CN103663352A - MEMS microphone packaging structure and packaging method - Google Patents
MEMS microphone packaging structure and packaging method Download PDFInfo
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- CN103663352A CN103663352A CN201310746916.7A CN201310746916A CN103663352A CN 103663352 A CN103663352 A CN 103663352A CN 201310746916 A CN201310746916 A CN 201310746916A CN 103663352 A CN103663352 A CN 103663352A
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Abstract
The invention discloses an MEMS microphone packaging structure which comprises a substrate and a metal shell. The substrate and the metal shell are combined to form internal space. The metal shell comprises a top plate, a side wall and a partition plate, wherein the top plate is provided with a sound aperture, and the partition plate extends downwards from the top plate. A metal supporting frame is arranged in the internal space and comprises a weight bearing portion and a supporting portion, wherein an MEMS microphone assembly is arranged on the weight bearing portion in surface mounting mode, the supporting portion is used for supporting the weight bearing portion, the weight bearing portion is provided with an opening corresponding to a microphone diaphragm of the MEMS microphone assembly, the supporting portion is fixedly connected with the substrate, and the weight bearing portion is fixedly connected with the partition plate. The partition plate and the metal supporting frame divide the internal space into a first sound cavity and a second sound cavity. A transaudient channel penetrating the sound aperture and the opening is formed in the first sound cavity and sealed relative to the second sound cavity. The invention further provides an MEMS microphone packaging method. According to the MEMS microphone packaging structure and packaging method, the occupied space of the substrate can be reduced, and the sound receiving effect is improved.
Description
Technical field
The present invention relates to MEMS microphone package technical field, particularly a kind of MEMS microphone packaging scheme and method for packing.
Background technology
Along with social progress and the development of technology, in recent years, the volume of Intelligent mobile equipment constantly reduces and performance and uniformity raising, to the encapsulation of microphone, requires also more and more tighter.Utilizing MEMS(MEMS) the integrated MEMS microphone of technique starts to be applied in batches in the idea products such as mobile phone, notebook.This MEMS microphone package is stayed collective with traditional EMC() microphone compares, volume is less, good seal performance, reliability is high, and high temperature resistant, can withstand SMT(surface mounting technology) the high temperature test of technique.
As shown in Figure 1, it utilizes a substrate 1(as pcb board to the general structure of MEMS microphone package) and metal outer frame 4 form cavitys 6 and become the periphery encapsulation of MEMS microphone.In the inside of cavity 6, MEMS microphone assembly 3 is installed, at the top of metal outer frame, is provided with permeate chamber inside and outside and for accepting the sound hole 5 of external sound signal.Transaudient passage enters cavity 6 by sound hole 5, arrives the diaphragm of MEMS microphone chip 3 depressions.MEMS microphone chip 3 is by 2 solder joints, and one is welded with integrated circuit asic chip 2, and another sidepiece that is welded direct to metal outer frame 4 is realized GND ground connection.
This traditional MEMS microphone packaging scheme has following shortcoming: first MEMS microphone assembly 3 and integrated circuit asic chip 2 all need to be mounted on substrate 1(PCB plate) above, add other some electronic devices and components, the area that takies substrate 1 is larger.Secondly, it is to be mounted on substrate that this encapsulating structure inside only has a cavity and MEMS microphone assembly, and the round of the transaudient passage in cavity is also indefinite.The diaphragm of the MEMS microphone chip effect that quiets down is directly relevant with the propagation circuit of sound with the volume size of cavity, and obvious such encapsulating structure has affected the effect that quiets down of MEMS microphone.In addition, because having required its encapsulating structure, the operation principle of silicon microphone must there is the sound hole that is communicated with space, inside and outside, this has just caused outside dust and light easily from the external world, to enter into inside cavity, and directly touch MEMS chip, this can bring certain interference to the work of MEMS chip, that is to say the noise of general understanding.Meanwhile, illumination is mapped on asic chip, also can exert an influence to the electrical property of microphone.
Summary of the invention
The object of the present invention is to provide a kind of substrate area occupied that reduces, improve quiet down the MEMS microphone packaging scheme of effect and the method for packing of MEMS microphone, to overcome above-mentioned shortcoming.
