CN110676207B - Separation device and separation method - Google Patents
Separation device and separation method Download PDFInfo
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- CN110676207B CN110676207B CN201910925053.7A CN201910925053A CN110676207B CN 110676207 B CN110676207 B CN 110676207B CN 201910925053 A CN201910925053 A CN 201910925053A CN 110676207 B CN110676207 B CN 110676207B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
Abstract
The present application relates to a separation device and a separation method. The separating device comprises a rolling piece, the rolling piece comprises a first bonding portion and an adsorption portion, the first bonding portion and the adsorption portion are arranged along the rolling direction of the rolling piece, the first bonding portion is connected to at least one side of the adsorption portion, the first bonding portion is used for bonding the flexible substrate of the virtual area, the adsorption portion is used for adsorbing the flexible substrate of the effective area, and then the flexible substrate and the rigid substrate of the effective area are separated when the rolling piece rolls. The application can effectively reduce the production cost of separation.
Description
Technical Field
The present disclosure relates to display technologies, and in particular, to a separation device and a separation method.
Background
With the development of the display industry, flexible display technologies have emerged. In a flexible display panel, after other functional film layers are processed and manufactured on a flexible layer formed on a rigid substrate, the display panel is separated from the rigid substrate, so that the display panel is flexible.
At present, the method for separating the display panel from the rigid substrate usually adopts a laser lift-off method. However, laser lift-off equipment is expensive, which is not favorable for reducing production cost.
Disclosure of Invention
In view of the above, it is necessary to provide a separation apparatus and a separation method that can reduce production costs.
A separation device is used for separating a rigid substrate and a flexible substrate of a display mother board, the flexible substrate is formed on the rigid substrate, the display mother board is provided with a dummy area and an effective area surrounded by the dummy area, the separation device comprises a rolling piece, the rolling piece comprises a first bonding portion and an adsorption portion, the first bonding portion and the adsorption portion are arranged along the rolling direction of the rolling piece, the first bonding portion is connected to at least one side of the adsorption portion, the first bonding portion is used for bonding the flexible substrate of the dummy area, the adsorption portion is used for adsorbing the flexible substrate of the effective area, and then the flexible substrate of the effective area and the rigid substrate are separated when the rolling piece rolls.
In one embodiment, the rolling member has a first surface, the first surface is a rollable surface and includes a first separation surface and a second separation surface, the first separation surface and the second separation surface are connected through at least one common edge, the first separation surface is an outer surface of the suction portion, and the second separation surface is an outer surface of the first bonding portion;
the separation device further comprises first bonding glue, the first bonding glue is bonded on the second separation surface, an adsorption hole is formed in the adsorption part, and the adsorption hole penetrates through the first separation surface.
In one embodiment, the first bonding parts are positioned at two opposite sides of the adsorption part.
In one embodiment, the rolling member further comprises a second bonding portion, the second bonding portion and the first bonding portion jointly surround the suction portion, and the second bonding portion is also used for bonding the flexible substrate of the dummy area.
In one embodiment, the outer surface of the rolling element is a cylindrical surface, and the first surface is a side surface of the cylindrical surface.
In one embodiment, the rolling member further has a second surface disposed opposite the first surface, the second surface being planar.
A separation method for separating a rigid substrate and a flexible substrate for separating a display mother board, the flexible substrate being formed on the rigid substrate, the display mother board having a dummy area and an active area surrounded by the dummy area, the separation method comprising:
providing a separation device according to any one of the preceding claims;
separating the flexible substrate of the dummy area from the rigid substrate to form a separation edging port;
bonding the flexible substrate of the dummy region separated from the rigid substrate to the first bonding portion;
and rolling the rolling member to separate the flexible substrate and the rigid substrate of the active area through the adsorption part.
In one embodiment, before adhering the flexible substrate separated from the rigid substrate to the first adhering part, the method further comprises:
and a thickness compensation layer is formed on the flexible substrate of the dummy area, the thickness compensation layer can effectively compensate the thickness difference between the dummy area and the effective area of the display mother board, and the contact area of the first bonding part and the dummy area is increased, so that the first bonding part and the dummy area are better separated.
