CN111711909B - Miniature microphone dust keeper and MEMS microphone - Google Patents
Miniature microphone dust keeper and MEMS microphone Download PDFInfo
- Publication number
- CN111711909B CN111711909B CN202010621362.8A CN202010621362A CN111711909B CN 111711909 B CN111711909 B CN 111711909B CN 202010621362 A CN202010621362 A CN 202010621362A CN 111711909 B CN111711909 B CN 111711909B
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- hole
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- protective film
- miniature microphone
- miniature
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- 239000000428 dust Substances 0.000 title claims description 9
- 230000001681 protective effect Effects 0.000 claims abstract description 40
- 230000008093 supporting effect Effects 0.000 claims abstract description 20
- 229920000642 polymer Polymers 0.000 claims abstract description 15
- 238000001914 filtration Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 230000002209 hydrophobic effect Effects 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 46
- 238000000034 method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 239000012528 membrane Substances 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004184 polymer manufacturing process Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention provides a miniature microphone dustproof device and an MEMS (micro-electromechanical systems) microphone, wherein the miniature microphone dustproof device comprises a support bracket and an entering protective film arranged on the support bracket; wherein the support bracket is formed with a through hole, and the entrance protection film covers the through hole when viewed from above; and the supporting bracket and/or the entering protective film are made of polymer, and the difference of the thermal expansion coefficients of the supporting bracket and the entering protective film is within a preset range. The invention can effectively solve the problem that the film structure on the existing dustproof device of the miniature microphone is bent under the high-temperature environment.
Description
Technical Field
The invention relates to the technical field of miniature microphone dust prevention, in particular to a miniature microphone dust prevention device and an MEMS (micro-electromechanical systems) microphone.
Background
In order to prevent the chip inside the microphone from being affected by external powder, particles and moisture, and therefore reduce the service life of the microphone, in general, a miniature microphone dust-proof device needs to be designed at a communication position (such as a sound hole) between the inside of the microphone and the outside, and the microphone chip is separated from the outside environment through the miniature microphone dust-proof device, so that the microphone chip is protected.
However, the conventional microphone micro-microphone dust-proof device is made of a plurality of different materials, and because the thermal expansion coefficients of the materials are different, during the installation process of the microphone dust-proof device, especially during the heat treatment process, the interior of the microphone dust-proof device (mainly at the interface of the materials) generates a strong thermal stress, and for the membrane structure (protective membrane), the thermal stress can cause the membrane structure to buckle and cause uncontrollable deformation, and further cause irregular wrinkles of the meshes on the membrane structure, thereby reducing the use effect and the service life.
In view of the above technical problems, a method for preventing buckling of a thin film structure in a high temperature environment is needed.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a micro microphone dust-proof device and an MEMS microphone, so as to solve the problem that the thin film structure on the conventional micro microphone dust-proof device is bent under a high temperature environment.
The miniature microphone dustproof device provided by the embodiment of the invention comprises a support bracket and an entering protective film arranged on the support bracket; wherein,
the supporting bracket is provided with a through hole, and the entering protective film covers the through hole when viewed from top; and,
the supporting bracket and/or the entering protective film are made of polymer, and the difference of the thermal expansion coefficients of the supporting bracket and the entering protective film is within a preset range.
Furthermore, it is preferable that the support bracket and the entrance protection film are made of the same polymer.
In addition, it is preferable that the entry protection film includes a connection portion and a filter portion, and the filter portion is connected to the support bracket through the connection portion; and the filtering part corresponds to the upper and lower positions of the through hole.
In addition, preferably, the cross sections of the filtering part and the through hole are both circular structures; and the meshes on the filtering part are in a circular, polygonal or special-shaped structure.
In addition, it is preferable that the mesh on the filter part has a honeycomb topology; and,
each regular hexagon in the honeycomb topological structure is formed by six regular triangle topologies.
Furthermore, it is preferable that the filter portion is made of a material having a hydrophobic property.
Further, it is preferable that the entry protection film covers one end of the through hole or is provided in the through hole.
In another aspect, the present invention further provides a MEMS microphone, which includes a substrate, a housing, a MEMS chip, and the above-mentioned micro microphone dust-proof device; a packaging structure is formed between the substrate and the shell, and the MEMS chip is arranged on the substrate in the packaging structure; and the substrate is provided with a sound hole corresponding to the upper position and the lower position of the MEMS chip, and the miniature microphone dustproof device is arranged outside the sound hole or between the sound hole and the MEMS chip.
In addition, it is preferable that the micro microphone dust-proof device is disposed between the acoustic hole and the MEMS chip through the support bracket; and the entrance protection film is disposed between the acoustic hole and the MEMS chip.
