CN211557482U

CN211557482U - Dustproof structure, microphone packaging structure and electronic equipment

Info

Publication number: CN211557482U
Application number: CN201922496350.2U
Authority: CN
Inventors: 游振江; 畠山庸平; 林育菁
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-09-22
Anticipated expiration: 2029-12-31

Abstract

The utility model discloses a dustproof construction, microphone packaging structure and electronic equipment. Wherein the dustproof structure comprises a carrier and a grid part; the grid part comprises a filter screen and a fixing part arranged around the filter screen; the carrier is of a hollow structure, and a pore channel structure extending along the thickness direction of the carrier is arranged on the carrier; the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier. The utility model has the technical effects that: the filter screen in net portion can keep smooth state, and net portion can effectively the separation external particulate matter, foreign matter enter into microphone packaging structure's inside.

Description

Dustproof structure, microphone packaging structure and electronic equipment

Technical Field

The utility model relates to an electroacoustic conversion technology field, more specifically, the utility model relates to a dustproof construction, microphone packaging structure and electronic equipment.

Background

With the rapid development of electroacoustic technology, various electroacoustic products are developed. A microphone, as a transducer for converting sound into an electrical signal, is one of the very important devices in electro-acoustic products. Nowadays, microphones have been widely applied to various types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smartwatches, and smart wearing. In recent years, for a microphone packaging structure, the design of the structure thereof has become an important point and a focus of research by those skilled in the art.

The existing microphone package structure is generally: the chip package comprises a shell with a containing cavity, and components such as a chip assembly (for example, a MEMS chip and an ASIC chip) are contained and fixed in the containing cavity; and a sound pickup hole is also arranged on the shell. However, in long-term application, it is found that external particles and foreign matters such as dust and impurities are easily introduced into the accommodating cavity of the microphone through the sound pickup hole, and the external particles and foreign matters cause certain damage to components such as a chip assembly in the accommodating cavity, and finally affect the acoustic performance and the service life of the microphone.

In view of the above problems, the prior art generally adopts a solution that an isolation component is disposed on a sound pickup hole of a microphone package structure to block the entry of external particles, foreign matters, and the like. The conventional spacer assembly, as shown in fig. 1 and 2, includes a support 101 and a spacer fabric 102. When the isolation component is used, the isolation component is installed on the sound pickup hole. However, in the conventional insulation assembly, because the support portion 101 and the insulation mesh 102 have different sizes, materials, structures, etc., a certain internal stress difference is likely to be generated at the connecting position of the support portion and the insulation mesh 102, which may cause wrinkles or wrinkles on the mesh 103 on the insulation mesh 102, and the mesh 103 may not be ensured to be in a flat state, which may cause a reduction in product quality, and may even affect the airflow at the mesh 103.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a dustproof construction, microphone packaging structure and electronic equipment's new technical scheme.

According to a first aspect of the present invention, there is provided a dustproof structure, comprising a carrier and a mesh part;

the grid part comprises a filter screen and a fixing part arranged around the filter screen;

the carrier is of a hollow structure, and a pore channel structure extending along the thickness direction of the carrier is arranged on the carrier;

the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected with the carrier.

Optionally, the channel structure comprises a plurality of first channels distributed over the edge portion of the carrier.

Optionally, the first duct is a through hole or a blind hole.

Optionally, the first pore canal extends out along the thickness direction of the carrier and extends to the fixing part of the grid part.

Optionally, the cross section of the first pore canal is circular, and the pore diameter of the first pore canal is 5-300 μm.

Optionally, the duct structure further comprises a second plurality of ducts adjacent to the hollow structure, the second plurality of ducts being arranged around the edge of the hollow structure.

Optionally, the second duct is a through hole or a blind hole.

Optionally, the second pore canal extends out along the thickness direction of the carrier and extends to the fixing part of the grid part.

Optionally, the cross section of the second duct is in a long strip shape or an arc shape;

the width of the second pore channel is 25-50 μm, and the length of the second pore channel is 300-600 μm.

According to a second aspect of the present invention, a microphone package structure is provided. The microphone packaging structure comprises a shell with an accommodating cavity, wherein a sound pickup hole is formed in the shell and is used for communicating the inside with the outside of the shell;

the microphone device is fixedly arranged in the accommodating cavity;

the dustproof structure is arranged on the sound pickup hole.

Optionally, the dust-proof structure is located outside the housing.

Optionally, the housing includes a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodation cavity;

the dustproof structure is accommodated in the accommodating cavity;

the microphone device includes a MEMS chip and a signal amplifier.

Optionally, the pickup hole is located on the encapsulation cover, and the dust-proof structure is fixedly connected with the encapsulation cover.

Optionally, the pickup hole is located on the package cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.

Optionally, the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole.

Optionally, the pickup hole is located on the substrate, the dustproof structure is fixedly arranged on the substrate at a position corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.

According to a third aspect of the present invention, there is provided an electronic apparatus. The electronic equipment comprises the microphone packaging structure.

The embodiment of the utility model provides a dustproof construction has designed the pore on the carrier very much, when fixing net portion on the carrier, can absorb the deformation of carrier, alleviates the stress difference to enable the filter screen in the net portion and keep the leveling state, avoid appearing the phenomenon that produces fold or wrinkle on the filter screen. The embodiment of the utility model provides a dustproof construction can protect microphone packaging structure's pickup hole effectively, and wherein net portion can the external particulate matter of separation, foreign matter enter into microphone packaging structure's inside to can protect each components and parts of microphone inside effectively, with acoustic performance and the life who avoids influencing the microphone. The technical task to be achieved or the technical problems to be solved by the present invention are never thought or not expected by the skilled in the art, so the present invention is a new technical solution.

Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.

FIG. 1 is a side view of a prior art insulation assembly.

Fig. 2 is a side view of a dust-proof structure according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a carrier according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a carrier according to another embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a microphone package structure according to a first embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a microphone package structure according to a second embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a microphone package structure according to a third embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a microphone package structure according to a fourth embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a microphone package structure according to a fifth embodiment of the present invention.

Description of reference numerals:

101-support part, 102-isolation mesh cloth, 103-net film;

1-carrier, 11-pore channel structure, 111-first pore channel, 112-second pore channel, 2-grid part, 12-hollow structure, 13-edge part, 21-filter screen, 22-fixing part, 3-shell, 31-packaging cover, 32-substrate, 4-sound pickup hole, 5-MEMS chip, and 6-signal amplifier.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

According to an embodiment of the utility model, a dustproof construction is provided. The dustproof structure can be applied to a microphone packaging structure. This dustproof construction can effectively the outside particulate matter of separation, foreign matter through the inside that microphone packaging structure's sound hole entered into microphone packaging structure is picked up to can protect each components and parts of microphone inside effectively, in order to avoid influencing the acoustics performance and the life of microphone.

The specific structure of the dustproof structure according to the embodiment of the present invention will be further described below. The embodiment of the utility model provides a dustproof construction, as shown in fig. 2, it includes carrier 1 and net portion 2. The mesh part 2 includes a filter mesh 21 and a fixing part 22 disposed around the filter mesh 21. The carrier 1 is a hollow structure, and a pore structure 11 extending along the thickness direction of the carrier 1 is arranged on the carrier 1. The grid part 2 is arranged at one end of the carrier 1 and covers the hollow structure 12, the filter screen 21 is opposite to the hollow structure 12, and the fixing part 22 is connected with the carrier 1.

The embodiment of the utility model provides a dustproof construction improves to the structure of carrier 1. Specifically, the edge portion 13 of the carrier 1 is provided with the cell structure 11 capable of absorbing deformation of the carrier 1 and relieving stress difference. When the grid part 2 is fixedly connected with the carrier 1, the pore structure 11 on the carrier 1 can keep the filter screen 21 on the grid part 2 in a flat state, and the phenomenon that wrinkles or wrinkles are generated on the filter screen 21 is avoided.

The embodiment of the utility model provides a dustproof construction can protect microphone packaging structure effectively. The grid part 2 therein is provided with the filter screen 21, the filter screen 2 can enable the air flow to pass through, and the filter screen 21 can also effectively obstruct the outside particles and foreign matters (such as dust and impurities) from entering the inside of the microphone packaging structure, thereby effectively protecting each component inside the microphone packaging structure, and avoiding affecting the acoustic performance and the service life of the microphone. In addition, since the filter screen 21 on the mesh part 2 can be in a flat state, it is also advantageous for air to flow smoothly there, and no adverse effect is exerted on the movement of the air flow.

In the present invention, as shown in fig. 2, the grid part 2 includes a filter screen 21 and a fixing part 22 surrounding the filter screen 21. Wherein the fixing portion 22 is used to connect the mesh portion 2 with the carrier 1 so that the mesh portion 2 can be covered on the carrier 1. Note that, when the fixing portion 22 of the mesh portion 2 is connected to the carrier 1, the fixing portion 22 is connected to the edge portion 13 of the carrier 1. Specifically, the fixing portion 22 of the mesh portion 2 and the edge portion 13 of the carrier 1 may be connected together by, for example, adhesive bonding, or may be connected together by a fastening member or welding, and those skilled in the art can flexibly select the fixing portion according to specific needs, which is not limited by the present invention.

The filter screen 21 may be made of metal mesh with a mesh aperture not greater than 10 μm, so as to allow air to pass through smoothly and effectively prevent particles such as dust and impurities from entering. The filter screen made of metal has the characteristic of good durability, does not need to be frequently replaced, and has longer service life. Of course, the filter screen 21 may also be mesh cloth with other aperture sizes and other materials. The shape of the mesh on the filter screen 21 may be, for example, a circle, a square, a triangle, or the like. The person skilled in the art can flexibly adjust the device according to specific needs, without limitation.

In the mesh part 2, the shape of the filter screen 21 itself may be a regular shape such as a circle, a square, or an ellipse, for example, but the filter screen 21 may have other irregular shapes. The technical personnel in the field can adjust according to the actual need in a flexible way, and the utility model does not limit this either.

In the present invention, the edge portion 13 of the carrier 1 is provided with the pore structure 11, wherein the pore structure 11 has a plurality of forms.

In an example of the present invention, as shown in fig. 3, the pore structure 11 includes a plurality of first pores 111, and the plurality of first pores 111 are distributed on the edge portion 13 of the carrier 1. More preferably, the plurality of first portholes 111 are evenly distributed on the edge portion 13 of the carrier 1 to better absorb the planar deformation of the carrier 1.

The first pore 111 may be, for example, a through hole penetrating the entire carrier 1. Of course, the first portholes 111 may also be blind holes provided in the carrier 1. Further, the first cell channels 111 may also extend out of the carrier 1 in the thickness direction of the carrier 1 to the fixing portions 22 of the mesh portion 2. The person skilled in the art can select it flexibly according to the specific situation without limitation.

As shown in fig. 3, the first porthole 111 may have a circular cross-section, for example. In this case, the pore diameter of the first pore passage 111 may be in the range of 5 μm to 300. mu.m. It should be noted that the cross section of the first duct 111 is not limited to a circle, but may also be other shapes such as a square, an ellipse, a triangle, a trapezoid, etc., and those skilled in the art can flexibly adjust the cross section according to specific situations, and the cross section is not limited thereto.