For reaching above-mentioned purpose, the invention provides a kind of MEMS microphone packaging scheme, it comprises the substrate and the metal shell being fixedly connected with described substrate that asic chip is installed, described substrate and described metal shell in conjunction with and form inner space, wherein said metal shell comprises top board, around and support the sidewall of described top board, and the dividing plate from described top board to downward-extension, has sound hole in described top board; In described inner space, be provided with metal supporting frames, the support portion that described metal supporting frames comprises mounting the mounting portion of MEMS microphone assembly and supports described mounting portion, described supporting part has the opening corresponding with the microphone film of described MEMS microphone assembly; Described support portion is fixedly connected with described substrate, and described mounting portion is fixedly connected with described dividing plate; Described dividing plate and described metal supporting frames are divided into first operatic tunes and second operatic tunes by described inner space, form the transaudient passage that runs through described sound hole and described opening in described first operatic tunes, and described transaudient passage is with respect to described the second operatic tunes sealing.
Preferably, in described transaudient passage, be provided with isolating and protecting part, described isolating and protecting part two ends are fixedly connected with dividing plate with the sidewall of described metal shell respectively.
Preferably, described first operatic tunes and described second operatic tunes are communicated with, and described asic chip is arranged in described second operatic tunes, with being electrically connected to of described microphone assembly.
Preferably, described metal shell is fixedly connected with described substrate by adhesive, in described adhesive, contains metal dust.
Preferably, described isolating and protecting part is nonwoven catch net, braiding catch net or macropore sponge net.
The present invention also provides a kind of method for packing of MEMS microphone, comprises the following steps: a substrate and a metal supporting frames are provided, and the support portion that support frame as described above comprises mounting portion and supports described mounting portion, has opening in described mounting portion; Described support portion and an asic chip are fixedly installed in to described substrate; On described substrate, fixedly mount a metal shell to form an inner space, described metal shell comprises top board, around and support the sidewall of described top board, and the dividing plate from described top board to downward-extension, has sound hole in described top board; Described dividing plate lower end is fixedly connected with described mounting portion; Described dividing plate and described metal supporting frames are divided into first operatic tunes and second operatic tunes by described inner space; In described first operatic tunes, form and run through described sound hole and described opening, and the transaudient passage sealing with respect to described second operatic tunes; In described mounting portion, mount MEMS microphone assembly, the microphone film of described MEMS microphone assembly is corresponding with described opening; By metal connecting line, described microphone assembly is electrically connected to described metal shell and described asic chip respectively.
Optionally, an isolating and protecting part is installed, described isolating and protecting part two ends are fixedly connected with dividing plate with the sidewall of described metal shell respectively.
Optionally, described first operatic tunes and described second operatic tunes are communicated with, and described asic chip is arranged in described second operatic tunes, with being electrically connected to of described microphone assembly.
Optionally, by adhesive, on described substrate, fixedly mount described metal shell, in described adhesive, contain metal dust.
Optionally, described isolating and protecting part is nonwoven catch net, braiding catch net or macropore sponge net.
The invention has the advantages that by MEMS microphone assembly is mounted in metal supporting frames, make MEMS microphone directly not be mounted on substrate, saved base plan area, make whole encapsulating structure more reasonable, three-dimensional more, substrate also can mount more other electronic devices and components.In addition, by metal supporting frames and dividing plate, inner encapsulated space is divided into first operatic tunes and second operatic tunes, increased the space of microphone film below, be conducive to quieting down of MEMS microphone assembly, and second operatic tunes more can be used as the substitute of first operatic tunes, that when first operatic tunes quiets down effect not good, carries out supplements.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the MEMS microphone packaging scheme of prior art;
Fig. 2 is the schematic diagram of the MEMS microphone packaging scheme of one embodiment of the invention;
Fig. 3 to Fig. 6 is the cutaway view of MEMS Mike method for packing of the present invention.
The specific embodiment
For making content of the present invention more clear understandable, below in conjunction with Figure of description, content of the present invention is described further.Certainly the present invention is not limited to this specific embodiment, and the known general replacement of those skilled in the art is also encompassed in protection scope of the present invention.
First, the MEMS microphone packaging scheme of one embodiment of the invention is described.
