CN204377135U - The encapsulating structure of micro-electro-mechanical microphone - Google Patents
The encapsulating structure of micro-electro-mechanical microphone Download PDFInfo
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- CN204377135U CN204377135U CN201520040234.9U CN201520040234U CN204377135U CN 204377135 U CN204377135 U CN 204377135U CN 201520040234 U CN201520040234 U CN 201520040234U CN 204377135 U CN204377135 U CN 204377135U
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Abstract
The utility model provides a kind of encapsulating structure of micro-electro-mechanical microphone, it comprises a substrate, be fixed on this substrate and in establish the first screening can and the microphone chip of assembly between described substrate and the first screening can of at least one deck metal level, this encapsulating structure also comprise one cover described first screening can and in establish the secondary shielding shell of at least one deck metal level, described secondary shielding shell is fixed on this substrate.The encapsulating structure of the micro-electro-mechanical microphone that the utility model provides, by substrate superordinate two screening cans, makes the effectiveness of micro-electro-mechanical microphone significantly increase.
Description
[technical field]
The utility model relates to a kind of micro-electro-mechanical microphone, particularly relates to a kind of encapsulating structure with the micro-electro-mechanical microphone of high effectiveness.
[background technology]
Due to the progress of science and technology, no matter micro-electro-mechanical microphone all has sizable advantage in function or volume, but because micro-electro-mechanical microphone must receive extraneous sound, so be easy to be subject to the interference of external factor (as electromagnetic wave) and cause reception quality not good, and then the surcharge of related electronic products is caused relatedly to be affected.Therefore, how to promote and prevent the effect of Electromagnetic Interference from being the problem of current industry in the urgent need to improving.
And to apply conventional microelectromechanical microphone more widely be at present all for microphone chip provides electromagnetic shielding at pcb board superordinate single metal cover.Along with rapidly the increasing progressively of value volume and range of product of electronic devices and components in the electronic equipment of application micro-electro-mechanical microphone, electromagnetic environment more sophisticated residing for micro-electro-mechanical microphone is changeable, now, the defect of the electromagnetic armouring structure of single metal cover more manifests, be difficult to adapt to this electromagnetic environment complicated and changeable, the electromagnetic interference that microphone chip is subject to is got over utility model and is shown, thus has a strong impact on the performance of micro-electro-mechanical microphone.
Therefore, the encapsulating structure that a kind of new micro-electro-mechanical microphone is provided is necessary.
[utility model content]
The purpose of this utility model is to provide a kind of encapsulating structure with the micro-electro-mechanical microphone of high effectiveness.
The technical solution of the utility model is as follows: a kind of encapsulating structure of micro-electro-mechanical microphone, it comprises a substrate, be fixed on this substrate and in establish the first screening can and the microphone chip of assembly between described substrate and the first screening can of at least one deck metal level, this encapsulating structure also comprise one cover described first screening can and in establish the secondary shielding shell of at least one deck metal level, described secondary shielding shell is fixed on this substrate.
Preferably, described first screening can and secondary shielding shell are all for metal level described in one deck is formed.
Preferably, being provided with the first fixing point for described first screening can being fixed on described substrate between described first screening can and described substrate, between described secondary shielding shell and described substrate, being provided with the second fixing point for described secondary shielding shell being fixed on described substrate.
Preferably, described first screening can is electrically connected at described substrate by described first fixing point.
Preferably, described secondary shielding shell is electrically connected at described substrate by described second fixing point.
Preferably, described first fixing point and described second fixing point overlap.
A kind of encapsulating structure of micro-electro-mechanical microphone, it comprise substrate, in establish the first screening can and the microphone chip of assembly between described substrate and the first screening can of at least one deck metal level, this encapsulating structure also comprise one cover described first screening can and in establish the secondary shielding shell of at least one deck metal level, described first screening can and secondary shielding shell interfix, and in described first screening can and secondary shielding shell, any one screening can is fixed on described substrate.
Preferably, described first screening can and secondary shielding shell are all for metal level described in one deck is formed.
Preferably, the screening can being fixed on described substrate in described first screening can and secondary shielding shell is electrically connected at described substrate.
Preferably, electrically conduct between described first screening can and secondary shielding shell.
The beneficial effects of the utility model are: by substrate superordinate two screening cans, the effectiveness of micro-electro-mechanical microphone is significantly increased.