In another example of the present invention, as shown in fig. 4, the duct structure 11 includes a plurality of first ducts 111 and a plurality of second ducts 112, and the first ducts 111 and the second ducts 112 have different shapes and structures. The cross section of the first pore channel 111 may be circular, for example, and the pore diameter of the first pore channel 111 ranges from 5 μm to 300 μm. The cross-section of the second channel 112 may be, for example, a long strip or an arc, in which case the width of the second channel ranges from 25 μm to 50 μm, and the length of the second channel ranges from 300 μm to 600 μm. As shown in fig. 4, the plurality of second cells 112 are all close to the hollow structure 12 of the carrier 1, and the plurality of second cells 112 are disposed around the edge of the hollow structure 12, so that the hollow structure 12 and the plurality of second cells 112 form a concentric ring structure. At this time, a plurality of first cell channels 111 are arranged in the portion of the edge portion 13 of the carrier 1 where the second cell channels 112 are not provided. The first holes 111 are preferably uniformly distributed. In this example, two types of cells are provided in the carrier 1, and in particular, the second plurality of cells 112 are provided adjacent to the outer edge of the hollow structure 12 of the carrier 1 to form a concentric ring structure with the hollow structure 12, so as to better absorb the planar deformation of the carrier 1. When the grid part 2 and the carrier 1 are fixedly connected, the connection position of the grid part 2 and the carrier can be prevented from being deformed to influence the flatness of the filter screen 21 on the grid part 2, and the filter screen 21 can be kept in a flat state without generating wrinkles.

The first pore 111 may be, for example, a through hole penetrating the entire carrier 1. Of course, the first portholes 111 may also be blind holes provided in the carrier 1. Likewise, the second duct 112 may be, for example, a through-hole that extends through the entire carrier 1. Of course, the second channels 111 may also be blind holes provided in the carrier 1.

In addition, when the pore structure 11 includes the first pore 111 and the second pore 112, the first pore 111 and the second pore 112 may be both a through hole or both blind holes. Alternatively, the first hole 111 may be a through hole, and the second hole 112 may be a blind hole. Alternatively, the first hole 111 is a blind hole, and the second hole 112 is a through hole. The person skilled in the art can flexibly adjust the method according to the specific situation without limitation. In addition, some of the first holes 111 may be through holes, and another part of the first holes may be blind holes. Similarly, some of the second holes 112 may be through holes, and another part of the second holes may be blind holes.

The fixing portion 22 of the mesh portion 2 may be connected to the carrier 1 by means of, for example, adhesive, welding, or fastening, and may be flexibly adjusted by a person skilled in the art according to specific needs, without limitation.

In the present invention, the thickness of the mesh part 2 may be 0.5 μm, for example. The height of the support 1 can be, for example, 40 μm. This size is suitable for most microphone packages. Of course, the size of the assembly can be adjusted by those skilled in the art according to the specific assembly requirement, and the assembly is not limited to this.

According to the utility model discloses another embodiment, still provide a microphone packaging structure. The microphone packaging structure can be applied to various electronic products such as mobile phones, notebook computers, Ipad and VR equipment and intelligent wearable equipment, and is widely applied. The embodiment of the utility model provides a microphone packaging structure can effectively avoid components and parts such as inside chip subassembly to receive the influence of particulate matter such as outside dust, impurity, foreign matter and suffer the phenomenon of destruction, can prolong the life of microphone, but also can make the microphone keep good acoustic performance.

The following further describes a specific structure of the microphone package structure provided in the embodiments of the present invention.

As shown in fig. 5-9, an embodiment of the present invention provides a microphone packaging structure, which includes a housing 3 having a receiving cavity, wherein a sound pickup hole 4 is disposed on the housing 3. The sound pickup hole 4 is used to communicate the inside and outside of the housing 3. A microphone device is accommodated and fixed in the accommodation chamber of the housing 3. The utility model provides a microphone packaging structure still includes as above dustproof construction, dustproof construction is fixed mounting be in pick up on the sound hole 4. The dustproof structure can effectively protect components inside the microphone packaging structure.

In the utility model, the sound pickup hole 4 can be, for example, circular, square, triangular, oval, etc. The pickup hole 4 may be provided in one or more as required. The concrete position that sets up of sound picking-up hole 4 also can adjust in a flexible way according to microphone packaging structure's particular case, the utility model discloses do not do the restriction to this.