As shown in Figure 2, microphone packaging scheme comprises substrate 11 and housing 14.Substrate 11 is fixedly connected with metal shell 14, combines and forms inner space.On substrate, be directly pasted with application-specific integrated circuit ASIC chip 13.Substrate 11 can be pcb board, also can be metallic plate.Substrate 11 is fixedly connected with by adhesive 15 with metal shell 14 in the present embodiment.Wherein the material of adhesive 15 is silica gel or UV glue, has wherein mixed metal dust, with the circuit turn-on being grounded.The material of metal dust can be one or more in copper, aluminium, nickel.In other embodiments, metal shell 14 also can be fixedly connected with substrate 11 by welding manner.
In metal shell 14 and the formed inner space of substrate 11, be provided with metal supporting frames 12.Metal supporting frames 12 comprises connected mounting portion and supports the support portion of mounting portion.Wherein, mounting portion is for mounting MEMS microphone assembly, wherein has the opening 12a corresponding with the microphone film of MEMS microphone assembly.Mounting portion is fixedly connected with the lower end of the dividing plate 14c of metal shell, and substrate 11 is fixed in Ze Qi lower end, support portion.The material of metal supporting frames can be copper, aluminium, nickel, or its alloy.Because MEMS microphone assembly is to be mounted in metal supporting frames 12, but not be directly mounted on substrate 11, saved the area of plane of substrate 11, make whole encapsulating structure more reasonable, more three-dimensional.Substrate 11 also can mount more other electronic devices and components on this basis, increases the function of MEMS microphone.Between the mounting portion of metal supporting frames and dividing plate 14c, between support and substrate 11, owing to all can completing and connect or mount by welding or adhesive between MEMS microphone assembly and mounting portion.In addition, MEMS microphone assembly is connected and is realized GND ground connection by the top 14a of a metal connecting line and metal shell, and is connected with asic chip 13 by another root metal connecting line, realizes circuit and controls.
As shown in the figure, the present invention is divided into first operatic tunes 18 and second operatic tunes 19 two parts by dividing plate 14c and bracing frame 12 by this inner space.Bracing frame 12 is raised the MEMS microphone assembly mounting on it, than prior art, has increased the spatial volume of microphone assembly diaphragm below by forming first operatic tunes 18, is conducive to quieting down of MEMS microphone chip.On the other hand, also formed and run through the transaudient passage that is positioned at the opening of metal shell top board 14a and the opening 12a of mounting portion in first operatic tunes 18, this transaudient passage seals with respect to second operatic tunes 19.Compared to prior art, the transaudient channel path forming in first operatic tunes 18 is clear and definite, has reduced the loss of sound in transmittance process, makes the MEMS microphone effect that quiets down better.
Preferably, although metal supporting frames and dividing plate are divided into first operatic tunes 18 and second operatic tunes 19 by inner space, two operatic tunes are not separated completely.In other words, the second not sealing of the operatic tunes 19, it has the part being communicated with first operatic tunes 18.Thus, when quieting down during poor effect that first operatic tunes 18 quiets down by this transaudient passage, sound can be by the part being communicated with second operatic tunes beyond the transaudient passage of first operatic tunes first through second operatic tunes, after metal shell reflection by second operatic tunes, import again the diaphragm of MEMES microphone assembly into, pass through subsequently the after-treatment of asic chip, complete and quiet down and analog-to-digital conversion.Therefore,, when transaudient passage quiets down poor effect, second operatic tunes is for favourable the supplementing of first operatic tunes.
Please continue to refer to Fig. 2, preferably, in whole encapsulating structure, also inserted isolating and protecting part 20.Isolating and protecting part 20 is located on the transaudient passage of first operatic tunes, the two ends of concrete isolating and protecting part 20 respectively with the sidewall 14b of metal shell and the supporting part of dividing plate 14c(or metal supporting frames) be fixedly connected with.Isolating and protecting part 20 has played dustproof, moistureproof, the effect of noise reduction, it is color that the color of isolating and protecting part 20 can be the dark colors such as black, navy blue, Dark grey, dark brown, blackish green, dark-brown, coffee color, can absorb most of illumination that the external world enters first operatic tunes, to reduce optical noise, also can not affect the reception of voice signal simultaneously.Isolating and protecting part can be nonwoven catch net, and braiding catch net, also can be macropore sponge net, can filter extraneous dust.Therefore, by being set, isolating and protecting part increased the reliability of encapsulating structure.
Below in conjunction with Fig. 3～Fig. 6, MEMS microphone package method of the present invention is described in detail.