[accompanying drawing explanation]
Fig. 1 is the cross-sectional schematic of the first embodiment of the encapsulating structure of the utility model micro-electro-mechanical microphone;
Fig. 2 is the cross-sectional schematic of the second embodiment of the encapsulating structure of the utility model micro-electro-mechanical microphone;
Fig. 3 is the cross-sectional schematic of the 3rd embodiment of the encapsulating structure of the utility model micro-electro-mechanical microphone;
Fig. 4 is the cross-sectional schematic of the 4th embodiment of the encapsulating structure of the utility model micro-electro-mechanical microphone.
[embodiment]
In order to describe structure of the present utility model, feature and effect place in detail, below in conjunction with specific embodiments and the drawings, the utility model is described in further detail.
As shown in Figure 1, the utility model provides a kind of encapsulating structure 1 of micro-electro-mechanical microphone, it comprises a substrate 10, be fixed on this substrate 10 and in establish the first screening can 11 of at least one deck metal level and the microphone chip 12 of assembly between described substrate 10 and the first screening can 11, this encapsulating structure 1 also comprise one cover described first screening can 11 and in establish the secondary shielding shell 13 of at least one deck metal level, described secondary shielding shell 13 is fixed on this substrate 10, in the utility model, this substrate 10 can be PCB substrate.Described first screening can 11 and secondary shielding shell 13 are all formed for metal level described in one deck, and namely described first screening can 11 and secondary shielding shell 13 are all a metal shell.
Being provided with the first fixing point 14 for described first screening can 11 being fixed on described substrate 10 between described first screening can 11 and described substrate 10, between described secondary shielding shell 13 and described substrate 10, being provided with the second fixing point 15 for described secondary shielding shell 13 being fixed on described substrate 10.This first fixing point 14 is between the first screening can 11 and substrate 10, described second fixing point 15 is between described secondary shielding shell 13 and substrate 10, described first fixing point 14 and the second fixing point 15 only can play bonding effect, also can only electrification property conducting effect, also can play bonding and effect that is that electrically conduct simultaneously.Therefore, described first fixing point 14 and the second fixing point 15 can be the various one be adhesively fixed in material such as conducting resinl, non-conductive adhesive, tin cream, even, contact point when contacting with each other when described first fixing point 14 and the second fixing point 15 may be only also and be fixed with substrate 10 by described first screening can 11 and secondary shielding shell 13 or contact-making surface.
In the utility model, preferably, described first screening can 11 is electrically connected at described substrate 10 by described first fixing point 14, and accordingly, described secondary shielding shell 13 is electrically connected at described substrate 10 by described second fixing point 15.
In addition, as shown in Figure 2, in the second embodiment of the encapsulating structure 1 of the utility model micro-electro-mechanical microphone, described first fixing point 14 can also overlap with described second fixing point 15.
As shown in Figures 3 and 4, the utility model additionally provides the encapsulating structure 1 of another micro-electro-mechanical microphone, it comprises substrate 10, inside establish at least one deck metal level first screening can 11, and the microphone chip 12 of assembly between described substrate 10 and the first screening can 11, this encapsulating structure 1 also comprise one cover described first screening can 11 and in establish the secondary shielding shell 13 of at least one deck metal level, described first screening can 11 and secondary shielding shell 13 interfix, any one screening can 11 in described first screening can 11 and secondary shielding shell 13, 13 are fixed on described substrate 10, described substrate 10 can be PCB substrate in the utility model.Described first screening can 11 and secondary shielding shell 13 are all formed for metal level described in one deck, and namely described first screening can 11 and secondary shielding shell 13 are all a metal shell.
Fixing point 16 is provided with between the screening can 11,13 fixing with described substrate 10 and this substrate 10 in described first screening can 11 and secondary shielding shell 13.Described fixing point 16 only can play bonding effect, also can only electrification property conducting effect, also can play bonding and effect that is that electrically conduct simultaneously.Therefore, described fixing point 16 can be the various one be adhesively fixed in material such as conducting resinl, non-conductive adhesive, tin cream, even, contact point when contacting with each other when described fixing point 16 may be only also and be fixed with substrate 10 by described screening can 11,13 or contact-making surface.
In the utility model, the screening can being fixed on described substrate 10 in described first screening can 11 and secondary shielding shell 13 is electrically connected at described substrate 10 by described fixing point 16.In order to improve effectiveness, electrically conduct between described first screening can 11 and secondary shielding shell 13.
The beneficial effects of the utility model are: by assembly two screening cans 11,13 on the substrate 10, the effectiveness of micro-electro-mechanical microphone is significantly increased.