According to the technical scheme, the filter part is arranged on the protective film, so that the micro microphone dustproof device can effectively prevent external powder and particles from entering the microphone to influence the performance of the microphone chip; in addition, the difference value of the thermal expansion coefficients of the support bracket and the protective film is within a preset range by selecting the materials of the support bracket and the protective film, so that the buckling of the film structure in a high-temperature environment can be effectively avoided; in addition, the filter part is made of a material with hydrophobic property, so that the waterproof effect of the filter part can be realized, and a microphone chip in the microphone can be protected.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a front sectional view of a dust-proof device for a micro microphone according to an embodiment of the present invention;
fig. 2 is a top view of a dust-proof device for a micro microphone according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of a filter portion according to an embodiment of the present invention;
fig. 4(a) is a front sectional view of a microphone according to an embodiment of the present invention;
fig. 4(b) is a front sectional view of a microphone according to another embodiment of the present invention.
Wherein the reference numerals include: support bracket 11, access protection film 12, connection 121, filter 122, substrate 13, MEMS chip 14, housing 15, acoustic aperture 16, honeycomb topology 17, through-hole 18.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
To describe the structure of the miniature microphone dust-proof device of the present invention in detail, specific embodiments of the present invention will be described below with reference to the accompanying drawings.
Fig. 1 shows a front cross-sectional structure of a micro microphone dust-proof device provided by an embodiment of the present invention, and as can be seen from fig. 1, the micro microphone dust-proof device provided by the present invention comprises a supporting bracket 11 for supporting, and an entrance protection film 12 disposed on the supporting bracket 11, wherein the entrance protection film 12 allows air to pass through, but blocks external powder, particles, etc. from passing through; the support bracket 11 has a hollow structure, i.e., a through hole 18 is formed at the center, and the through hole 18 is covered by the protective film 12 in a plan view; and, the difference of the thermal expansion coefficient of the support bracket 11 and the entrance protective film 12 is within a preset range.
It should be noted that the preset range is set according to actual requirements, as long as the thermal expansion coefficients of the support bracket 11 and the entering protective film 12 are the same or similar, so that the thermal stress at the interface between the support bracket 11 and the entering protective film 12 is significantly reduced in the heat treatment process of the micro microphone dust-proof device at high temperature, thereby preventing the entering protective film 12 from deforming. For example, the preset range of the difference between the thermal expansion coefficients of the support bracket 11 and the entrance protective film 12 may be set to ± 1 × 10 according to actual needs -6 Within/° c.
It should be noted that, because the supporting structure and the protective film of the miniature microphone dust-proof device have different functions, the supporting structure and the protective film of the conventional miniature microphone dust-proof device are usually made of two different materials, the supporting structure is usually made of a polymer, the protective film is usually made of a metal, and because the types of the polymer and the metal are different, the structure of the metal/polymer interface generates a strong thermal stress at a high temperature due to mismatch of Coefficients of Thermal Expansion (CTEs), thereby causing deformation of the protective film and reducing the use effect of the protective film. To solve this problem, a polymer member may be used for one of the support bracket 11 and the access protection film 12. It should be further noted that the polymer is a mixture in nature, and different substances can be doped according to actual requirements, so as to change the thermal expansion coefficient of the polymer, therefore, the components of the polymer can be selected according to the required thermal expansion coefficient, as long as the difference between the thermal expansion coefficients of the support bracket 11 and the protective film 12 is within a preset range.
Of course, it is also possible to use polymer parts for both the support bracket 11 and the access protection membrane 12; and, the difference of the thermal expansion coefficients of the support bracket 11 and the entrance protective film 12 is ensured to be within a preset range. Different substances can be doped according to actual requirements, so that the polymer has different effects, and therefore, corresponding polymer materials can be selected for the support bracket 11 and the protective film 12 according to the actual requirements, wherein the material for manufacturing the support bracket 11 has stronger support performance, the material for manufacturing the protective film 12 has stronger ductility (which is convenient for forming a mesh surface structure), and the difference between the thermal expansion coefficients of the two materials is within a preset range.
In addition, in order to further reduce the thermal stress inside the micro microphone dust-proof device, the supporting bracket 11 and the access protection film 12 may be made of the same polymer material, and the polymer has at least supporting property and ductility. It should be noted that the polymer manufacturing process is a relatively mature process in the prior art, such as the manufacturing of plastics, and the innovation point of the present invention lies in the application of the polymer performance, and therefore, the details about the polymer manufacturing process are not described herein again.
