CN211047218U

CN211047218U - Dustproof structure, microphone packaging structure and electronic equipment

Info

Publication number: CN211047218U
Application number: CN201922492399.0U
Authority: CN
Inventors: 畠山庸平; 林育菁
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-07-17
Anticipated expiration: 2029-12-31

Abstract

The utility model discloses a dustproof construction, microphone packaging structure and electronic equipment, include: the carrier layer is provided with a through hole in the middle; the film body layer comprises a grid structure and a connecting part arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting part is connected to the carrier layer; and the warpage compensation layer is fixed on one side of the carrier layer, which is far away from the film body layer, and the thermal expansion coefficient of the warpage compensation layer is lower than that of the carrier layer. The utility model discloses a technological effect lies in, is less than the warpage compensation layer of carrier layer through setting up thermal expansion coefficient, effectively suppresses the warpage that dustproof construction takes place in the installation.

Description

Dustproof structure, microphone packaging structure and electronic equipment

Technical Field

The utility model relates to a MEMS microphone technical field, more specifically relates to a dustproof construction, microphone packaging structure and electronic equipment.

Background

The microphone is provided with a dust-proof structure, which is a device capable of preventing foreign substances such as powder, particles, etc. from entering to cause a false reaction of the microphone and allowing sound waves to pass through.

The dustproof structure is composed of different materials, and the thermal expansion coefficients of the different materials are different. In the mounting process of the dust-proof structure, the dust-proof structure is warped during heat treatment. This makes the installation of the dust-proof structure more difficult.

Therefore, a new technical solution is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dustproof construction, microphone packaging structure and electronic equipment's new technical scheme.

According to the utility model discloses an aspect provides a dustproof construction, include:

the carrier layer is provided with a through hole in the middle;

the film body layer comprises a grid structure and a connecting part arranged around the grid structure, the grid structure covers one end of the through hole, and the connecting part is connected to the carrier layer;

and the warpage compensation layer is fixed on one side of the carrier layer, which is far away from the film body layer, and the thermal expansion coefficient of the warpage compensation layer is lower than that of the carrier layer.

Optionally, the film body layer is made of a metal material, the carrier layer is made of an organic material, and the thermal expansion coefficient of the warpage compensation layer is the same as that of the film body layer.

Optionally, the lattice structure comprises an elastically stretchable structure in a direction of a plane in which the lattice structure is located.

Optionally, the elastic coefficient of the lattice structure has anisotropy.

Optionally, the open area ratio varies throughout the lattice structure.

Optionally, a stress relaxation portion is provided at a position of the carrier layer fixed to the connection portion.

Optionally, the material of the film body layer is metallic glass.

Optionally, the material of the carrier layer is epoxy or PI.

Optionally, the warpage compensation layer is also fixed to a side of the carrier layer.

According to another aspect of the present invention, there is provided a microphone packaging structure, comprising any one of the above dustproof structures, wherein the dustproof structure is fixed on a sound hole of the microphone packaging structure;

or, the dustproof structure covers the MEMS chip in the microphone packaging structure.

According to another aspect of the present invention, an electronic device is provided, which includes the above microphone package structure.

According to one embodiment of the present disclosure, by providing the warpage compensation layer having a lower thermal expansion coefficient than the carrier layer, warpage deformation of the dust-proof structure occurring during mounting is effectively suppressed.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

Fig. 1 is a sectional view of a dustproof structure according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of a membrane layer structure according to an embodiment of the present invention.

Fig. 3 is a schematic structural view of a carrier layer side surface of the present invention to which a warpage compensation layer is also fixed.

Fig. 4 is a schematic structural diagram of a microphone package structure according to an embodiment of the present disclosure, where a dust-proof structure is disposed inside a sound hole on a substrate.

Fig. 5 is a schematic structural diagram of a dustproof structure disposed at a MEMS chip on a microphone packaging structure substrate according to an embodiment of the disclosure.

In the figure, 1 is a membrane layer, 11 is a connecting part, 12 is a grid structure, 2 is a carrier layer, 3 is a warpage compensation layer, 4 is a sound hole, and 5 is a MEMS chip.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

According to an embodiment of the present disclosure, there is provided a dust-proof structure, as shown in fig. 1 and 2, including:

the carrier layer 2 is provided with a through hole in the middle;

the membrane layer 1 comprises a grid structure 12 and a connecting part 11 arranged around the grid structure 12, the grid structure 12 covers one end of the through hole, and the connecting part 11 is connected to the carrier layer 2;

and a warpage compensation layer 3, wherein the warpage compensation layer 3 is fixed on at least one side of the carrier layer 2 far away from the film body layer 1, and the thermal expansion coefficient of the warpage compensation layer 3 is lower than that of the carrier layer 2.