Above-described is only execution mode of the present utility model; it should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite not departing from the utility model creation design; improvement can also be made, but these all belong to protection range of the present utility model.
Claims (10)
1. the encapsulating structure of a micro-electro-mechanical microphone, it comprises a substrate, be fixed on this substrate and in establish the first screening can and the microphone chip of assembly between described substrate and the first screening can of at least one deck metal level, it is characterized in that, this encapsulating structure also comprise one cover described first screening can and in establish the secondary shielding shell of at least one deck metal level, described secondary shielding shell is fixed on this substrate.
2. the encapsulating structure of micro-electro-mechanical microphone according to claim 1, is characterized in that: described first screening can and secondary shielding shell are all for metal level described in one deck is formed.
3. the encapsulating structure of micro-electro-mechanical microphone according to claim 2, it is characterized in that: between described first screening can and described substrate, be provided with the first fixing point for described first screening can being fixed on described substrate, between described secondary shielding shell and described substrate, being provided with the second fixing point for described secondary shielding shell being fixed on described substrate.
4. the encapsulating structure of micro-electro-mechanical microphone according to claim 3, is characterized in that: described first screening can is electrically connected at described substrate by described first fixing point.
5. the encapsulating structure of the micro-electro-mechanical microphone according to claim 3 or 4, is characterized in that: described secondary shielding shell is electrically connected at described substrate by described second fixing point.
6. the encapsulating structure of the micro-electro-mechanical microphone according to claim 3 or 4, is characterized in that: described first fixing point and described second fixing point overlap.
7. the encapsulating structure of a micro-electro-mechanical microphone, it comprise substrate, in establish the first screening can and the microphone chip of assembly between described substrate and the first screening can of at least one deck metal level, it is characterized in that, this encapsulating structure also comprise one cover described first screening can and in establish the secondary shielding shell of at least one deck metal level, described first screening can and secondary shielding shell interfix, and in described first screening can and secondary shielding shell, any one screening can is fixed on described substrate.
8. the encapsulating structure of micro-electro-mechanical microphone according to claim 7, is characterized in that: described first screening can and secondary shielding shell are all for metal level described in one deck is formed.
9. the encapsulating structure of micro-electro-mechanical microphone according to claim 8, is characterized in that: the screening can being fixed on described substrate in described first screening can and secondary shielding shell is electrically connected at described substrate.
10. the encapsulating structure of the micro-electro-mechanical microphone according to claim 7 to 9 any one, is characterized in that: electrically conduct between described first screening can and secondary shielding shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520040234.9U CN204377135U (en) | 2015-01-20 | 2015-01-20 | The encapsulating structure of micro-electro-mechanical microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520040234.9U CN204377135U (en) | 2015-01-20 | 2015-01-20 | The encapsulating structure of micro-electro-mechanical microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204377135U true CN204377135U (en) | 2015-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520040234.9U Active CN204377135U (en) | 2015-01-20 | 2015-01-20 | The encapsulating structure of micro-electro-mechanical microphone |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107184231A (en) * | 2016-12-28 | 2017-09-22 | 欧姆龙健康医疗事业株式会社 | Organism sound measurement device |
| CN110290451A (en) * | 2019-06-26 | 2019-09-27 | 维沃移动通信有限公司 | A kind of package assembling and microphone mould group |
| CN110662149A (en) * | 2019-09-06 | 2020-01-07 | 歌尔股份有限公司 | MEMS microphone |
| CN110691311A (en) * | 2019-10-28 | 2020-01-14 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
| CN110783318A (en) * | 2019-10-28 | 2020-02-11 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
| CN110868682A (en) * | 2019-12-18 | 2020-03-06 | 青岛歌尔智能传感器有限公司 | MEMS microphone |
-
2015
- 2015-01-20 CN CN201520040234.9U patent/CN204377135U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107184231A (en) * | 2016-12-28 | 2017-09-22 | 欧姆龙健康医疗事业株式会社 | Organism sound measurement device |
| CN110290451A (en) * | 2019-06-26 | 2019-09-27 | 维沃移动通信有限公司 | A kind of package assembling and microphone mould group |
| CN110662149A (en) * | 2019-09-06 | 2020-01-07 | 歌尔股份有限公司 | MEMS microphone |
| CN110691311A (en) * | 2019-10-28 | 2020-01-14 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
| CN110783318A (en) * | 2019-10-28 | 2020-02-11 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
| CN110868682A (en) * | 2019-12-18 | 2020-03-06 | 青岛歌尔智能传感器有限公司 | MEMS microphone |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |