CN103663352B - A kind of MEMS microphone package structure and method for packing - Google Patents

A kind of MEMS microphone package structure and method for packing Download PDF

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Publication number
CN103663352B
CN103663352B CN201310746916.7A CN201310746916A CN103663352B CN 103663352 B CN103663352 B CN 103663352B CN 201310746916 A CN201310746916 A CN 201310746916A CN 103663352 B CN103663352 B CN 103663352B
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China
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mems microphone
operatic tunes
substrate
metal
mounting portion
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CN201310746916.7A
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Chinese (zh)
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CN103663352A (en
Inventor
周育樑
王勇
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上海集成电路研发中心有限公司
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Priority to CN201310746916.7A priority Critical patent/CN103663352B/en
Publication of CN103663352A publication Critical patent/CN103663352A/en
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Abstract

The invention discloses a kind of MEMS microphone package structure, including substrate and metal shell, substrate and metal shell combine and form inner space.Wherein metal shell includes top plate, side wall with acoustic aperture, and the dividing plate extended downwardly from top plate;Metal supporting frames are provided with inner space, it includes the supporting part for mounting the mounting portion of MEMS microphone component and support mounting portion, supporting part has the opening corresponding with the microphone film of MEMS microphone component;Supporting part is fixedly connected with substrate, and mounting portion is fixedly connected with dividing plate.Inner space is divided into the transaudient passage formed in first operatic tunes and second operatic tunes, first operatic tunes through acoustic aperture and opening by dividing plate and metal supporting frames, and the transaudient passage is closed relative to second operatic tunes.Present invention also offers a kind of MEMS microphone package method, substrate area occupied can be reduced, the effect that quiets down is improved.

Description

A kind of MEMS microphone package structure and method for packing

Technical field

The present invention relates to MEMS microphone package technical field, more particularly to a kind of MEMS microphone package structure and encapsulation Method.

Background technology

With the progress and the development of technology of society, in recent years, the volume of Intelligent mobile equipment constantly reduce and performance and Uniformity is improved, and the encapsulation to microphone requires also more and more tighter.Utilize MEMS(MEMS)The integrated MEMS of technique Microphone starts by the idea product such as batch application to mobile phone, notebook.This MEMS microphone package and traditional EMC (In collective)Microphone is compared, and volume is smaller, good seal performance, and reliability is high, and high temperature resistant, can withstand SMT(Paste on surface Dress technology)The high temperature test of technique.

The general structure of MEMS microphone package is as shown in figure 1, it utilizes a substrate 1(Such as pcb board)With a metal Housing 4 constitutes a cavity 6 and turns into the surrounding package of MEMS microphone.MEMS microphone group is installed in the inside of cavity 6 Part 3, is provided through inside and outside cavity and is used for the acoustic aperture 5 for receiving external sound signal at the top of metal outer frame.Transaudient passage Cavity 6 is entered by acoustic aperture 5, the diaphragm that MEMS microphone chip 3 is recessed is reached.MEMS microphone chip 3 by 2 solder joints, One is welded with integrated circuit asic chip 2, and another sidepiece for being welded direct to metal outer frame 4 realizes that GND is grounded.

This traditional MEMS microphone package structure has the disadvantages that:MEMS microphone component 3 and integrated electricity first Road asic chip 2 is required for being mounted on substrate 1(Pcb board)On, along with some other electronic components, take substrate 1 Area is larger.Secondly, only one of which cavity and MEMS microphone component is mounted on substrate, cavity inside this encapsulating structure The round of interior transaudient passage is simultaneously indefinite.The diaphragm of MEMS microphone chip volume of the effect directly with cavity that quiet down is big It is small relevant with the propagation circuit of sound, it is clear that such encapsulating structure have impact on the effect that quiets down of MEMS microphone.Further, since The operation principle of silicon microphone require that its encapsulating structure has to the acoustic aperture that there is connection inside and outside space, and this has resulted in outer The dust and light in portion easily enter inside cavity from the external world, and directly contact MEMS chip, and this can be to MEMS chip Work brings certain interference, that is to say the noise of general understanding.Meanwhile, illumination is mapped on asic chip, also can be to microphone Electrical property produce influence.

The content of the invention

Reduce substrate area occupied it is an object of the invention to provide one kind, improve the MEMS microphone package for the effect that quiets down The method for packing of structure and MEMS microphone, to overcome disadvantages mentioned above.