In this embodiment, the film body layer 1 and the carrier layer 2 form the basic structure of the dust-proof structure, the warpage compensation layer 3 is fixed to the bottom of the carrier layer 2, and the Coefficient of Thermal Expansion (CTE) of the warpage compensation layer 3 is lower than that of the carrier layer 2.

The mesh structure 12 is capable of blocking the passage of particles such as dust and the like, and of passing sound waves. For example, the connection part 11 is enclosed in the film body layer 1 formed outside the lattice structure 12, and the lattice structure 12 may be a regular or irregular shape such as a rectangle, a triangle, or an ellipse as a whole.

During the mounting of the dust-proof structure, the carrier layer 2 and the film body layer 1 may warp the entire structure due to the heat treatment process during the mounting. While the warpage compensation layer 3 in this embodiment has a lower coefficient of thermal expansion than the carrier layer 2, and is subjected to heat during the process, the warpage compensation layer 3 has a smaller amount of deformation than the carrier layer 2. This can restrict the carrier layer 2 from occurring while effectively suppressing the warp deformation of the structure of the dust-proof structure itself.

For example, the warpage compensation layer 3 is fixed to the carrier layer 2, and during the warpage of the carrier layer 2, the warpage compensation layer 3 deforms to a smaller extent, which limits the warpage of the carrier layer 2.

In one embodiment, the film body layer 1 is a metal material, the carrier layer 2 is an organic material, and the warpage compensation layer 3 has the same coefficient of thermal expansion as the film body layer 1.

In this embodiment, the membrane body layer 1 is a metallic material and the carrier layer 2 is an organic material. The thermal expansion coefficient of metallic materials is lower than that of organic materials and greatly differs. In the process of mounting the dustproof structure, the carrier layer 2 is greatly deformed by the heat treatment process, and the deformation of the membrane layer 1 is small. The warpage compensation layer 3 fixed to the lower portion of the carrier layer 2 has the same thermal expansion coefficient as that of the film body layer 1, and for example, the warpage compensation layer 3 may be a metal material or other material having the same thermal expansion coefficient as that of the film body layer 1. Alternatively, the warpage compensation layer 3 is made of a material having a thermal expansion coefficient close to that of the film body layer 1. Thus, the warp compensation layer 3 is substantially free from warp deformation. The warpage compensation layer 3 is fixed with the carrier layer 2, so that the warpage of the carrier layer 2 can be effectively limited, and the deformation amount of the carrier layer 2 is reduced. Therefore, the dustproof structure can be effectively prevented from warping, and the installation reliability of the dustproof structure is ensured.

For example, the film body layer 1 is a metal film, and the support layer 2 is an organic film. In such a dust-proofing structure, the thermal expansion coefficients of the carrier layer 2 and the film body layer 1 are greatly different. In the process of installing the dustproof structure, the dustproof structure is influenced by heat generated in the heat treatment process, and the carrier layer 2 generates large deformation, so that the dustproof structure is warped and difficult to install. For example, the dust-proof structure is fixed by thermal bonding during installation. By fixing the dust-proof structure using a thermosetting adhesive, the dust-proof structure may be affected by heat during mounting. In the above example, the warpage-compensating layer 3 is fixed to the bottom of the carrier layer 2, and the same material as the film body layer 1 is used for the warpage-compensating layer 3, so that the coefficient of thermal expansion of the warpage-compensating layer 3 is lower than that of the carrier layer 2. The warpage compensation layer 3 is substantially not deformed during the heat application, so that the deformation of the carrier layer 2 caused by heat can be suppressed. The dustproof structure is not warped. Further, the mounting process of the dust-proof structure becomes easier.

In one example, as shown in fig. 3, the carrier layer 2 is also fixed with the warpage compensation layer 3 at its side.

The carrier layer 2 is deformed after the carrier layer 2 is subjected to the heat of the heat treatment process. The deformation of the carrier layer 2 takes place as a whole of the structure of the carrier layer 2. In the case where the warpage-compensating layer 3 restricts the deformation of the carrier layer 2 from the bottom of the carrier layer 2, the warpage-compensating layer 3 is also fixed at the side of the carrier layer 2. A structure is formed in which the warpage-compensating layer 3 wraps the bottom and sides of the carrier layer 2. Thus, the deformation of the carrier layer 2 can be limited to the maximum extent through the warpage compensation layer 3, and the dustproof structure is effectively prevented from warping.

For example, the heat generated in the heat treatment process affects the dust-proof structure during the installation of the dust-proof structure. The carrier layer 2 expands in volume by heat and changes its shape. The change in volume of the warpage-compensating layer 3 under the same influence of heat is negligible with respect to the carrier layer 2. The warpage compensation layer 3 limits the expansion of the carrier layer 2 from the bottom and the sides of the carrier layer 2 and avoids an excessive amount of deformation of the carrier layer 2, so that the dust-proof structure is not warped.

In one embodiment, the lattice structure 12 comprises an elastically stretchable structure in the direction of the plane in which the lattice structure 12 is located.

The mesh structure 12 is a structure for placing foreign matter such as powder from the outside into the apparatus and passing sound waves among the structures of the dustproof structure. The foreign object entering the equipment can cause the equipment to receive abnormal information and generate wrong reaction or instruction. In the case where the dustproof structure is warped due to the influence of heat during the installation of the dustproof structure, the deformed dustproof structure may damage the structure of the lattice structure 12. Thus, the dustproof structure loses its function.

In this example, the lattice structure 12 is provided with an elastically stretchable structure which is arranged in a plane direction in which the lattice structure 12 is located. The mesh structure 12 is the film body layer 1, and may be an elastic expansion structure disposed along the plane direction of the film body layer 1, and the elastic expansion structure can elastically expand and contract in this direction.

For example, the lattice structure 12 is provided with an elastic expansion structure, or the lattice structure 12 is an elastic expansion structure. For example, the elastic expansion structure is a net structure. This can satisfy the function that the mesh structure 12 prevents foreign matters such as dust, powder from entering and sound waves can pass through, and the mesh structure 12 can also realize elastic expansion and contraction.

In the installation process of the dustproof structure and the installation process of the heat treatment, the warp deformation of the dustproof structure caused by the influence of heat can extrude the grid structure 12, and the grid structure 12 can deform. In the case where the lattice structure 12 is capable of elastic expansion, the lattice structure 12 of the elastic expansion structure is contracted when the lattice structure 12 is extruded, or the elastic expansion structure is stretched when the lattice structure 12 is stretched. Because the lattice structure 12 has the ability to stretch, the lattice structure 12 is not damaged during the compression or stretching process. But also can be recovered due to the self expansion and contraction capability.

In addition, wrinkles may be generated in the mesh structure 12 due to stress during the warping of the dust-proof structure. The provision of the elastically stretchable structure in this example effectively prevents the grid structure 12 from being wrinkled.

For example, the lattice structure 12 is wrinkled after being stressed, and the lattice structure 12 is restored to the original structure without wrinkling under the action of the elastic expansion structure.

In one example, the elastic modulus of the lattice structure 12 has an anisotropy.

Anisotropy refers to the difference in material properties in different directions of the substance, for example, the physical properties of the lattice structure 12 itself differ along different directions of the lattice structure 12. The elasticity of the lattice structure 12 in the direction in which the film body layer 1 is located may be set by setting the elastic modulus of the lattice structure 12 in the direction. It is also possible to set the modulus of elasticity of the lattice structure 12 in the direction perpendicular to the plane of the film body layer 1.

For example, when the dustproof structure is warped, the film body layer 1 is deformed by pressing or stretching. During the deformation process, different deformations are generated in different directions of the grid structure 12. In this example, the elastic coefficients in different directions are set by the anisotropy of the mesh structure 12, so that the mesh structure 12 can be adapted to different degrees of deformation in different directions. Thus, the deformation of the grid structure 12 which cannot be recovered due to extrusion and stretching can be effectively avoided. Or the rigidity of the grid structure 12 is too high during the extrusion and stretching processes, so that the deformation destroys the structures except the grid structure 12. The dustproof structure is ensured not to be damaged in the warping process.

In addition, wrinkles may be generated in the mesh structure 12 due to stress during the warping of the dust-proof structure. The deformation is accommodated everywhere by the anisotropy of the lattice structure 12. And also, by setting the elastic coefficient of the lattice structure 12 in the vertical direction, displacement in the vertical direction due to deformation of the dust-proof structure during stress can be suppressed.

In one embodiment, the open area ratio varies throughout the lattice structure 12.

The mesh structure 12 is provided as a mesh structure capable of preventing foreign matter such as dust from entering and allowing sound waves to pass therethrough. For example, the lattice structure 12 is a lattice structure that passes sound waves. Meshes of different sizes on the lattice structure have different effects on the passage of sound waves. A smaller mesh creates a greater viscous resistance to passing sound waves. The larger mesh size does not prevent foreign matter such as dust from entering.

Therefore, the dustproof structure can be made to exhibit an optimum effect by adjusting the aperture ratio at each location of the mesh structure 12 to a set level. For example, the aperture ratio is adjusted to adjust air viscous resistance, thereby adjusting the frequency characteristics of the MEMS microcomputer in which the dust-proof structure is located.

In one embodiment, a stress relief is provided at a position of the carrier layer 2 fixed to the connection portion 11.

In the process of warping of the dustproof structure, the warping degree of the lower portion is large. The stress generated by the warp deformation is the largest at the carrier layer 2, and the stress transmitted from the carrier layer 2 to the film body layer 1 is the largest.

