CN110482477A - Silicon microphone packaging structure and its packaging method - Google Patents
Silicon microphone packaging structure and its packaging method Download PDFInfo
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- CN110482477A CN110482477A CN201910851812.XA CN201910851812A CN110482477A CN 110482477 A CN110482477 A CN 110482477A CN 201910851812 A CN201910851812 A CN 201910851812A CN 110482477 A CN110482477 A CN 110482477A
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- metal shell
- circuit board
- acoustic aperture
- silicon microphone
- microphone packaging
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 69
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 64
- 239000010703 silicon Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 190
- 239000002184 metal Substances 0.000 claims abstract description 190
- 239000012528 membrane Substances 0.000 claims description 26
- 239000003566 sealing material Substances 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 14
- 229920000297 Rayon Polymers 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229920006335 epoxy glue Polymers 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- 239000006071 cream Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 239000000084 colloidal system Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 3
- 230000001939 inductive effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004429 Calibre Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
A kind of silicon microphone packaging structure and its packaging method, the silicon microphone packaging structure includes: circuit board, has opposite first surface and second surface；First metal shell is set on the first surface of the circuit board, and the first cavity is formed between the circuit board, and first metal shell has the first acoustic aperture；Second metal shell, it is set on the first surface of the circuit board, and it is sheathed on outside first metal shell, the second cavity is formed between first metal shell, circuit board, the second acoustic aperture that there is second metal shell side wall to be recessed towards inside, the side wall of second acoustic aperture and first metal shell are tightly connected, and first acoustic aperture is connected to second acoustic aperture；Microphone chip is set in first cavity.The electromagnetic shielding capability of above-mentioned silicon microphone packaging structure improves.
Description
Technical field
The present invention relates to MEMS technology field more particularly to a kind of silicon microphone packaging structures and its packaging method.
Background technique
ASIC (the ApplicationSpecific that MEMS microphone generally includes MEMS chip and is electrically connected
Integrated Circuit, functional integrated circuit) chip, wherein MEMS chip includes substrate and fixed vibration on substrate
Film and backplane, vibrating diaphragm and backplane constitute capacitor and integrate on silicon, and sound is entered microphone by acoustic aperture and acted on
On MEMS chip vibrating diaphragm, by vibration of membrane of shaking, change the distance between vibrating diaphragm and backplane, so that voice signal is converted to
Electric signal.
Complicated electromagnetic environment, assembly technology environment etc. in electronic equipment, it is desirable that MEMS chip has anti-electromagnetism ring
The performances such as border, thermal insulation be good, more stringent requirements are proposed for this encapsulation to chip.Traditional encapsulating structure, generally passes through metal
Shell shields the electromagnetic wave in external environment.Such encapsulating structure is fairly simple, can only shield smaller portions electromagnetic wave, still have
More electromagnetic wave can penetrate shell, influence the normal work of the chip in encapsulation.
How silicon microphone is further improved to shielding electromagnetic waves ability, to improve the property of silicon microphone packaging structure
Can, it is current urgent problem to be solved.
Summary of the invention
The technical problem to be solved by the invention is to provide a kind of silicon microphone packaging structure and its packaging methods, improve
The ability of the silicon microphone acoustical behavior and electromagnetism interference.
To solve the above-mentioned problems, the present invention provides a kind of silicon microphone packaging structures, comprising: circuit board has phase
Pair first surface and second surface；First metal shell is set on the first surface of the circuit board, with the circuit board
Between form the first cavity, first metal shell has the first acoustic aperture；Second metal shell is set to the circuit board
It on first surface, and is sheathed on outside first metal shell, forms second between first metal shell, circuit board
Cavity, second metal shell have the second acoustic aperture for being recessed towards inside of side wall, the side wall of second acoustic aperture with it is described
First metal shell is tightly connected, and first acoustic aperture is connected to second acoustic aperture；Microphone chip is set to described first
In cavity.
Optionally, the first acoustic aperture of first metal shell has the side wall towards outer projection, first acoustic aperture
Across second acoustic aperture.
Optionally, it is tightly connected between the side wall of second acoustic aperture and first metal shell by sealing material,
The sealing material includes at least one of silica gel, epoxy glue, conductive silver glue, solder(ing) paste and high temperature resistant viscose.
Optionally, further includes: channel is located in the circuit board, and the one end of the channel is connected to the microphone chip
Back chamber, the other end is connected to second cavity.
