WO2021135129A1 - Dust-proof structure, microphone packaging structure, and electronic device - Google Patents

Abstract

Disclosed are a dust-proof structure, a microphone structure, and an electronic device. The dust-proof structure comprises: a carrier, a through hole being formed in the middle of the carrier, and the carrier being subjected to hydrophobic treatment to form a hydrophobic portion at the bottom of the carrier; and a membrane, the membrane comprising a grid structure and a connection portion surrounding the grid structure, the grid structure covering one end of the through hole, and the connection portion being connected to the carrier. The bottom of the carrier is the surface of the carrier distant from the membrane. The technical effect of the present invention is that the bonding strength between the dust-proof structure and a UV adhesive tape to which the structure is transferred is reduced by performing hydrophobic treatment on the surface of the carrier, so that the dust-proof structure can be removed from the UV adhesive tape more easily, without causing damage to the dust-proof structure.

Description

Dustproof structure, microphone packaging structure and electronic equipment Technical field

The present invention relates to the field of acousto-electric technology, and more specifically, to a dust-proof structure, a microphone packaging structure, and an electronic device.

Background technique

In order to prevent foreign objects such as dust from affecting MEMS devices, dust-proof structures are usually set for protection. The dust-proof structure needs to go through a series of operations from manufacturing to installation in the set position. For example, the dust-proof structure needs to be picked up from a specific location to the installation location.

During the manufacturing process, the dust-proof structure needs to be transferred to the UV tape. After that, pick up the dust-proof structure and place it to the set position. During the pick-up process, the pick-up operation becomes difficult due to the adhesion between the dust-proof structure and the UV tape. During the picking operation, the dust-proof structure cannot be normally removed from the UV tape, or the picking force is too large, which may damage the dust-proof structure.

Therefore, it is necessary to provide a new technical solution to solve the above-mentioned problems.

Summary of the invention

An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone packaging structure, and an electronic device.

According to the first aspect of the present invention, there is provided a dust-proof structure, including:

A carrier, a through hole is formed in the middle of the carrier, and the carrier is subjected to a hydrophobization treatment to form a hydrophobic part at the bottom of the carrier;

A membrane body, the membrane body includes a grid structure and a connecting part arranged around the grid structure, the grid structure covers one end of the through hole, the connecting part is connected to the carrier, the The bottom of the carrier is the surface of the carrier away from the membrane body.

Optionally, the hydrophobization treatment includes a fluorination treatment to form a fluorinated layer on the bottom of the carrier.

Optionally, the fluorination treatment includes reactive ion etching, and fluorine-containing gas is used in the reactive ion etching.

Optionally, the fluorine-containing gas includes any one of _{SF 6} , XeF ₂ , NF ₃ , and CF _4.

Optionally, the hydrophobizing treatment includes treating the bottom of the carrier to a rough surface.

Optionally, the bottom of the carrier is treated with argon to form the rough surface; or, physical ion impact by an argon ion beam is used to form the rough surface.

Optionally, the argon gas treatment is performed by one of Photolithography and Dry-Etching.

Optionally, the rough surface is further fluorinated.

According to a second aspect of the present invention, there is provided a microphone packaging structure, including the dust-proof structure described in any one of the above, and the dust-proof structure is fixed on the sound hole of the microphone packaging structure;

Alternatively, the dust-proof structure covers the MEMS chip in the microphone packaging structure.

According to a third aspect of the present invention, there is provided an electronic device including the aforementioned microphone packaging structure.

According to an embodiment of the present disclosure, by hydrophobizing the surface of the carrier, the adhesion between the dust-proof structure and the transferred UV tape is reduced, which makes it easier to remove the dust-proof structure from the UV tape without Damage to the dust-proof structure.

Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.

Description of the drawings

The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present invention, and together with the description are used to explain the principle of the present invention.

Fig. 1 is an exploded view of the surface of the carrier of the dust-proof structure, which is far from the membrane body, forming a hydrophobic part in an embodiment of the present disclosure.

2 is a schematic structural view of a cross-section of a dust-proof structure in which the hydrophobic part is a fluorinated layer in an embodiment of the present disclosure.

Fig. 3 is a schematic structural view of a cross-section of a dust-proof structure with a rough surface formed on the surface of the carrier away from the membrane body in an embodiment of the present disclosure.

FIG. 4 is a schematic diagram of a dustproof structure provided inside the sound hole on the microphone packaging structure substrate according to an embodiment of the present disclosure.

FIG. 5 is a schematic diagram of a dustproof structure provided at the MEMS chip on the microphone packaging structure substrate according to an embodiment of the present disclosure.

In the figure, 1 is a membrane body, 2 is a carrier, 21 is a hydrophobic part, 21a is a fluorinated layer, 21b is a rough surface, 31 is a sound hole, and 32 is a MEMS chip.

Detailed ways

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.

The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.

In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further discussed in the subsequent drawings.