In one embodiment, the thickness compensation layer is a second adhesive glue.
In one embodiment, the display motherboard includes an upper protective film in the active area, and the second adhesive extends from the dummy area to an upper surface of the upper protective film.
In one embodiment, separating the flexible substrate of the dummy region from the rigid substrate to form a separation bead includes:
irradiating the dummy region by laser and then separating the flexible substrate and the rigid substrate of the dummy region;
or, the flexible substrate of the dummy area is cut off from the rigid substrate by a separating tool.
Before the rolling member rolls, the flexible substrate of the virtual area is separated from the rigid substrate and is fixed on the rolling member through the first bonding part, the effective area connected with the virtual area is fixed on the suction part of the rolling member through the suction hole, and when the rolling member rolls, the first bonding part bonds the flexible substrate to provide a pulling force along the rolling direction, so that the suction and separation are carried out more smoothly. Therefore, this application replaces laser stripping equipment with separator, can separate the rigid substrate and the flexible substrate of display motherboard effectively, and then can separate flexible display panel from rigid substrate effectively, and then reduction in production cost.
Drawings
FIG. 1 is a schematic diagram of the structure of a separation apparatus in one embodiment during separation;
FIG. 2 is a schematic cross-sectional view of a display motherboard in one embodiment;
FIG. 3 is a schematic plan view of a display motherboard in one embodiment;
FIG. 4 is an enlarged view of area A in FIG. 1;
FIG. 5 is an enlarged view of area B of FIG. 1;
FIG. 6 is a schematic view of a rolling member in one embodiment;
FIG. 7 is a schematic view of the structure of the separating apparatus in another embodiment during the separation process;
FIG. 8 is a schematic flow chart of a separation method in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Referring to fig. 1, the separation apparatus 100 provided in the present application is used to separate a rigid substrate 210 and a flexible substrate 220 of a display mother board 200, thereby forming a flexible display panel.
Referring to fig. 2 and 3, a motherboard 200 is shown to include a rigid substrate 210 and a flexible substrate 220. The flexible substrate 220 may specifically include a sacrificial layer 221 and a flexible layer 222. Meanwhile, the motherboard 200 is shown to have a dummy area 200a and an active area 200 b. The dummy area 200a surrounds the active area 200 b.
The rigid substrate 210 may be specifically a glass substrate or the like. The sacrificial layer 221 is formed on the rigid substrate 210 of the active region 200b, and has a weaker bonding force with the rigid substrate 210 than the flexible layer 222 with the rigid substrate 210, and thus is easily separated from the rigid substrate 210 by adsorption. The material of the sacrificial layer 221 may be metal or graphite. At this time, the thickness of the sacrifice layer 221 may be set to be less than a certain value, for example, less than 1 μm, so as not to affect device performance (for example, flexibility performance and the like). The flexible layer 222 is formed on the rigid substrate 210 of the dummy area 200a and the sacrificial layer 221 of the active area 200 b. And, the flexible layer 222 wraps the sacrificial layer 221.
In addition, the display mother board 200 may further include a driving circuit layer group 240 formed on the flexible layer 222 of the active area 200b, a light emitting device layer group 250 formed on the driving circuit layer group 240, a package layer group 260 formed on the light emitting device layer group 250, and the like. The driving circuit layer group 240 serves to drive the light emitting device layer group 250 to emit light. The light emitting device layer group 250 may include a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and the like. And the light emitting device layer group 250 may form various light emitting devices of different colors, such as a red light emitting device, a green light emitting device, a blue light emitting device, and the like, according to the difference of the organic light emitting layer materials. The package layer group 260 serves to effectively protect the light emitting device layer group 250.
The material of the flexible layer 222 may be selected to be a flexible material such as Polyimide (PI). The flexible layer 222 may be formed on the rigid substrate 210 and the sacrificial layer 221 by coating or the like. The flexible layer 222 is typically formed by a forming process such that the dummy region 200a at the edge has a non-uniform thickness (and is typically thinner) and the active region 200b at the center has a uniform thickness. Therefore, the subsequent film layers (the driver circuit layer group 240, the light emitting device layer group 250, and the like) on the flexible layer 222 each form the active area 200b surrounded by the dummy area 200a in the center. And the dummy region 200a of the motherboard 200 is shown as the area that is ultimately cut away.
