CN111050258A - Dustproof structure, microphone packaging structure and electronic equipment - Google Patents

Dustproof structure, microphone packaging structure and electronic equipment Download PDF

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Publication number
CN111050258A
CN111050258A CN201911421939.4A CN201911421939A CN111050258A CN 111050258 A CN111050258 A CN 111050258A CN 201911421939 A CN201911421939 A CN 201911421939A CN 111050258 A CN111050258 A CN 111050258A
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CN
China
Prior art keywords
carrier
dust
dustproof
treatment
rough surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911421939.4A
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Chinese (zh)
Inventor
林育菁
池上尚克
畠山庸平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weifang Goertek Microelectronics Co Ltd
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to CN201911421939.4A priority Critical patent/CN111050258A/en
Publication of CN111050258A publication Critical patent/CN111050258A/en
Priority to PCT/CN2020/099383 priority patent/WO2021135129A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/001—Moulding aspects of diaphragm or surround

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Micromachines (AREA)
  • Dicing (AREA)

Abstract

The invention discloses a dustproof structure, a microphone structure and an electronic device, comprising: a carrier having a through hole formed in the middle thereof, the carrier being subjected to a hydrophobic treatment to form a hydrophobic portion at the bottom thereof; the membrane body, the membrane body includes lattice construction and centers on the connecting portion that lattice construction set up, lattice construction covers the one end of through-hole, connecting portion connect on the carrier, the bottom of carrier is for the carrier is kept away from the surface of membrane body. One technical effect of the present invention is that the adhesion force between the dust-proof structure and the transferred UV tape is reduced by hydrophobizing the surface of the carrier, so that the dust-proof structure can be more easily removed from the UV tape without damaging the dust-proof structure.