In this example, the stress relaxation portion is provided at a position of the carrier layer 2 fixed to the connection portion 11. The stress relaxation portion can control the stress transmitted to the film body layer 1 to be maintained at a certain level and to be reduced with time. The stresses acting on the lattice structure 12 are thus reduced. Wrinkles of the lattice structure 12 due to stress are avoided.

In one example, the material of the film body layer 1 is metallic glass.

The film body layer 1 is the uppermost structure of the dustproof structure, and the film body layer 1 is most easily subjected to external force applied from the outside during installation or use of the dustproof structure. For example, pressing of other members, pressing of a dust-proof structure at the time of mounting, and the like.

In this example, the material of the film body layer 1 is made of metallic glass. Therefore, the mechanical strength of the dustproof structure can be enhanced, and the capacity of bearing external force is enhanced. In addition, in the process of warping of the dust-proof structure, the film body layer 1 having a higher structural strength can suppress warping and reduce distortion. This can further protect the structure of the dust-proof structure from being damaged.

In one example, the material of the carrier layer 2 is epoxy or PI. Epoxy resins are among the thermosetting plastics. PI is polyimide, and has stable molecular main chain structure, good heat resistance, radiation resistance and good mechanical properties. The structure strength and the heat deformation resistance of the dustproof structure are improved.

In the process of installing the dustproof structure, a heat treatment process can be selected for fixing. By providing the carrier layer 2 as an epoxy material, the carrier layer 2 itself can be adhesively secured to the secured location by heat treatment without the use of other adhesives. Similarly, the carrier layer 2 and the film body layer 1 may be fixed without using a separate adhesive. Thus, the thickness of the dustproof structure after being fixed can be reduced, and the integral thinning is facilitated.

According to an embodiment of the present invention, a microphone package structure is provided, which includes the above-mentioned dustproof structure, and the dustproof structure is fixed on the sound hole 4 of the microphone package structure;

or, the dustproof structure covers the MEMS chip 5 in the microphone packaging structure.

Generally, a microphone package structure includes a case forming a receiving cavity and a substrate fixed to the case. The sound hole 4 may be provided in the substrate or in the housing.

In this embodiment, the dustproof structure may be fixed to the sound hole 4 from the outside of the microphone package structure, so as to protect components in the microphone package structure from the outside.

As shown in fig. 4, the dust-proof structure may be fixed to the sound hole 4 from inside the microphone package structure, so as to protect components of the microphone package structure from inside.

As shown in fig. 5, the dust-proof structure may be fixed to the substrate to protect the sound hole 31 and the inside of the microphone package. The MEMS chip 5 is fixed by a dust-proof structure.

Alternatively, the dustproof structure is fixed inside the microphone packaging structure and covers the MEMS chip 5. This can protect the MEMS chip 5. In this structure, the dust-proof structure can be fixed to the substrate on which the MEMS chip 5 is provided, and the cover can be formed. The dust-proof structure may be fixed to the substrate of the MEMS chip 5 to form a coating. The above structure can provide a protective effect to the MEMS chip 5.

The microphone packaging structure can effectively prevent the damage of the dustproof structure caused by heating in the microphone installation and use processes. And can form the protection to the components and parts in the microphone. For example, the MEMS chip 5 is protected from contamination such as external dust.

According to an embodiment of the present invention, there is provided an electronic device including the microphone package structure described above.

The electronic equipment comprises the microphone packaging structure and has all the advantages of the microphone packaging structure. For example, the electronic device may be a sound device, a mobile phone, a computer, or the like.

Although certain specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A dustproof structure, characterized by comprising:

the carrier layer is provided with a through hole in the middle;

2. The dustproof structure according to claim 1, wherein the film body layer is a metal material, the carrier layer is an organic material, and a coefficient of thermal expansion of the warpage compensation layer is the same as a coefficient of thermal expansion of the film body layer.

3. The dustproof structure according to claim 1, wherein the lattice structure comprises an elastic expansion structure in a plane direction in which the lattice structure is located.

4. The dustproof structure according to claim 3, wherein the elastic coefficient of the lattice structure has anisotropy.

5. The dustproof structure according to claim 1, wherein the aperture ratio is different at each location of the lattice structure.

6. The dust-proof structure according to claim 1, wherein a stress relaxing portion is provided at a position of the carrier layer fixed to the connecting portion.

7. The dustproof structure according to claim 1, wherein the material of the film body layer is metallic glass.

8. The dust-proof structure of claim 1, wherein the material of the carrier layer is epoxy or PI.

9. The dust-proof structure of claim 1, wherein said warpage-compensating layer is also fixed to a side surface of said carrier layer.

10. A microphone package comprising the dust-proof structure according to any one of claims 1 to 9, wherein the dust-proof structure is fixed to a sound hole of the microphone package;

11. An electronic device comprising the microphone package structure of claim 10.