In an alternative example of the present invention, as shown in fig. 5, the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside. In this example, the dust-proof structure is mounted outside the microphone package to cover the sound pickup hole 4, and does not occupy the space inside the microphone package. When the dustproof structure is installed, the dustproof structure can be reasonably installed according to the position of the sound pickup hole 4, so that the dustproof structure can be aligned to the sound pickup hole 4, and external particles and foreign matters can be prevented from being introduced into the microphone packaging structure through the sound pickup hole 4.

Of course, the present invention is not limited to the dustproof structure disposed outside the housing 3, and the dustproof structure may be disposed in the accommodating cavity of the housing 3. The technical personnel in the field can flexibly adjust the arrangement position of the dustproof structure according to specific needs.

The utility model discloses a microphone packaging structure, its shell 3's structure is: the substrate 32 and the packaging cover 31 are included, and the substrate 32 and the packaging cover 31 together enclose the accommodating cavity. The dust-proof structure is accommodated in the accommodating cavity of the housing 3. The microphone device comprises a MEMS chip 5 and a signal amplifier 6.

In an alternative example of the present invention, as shown in fig. 6, the sound-collecting hole 4 is located on the package cover 31, and the dust-proof structure is fixedly connected to the package cover 32. Dustproof construction's position corresponds to pickup hole 4, can avoid outside particulate matter, foreign matter to introduce inside microphone packaging structure through pickup hole 4.

In an alternative example of the present invention, as shown in fig. 7, the sound pickup hole 4 is located on the package cover 31, the dustproof structure is fixedly connected to the substrate 32 corresponding to the position of the sound pickup hole 4, and at the same time, the dustproof structure also covers the MEMS chip 5, so as to effectively protect the chip in the microphone package structure.

In the present invention, the sound collecting hole 4 is not limited to be provided in the sealing cover 31 of the housing 3, and may be provided in the base plate 32. For example, as shown in fig. 8, the sound collecting hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4. For another example, as shown in fig. 9, the sound collecting hole 4 is located on the substrate 32, the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound collecting hole 4, and the MEMS chip 5 is provided on the dust-proof structure. It should be noted that, when the sound-collecting hole 4 is formed in the substrate 32, a person skilled in the art may adjust the installation position of the dust-proof structure according to specific situations, as long as the person can prevent external particles and foreign matters from entering or can protect the internal chip, and the invention is not limited thereto.

Wherein the package cover 31 has a dish-shaped structure with an open end. The material of the package cover 31 may be, for example, a metal material, a plastic material, or a PCB. The shape of the sealing cap 31 may be, for example, a cylindrical shape or a rectangular parallelepiped shape. The person skilled in the art can flexibly adjust the device according to the actual needs without limitation.

The substrate 32 may be a circuit board known in the art, such as a PCB, without limitation. The package cover 31 and the substrate 32 may be fixed together by, for example, adhesive bonding or solder paste welding, and those skilled in the art can flexibly select the combination according to the needs without limitation.

The utility model provides a microphone packaging structure is fixed in the chamber that holds of shell 3 and is acceptd the microphone device. Specifically, as shown in fig. 5 to 9, the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.

The MEMS chip 5 includes a substrate and an inductive film. The substrate is also a hollow structure. The sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate. The hollow structure forms a back cavity. When the MEMS chip 5 is fixed in the housing chamber, the MEMS chip 5 may be attached to the substrate 32. Of course, the MEMS chip 5 may also be attached to the package cover 31, for example, a special adhesive may be used to adhere the MEMS chip 5 to the package cover 31. The MEMS chip 5 can also be turned on by a circuit pattern in the substrate 32 in a flip-chip manner, which is common knowledge of those skilled in the art, and the present invention is not described in detail herein.

The signal amplifier 6 may be mounted on the package cover 31, or may be mounted on the substrate 32. The signal amplifier 6 may be, for example, an ASIC chip. The ASIC chip is connected to the MEMS chip 5. The electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed by the ASIC chip, and output. The MEMS chip 5 and the ASIC chip 6 may be electrically connected through a metal wire (bonding wire) to realize mutual conduction therebetween.