To reach above-mentioned purpose, the present invention provides a kind of MEMS microphone package structure, and it includes being provided with asic chip Substrate and the metal shell that is fixedly connected with the substrate, the substrate and the metal shell combine and form internal empty Between, wherein the metal shell includes top plate, the side wall of the top plate is surrounded and supported, and extended downwardly from the top plate There is acoustic aperture in dividing plate, the top plate;Metal supporting frames are provided with the inner space, the metal supporting frames are included to paste Fill the mounting portion of MEMS microphone component and support the supporting part of the mounting portion, the supporting part has and the MEMS Mikes The corresponding opening of the microphone film of wind component;The supporting part is fixedly connected with the substrate, the mounting portion with it is described Dividing plate is fixedly connected;The inner space is divided into first operatic tunes and second operatic tunes by the dividing plate and the metal supporting frames, The transaudient passage through the acoustic aperture and the opening is formed in first operatic tunes, the transaudient passage is relative to described second The operatic tunes is closed.

Preferably, in the transaudient passage be provided with isolating and protecting part, the isolating and protecting part two ends respectively with the metal The side wall of housing is fixedly connected with dividing plate.

Preferably, first operatic tunes is connected with second operatic tunes, and the asic chip is located in second operatic tunes, With the electrical connection of the microphone assembly.

Preferably, the metal shell is fixedly connected by adhesive with the substrate, and metal is contained in described adhesive Powder.

Preferably, the isolating and protecting part is non-woven fabrics catch net, braiding catch net or macropore sponge net.

Present invention also offers a kind of method for packing of MEMS microphone, comprise the following steps:One substrate and a gold medal are provided Belong to support frame, support frame as described above includes having opening in the supporting part of mounting portion and the support mounting portion, the mounting portion; The supporting part and an asic chip are fixedly installed in the substrate;Be fixedly mounted on the substrate a metal shell with Form an inner space, the metal shell includes top plate, surround and support the side wall of the top plate, and from the top plate to There is acoustic aperture in the dividing plate of lower extension, the top plate;The dividing plate lower end is fixedly connected with the mounting portion;The dividing plate and The inner space is divided into first operatic tunes and second operatic tunes by the metal supporting frames;Formed in first operatic tunes and run through institute State acoustic aperture and the opening, and the transaudient passage closed relative to second operatic tunes;MEMS wheats are mounted in the mounting portion Gram wind component, the microphone film of the MEMS microphone component is corresponding with the opening;By metal connecting line by the wheat Gram wind component is electrically connected with the metal shell and the asic chip respectively.

Optionally, an isolating and protecting part is installed, the isolating and protecting part two ends respectively with the side wall of the metal shell and Dividing plate is fixedly connected.

Optionally, first operatic tunes is connected with second operatic tunes, and the asic chip is located in second operatic tunes, With the electrical connection of the microphone assembly.

Optionally, it is fixedly mounted on the substrate by adhesive in the metal shell, described adhesive containing gold Belong to powder.

Optionally, the isolating and protecting part is non-woven fabrics catch net, braiding catch net or macropore sponge net.

The advantage of the invention is that by the way that in metal supporting frames, MEMS microphone component placement is made into MEMS microphone not Directly against loaded on substrate, saving base plan area so that whole encapsulating structure is more reasonable, and more three-dimensional, substrate can also be pasted Other more electronic components of dress.In addition, enclosed inside space is divided into first operatic tunes by metal supporting frames and dividing plate With second operatic tunes, the space below microphone film is added, is conducive to quieting down for MEMS microphone component, and second operatic tunes is more Can as first operatic tunes substitute, first operatic tunes quiet down effect it is not good when the supplement that carries out.

Brief description of the drawings

Fig. 1 is the schematic diagram of the MEMS microphone package structure of prior art;

Fig. 2 is the schematic diagram of the MEMS microphone package structure of one embodiment of the invention;

Fig. 3 to Fig. 6 is the sectional view of MEMS Mikes method for packing of the present invention.

Embodiment

To make present disclosure more clear understandable, below in conjunction with Figure of description, present disclosure is made into one Walk explanation.Certainly the invention is not limited in the specific embodiment, the general replacement known to those skilled in the art Cover within the scope of the present invention.

First, the MEMS microphone package structure to one embodiment of the invention is illustrated.