Description

Dustproof structure, microphone packaging structure and electronic equipment
Technical Field
The invention relates to the technical field of acoustoelectric technology, in particular to a dustproof structure, a microphone packaging structure and electronic equipment.
Background
In order to prevent foreign matters such as dust from affecting the MEMS device, a dust-proof structure is usually provided for protection. The dust-proof structure is required to undergo a series of operations from the manufacture to the installation at a set position. For example, it is necessary to pick up the dust-proof structure from a specific position to the mounting position.
The dust-proofing structure needs to be transferred onto the UV tape during the manufacturing process. After that, the dust-proof structure is picked up and placed to a set position. During the pick-up process, the pick-up operation is difficult due to the adhesive force between the dust-proof structure and the UV tape. There may be a case where the dust-proof structure cannot be normally removed from the UV tape in the pick-up operation, or the pick-up force is too large, and the dust-proof structure may be damaged.
Therefore, a new technical solution is needed to solve the above problems.
Disclosure of Invention
An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone package structure, and an electronic device.
According to a first aspect of the present invention, there is provided a dust-proof structure including:
a carrier having a through hole formed in the middle thereof, the carrier being subjected to a hydrophobic treatment to form a hydrophobic portion at the bottom thereof;
the membrane body, the membrane body includes lattice construction and centers on the connecting portion that lattice construction set up, lattice construction covers the one end of through-hole, connecting portion connect on the carrier, the bottom of carrier is for the carrier is kept away from the surface of membrane body.
Optionally, the hydrophobizing treatment comprises a fluorination treatment to form a fluorinated layer at the bottom of the support.
Optionally, the fluorination process comprises reactive ion etching in which a fluorine-containing gas is used.
Optionally, the fluorine-containing gas comprises SF6、XeF2、NF3、CF4Any one of them.
Optionally, the hydrophobizing treatment comprises treating the bottom of the support to a rough surface.
Optionally subjecting the bottom of the support to argon treatment to form the rough surface; alternatively, physical ion bombardment by an argon ion beam forms the rough surface.
Alternatively, the argon treatment is performed by one of Photolithograph, Dry-Etching.
Optionally, the rough surface is further subjected to a fluorination treatment.
According to a second aspect of the present invention, there is provided a microphone packaging structure, comprising the dust-proof structure described in any one of the above, the dust-proof structure being fixed on a sound hole of the microphone packaging structure;
or, the dustproof structure covers the MEMS chip in the microphone packaging structure.
According to a third aspect of the present invention, there is provided an electronic device including the microphone packaging structure described above.
According to one embodiment of the disclosure, the adhesion force of the dustproof structure and the transferred UV adhesive tape is reduced by performing hydrophobic treatment on the surface of the carrier, so that the dustproof structure is easier to remove from the UV adhesive tape without damaging the dustproof structure.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is an exploded view of a hydrophobic portion formed on a surface of a carrier of a dust-proof structure away from a membrane body in one embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a dust-proof structural section in which the hydrophobic portion is a fluorinated layer according to an embodiment of the present disclosure.
Fig. 3 is a schematic structural diagram of a dust-proof structure section in which a rough surface is formed on a surface of a carrier away from a film body in one embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of a microphone package structure according to an embodiment of the present disclosure, where a dust-proof structure is disposed inside a sound hole on a substrate.
Fig. 5 is a schematic structural diagram of a dustproof structure disposed at a MEMS chip on a microphone packaging structure substrate according to an embodiment of the disclosure.
In the figure, 1 is a membrane body, 2 is a carrier, 21 is a hydrophobic part, 21a is a fluoride layer, 21b is a rough surface, 31 is a sound hole, and 32 is a MEMS chip.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
According to an embodiment of the present disclosure, there is provided a dust-proof structure, as shown in fig. 1, including:
a carrier 2, a through hole being formed in the middle of the carrier 2, the carrier 2 being subjected to a hydrophobic treatment to form a hydrophobic portion 21 at the bottom of the carrier 2; the membrane body 1, the membrane body 1 includes the grid structure and centers on the connecting portion that the grid structure set up, the grid structure covers the one end of through-hole, connecting portion connect on carrier 2, the bottom of carrier 2 is carrier 2 keeps away from the surface of membrane body 1.
In this embodiment, after the carrier 2 is subjected to the hydrophobization treatment, the hydrophobic portion 21 is formed at the bottom of the carrier 2. For example, in the process of manufacturing the dust-proof structure, the dust-proof structure needs to be transferred to a UV tape. The hydrophobic portion 21 can reduce the adhesive force between the bottom of the carrier 2 and the UV tape, and the carrier 2 and the UV tape can be more easily separated after UV irradiation to the back surface of the UV tape. This makes it easier to pick up the dust-repellent structure from the UV tape. . And, need not exert too big power to pick up dustproof construction, avoid exerting too big power and leading to dustproof construction to be damaged when picking up
For example, in the process of manufacturing the dustproof structure, after the dustproof structure is transferred to the UV tape, the carrier 2 on the dustproof structure is adhered to the UV tape. When the dust-proof result is picked up, the UV irradiation is performed from the back side of the UV adhesive tape, and the hydrophobic structure 21 reduces the bonding force between the carrier 2 and the UV adhesive tape after the UV irradiation. This eliminates the need to apply excessive force to pick up the dust-proof structure, making the pick-up of the dust-proof structure easier.
In one embodiment, as shown in fig. 2, the hydrophobizing treatment includes a fluorination treatment to form a fluorinated layer 21a at the bottom of the support 2.
The fluorinated layer 21a makes the bottom of the carrier 2 hydrophobic, reducing the adhesion between the carrier 2 and the UV tape. It is easier to pick up the dust-proof structure transferred to the UV tape.
For example, the fluorination process includes reactive ion etching in which a fluorine-containing gas is used.