According to an embodiment of the present disclosure, a dust-proof structure is provided. As shown in FIG. 1, the dust-proof structure includes:

A carrier 2, a through hole is formed in the middle of the carrier 2, and the carrier 2 is hydrophobized to form a hydrophobic portion 21 at the bottom of the carrier 2; a membrane body 1, the membrane body 1 includes a mesh structure and A connecting portion provided around the grid structure, the grid structure covering one end of the through hole, the connecting portion is connected to the carrier 2, and the bottom of the carrier 2 is far away from the carrier 2 The surface of the membrane body 1.

In this embodiment, after the carrier 2 is subjected to the hydrophobization treatment, a hydrophobic portion 21 is formed on the bottom of the carrier 2. For example, in the process of manufacturing the dust-proof structure, the dust-proof structure needs to be transferred to the UV tape. The hydrophobic part 21 can reduce the adhesive force between the bottom of the carrier 2 and the UV tape. After UV irradiates the back of the UV tape, the carrier 2 and the UV tape are easier to separate. This makes it easier to pick up the dust-proof structure from the UV tape. . And, there is no need to apply too much force to pick up the dust-proof structure, so as to avoid the dust-proof structure being damaged due to excessive force when picking up

For example, in the process of manufacturing the dust-proof structure, after the dust-proof structure is transferred to the UV tape, the carrier 2 on the dust-proof structure and the UV tape are bonded together. When picking up the dust-proof result, first perform UV irradiation from the back of the UV tape, and the hydrophobic structure 21 reduces the adhesive force between the carrier 2 and the UV tape after UV irradiation. In this way, there is no need to apply excessive force to pick up the dust-proof structure, making the pick-up of the dust-proof structure easier.

In one embodiment, as shown in FIG. 2, the hydrophobization treatment includes fluorination treatment to form a fluorinated layer 21 a on the bottom of the carrier 2.

The fluorinated layer 21a can make the bottom of the carrier 2 hydrophobic and reduce the adhesive force between the carrier 2 and the UV tape. It is easier to pick up the dust-proof structure transferred to the UV tape.

For example, fluorination treatment includes reactive ion etching, and fluorine-containing gas is used in reactive ion etching.

The bottom surface of the carrier 2 is etched by reactive ion etching, and fluorine-containing gas is used in the reactive ion etching. The carrier 2 contains a large amount of organic materials, so that a C-F bond is formed between the fluorine ion and the material of the carrier 2, and the fluorine and the material at the bottom of the carrier 2 are combined to form a fluorinated layer 21a.

The above-mentioned fluorination treatment of reactive ion etching using fluorine-containing gas is performed by RIE.

In an embodiment, the fluorine-containing gas includes any one of _{SF 6} , XeF ₂ , NF ₃ , and CF _4.

The fluorine-containing gas may also contain any one of _{SF 6} , XeF ₂ , NF ₃ , and CF _4. SF ₆ , XeF ₂ , NF ₃ , and CF ₄ can all form an ion impact on the bottom of the carrier 2 to generate a fluorinated layer 21 a. The bottom of the carrier 2 can also be fluorinated with other fluorine-containing gas components, which can be selected by those skilled in the art according to requirements.

In one embodiment, as shown in FIG. 3, the hydrophobizing treatment includes treating the bottom of the carrier 2 as a rough surface 21b. Treating the bottom of the carrier 2 as a rough surface 21b means to treat the bottom of the carrier 2 as a rough surface. For example, the rough surface may have an uneven structure formed on the surface, or it may have multiple surfaces distributed on the surface. Regular or irregular depressions can also be the formation of multiple staggered or parallel grooves, zigzag chase bumps, etc. on the surface.

The bottom of the carrier 2 is treated as a rough surface 21b, which can reduce the bonding area between the carrier 2 and the UV tape, thereby reducing the bonding force between the carrier 2 and the UV tape. This can make the pick-up of the dust-proof structure in the manufacturing process easier and labor-saving, and avoid damaging the dust-proof structure by excessive force during picking.

For example, in the process of manufacturing the dust-proof structure, after the dust-proof structure is transferred to the UV tape, the carrier 2 on the dust-proof structure and the UV tape are bonded together. When picking up the dust-proof result, first perform UV irradiation from the back of the UV tape. The rough surface 21b can reduce the bonding area between the carrier 2 and the UV tape, thereby reducing the bonding force between the carrier 2 and the UV tape. When the pick-up process is performed after the transfer, the carrier 2 and the UV tape are easier to separate. In this way, when picking up the dust-proof structure, the carrier 2 on the dust-proof structure can be separated from the UV tape without applying excessive force to realize the pick-up of the dust-proof structure, and avoid excessive force on the dust-proof structure during the picking process. Damage.

In one embodiment, the bottom of the carrier 2 is treated with argon gas to form the rough surface 21b; or, physical ion impact by an argon ion beam is used to form the rough surface 21b.

The argon treatment may be, for example, etching the bottom of the carrier 2 with argon, so that the bottom of the carrier 2 is formed with a rough surface 21b.

Alternatively, the bottom of the carrier 2 is physically impacted by an argon ion beam, so that the bottom of the carrier 2 forms a rough surface 21b.

The above-mentioned argon treatment can be performed by means of RIE.

For example, the argon gas treatment can also be performed by one of Photolithography and Dry-Etching.