First, as shown in Figure 3, on substrate 11, fixedly mount metal supporting frames and asic chip.Concrete, asic chip 13 can be realized the SMT paster on substrate by the mode of welding.Metal supporting frames 12 comprises mounting portion and the support portion of supporting mounting portion, and this support portion also can directly be welded on substrate 11, thereby metal supporting frames and substrate are fixed.In mounting portion, there is opening 12a.Metallic support frame material can be copper, aluminium, nickel, or its alloy.Substrate can be pcb board or metallic plate.
Then, as shown in Figure 4, on substrate 11, fixedly mount a housing 14, thereby form an inner space.This housing 14 comprises top board 14a, around and the sidewall 14b of roof supporting, and the dividing plate 14c from top board to downward-extension.In top board 14a, there is sound hole 16.The lower end of dividing plate 14c is fixedly connected with the mounting portion of metal supporting frames 12.Wherein, in the present embodiment, metal shell 14 can be connected and fixed by adhesive 15 and substrate 11.Wherein the material of adhesive is silica gel or UV glue, has wherein mixed metal dust, with the circuit turn-on being grounded.The material of metal dust can be one or more in copper, aluminium, nickel.In other embodiments, metal shell 14 also can be connected with substrate 11 by welding manner.The lower end of dividing plate 14c also can be fixedly connected with by the mode of adhesive or welding with the mounting portion of metal supporting frames 12.The material of metal shell and metal supporting frames all can be copper, aluminium, nickel, or its alloy.
Please continue to refer to Fig. 5, MEMS microphone assembly 17 is installed in the mounting portion of metal supporting frames 12, the microphone film of the depression of MEMS microphone assembly 17 is corresponding with the opening 12a of mounting portion.Wherein MEMS microphone assembly can be mounted and is fixed in mounting portion by silica gel, also can fix with the adhesives such as UV glue or Type of Welding.By the solder joint on MEMS microphone chip, through two strip metal lines, one is welded to realize with asic chip 13 conducting that circuit is controlled in addition, and another and metal shell welding, realize GND ground connection.
So far, dividing plate 14c and bracing frame 12 are divided into first operatic tunes 18 and second operatic tunes 19 by inner space, and MEMS microphone assembly is mounted in metal supporting frames 12, has saved the area of plane of substrate 11; First operatic tunes 18 that forms has increased the spatial volume of microphone assembly diaphragm below, is conducive to quieting down of MEMS microphone chip; In addition, in first operatic tunes 18, formed with respect to the second operatic tunes 19 sealings, and run through the transaudient passage of the opening 12a of sound hole 16 and mounting portion, this transaudient channel path is clear and definite, reduced the loss of sound in transmittance process, made the MEMS microphone effect that quiets down better.In a preferred embodiment of the present invention, second operatic tunes 19 is communicated with the first operatic tunes 18 parts.When quieting down during poor effect that first operatic tunes 18 quiets down by this transaudient passage, second operatic tunes is for favourable the supplementing of first operatic tunes.
Preferably, method for packing of the present invention also comprises the step that isolating and protecting part is installed.Please refer to Fig. 6, isolating and protecting part 20 is fixed between the sidewall 14b and dividing plate 14c of metal shell, dustproof to play, protection against the tide, the effect of noise reduction.The position of isolating and protecting part 20 can be near the end of sound hole 16 or close dividing plate 14c, and the present invention is not limited.The color of isolating and protecting part 20 can be for black, navy blue, Dark grey, dark brown, the dark system such as blackish green, brown, coffee-like, to reduce optical noise; Material can be nonwoven catch net, and braiding catch net, or macropore sponge net, to filter extraneous dust.
In sum, compared with prior art, MEMS microphone packaging scheme provided by the present invention and method for packing, by MEMS microphone assembly is mounted in metal supporting frames, make MEMS microphone directly not be mounted on substrate, saved base plan area.In addition, by metal supporting frames and dividing plate, the inner space of encapsulating structure is divided into first operatic tunes and second operatic tunes, increased the space of microphone film below, be conducive to quieting down of MEMS microphone assembly, and second operatic tunes more can be used as the substitute of first operatic tunes, that when first operatic tunes quiets down effect not good, carries out supplements
Although the present invention discloses as above with preferred embodiment; so described many embodiment only give an example for convenience of explanation; not in order to limit the present invention; those skilled in the art can do some changes and retouching without departing from the spirit and scope of the present invention, and the protection domain that the present invention advocates should be as the criterion with described in claims.