The structure of the flexible substrate 220 may be different from that of the display mother board used in the separation apparatus 100 provided in the present application. For example, if the flexible layer 222 and the rigid substrate 210 are selected from suitable materials such that the flexible layer 222 and the rigid substrate 210 can be separated by adsorption, the flexible substrate 220 may not include the sacrificial layer 221.
In the following description of the separation apparatus 100 and the separation method, the separation of the rigid substrate 210 and the flexible substrate 220 of the mother substrate shown in fig. 2 will be mainly described.
In one embodiment, referring to fig. 1, 4 (enlarged view of area a of fig. 1), and 5 (enlarged view of area B of fig. 1), a separation device 100 is provided. The separating apparatus 100 comprises a rolling member 110. The roller 110 includes an adsorption part 111 and a first adhesive part 112. The suction part 111 and the first adhesive part 112 are arranged along the rolling direction of the rolling member 110. The first adhesive portion 112 is connected to at least one side of the suction portion 111.
The first bonding portion 112 is used for bonding the flexible substrate 220 of the dummy region 200a, and specifically, may be used for bonding the flexible layer 222 of the dummy region 200 a. The suction portion 111 is used for sucking the flexible substrate 220 of the active area 200b, and specifically, may be used for bonding the sacrificial layer 221 of the dummy area 200a, thereby separating the flexible substrate 220 of the active area from the rigid substrate 210 when the rolling member 110 rolls.
Referring to fig. 1 and 2, when the rigid substrate 210 of the mother substrate 200 is separated and removed by the separating device of the present application, the flexible layer 222 with non-uniform thickness in the dummy region 200a may be separated from the rigid substrate 210. Then, the flexible layer 222 on the dummy area 200a of the display mother board 200 is adhered by the first adhesion portion 112 of the separation device 100. Then, the rolling member 110 of the rolling separation device 100 is rolled, and the sacrifice layer 221 of the effective region 200b and the rigid substrate 210 are separated by the suction portion 111.
Before rolling the roller 110, the first bonding portion 112 connected to the suction portion 111 has bonded the flexible layer 222 on the dummy area 200a, and the display mother panel of the dummy area 200a portion and the display mother panel of the active area 200b are connected to each other. Therefore, when the sacrificial layer 221 and the rigid substrate 210 are separated by rolling the rolling element 110, a pulling force is provided by the first bonding portion 112 bonding the flexible layer 222, so that the suction separation is performed more smoothly.
Therefore, the separation apparatus 100 of the present embodiment replaces a laser lift-off device, and can effectively separate the rigid substrate 210 and the flexible substrate 220 of the display motherboard, so as to effectively separate the flexible display panel from the rigid substrate 210, thereby reducing the production cost.
In one embodiment, the rolling member 110 is provided with a first surface 110a, and the first surface 110a is a rollable surface (e.g., a cambered surface). Thus, the rolling member 110 may roll along the first surface 110 a. The rolling of the rolling member 110 may be performed on an associated rolling platform SP. The rolling platform SP may also secure the rigid substrate 210, thereby facilitating separation of the rigid substrate 210 from the flexible substrate 220.
The first surface 110a includes a first separation surface 110b and a second separation surface 110 c. The first separation surface 110b is connected to the second separation surface 110c by at least one common edge. The first separation surface 110b is an outer surface of the suction portion 111, and the second separation surface 110c is an outer surface of the first adhesive portion 112. Therefore, the suction portion 111 and the first adhesive portion 112 are arranged along the rollable direction of the rolling member 110, and the first adhesive portion 112 is located at least one side of the rollable direction of the suction portion 111.
Meanwhile, the separation device of the present embodiment further includes a first adhesive 120, and the first adhesive 120 is specifically adhered to the second separation surface 110c of the first adhesive portion 112, so that the first adhesive portion 112 can be adhered to the flexible substrate 220 of the dummy region 200 a. The suction portion 111 is provided with a suction hole 111a penetrating the first separation surface 110 b. The suction holes 111a may communicate with a suction device (e.g., a vacuum pump, etc.) to have a suction function, so that the suction part 111 may suck the flexible substrate 220 of the effective area 200b, thereby separating the flexible substrate 220 of the effective area 200b from the rigid substrate 210 when the rolling member 110 rolls.