The bottom surface of the carrier 2 is etched by reactive ion etching using a fluorine-containing gas. The support 2 contains a large amount of organic material, and fluorine ions are bonded to the material of the support 2 to form a C-F bond, so that fluorine is bonded to the material of the bottom of the support 2 to form the fluoride layer 21 a.
The fluorination treatment by reactive ion etching using a fluorine-containing gas described above is performed by RIE.
In one embodiment, the fluorine-containing gas comprises SF6、XeF2、NF3、CF4Any one of them.
The fluorine-containing gas may further contain SF6、XeF2、NF3、CF4Any one of them. SF6、XeF2、NF3、CF4An ion impact can be formed on the bottom of the support 2 to generate the fluoride layer 21 a. The bottom of the carrier 2 may also be fluorinated by other fluorine-containing gas components, which can be selected by the person skilled in the art as desired.
In one embodiment, as shown in fig. 3, the hydrophobizing treatment includes treating the bottom of the support 2 into a rough surface 21 b. The bottom of the carrier 2 is processed to be a rough surface 21b, that is, the bottom of the carrier 2 is processed to be a rough surface, for example, the rough surface may have an uneven structure formed on the surface, or may have a plurality of regular or irregular recesses distributed on the surface, or may have a plurality of staggered or parallel ravines, jagged chases, or the like formed on the surface.
The bottom of the carrier 2 is treated to be a rough surface 21b, which can reduce the bonding area between the carrier 2 and the UV tape, and thus reduce the bonding force between the carrier 2 and the UV tape. Therefore, the dustproof structure can be picked up more easily and more labor-saving in the manufacturing process, and the dustproof structure is prevented from being damaged by overlarge force application in the picking process.
For example, in the process of manufacturing the dustproof structure, after the dustproof structure is transferred to the UV tape, the carrier 2 on the dustproof structure is adhered to the UV tape. When the dustproof result is picked up, UV irradiation is firstly carried out from the back of the UV adhesive tape. The rough surface 21b can reduce the area of adhesion between the carrier 2 and the UV tape, thereby reducing the adhesion between the carrier 2 and the UV tape. When the pick-up process is performed after the transfer, the carrier 2 and the UV tape are more easily separated. When picking up dustproof construction like this, need not exert too big power just can make carrier 2 on the dustproof construction separate with the UV sticky tape, realize picking up dustproof construction, avoid picking up the too big damage that causes dustproof construction of in-process application of force.
In one embodiment, the bottom of the carrier 2 is subjected to argon gas treatment to form the rough surface 21 b; alternatively, physical ion impact by the argon ion beam is performed to form the rough surface 21 b.
The argon gas treatment may be, for example, etching the bottom of the support 2 with argon gas to form the rough surface 21b on the bottom of the support 2.
Alternatively, the bottom of the support 2 is formed into the rough surface 21b by physical example impact of the argon ion beam on the bottom of the support 2.
The argon treatment can be performed by RIE.
The argon treatment can also be carried out, for example, by one of the methods of Photolithology, Dry-Etching.
The rough surface 21b formed by any mode in the embodiment can reduce the contact area between the carrier 2 and the UV adhesive tape, and can reduce the adhesive force between the carrier 2 and the UV adhesive tape, so that when the dustproof structure is picked up, the carrier 2 on the dustproof structure can be separated from the UV adhesive tape by applying a small force, the dustproof structure is picked up, and the damage to the dustproof structure caused by the overlarge force application in the picking process is avoided.
In one embodiment, the rough surface 21b is also fluorinated.
After the rough surface 21b is formed, the rough surface 21b is subjected to a fluorination treatment to form a fluorinated layer on the rough surface 21 b. In this way, the fluoride layer further reduces the adhesion between the support 2 and the UV tape on the basis that the structure of the rough surface 21b reduces the adhesion between the support 2 and the UV tape. Therefore, the force applied when the dustproof structure is picked up can be further reduced, and the dustproof structure is easier to pick up and is not easy to damage in the manufacturing process.
The person skilled in the art can adjust the roughness of the rough surface 21b and the fluorinated layer after the fluorination treatment according to the actual situation, so that the adhesion between the carrier 2 and the UV tape can be adjusted to a set value. Therefore, the dustproof structure can be easier to pick up and is not easy to damage in the manufacturing process. It is also possible to avoid insufficient adhesion between the support 2 and the UV tape due to excessive hydrophobization.
According to an embodiment of the present invention, there is provided a microphone package structure, including the above-mentioned dust-proof structure, the dust-proof structure being fixed on the sound hole 31 of the microphone package structure;
alternatively, the dust-proof structure covers the MEMS chip 32 in the microphone package structure.
Generally, a microphone package structure includes a case forming a receiving cavity and a substrate fixed to the case. The sound hole 31 may be provided in the substrate or in the housing.
In this embodiment, the dustproof structure may be fixed to the sound hole 31 from the outside of the microphone package structure, so as to protect components in the microphone package structure from the outside.
As shown in fig. 4, the dust-proof structure may be fixed to the sound hole 31 from inside the microphone package structure, and may protect components of the microphone package structure from inside.
As shown in fig. 5, the dust-proof structure may be fixed to the substrate to protect the sound hole 31 and the inside of the microphone package. The MEMS chip 32 is fixed by a dust-proof structure.
Alternatively, the dustproof structure is fixed inside the microphone packaging structure and covers the MEMS chip 32. This can protect the MEMS chip 32. In this structure, the carrier 2 can be fixed to the substrate on which the MEMS chip 32 is provided, and can be coated. The carrier 2 may be fixed to the substrate of the MEMS chip 32 to form a package. The above structure can provide a protective effect to the MEMS chip 32.
The microphone packaging structure can effectively prevent the damage of the dustproof structure caused by heating in the microphone installation and use processes. And can form the protection to the components and parts in the microphone. For example, the MEMS chip 32 is protected from contamination such as external dust.
According to an embodiment of the present disclosure, there is provided an electronic device including the microphone packaging structure described above.
The electronic equipment comprises the microphone and has all the advantages of the microphone packaging structure. For example, the electronic device may be a sound device, a mobile phone, a computer, or the like.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (10)