Further, the MEMS chip 5 and/or the signal amplifier 6 may be embedded in the substrate 32 or may be semi-embedded in the substrate 32. For example, a conductor is provided in the substrate 32, and a pad is provided on the substrate 32. The conductors are, for example, metallized through holes provided in the substrate 32. The pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 via a conductor. The design in which the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32 contributes to miniaturization of the microphone.

When the MEMS chip 5 and the signal amplifier 6 are embedded in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6. The metal layer is grounded as a shield. A plurality of metal conductors are arranged in the area around the MEMS chip 5 and the signal amplifier 6 for constituting a shielding structure together with the above-mentioned metal layers. The design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 makes it unnecessary to coat protective glue on the surface of the signal amplifier 6, thus simplifying the process and improving the optical noise resistance of the product.

On the other hand, the utility model also provides an electronic equipment. The electronic device comprises the microphone packaging structure.

Wherein, electronic equipment can be cell-phone, notebook computer, panel computer, VR equipment, intelligent wearing equipment etc. the utility model discloses do not do the restriction to this.

Although certain specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A dustproof construction which characterized in that: comprises a carrier and a grid part;

2. The dustproof structure according to claim 1, characterized in that: the channel structure comprises a plurality of first channels distributed over the edge portion of the carrier.

3. The dustproof structure according to claim 2, characterized in that: the first pore passage is a through hole or a blind hole.

4. The dustproof structure according to claim 2, wherein the first pore passage extends in the thickness direction of the carrier and extends to the fixing portion of the mesh portion.

5. The dustproof structure according to claim 2, characterized in that: the cross section of the first pore canal is circular, and the pore diameter of the first pore canal is 5-300 μm.

6. The dustproof structure according to claim 2, characterized in that: the channel structure further comprises a second plurality of channels adjacent to the hollow structure, the second plurality of channels being disposed around an edge of the hollow structure.

7. The dustproof structure according to claim 6, characterized in that: the second pore passage is a through hole or a blind hole.

8. The dustproof structure according to claim 6, wherein the second pore passage extends in the thickness direction of the carrier and extends to the fixing portion of the mesh portion.

9. The dustproof structure according to claim 6, characterized in that: the section of the second pore passage is in a long strip shape or an arc shape;

10. A microphone packaging structure is characterized in that: the shell is provided with a sound pickup hole, and the sound pickup hole is used for communicating the inside with the outside of the shell;

the microphone device is fixedly arranged in the accommodating cavity;

further comprising a dust-proof structure according to any of claims 1-9, said dust-proof structure being arranged on said sound pick-up aperture.

11. The microphone package structure of claim 10, wherein: the dust-proof structure is located outside the housing.

12. The microphone package structure of claim 10, wherein: the shell comprises a substrate and an encapsulation cover, and the substrate and the encapsulation cover enclose the accommodating cavity;

the dustproof structure is accommodated in the accommodating cavity;

the microphone device includes a MEMS chip and a signal amplifier.

13. The microphone package structure of claim 12, wherein: the pickup hole is located on the encapsulation cover, the dustproof construction with encapsulation cover fixed connection.

14. The microphone package structure of claim 12, wherein: the pickup hole is located on the packaging cover, and the dustproof structure is fixedly connected to the substrate so as to cover the MEMS chip.

15. The microphone package structure of claim 12, wherein: the sound pickup hole is positioned on the substrate, and the dustproof structure is fixedly arranged on the substrate corresponding to the position of the sound pickup hole.

16. The microphone package structure of claim 12, wherein: the pickup hole is positioned on the substrate, the dustproof structure is fixedly arranged on the substrate corresponding to the pickup hole, and the MEMS chip is arranged on the dustproof structure.

17. An electronic device, characterized in that: comprising a microphone package according to any of claims 10-16.