Therefore, when the rigid substrate 210 is separated and removed by the separation apparatus 100 according to the present embodiment, the flexible layer 222 of the dummy region 200a may be adhered to the first adhesive portion 112 of the rolling member 110 by the first adhesive 120 before the rigid substrate 210 of the active region 200b is separated and removed by the suction method. Then, the rolling member 110 is rolled along the first surface 110 a.
The first separation surface 110b of the suction portion 111 and the second separation surface 110c of the first adhesive portion 112 are connected by at least one common edge. Therefore, after the rolling member 110 is rolled, the first bonding portion 112 bonded to the flexible layer 222 can provide a pulling force when the rolling member 110 is rolled, so as to guide the subsequent adsorption separation to be performed smoothly. Meanwhile, the first separation surface 110b of the adsorption part 111 is connected with the second separation surface 110c of the first bonding part 112 through at least one common edge, so that adsorption and separation can be performed on one edge of the second separation surface 110c connected with the first separation surface 110b, and further, the adsorption and separation effects on the rigid substrate 210 are more uniform.
Therefore, the separation apparatus 100 of the present embodiment can effectively improve the uniformity of the separation of the rigid substrate 210 in the effective region 200b, and improve the mechanical separation effect.
Of course, in other embodiments of the present application, the specific arrangement form of the suction portion 111 and the first adhesion portion 112 of the rolling member 110 may also be different from that of the present embodiment, and those skilled in the art may also make other alternatives without departing from the inventive concept of the present application, and the present application is not limited thereto.
In one embodiment, the first adhesive parts 112 are disposed at opposite sides of the suction part 111. Therefore, the first separation surface 110b and the second separation surface 110c are connected by two common sides opposing in the rollable direction at this time.
At this time, since the two first bonding portions 112 of the separating device 100 have a bonding function, after the rigid substrate 210 of the display mother board 200 is separated and removed by the separating device 100 of the present embodiment, both sides of the display mother board 200 from which the rigid substrate 210 is removed can be bonded to the separating device 100. Therefore, the rolling member 110 can be rolled along the first surface 110a in a reverse direction, and then a support film (not shown) is attached to the display mother board 200 from which the rigid substrate 210 is removed, so that the support film attaching process is simplified, the production line is shortened, and the equipment investment is reduced. After the attachment of the support film is completed, the dummy region 200a of the display mother board 200 may be cut off, thereby completing the fabrication of the flexible display panel.
In one embodiment, further, the rolling member 110 further comprises a second adhesive portion. The first adhesive portion 112 and the second adhesive portion together surround the suction portion 111. At this time, the first bonding portion 112 and the second bonding portion of the roller 110 correspond to the dummy area 200a of the display mother board 200, and the suction portion 111 of the roller 110 corresponds to the effective area 200b of the display mother board 200 (refer to fig. 3).
The second adhesive portion is also used to adhere the flexible substrate 220 of the dummy region 200a (specifically, the first adhesive paste 120 may be provided to adhere also on the outer surface of the second adhesive portion). At this time, since the first adhesive portion 112 and the second adhesive portion surrounding the suction portion 111 both have an adhesive function, after the rigid substrate 210 of the display mother board 200 is separated and removed by the separation device 100 of the present embodiment, the display mother board 200 from which the rigid substrate 210 is removed can be completely attached to the separation device 100, and the display mother board 200 from which the rigid substrate 210 is removed can be prevented from being deformed due to the flexibility. Therefore, when the rolling member 110 is rolled in the reverse direction on the first surface 110a, the support film attachment to the display mother substrate 200 from which the rigid substrate 210 is removed is more facilitated.
Of course, in other embodiments, the separation device 100 may not include the second adhesive portion, which is not limited in this application.