As shown in Fig. 2 microphone packaging scheme includes substrate 11 and housing 14.Substrate 11 and metal shell 14, which are fixed, to be connected Connect, be combined and form inner space.Directly against equipped with application-specific integrated circuit ASIC chip 13 on substrate.Substrate 11 can be Pcb board, or metallic plate.Substrate 11 is fixedly connected with metal shell 14 by adhesive 15 in the present embodiment.Wherein glue The material of mixture 15 is silica gel or UV glue, wherein metal dust is mixed with, with the circuit turn-on being grounded.The material of metal dust Material can be the one or more in copper, aluminium, nickel.In other embodiments, metal shell 14 can also pass through welding manner and base Plate 11 is fixedly connected.

Metal shell 14 includes top plate 14a, surrounds and supports the side wall 14b of top plate, and extended downwardly from top plate 14a Dividing plate 14c.Side wall 14b lower end is fixedly connected by adhesive 15 or welding manner with substrate 11.Have in top plate 14a and receive The acoustic aperture 16 of external voice signal.

Metal supporting frames 12 are provided with the inner space that metal shell 14 and substrate 11 are formed.Metal supporting frames 12 include Connected mounting portion and the supporting part of support mounting portion.Wherein, mounting portion is to be used to mount MEMS microphone component, wherein having The opening 12a corresponding with the microphone film of MEMS microphone component.The dividing plate 14c of mounting portion and metal shell lower end is consolidated Fixed connection, supporting part is then fixed on substrate 11 in its lower end.The material of metal supporting frames can be copper, aluminium, nickel, or its alloy.By In MEMS microphone component it is mounted in metal supporting frames 12, rather than directly against loaded on substrate 11, saves substrate 11 The area of plane so that whole encapsulating structure is more reasonable, more three-dimensional.Substrate 11 can also mount other more electricity on this basis Sub- component, increases the function of MEMS microphone.Between the mounting portion and dividing plate 14c of metal supporting frames, support and substrate 11 Between, due to can be completed to connect or mounting by welding or adhesive between MEMS microphone component and mounting portion.In addition, MEMS microphone component is connected by a metal connecting line with the top 14a of metal shell realizes that GND is grounded, and by another metal Line and asic chip 13 are connected, and realize circuit control.

As illustrated, the inner space is divided into the He of first operatic tunes 18 by the present invention by dividing plate 14c and support frame 12 The two parts of second operatic tunes 19.Support frame 12 raises the MEMS microphone component mounted thereon, compared to prior art, passes through Form first operatic tunes 18 and add spatial volume below microphone assembly diaphragm, be conducive to quieting down for MEMS microphone chip. On the other hand, it also form in first operatic tunes 18 through the opening and the opening 12a of mounting portion positioned at metal shell top plate 14a Transaudient passage, the transaudient passage relative to second operatic tunes 19 be closing.Compared to prior art, formed in first operatic tunes 18 Transaudient channel path clearly, reduce loss of the sound in transmittance process, MEMS microphone is quieted down better.

Preferably, although inner space is divided into first operatic tunes 18 and second operatic tunes 19 by metal supporting frames and dividing plate, It is that two operatic tunes are not completely separated.In other words, second operatic tunes 19 and non-close, it has the part connected with first operatic tunes 18. Thus, when the effect that quiets down that first operatic tunes 18 is quieted down by the transaudient passage is not good, sound can be transaudient logical by first operatic tunes The part connected with second operatic tunes beyond road first passes through second operatic tunes, incoming again after the metal shell reflection of second operatic tunes The diaphragm of MEMES microphone assemblies, then passes through the after-treatment of asic chip, and completion quiets down and analog-to-digital conversion.Therefore, when Transaudient passage quiet down effect it is not good when, second operatic tunes is the supplement for first operatic tunes favorably.

Please continue to refer to Fig. 2, preferably, also inserting isolating and protecting part 20 in whole encapsulating structure.Isolating and protecting part 20 On the transaudient passage of first operatic tunes, the two ends of specific isolating and protecting part 20 respectively with the side wall 14b of metal shell and Dividing plate 14c(Or the supporting part of metal supporting frames)It is fixedly connected.Isolating and protecting part 20 serves dust-proof, moistureproof, the effect of noise reduction, The color of isolating and protecting part 20 can be the dark system such as black, navy blue, Dark grey, dark brown, blackish green, dark-brown, coffee color Color, can absorb the extraneous most of illumination for entering first operatic tunes, to reduce optical noise, while also not interfering with voice signal Reception.Isolating and protecting part can be non-woven fabrics catch net, weave catch net, or macropore sponge net, may filter that the external world Dust.Therefore, by setting isolating and protecting part to add the reliability of encapsulating structure.

