside the microphone packaging structure and covers the MEMS chip 5. This can protect the MEMS chip 5. In this structure, the dust-proof structure can be fixed to the substrate on which the MEMS chip 5 is provided, and the cover can be formed. The dust-proof structure may be fixed to the substrate of the MEMS chip 5 to form a coating. The above structure can provide a protective effect to the MEMS chip 5.

The microphone packaging structure can effectively prevent the damage of the dustproof structure caused by heating in the microphone installation and use processes. And can form the protection to the components and parts in the microphone. For example, the MEMS chip 5 is protected from contamination such as external dust.

According to an embodiment of the present invention, there is provided an electronic device including the microphone packaging structure described above.

The electronic equipment comprises the microphone packaging structure and has all the advantages of the microphone packaging structure. For example, the electronic device may be a sound device, a mobile phone, a computer, or the like.

Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized by comprising:

a grid structure;

2. The dustproof structure according to claim 1, wherein the stress concentration portion is formed inside the connection portion, the stress concentration portion surrounding the lattice structure.

3. The dustproof structure according to claim 2, wherein the stress concentration portion includes a first extension portion extending inward from the connection portion, and a plurality of second through holes are provided in the first extension portion, and are distributed in a circumferential direction of the first extension portion.

4. The dustproof structure according to claim 3, wherein an aperture ratio of the second through hole is equal to or less than an aperture ratio of the lattice structure.

5. The dust-proof structure according to claim 3, wherein the second through hole comprises a rectangular hole or an arc-shaped hole.

6. The dust-proof structure according to claim 2, wherein the stress concentrating portion includes a first extending portion on which the connecting portion extends inward, a plurality of slits are cut in the first extending portion, a neck portion connected to the first extending portion is formed between both end portions of each of the slits, the slits face the lattice structure, and the neck portion faces the support portion; a plurality of the notches are distributed along the circumference of the first extension.

7. The dust-proof structure according to claim 1, wherein the stress concentration portion is formed inside the carrier, and the stress concentration portion is provided coaxially with the first through hole.

8. The dust-proof structure according to claim 7, wherein the stress concentrating portion includes a second extension portion extending from the carrier toward the inner side, and the second extension portion includes a plurality of protrusions distributed along a circumferential direction of the second extension portion.

9. The dust-proof structure according to claim 7, wherein the projection includes a rectangular projection having a rectangular edge shape or an arc-shaped projection having an arc edge shape, in a cross section perpendicular to the axial direction of the first through hole.

10. The dust-proof structure of claim 7, wherein the stress concentrator comprises a second extension extending inwardly of the carrier, the second extension comprising a plurality of arcuate walls; the two ends of the arc-shaped wall are connected with the carrier, and the middle of the arc-shaped wall is hollow; the plurality of arc-shaped walls are distributed along the circumferential direction of the second extension part, and the arc-shaped walls are arc-shaped along the section perpendicular to the axial direction of the first through hole.

11. The dust-proof structure according to claim 1, wherein the stress concentration portion is formed at both the connection portion and an inner side of the carrier;

12. The dustproof structure according to any one of claims 1 to 11, wherein the lattice structure is provided with an elastically stretchable structure, and the elastically stretchable structure is stretchable along a plane in which the lattice structure is located.

13. The dustproof structure according to claim 12, wherein the elastic modulus of the elastic expansion structure has anisotropy.

14. The dustproof structure according to any one of claims 1 to 11, wherein the aperture ratio is different at each location of the lattice structure.

15. The dust-proof structure according to any one of claims 1 to 11, wherein the material of the mesh structure and the connecting portion comprises metallic glass.

16. The dust-proof structure according to any one of claims 1 to 11, wherein a material of the carrier includes an epoxy resin.

17. A microphone package comprising the dust-proof structure of any one of claims 1 to 16, wherein the dust-proof structure is fixed to a sound hole of the microphone package;

18. An electronic device comprising the microphone package structure of claim 17.