In one embodiment, and with particular reference to FIG. 6, the outer surface of the rolling elements 110 is provided as a cylindrical surface. The first surface 110a is a side surface of a cylindrical surface. At this time, more rollable areas can be provided for the rolling members 110 having the same volume, and thus a display mother board having a larger length can be separated.
In another embodiment, referring to fig. 7, the rolling member 110 is provided to further have a second surface 110d disposed opposite to the first surface, the second surface 110d being a plane. At this time, for the same arc surface (the arc degree and the arc length are the same), the rolling member 110 of the present embodiment may occupy a smaller volume than when the rolling member 110 is a cylindrical surface.
Or, the rolling member 110 is in a limited volume range, the curvature of the first surface 110a may be set relatively slow in this embodiment, so as to avoid wrinkles generated by other film layers (especially, film layers close to the rolling member 110) of the display mother board 200 due to an excessively large curvature of the rolling member 110 when the rolling member 110 rolls to separate and remove the rigid substrate 210 of the display mother board 200.
Of course, in the embodiment of the present application, the arrangement form of the rolling member 110 is not limited to the above two forms as long as it can have a rollable surface.
In one embodiment, referring to fig. 8, a separation method for separating the rigid substrate 210 and the flexible substrate 220 of the display mother board 200 to form a flexible display panel is provided. Specifically, the separation method comprises:
in step S1, the separation device 100 is provided.
The separating apparatus 100 may be the separating apparatus 100 provided in the above embodiments, and may include the rolling member 110, and further may include the first adhesive 120.
The roller 110 includes an adsorption part 111 and a first adhesive part 112. The suction portion 111 is provided with a suction hole 111 a. The adsorption hole 111a may communicate with an external adsorption device (e.g., a vacuum pump) to have an adsorption function.
Meanwhile, the separation device 100 is further provided with a first bonding portion 112, and the first bonding portion 112 is located on at least one side of the adsorption portion 111. The first adhesive part 112 may be provided with a first adhesive 120. Accordingly, the first adhesive portion 112 may adhere the flexible substrate 220 on the dummy region 200a of the display mother board 200.
Meanwhile, the rolling member 110 may have a first surface 110a, and the first surface 110a may be a rollable surface (e.g., a cambered surface). Thus, the rolling member 110 may roll along the first surface 110 a. In particular, the rolling of the rolling member 110 may be performed on an associated rolling platform SP.
The first surface 110a includes a first separation surface 110b and a second separation surface 110 c. The first and second separation surfaces 110b and 110c are arranged along the rollable direction of the first surface 110 a. The first separation surface 110b is an outer surface of the suction portion 111, and the second separation surface 110c is an outer surface of the first adhesive portion 112. The first adhesive 120 may be adhered to the second separation surface 110c of the first adhesive part 112. The first separation surface 110b and the second separation surface 110c may be connected by at least one common edge.
In step S2, the flexible substrate 220 in the dummy region 200a is separated from the rigid substrate 210 to form a separation flange.
In particular, the flexible layer 222 of the dummy region 200a may be separated from the rigid substrate 210. In the method of this embodiment, the flexible substrate 220 in the dummy region 200a is separated from the rigid substrate 210, so that the subsequent peeling process of the rigid substrate 210 can be performed smoothly.
In step S3, the flexible substrate 220 of the dummy region 200a separated from the rigid substrate 210 is bonded on the first bonding part 112.
The suction portion 111 of the separation device 100 is provided corresponding to the effective region 200b of the display mother substrate 200. The first adhesive portion 112 of the separation device 100 is disposed corresponding to at least a portion of the dummy region 200a of the display mother substrate 200.
This step may specifically bond the flexible layer 222 of the dummy region 200a, which is separated from the rigid substrate 210, to the first bonding portion 112.
In step S4, the rolling member 110 is rolled, and the flexible substrate 220 and the rigid substrate 210 of the effective region 200b are separated by the suction portion 111.
Therefore, the separation method of the present embodiment, using the separation apparatus 100, can effectively separate the rigid substrate 210 and the flexible substrate 220 of the active area 200b, thereby reducing the production cost.
In one embodiment, before the step S3, that is, before the flexible substrate 220 of the dummy region 200a separated from the rigid substrate 210 is adhered on the first adhesion part 112, the method further includes:
a thickness compensation layer 270 is formed on the flexible substrate 220 in the dummy region 200 a.