The entry protection film 12 may cover one end of the through hole 18, or may be provided in the through hole 18, for example, at the center in the depth direction of the through hole 18 so as to cover the through hole 18 in a plan view. In the case of the structure in which the ingress protection film 12 covers one end of the through hole 18 of the support bracket 11, the accurate assembly direction can be easily recognized in the process of assembling the micro microphone dust-proofing device to the microphone substrate. When the structure that the entering protective film 12 is arranged in the through hole 18 is adopted, in the process of assembling the micro microphone dustproof device on the substrate of the microphone, the installation direction does not need to be distinguished, the efficiency of the assembling process can be improved, and the entering protective film 12 is positioned in the through hole 18, so that the entering protective film 12 can be prevented from being damaged due to the fact that the entering protective film 12 is contacted in the assembling process and the transporting process. In the following description, a structure in which the entry protection film 12 covers one end of the through hole 18 will be described as an example.
In addition, fig. 2 shows a top view structure of the dust-proof device for the miniature microphone according to the embodiment of the present invention, as can be seen from fig. 2, the entrance protection film 12 includes a connecting portion 121 for connection and a filtering portion 122 for filtering external powder and particles, and the filtering portion 122 is connected to the support bracket 11 through the connecting portion 121; the filter portion 122 corresponds to the vertical position of the through hole 18. In the actual working process, outside sound signals enter the microphone through the filter part 122, and outside powder, particles and the like are blocked outside the microphone by the filter part 122, so that the dustproof effect is achieved.
Specifically, since the sound hole 16 of the microphone is generally circular, the cross sections of the filter portion 122 and the through hole 18 may be circular to achieve the matching between the micro microphone dust-proof device and the sound hole 16; in addition, the filter part 122 is provided with meshes having a circular, polygonal or irregular structure, thereby realizing a desired filtering effect.
More specifically, fig. 3 shows a partial enlarged structure of the filter portion 122 provided by the embodiment of the present invention, and as can be seen from fig. 3, the mesh on the filter portion 122 has a honeycomb topology 17; and, each regular hexagon within the cellular topology 17 is formed by six regular triangle topologies. By the design, the filter part 122 can be firmer on the premise of ensuring the filtering effect of the filter part 122, and the service life of the dustproof device of the miniature microphone can be further prolonged.
In addition, in order to prevent external moisture from entering the microphone through the filter portion 122 and damaging the microphone chip 14, the filter portion 122 may be made of a material having a hydrophobic property.
In addition, fig. 4(a) and 4(b) respectively show the front cross-sectional structures of MEMS microphones provided by two embodiments of the present invention, and as can be seen from fig. 4(a) and 4(b), the present invention further provides a MEMS microphone, which includes a substrate 13 for carrying a chip, a protective housing 15, a MEMS chip 14, and the above-mentioned micro microphone dust-proof device; wherein, an encapsulation structure is formed between the substrate 13 and the housing 15, and the MEMS chip 14 is disposed on the substrate 13 (fig. 4(a)) or on the protective film 12 (fig. 4(b)) within the encapsulation structure; moreover, the substrate 13 is provided with a sound hole 16 corresponding to the upper and lower positions of the MEMS chip 14, and the micro microphone dust-proof device is disposed outside the sound hole 16 or between the sound hole 16 and the MEMS chip 14 as long as the function of covering the sound hole 16 by the micro microphone dust-proof device is satisfied.
Specifically, when the miniature microphone dust-proof device is disposed between the sound hole 16 and the MEMS chip 14, the miniature microphone dust-proof device may be disposed between the sound hole 16 and the MEMS chip 14 by connecting the support bracket 11 with the substrate 13; also, the entrance protection film 12 is disposed between the acoustic hole 16 and the MEMS chip 14.
In this way, a channel formed by the sound hole 16 and the through hole 18 is formed, through which external sound signals enter the inside of the microphone, and external powder, particles and moisture are blocked by the filter 122 in the channel, so that the MEMS chip 14 inside the housing 15 is protected.
As can be seen from the above embodiments, the dust-proof device for a miniature microphone according to the present invention has at least the following advantages:
1. the filter part is arranged on the protective film, so that the influence of external powder and particles on the performance of the microphone chip caused by the fact that the external powder and the particles enter the microphone can be effectively avoided;
2. the difference value of the thermal expansion coefficients of the support bracket and the protective film is within a preset range by selecting the materials of the support bracket and the protective film, so that the buckling of the film structure in a high-temperature environment can be effectively avoided;
3. the filter part is made of the hydrophobic material, so that the waterproof effect of the filter part can be realized, and a microphone chip in the microphone is protected;
4. the mesh on the filtering part is designed into a honeycomb topological structure, so that the filtering part is firmer on the premise of ensuring the filtering effect of the filtering part, and the service life of the dustproof device of the miniature microphone is prolonged.