1. A dustproof structure, characterized by comprising:
a carrier having a through hole formed in the middle thereof, the carrier being subjected to a hydrophobic treatment to form a hydrophobic portion at the bottom thereof;
the membrane body, the membrane body includes lattice construction and centers on the connecting portion that lattice construction set up, lattice construction covers the one end of through-hole, connecting portion connect on the carrier, the bottom of carrier is for the carrier is kept away from the surface of membrane body.
2. The dustproof structure according to claim 1, wherein the hydrophobizing treatment comprises a fluorination treatment to form a fluorinated layer at the bottom of the support.
3. The dust-proof structure according to claim 2, wherein the fluorination process comprises reactive ion etching in which a gas containing fluorine is used.
4. The dust-proof structure according to claim 3, wherein the fluorine-containing gas contains SF6、XeF2、NF3、CF4Any one of them.
5. The dustproof structure according to claim 1, wherein the hydrophobizing treatment comprises treating a bottom of the carrier to a rough surface.
6. The dustproof structure according to claim 5, wherein the bottom of the carrier is subjected to argon gas treatment to form the rough surface; alternatively, physical ion bombardment by an argon ion beam forms the rough surface.
7. The dustproof structure according to claim 6,
the argon treatment was performed by one of Photolithograph, Dry-Etching.
8. The dustproof structure of claim 7, wherein the rough surface is further subjected to a fluorination treatment.
9. A microphone package comprising the dust-proof structure according to any one of claims 1 to 8, wherein the dust-proof structure is fixed to a sound hole of the microphone package;
or, the dustproof structure covers the MEMS chip in the microphone packaging structure.
10. An electronic device comprising the microphone package structure of claim 9.
CN201911421939.4A 2019-12-31 2019-12-31 Dustproof structure, microphone packaging structure and electronic equipment Pending CN111050258A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201911421939.4A CN111050258A (en) 2019-12-31 2019-12-31 Dustproof structure, microphone packaging structure and electronic equipment
PCT/CN2020/099383 WO2021135129A1 (en) 2019-12-31 2020-06-30 Dust-proof structure, microphone packaging structure, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911421939.4A CN111050258A (en) 2019-12-31 2019-12-31 Dustproof structure, microphone packaging structure and electronic equipment

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CN111050258A true CN111050258A (en) 2020-04-21

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WO (1) WO2021135129A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111711912A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711910A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711909A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711911A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
WO2021135129A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Dust-proof structure, microphone packaging structure, and electronic device

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CN105217563A (en) * 2014-06-03 2016-01-06 联华电子股份有限公司 The engraving method of microcomputer electric component
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Publication number Priority date Publication date Assignee Title
WO2021135129A1 (en) * 2019-12-31 2021-07-08 潍坊歌尔微电子有限公司 Dust-proof structure, microphone packaging structure, and electronic device
CN111711912A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711910A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711909A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711911A (en) * 2020-06-30 2020-09-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711910B (en) * 2020-06-30 2022-02-25 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone
CN111711909B (en) * 2020-06-30 2022-08-09 歌尔微电子有限公司 Miniature microphone dust keeper and MEMS microphone

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