Since the dummy region 200a of the motherboard 200 is shown as an area to be finally cut and removed, subsequent film layers (the group of driver circuit layers 240, the group of light emitting device layers 250, and the like) on the flexible layer 222 are formed only in the central active region 200b surrounded by the dummy region 200 a. Therefore, there is a thickness difference between the dummy area 200a and the active area 200b of the conventional display mother board 200.
In this embodiment, before step S3, a thickness compensation layer 270 is formed on the flexible substrate 220 in the dummy area 200a, specifically, the thickness compensation layer 270 is formed on the flexible layer 222 in the dummy area 200 a. The thickness compensation layer 270 may effectively compensate for a difference in thickness between the dummy area 200a and the active area 200b of the display mother board 200. Therefore, the first bonding portion 112 of the rolling element 110 of the present embodiment can be bonded to the thickness compensation layer 270 of the dummy region 200a having a thickness not much different from the thickness of the upper surface of the active region 200b by the first bonding paste 120, thereby improving the bonding flatness.
Further, the thickness compensation layer 270 may be a second adhesive glue. In this case, the thickness compensation layer 270 can be more favorably adhered to the first adhesive portion 112 of the separation device 100, and thus the peeling effect of the rigid substrate 210 can be more favorably improved.
In one embodiment, the display mother substrate 200 includes an upper protective film 280 positioned at the active area 200 b. The second adhesive (i.e., the thickness compensation layer 270) extends from the dummy region 200a to the upper surface of the upper protection film 280.
The upper protective film 280 is a film layer that effectively protects other film layers of the flexible display panel formed by the display mother substrate 200. The flexible display panel can be scratched and rubbed in the transportation process and the like on the upper protective film 280, so that other film layers of the flexible display panel below the upper protective film 280 are prevented from being damaged.
In the present embodiment, the second adhesive extends from the dummy region 200a to the upper protection film 280. Therefore, the second adhesive paste can effectively prevent the upper protective film 280 from falling off during the process of removing the rigid substrate 210 by rolling the rolling member 110.
In one embodiment, the step S2 of separating the flexible substrate 220 of the dummy region 200a from the rigid substrate 210 to form a separation flange may include:
in step S211, the dummy region 200a is irradiated with laser light.
Here, the rigid substrate 210 is peeled off similarly to a conventional laser. The dummy area 200a of the display mother substrate 200 is irradiated from the back side. The molecular chain structure of the flexible substrate 220 (specifically, the flexible layer 222 of the flexible substrate 220) of the dummy region 200a irradiated with the laser is broken by the energy of the laser, so that the flexible substrate 220 (specifically, the flexible layer 222 of the flexible substrate 220) of the dummy region 200a is easily separated from the rigid substrate 210.
Meanwhile, the dummy region 200a of the display mother board 200 is an area to be finally cut and removed, which is not a component of the final flexible display panel. Therefore, the laser used at this time has low precision requirement, and further, the laser with low precision can be used, thereby reducing the production cost.
In step S212, the flexible substrate 220 and the rigid substrate 210 in the dummy region 200a are separated to form a separation opening.
The flexible substrate 220 and the rigid substrate 210 of the dummy area 200a are separated, and specifically, the flexible layer 222 and the rigid substrate 210 of the dummy area 200a are separated.
Of course, step S2 may be completed in other ways.
For example, in another embodiment, separating the flexible substrate 220 of the dummy region 200a from the rigid substrate 210 to form a separation opening may specifically include:
in step S221, the flexible substrate 220 of the dummy region 200a is cut away from the rigid substrate 210 by a separating tool to form a separating opening.
Also, the dummy region 200a of the motherboard 200 is shown as the area to be finally cut away. Therefore, at this time, the cutting requirement of the separation tool for separating the flexible substrate 220 and the rigid substrate 210 of the dummy region 200a can be reduced as long as the flexible substrate 220 and the rigid substrate 210 of the dummy region 200a are separated.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A separating device for separating a rigid substrate and a flexible substrate of a display mother board, the display mother board having a dummy area and an active area surrounded by the dummy area, the separating device comprising:
the rolling member, the rolling member includes along first bonding portion and the absorption portion that the rolling member's roll direction was arranged, first bonding portion is connected at least one side of absorption portion, just first bonding portion is used for bonding the flexible substrate in dummy area, the absorption portion is used for adsorbing the flexible substrate in active area, so that the flexible substrate in active area with the separation of rigidity substrate.