Claims (10)
1. a MEMS microphone packaging scheme, comprises substrate and the metal shell being fixedly connected with described substrate that asic chip is installed, described substrate and described metal shell in conjunction with and form inner space, it is characterized in that,
Described metal shell comprises top board, around and support the sidewall of described top board, and the dividing plate from described top board to downward-extension, has sound hole in described top board;
In described inner space, be provided with metal supporting frames, the support portion that described metal supporting frames comprises mounting the mounting portion of MEMS microphone assembly and supports described mounting portion, described supporting part has the opening corresponding with the microphone film of described MEMS microphone assembly; Described support portion is fixedly connected with described substrate, and described mounting portion is fixedly connected with described dividing plate;
Described dividing plate and described metal supporting frames are divided into first operatic tunes and second operatic tunes by described inner space, form the transaudient passage that runs through described sound hole and described opening in described first operatic tunes, and described transaudient passage is with respect to described the second operatic tunes sealing.
2. MEMS microphone packaging scheme as claimed in claim 1, is characterized in that, in described transaudient passage, is provided with isolating and protecting part, and described isolating and protecting part two ends are fixedly connected with dividing plate with the sidewall of described metal shell respectively.
3. MEMS microphone packaging scheme as claimed in claim 1, is characterized in that, described first operatic tunes and described second operatic tunes are communicated with, and described asic chip is arranged in described second operatic tunes, with being electrically connected to of described microphone assembly.
4. MEMS microphone packaging scheme as claimed in claim 1, is characterized in that, described metal shell is fixedly connected with described substrate by adhesive, in described adhesive, contains metal dust.
5. MEMS microphone packaging scheme as claimed in claim 2, is characterized in that, described isolating and protecting part is nonwoven catch net, braiding catch net or macropore sponge net.
6. a method for packing for MEMS microphone, comprises the steps:
One substrate and a metal supporting frames are provided, and the support portion that support frame as described above comprises mounting portion and supports described mounting portion, has opening in described mounting portion; Described support portion and an asic chip are fixedly installed in to described substrate;
On described substrate, fixedly mount a metal shell to form an inner space, described metal shell comprises top board, around and support the sidewall of described top board, and the dividing plate from described top board to downward-extension, has sound hole in described top board; Described dividing plate lower end is fixedly connected with described mounting portion; Described dividing plate and described metal supporting frames are divided into first operatic tunes and second operatic tunes by described inner space; In described first operatic tunes, form and run through described sound hole and described opening, and the transaudient passage sealing with respect to described second operatic tunes;
In described mounting portion, mount MEMS microphone assembly, the microphone film of described MEMS microphone assembly is corresponding with described opening;
By metal connecting line, described microphone assembly is electrically connected to described metal shell and described asic chip respectively.
7. the method for packing of MEMS microphone as claimed in claim 6, is characterized in that, also comprises: an isolating and protecting part is installed, and described isolating and protecting part two ends are fixedly connected with dividing plate with the sidewall of described metal shell respectively.
8. the method for packing of MEMS microphone as claimed in claim 6, is characterized in that, described first operatic tunes and described second operatic tunes are communicated with, and described asic chip is arranged in described second operatic tunes, with being electrically connected to of described microphone assembly.
9. the method for packing of MEMS microphone as claimed in claim 6, is characterized in that, fixedly mounts described metal shell by adhesive on described substrate, in described adhesive, contains metal dust.
10. the method for packing of MEMS microphone as claimed in claim 7, is characterized in that, described isolating and protecting part is nonwoven catch net, braiding catch net or macropore sponge net.
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| CN201310746916.7A CN103663352B (en) | 2013-12-30 | 2013-12-30 | A kind of MEMS microphone package structure and method for packing |
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| CN112020865A (en) * | 2018-04-26 | 2020-12-01 | 美商楼氏电子有限公司 | Acoustic assembly with acoustically transparent diaphragm |
| CN112551483A (en) * | 2021-02-20 | 2021-03-26 | 甬矽电子(宁波)股份有限公司 | Manufacturing method of acoustic sensor packaging structure and acoustic sensor packaging structure |
| CN117377637A (en) * | 2021-06-10 | 2024-01-09 | 应美盛股份有限公司 | MEMS stress relief structure embedded in package |
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| CN103663352B (en) | 2017-11-07 |
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