The MEMS microphone package method of the present invention is described in detail below in conjunction with Fig. 3~Fig. 6.

First, as shown in figure 3, metal supporting frames and asic chip are fixedly mounted on the substrate 11.Specifically, asic chip 13 can realize the SMT pasters on substrate by way of welding.Metal supporting frames 12 include mounting portion and support mounting portion Supporting part, the supporting part can be also directly welded on substrate 11, so that metal supporting frames are fixed with substrate.Have in mounting portion There is opening 12a.Metal supporting frames material can be copper, aluminium, nickel, or its alloy.Substrate can be pcb board or metallic plate.

Then, as shown in figure 4, a housing 14 is fixedly mounted on the substrate 11, so as to form an inner space.The housing 14 Including top plate 14a, the side wall 14b of top plate, and the dividing plate 14c extended downwardly from top plate are surrounded and supported.Have in top plate 14a Acoustic aperture 16.Dividing plate 14c lower end is fixedly connected with the mounting portion of metal supporting frames 12.Wherein, in the present embodiment, metal-back Body 14 can be connected by adhesive 15 with substrate 11.Wherein the material of adhesive is silica gel or UV glue, wherein being mixed with gold Belong to powder, with the circuit turn-on being grounded.The material of metal dust can be the one or more in copper, aluminium, nickel.In other realities Apply in example, metal shell 14 can also be connected by welding manner and substrate 11.Dividing plate 14c lower end and metal supporting frames 12 Mounting portion can be also fixedly connected by way of adhesive or welding.Metal shell and the material of metal supporting frames can be copper, Aluminium, nickel, or its alloy.

Please continue to refer to Fig. 5, MEMS microphone component 17, MEMS microphone are installed in the mounting portion of metal supporting frames 12 The microphone film of the depression of component 17 is corresponding with the opening 12a of mounting portion.Wherein MEMS microphone component can pass through silica gel Attachment is fixed in mounting portion, can also be fixed with the adhesives such as UV glue or Type of Welding.Additionally by MEMS microphone core Solder joint on piece, through two metal connecting lines, one is welded to realize the conducting in circuit control with asic chip 13, another with Metal shell is welded, and realizes that GND is grounded.

So far, inner space is divided into first operatic tunes 18 and second operatic tunes 19, MEMS Mikes by dividing plate 14c and support frame 12 Wind component placement saves the area of plane of substrate 11 in metal supporting frames 12;Form first operatic tunes 18 and add Mike Spatial volume below wind component diaphragm, is conducive to quieting down for MEMS microphone chip;In addition, being formd in first operatic tunes 18 Closed relative to second operatic tunes 19, and through acoustic aperture 16 and the opening 12a of mounting portion transaudient passage, the transaudient channel path is bright Really, loss of the sound in transmittance process is reduced, MEMS microphone is quieted down better.One in the present invention preferably implements In example, second operatic tunes 19 is connected with the part of first operatic tunes 18.The effect that quiets down quieted down when first operatic tunes 18 by the transaudient passage When not good, second operatic tunes is the supplement for first operatic tunes favorably.

Preferably, the step of method for packing of the present invention also includes installing isolating and protecting part.Fig. 6 is refer to, isolation is anti- Guard 20 is fixed between side the wall 14b and dividing plate 14c of metal shell, dust-proof to play, moistureproof, the effect of noise reduction.Isolation is anti- The position of guard 20 can be close to acoustic aperture 16 or close to dividing plate 14c end, and the present invention is not any limitation as.Isolating and protecting part 20 Color can be the dark system such as black, navy blue, Dark grey, dark brown, blackish green, brown, coffee color, to reduce optical noise; Material can be non-woven fabrics catch net, catch net, or macropore sponge net be woven, to filter extraneous dust.