Optionally, first metal shell and/or second metal shell pass through conductive material and the circuit board
It is tightly connected.
Optionally, ground terminal is formed on the circuit board, first metal-back and/or second metal-back pass through
The wiring of the circuit board is connected to the ground terminal.
Optionally, be formed in the circuit board respectively with first metal shell and/or second metal shell
Corresponding non-conductive socket, first metal-back and/or the second metal-back are inserted into respectively in the non-conductive socket, with the conduction
Slot forms electrical connection.
Optionally, the non-conductive socket is electrically connected to the ground terminal of the circuit board.
Optionally, dustproof membrane is covered in first acoustic aperture and/or the second acoustic aperture.
Optionally, the dustproof membrane is conductive film.
In order to solve the above technical problems, a specific embodiment of the invention also provides a kind silicon microphone packaging method,
Include: offer circuit board, there are opposite first surface and second surface；Microphone chip is fixed on the circuit board；It mentions
For the first metal shell, first metal shell is set on the first surface of the circuit board, with the circuit board it
Between form the first cavity, the microphone chip is located in first cavity, first metal shell have the first acoustic aperture；
First metal shell is provided, second metal shell is placed on outside first metal shell and is fixed on the circuit board
First surface on, form the second cavity between first metal shell, circuit board, second metal shell has side
The second acoustic aperture that wall is recessed towards inside, the side wall of second acoustic aperture and first metal shell are tightly connected, and described the
One acoustic aperture is connected to second acoustic aperture.
Optionally, the first acoustic aperture of first metal shell has the side wall towards outer projection, first acoustic aperture
Across second acoustic aperture.
Optionally, the side wall of second acoustic aperture and first metal shell are tightly connected by sealing material, institute
Stating sealing material includes at least one of silica gel, epoxy glue, conductive silver glue, solder(ing) paste and high temperature resistant viscose.
Optionally, channel is also formed in the circuit board, the one end of the channel is connected to the back of the microphone chip
Chamber, the other end are connected to second cavity.
Optionally, by conductive material by first metal shell and/or second metal shell and the circuit
Plate is tightly connected.
Optionally, it is formed with ground terminal on the circuit board, first metal-back and/or second metal-back is led to
The wiring for crossing the circuit board is connected to the ground terminal.
Optionally, be formed in the circuit board respectively with first metal shell and/or second metal shell
Corresponding non-conductive socket；First metal-back and/or the second metal-back are inserted into respectively in the non-conductive socket, led with described
Electrical slot forms electrical connection.
Optionally, the non-conductive socket is electrically connected to the ground terminal of the circuit board.
Optionally, the dustproof membrane for covering first acoustic aperture and/or the second acoustic aperture is formed.
Optionally, the dustproof membrane is conductive film.
Silicon microphone packaging structure of the invention is top into sound structure, including the first metal shell and the second metal-back
Body, and there is gap between two side bodies, it is improved by double layer of metal shell to external shielding electromagnetic waves ability；And described
One metal shell and the second metal shell are provided with acoustic aperture, can avoid in encapsulation process due to inside cavity gas expansion
The problem of leading to failure welding.
Further, it is formed with the channel of connection microphone chip back chamber in the circuit board, is conducive to improve silicon microphone
Effective back cavity volume, improve the acoustical behavior of the silicon microphone packaging structure；The channel is also connected to first metal
The second cavity between shell and the second metal shell, further expansion by effective back cavity volume of the microphone chip, from
And improve the acoustical behavior of the silicon microphone packaging structure.
Further, first metal shell and/or second metal shell may also connect to the ground connection of circuit board
End is conducive to improve effectiveness, also advantageously improves electrostatic protection performance.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the silicon microphone packaging structure of the embodiment of the invention；
Fig. 2 is the structural schematic diagram of the silicon microphone packaging structure of another specific embodiment of the present invention；
Fig. 3 is the structural schematic diagram of the silicon microphone packaging structure of another specific embodiment of the present invention；
Fig. 4 is the structural schematic diagram of the silicon microphone packaging structure of another specific embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the silicon microphone packaging structure of another specific embodiment of the present invention；
Fig. 6 is the structural schematic diagram of the silicon microphone packaging structure of another specific embodiment of the present invention；
Fig. 7 is the structural schematic diagram of the silicon microphone packaging structure of another specific embodiment of the present invention.
Specific embodiment
With reference to the accompanying drawing to the specific embodiment of silicon microphone packaging structure provided by the invention and its packaging method
It elaborates.