2. The separating device according to claim 1, wherein the rolling member has a first surface, the first surface is a rollable surface and includes a first separating surface and a second separating surface, and the first separating surface and the second separating surface are connected by at least one common edge, the first separating surface is an outer surface of the suction portion, and the second separating surface is an outer surface of the first bonding portion;
the separation device further comprises first bonding glue, the first bonding glue is bonded on the second separation surface, an adsorption hole is formed in the adsorption part, and the adsorption hole penetrates through the first separation surface.
3. The separating apparatus according to claim 1, wherein the first adhering portions are located on opposite sides of the suction portion in a rolling direction of the rolling member.
4. The separation device of claim 3, wherein the rolling element further comprises a second adhesive portion, the second adhesive portion and the first adhesive portion together surrounding the suction portion, the second adhesive portion also serving to adhere the flexible substrate of the dummy area.
5. The separation device of claim 2, wherein the outer surface of the roller is a cylindrical surface and the first surface is a side surface of the cylindrical surface.
6. The separation device of claim 2, wherein the rolling member further has a second surface disposed opposite the first surface, the second surface being planar.
7. A separation method for separating a rigid substrate and a flexible substrate of a display mother board having a dummy area and an active area surrounded by the dummy area, the separation method comprising:
providing the separation device of any one of claims 1-6;
separating the flexible substrate of the dummy area from the rigid substrate to form a separation edging port;
bonding the flexible substrate of the dummy area separated from the rigid substrate to the first bonding portion;
and rolling the rolling member to separate the flexible substrate and the rigid substrate of the active area through the adsorption part.
8. The separation method according to claim 7, further comprising, before adhering the flexible substrate separated from the rigid substrate to the first adhering portion:
and forming a thickness compensation layer on the flexible substrate in the dummy area.
9. The separation method of claim 8, wherein the thickness compensation layer is a second adhesive glue.
10. The separation method according to claim 9, wherein the display mother board includes an upper protective film located in the active area, and the second adhesive paste extends from the dummy area to an upper surface of the upper protective film.
11. The method of separating of claim 7, wherein separating the flexible substrate of the dummy region from the rigid substrate to form a separation bead comprises:
irradiating the dummy area by laser, and separating the flexible substrate and the rigid substrate of the dummy area to form the separation flanging opening;
or cutting the flexible substrate of the dummy area from the rigid substrate by a separating tool to form the separating edging port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910925053.7A CN110676207B (en) | 2019-09-27 | 2019-09-27 | Separation device and separation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910925053.7A CN110676207B (en) | 2019-09-27 | 2019-09-27 | Separation device and separation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110676207A CN110676207A (en) | 2020-01-10 |
| CN110676207B true CN110676207B (en) | 2021-11-16 |
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Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2634560A1 (en) * | 1976-07-31 | 1978-02-02 | Hoechst Ag | METHOD AND DEVICE FOR DISCONNECTING CONNECTED |
| JPH1087160A (en) * | 1996-09-19 | 1998-04-07 | Nec Eng Ltd | Peeling mechanism for protective sheet on polarizing plate |