The rough surface 21b formed by any method in this embodiment can reduce the contact area between the carrier 2 and the UV tape, and can reduce the adhesive force between the carrier 2 and the UV tape, so that when picking up the dust-proof structure, a smaller amount is applied. The force can separate the carrier 2 on the dust-proof structure from the UV tape, realize the pick-up of the dust-proof structure, and avoid damage to the dust-proof structure caused by excessive force during the picking process.

In one embodiment, the rough surface 21b is further fluorinated.

After the rough surface 21b is formed, the rough surface 21b is fluorinated to form a fluorinated layer on the rough surface 21b. In this way, on the basis that the structure of the rough surface 21b reduces the adhesive force between the carrier 2 and the UV tape, the fluorinated layer further reduces the adhesive force between the carrier 2 and the UV tape. This can further reduce the force applied when picking up the dust-proof structure, and make the pick-up step of the dust-proof structure in the manufacturing process easier and less likely to be damaged.

Those skilled in the art can adjust the roughness of the rough surface 21b and adjust the fluorinated layer after the fluorination treatment according to the actual situation, so that the adhesive force between the carrier 2 and the UV tape can be adjusted to a set value. In this way, the pick-up step in the manufacturing process of the dust-proof structure can be made easier and not easily damaged. It is also possible to avoid insufficient adhesion between the carrier 2 and the UV tape caused by excessive hydrophobization.

According to an embodiment of the present invention, a microphone packaging structure is provided, the microphone packaging structure includes the above-mentioned dust-proof structure, and the dust-proof structure is fixed on the sound hole 31 of the microphone packaging structure;

Alternatively, the dust-proof structure covers the MEMS chip 32 in the microphone packaging structure.

Generally, the microphone packaging structure includes a housing forming a accommodating cavity and a substrate fixed to the housing. The sound hole 31 may be provided on the substrate or on the housing.

In this embodiment, it may be that the dust-proof structure is fixed on the sound hole 31 from the outside of the microphone packaging structure to protect the components in the microphone packaging structure from the outside.

Alternatively, as shown in FIG. 4, the dust-proof structure is fixed on the sound hole 31 from the inside of the microphone packaging structure to protect the components of the microphone packaging structure from the inside.

Alternatively, as shown in FIG. 5, the dust-proof structure is fixed on the substrate to protect the sound hole 31 and the inside of the microphone packaging structure. The MEMS chip 32 is fixed by a dust-proof structure.

It is also possible that the dustproof structure is fixed inside the microphone packaging structure and covers the MEMS chip 32. This can protect the MEMS chip 32. In this structure, the carrier 2 can be fixed on the substrate where the MEMS chip 32 is located to form a coating. The carrier 2 can also be fixed on the substrate of the MEMS chip 32 to form a cladding. All of the above structures can form a protective effect on the MEMS chip 32.

The microphone packaging structure can effectively prevent damage to the dust-proof structure caused by heat during the installation and use of the microphone. And it can protect the components in the microphone. For example, the MEMS chip 32 is protected from contamination by pollutants such as external dust.

According to an embodiment of the present disclosure, there is provided an electronic device including the aforementioned microphone packaging structure.

The electronic device includes the above-mentioned microphone and has all the advantages of the above-mentioned microphone packaging structure. For example, the electronic equipment can be audio equipment, mobile phones, computers and other products.

Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims (10)

1. A dust-proof structure, which is characterized in that it comprises:

   A carrier, a through hole is formed in the middle of the carrier, and the carrier is subjected to a hydrophobization treatment to form a hydrophobic part at the bottom of the carrier;

   A membrane body, the membrane body includes a grid structure and a connecting part arranged around the grid structure, the grid structure covers one end of the through hole, the connecting part is connected to the carrier, the The bottom of the carrier is the surface of the carrier away from the membrane body.
2. The dust-proof structure according to claim 1, wherein the hydrophobization treatment includes a fluorination treatment to form a fluorinated layer on the bottom of the carrier.
3. The dust-proof structure according to claim 2, wherein the fluorination treatment includes reactive ion etching, and fluorine-containing gas is used in the reactive ion etching.
4. The dust-proof structure according to claim 3, wherein the fluorine-containing gas contains any one of _{SF 6} , XeF ₂ , NF ₃ , and CF _4.
5. The dust-proof structure according to claim 1, wherein the hydrophobizing treatment includes treating the bottom of the carrier to a rough surface.
6. The dust-proof structure according to claim 5, wherein the bottom of the carrier is treated with argon to form the rough surface; or, physical ion impact by an argon ion beam is used to form the rough surface .
7. The dust-proof structure according to claim 6, wherein:

   The argon treatment is performed by one of Photolithography and Dry-Etching.
8. The dust-proof structure according to claim 7, wherein the rough surface is further fluorinated.
9. A microphone packaging structure, comprising the dust-proof structure according to any one of claims 1-8, the dust-proof structure being fixed on the sound hole of the microphone packaging structure;

   Alternatively, the dust-proof structure covers the MEMS chip in the microphone packaging structure.
10. An electronic device, characterized by comprising the microphone packaging structure of claim 9.

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