The dust-proof device for a miniature microphone and the MEMS microphone according to the present invention have been described above by way of example with reference to the accompanying drawings. However, it will be understood by those skilled in the art that various modifications may be made to the above-described miniature microphone dust-proof device and MEMS microphone of the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (7)
1. A miniature microphone dust keeper, characterized by, including supporting the bracket and setting up in the entering protective film of the said supporting the bracket; wherein,
the supporting bracket is provided with a through hole, the entry protection film covers one end of the through hole or is arranged in the through hole, and the entry protection film covers the through hole when viewed from top; and,
the supporting bracket and/or the entering protective film are polymer products, the supporting bracket and the entering protective film are made of different materials, and the difference value of the thermal expansion coefficients of the supporting bracket and the entering protective film is within a preset range;
the entering protective film comprises a connecting part and a filtering part, and meshes on the filtering part are of a honeycomb topological structure.
2. The miniature microphone dust keeper of claim 1,
the filter part is connected with the support bracket through the connecting part; and,
the filtering part corresponds to the upper and lower positions of the through hole.
3. The miniature microphone dust keeper of claim 1,
the cross sections of the filtering part and the through hole are both circular structures; and,
the meshes on the filtering part are in a circular, polygonal or special-shaped structure.
4. The miniature microphone dust keeper of claim 3,
each regular hexagon in the honeycomb topological structure is formed by six regular triangle topologies.
5. The miniature microphone dust keeper of claim 1,
the filter portion is made of a material having hydrophobic properties.
6. A MEMS microphone comprising a substrate, a housing, a MEMS chip, and the miniature microphone dust-proof device of any one of claims 1 to 5; wherein,
a packaging structure is formed between the substrate and the shell, and the MEMS chip is arranged on the substrate in the packaging structure; and,
the substrate is provided with a sound hole corresponding to the upper position and the lower position of the MEMS chip, and the miniature microphone dustproof device is arranged outside the sound hole or between the sound hole and the MEMS chip.
7. The microphone of claim 6,
the miniature microphone dust-proof device is arranged between the sound hole and the MEMS chip through the supporting bracket;
and the entrance protection film is disposed between the acoustic hole and the MEMS chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010621362.8A CN111711909B (en) | 2020-06-30 | 2020-06-30 | Miniature microphone dust keeper and MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010621362.8A CN111711909B (en) | 2020-06-30 | 2020-06-30 | Miniature microphone dust keeper and MEMS microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111711909A CN111711909A (en) | 2020-09-25 |
| CN111711909B true CN111711909B (en) | 2022-08-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010621362.8A Active CN111711909B (en) | 2020-06-30 | 2020-06-30 | Miniature microphone dust keeper and MEMS microphone |
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| Country | Link |
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| JP2010166286A (en) * | 2009-01-15 | 2010-07-29 | Yamaha Corp | Structure for mounting silicon microphone, and electronic apparatus |
| KR101158354B1 (en) * | 2011-12-29 | 2012-06-22 | (주)다빛다인 | Microphone package |
| CN208572438U (en) * | 2018-08-02 | 2019-03-01 | 瑞声声学科技(深圳)有限公司 | The terminal assembling structure of MEMS microphone |
| CN110972047A (en) * | 2019-12-31 | 2020-04-07 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111050258A (en) * | 2019-12-31 | 2020-04-21 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111131986A (en) * | 2019-12-31 | 2020-05-08 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205378162U (en) * | 2015-12-24 | 2016-07-06 | 昆山市飞荣达电子材料有限公司 | Electromagnetic -shielding type speaker mesh |
| CN110248298A (en) * | 2019-05-13 | 2019-09-17 | 苏州捷研芯纳米科技有限公司 | Silicon microphone and its processing method |
| CN111083623A (en) * | 2019-12-31 | 2020-04-28 | 歌尔股份有限公司 | MEMS device |
| CN110972046A (en) * | 2019-12-31 | 2020-04-07 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
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2020
- 2020-06-30 CN CN202010621362.8A patent/CN111711909B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010166286A (en) * | 2009-01-15 | 2010-07-29 | Yamaha Corp | Structure for mounting silicon microphone, and electronic apparatus |
| KR101158354B1 (en) * | 2011-12-29 | 2012-06-22 | (주)다빛다인 | Microphone package |
| CN208572438U (en) * | 2018-08-02 | 2019-03-01 | 瑞声声学科技(深圳)有限公司 | The terminal assembling structure of MEMS microphone |
| CN110972047A (en) * | 2019-12-31 | 2020-04-07 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111050258A (en) * | 2019-12-31 | 2020-04-21 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
| CN111131986A (en) * | 2019-12-31 | 2020-05-08 | 歌尔股份有限公司 | Dustproof structure, microphone packaging structure and electronic equipment |
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| CN111711909A (en) | 2020-09-25 |
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