In summary, compared with prior art, MEMS microphone package structure provided by the present invention and method for packing, lead to Cross MEMS microphone component placement in metal supporting frames, MEMS microphone directly against loaded on substrate, is not saved substrate The area of plane.In addition, the inner space of encapsulating structure is divided into first operatic tunes and the rising tone by metal supporting frames and dividing plate Chamber, adds the space below microphone film, is conducive to quieting down for MEMS microphone component, and second operatic tunes can more be used as The substitute of one operatic tunes, first operatic tunes quiet down effect it is not good when the supplement that carries out

Although the present invention is disclosed as above with preferred embodiment, right many embodiments are illustrated only for the purposes of explanation , the present invention is not limited to, those skilled in the art can make without departing from the spirit and scope of the present invention Some changes and retouching, the protection domain that the present invention is advocated should be to be defined described in claims.

Claims (8)

1. a kind of MEMS microphone package structure, including the substrate of asic chip and the gold being fixedly connected with the substrate are installed Belong to housing, the substrate and the metal shell combine and form inner space, it is characterised in that
The metal shell includes top plate, surrounds and supports the side wall of the top plate, and from the top plate extend downwardly every There is acoustic aperture in plate, the top plate;
Metal supporting frames are provided with the inner space, the metal supporting frames include the load to mount MEMS microphone component Put portion and support the supporting part of the mounting portion, the mounting portion has the microphone film phase with the MEMS microphone component Corresponding opening;The supporting part is fixedly connected with the substrate, and the mounting portion is fixedly connected with the dividing plate;
The inner space is divided into first operatic tunes and second operatic tunes, first sound by the dividing plate and the metal supporting frames The transaudient passage through the acoustic aperture and the opening is formed in chamber, the transaudient passage is closed relative to second operatic tunes;
First operatic tunes is connected with second operatic tunes, and the asic chip is located in second operatic tunes, with the Mike The electrical connection of wind component.
2. MEMS microphone package structure as claimed in claim 1, it is characterised in that anti-provided with isolation in the transaudient passage Guard, the isolating and protecting part two ends are fixedly connected with the side wall and dividing plate of the metal shell respectively.
3. MEMS microphone package structure as claimed in claim 1, it is characterised in that the metal shell by adhesive with The substrate is fixedly connected, and metal dust is contained in described adhesive.
4. MEMS microphone package structure as claimed in claim 2, it is characterised in that the isolating and protecting part is protected for non-woven fabrics Protecting wire net, braiding catch net or macropore sponge net.
5. a kind of method for packing of MEMS microphone, comprises the following steps:
A substrate and a metal supporting frames are provided, support frame as described above includes the supporting part of mounting portion and the support mounting portion, There is opening in the mounting portion;The supporting part and an asic chip are fixedly installed in the substrate;
A metal shell is fixedly mounted on the substrate to form an inner space, the metal shell includes top plate, surround And support in the side wall of the top plate, and the dividing plate extended downwardly from the top plate, the top plate with acoustic aperture;Will it is described every Plate lower end is fixedly connected with the mounting portion;The inner space is divided into the first sound by the dividing plate and the metal supporting frames Chamber and second operatic tunes;First operatic tunes is connected with second operatic tunes, and the asic chip is located in second operatic tunes;Institute State to be formed in first operatic tunes and run through the acoustic aperture and the opening, and the transaudient passage closed relative to second operatic tunes;
MEMS microphone component, the microphone film of the MEMS microphone component and the opening are mounted in the mounting portion It is corresponding;
The MEMS microphone component is electrically connected with the metal shell and the asic chip respectively by metal connecting line.
6. the method for packing of MEMS microphone as claimed in claim 5, it is characterised in that also include:One isolating and protecting is installed Part, the isolating and protecting part two ends are fixedly connected with the side wall and dividing plate of the metal shell respectively.
7. the method for packing of MEMS microphone as claimed in claim 6, it is characterised in that by adhesive on the substrate It is fixedly mounted in the metal shell, described adhesive and contains metal dust.
8. the method for packing of MEMS microphone as claimed in claim 6, it is characterised in that the isolating and protecting part is non-woven fabrics Catch net, braiding catch net or macropore sponge net.
CN201310746916.7A 2013-12-30 2013-12-30 A kind of MEMS microphone package structure and method for packing CN103663352B (en)

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CN107864258B (en) * 2017-10-27 2019-12-27 Oppo广东移动通信有限公司 Shell assembly of electronic equipment and electronic equipment

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