| EP1054437A2 (en) * | 1999-05-21 | 2000-11-22 | Tokyo Seimitsu Co.,Ltd. | Method and apparatus for attaching wafer to wafer frame and planarization apparatus including attaching apparatus |
| WO2006001289A1 (en) * | 2004-06-25 | 2006-01-05 | Lintec Corporation | Sheet peeling device and method |
| CN101123168A (en) * | 2006-08-09 | 2008-02-13 | 黄伟民 | Thin film peel-off device |
| CN102227482A (en) * | 2008-12-01 | 2011-10-26 | 日东电工株式会社 | Film roll for producing semiconductor device |
| CN103560101A (en) * | 2013-11-11 | 2014-02-05 | 京东方科技集团股份有限公司 | Flexible device stripping device |
| CN203826359U (en) * | 2014-04-30 | 2014-09-10 | 京东方科技集团股份有限公司 | A flexible device peeling mechanism |
| CN104347449A (en) * | 2013-07-24 | 2015-02-11 | 上海和辉光电有限公司 | Peeling apparatus and peeling method |
| CN104838485A (en) * | 2012-10-04 | 2015-08-12 | 荷兰应用自然科学研究组织Tno | Releasable substrate on carrier |
| CN105374728A (en) * | 2014-08-08 | 2016-03-02 | 日东电工株式会社 | Method and apparatus for separating adhesive tapes |
| CN106373917A (en) * | 2015-07-20 | 2017-02-01 | Tcl集团股份有限公司 | Manufacturing method for flexible display screen and preparing device for flexible display screen |
| CN106783688A (en) * | 2016-12-28 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of stripping off device and its stripping means |
| CN109585310A (en) * | 2017-09-28 | 2019-04-05 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
| JP2019102401A (en) * | 2017-12-08 | 2019-06-24 | 株式会社村田製作所 | Manufacturing apparatus of lamination electrode body |
| CN110504296A (en) * | 2019-09-06 | 2019-11-26 | 云谷（固安）科技有限公司 | The preparation method and flexible display screen of flexible display screen |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5431777B2 (en) * | 2009-04-20 | 2014-03-05 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
-
2019
- 2019-09-27 CN CN201910925053.7A patent/CN110676207B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2634560A1 (en) * | 1976-07-31 | 1978-02-02 | Hoechst Ag | METHOD AND DEVICE FOR DISCONNECTING CONNECTED |
| JPH1087160A (en) * | 1996-09-19 | 1998-04-07 | Nec Eng Ltd | Peeling mechanism for protective sheet on polarizing plate |
| EP1054437A2 (en) * | 1999-05-21 | 2000-11-22 | Tokyo Seimitsu Co.,Ltd. | Method and apparatus for attaching wafer to wafer frame and planarization apparatus including attaching apparatus |
| WO2006001289A1 (en) * | 2004-06-25 | 2006-01-05 | Lintec Corporation | Sheet peeling device and method |
| CN101123168A (en) * | 2006-08-09 | 2008-02-13 | 黄伟民 | Thin film peel-off device |
| CN102227482A (en) * | 2008-12-01 | 2011-10-26 | 日东电工株式会社 | Film roll for producing semiconductor device |
| CN104838485A (en) * | 2012-10-04 | 2015-08-12 | 荷兰应用自然科学研究组织Tno | Releasable substrate on carrier |
| CN104347449A (en) * | 2013-07-24 | 2015-02-11 | 上海和辉光电有限公司 | Peeling apparatus and peeling method |
| CN103560101A (en) * | 2013-11-11 | 2014-02-05 | 京东方科技集团股份有限公司 | Flexible device stripping device |
| CN203826359U (en) * | 2014-04-30 | 2014-09-10 | 京东方科技集团股份有限公司 | A flexible device peeling mechanism |
| CN105374728A (en) * | 2014-08-08 | 2016-03-02 | 日东电工株式会社 | Method and apparatus for separating adhesive tapes |
| CN106373917A (en) * | 2015-07-20 | 2017-02-01 | Tcl集团股份有限公司 | Manufacturing method for flexible display screen and preparing device for flexible display screen |
| CN106783688A (en) * | 2016-12-28 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of stripping off device and its stripping means |
| CN109585310A (en) * | 2017-09-28 | 2019-04-05 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
| JP2019102401A (en) * | 2017-12-08 | 2019-06-24 | 株式会社村田製作所 | Manufacturing apparatus of lamination electrode body |
| CN110504296A (en) * | 2019-09-06 | 2019-11-26 | 云谷（固安）科技有限公司 | The preparation method and flexible display screen of flexible display screen |
Non-Patent Citations (1)
| Title |
|---|
| 夹层结构滚筒剥离性能研究;周祝林等;《玻璃钢》;20110915(第03期);正文全文 * |
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