Referring to FIG. 1, the schematic diagram of the microphone packaging scheme for the embodiment of the invention.
In the specific embodiment, the microphone packaging scheme includes: circuit board 100, the first metal shell 110,
Two metal shells 120, microphone chip 150.
The circuit board 100 has opposite first surface and second surface.Circuit is formed in the circuit board 100
Wiring.
First metal shell 110 is set on the first surface of the circuit board 100, with the circuit board 100 it
Between form the first cavity 130.Second metal shell 120 is set on the first surface of the circuit board 100, and is arranged
Outside first metal shell 110, the second cavity 140 is formed between first metal shell 110, circuit board 100.
The size of second cavity 140 can be configured according to the volume requirement to encapsulating structure.
First metal shell 110 and second metal shell 120 can select identical or different metal respectively
The metal materials such as material, including Copper base material, Ni-based material and zinc-base material.
First metal shell 110 and second metal shell 120 are sealingly fastened in the circuit board 100 respectively
On first surface.Can be realized by welding or viscose etc. first metal shell 110 and second metal shell 120 with
Sealed connection between circuit board 100.
The microphone chip 150 is set in first cavity 130.In the specific embodiment, the silicon Mike
Wind encapsulating structure further includes asic chip 160, and the asic chip 160 is also disposed in first cavity 130, the ASIC
Chip 160 is electrically connected in the microphone chip 150 and the circuit board 100.The microphone chip 150 includes acoustic pressure
Inductive layer, and the back chamber 151 positioned at acoustic pressure inductive layer side.The asic chip 160 can by conducting wire respectively with
The microphone chip 150 and the circuit board 100 are electrically connected, for receiving the inductive signal of the microphone chip 150, into
After row processing, exported by the circuit board 100.The microphone chip 150 and the asic chip 160 can pass through insulation
Colloid is fixed on 100 surface of circuit board.
In other specific embodiments, the asic chip can also be embedded in inside the circuit board 100, directly with
Wiring connection inside the circuit board 100, microphone chip 150 are connected by welding or conducting wire and the asic chip
It connects.
The microphone chip 150 and the asic chip 160 are set in first cavity 130, by described first
Metal shell 110 and second metal shell 120 shroud, 120 conduct of first metal shell 110 and the second metal shell
Electro-magnetic screen layer is conducive to shield influence of the external electromagnetic wave to the asic chip 160 and microphone chip 150.
It can be improved using double-level-metal shell to shielding electromagnetic waves ability, also, in a specific embodiment of the invention
There is certain interval between first metal-back 110 and second metal-back 120, electromagnetic shielding effect can be further increased
Fruit plays the effect of dual shield.
The microphone packaging scheme further include: channel 170 is located in the circuit board 100, described 170 one end of channel
It is connected to the back chamber 151 of the microphone chip 150.
In some embodiments, the other end in the channel 170 can be located at the circuit board 100 in, not with
Second cavity 140 is connected to.The channel 170 and the back chamber 151, increase the practical back of the microphone chip 150
Cavity volume is conducive to the acoustical behavior for improving the microphone packaging scheme.
In the specific embodiment, 170 other end of channel is connected to second cavity 140, by second chamber
Body 140, channel 170 are connected to the back chamber 151, further increase the practical back cavity volume of the microphone chip 150,
Further increase the acoustical behavior of the microphone packaging scheme.
Second metal shell 120 of the microphone packaging scheme has the second acoustic aperture 121, second acoustic aperture 121
Side wall 1211 is recessed towards inside.First metal shell 110 has the first acoustic aperture 111, the side wall of second acoustic aperture 121
1211 are tightly connected with first metal shell 110, and first acoustic aperture 111 is connected to second acoustic aperture 121.
In the specific embodiment, it is deep to pass through described second towards outer projection for the side wall 1111 of first acoustic aperture 111
Hole.The cross section of second acoustic aperture 121 can be trapezoidal, the size phase of size and first acoustic aperture 111 at lowest calibre
When, so that after first acoustic aperture 111 passes through second acoustic aperture 121, the side wall 1211 of second acoustic aperture 121 and described the
Gap is smaller between the side wall 1111 of one acoustic aperture 111, is easy to be tightly connected.In the specific embodiment, second acoustic aperture 121
It is sealed between side wall and the side wall of first acoustic aperture 111 by sealing material 122, so that second cavity 140 seals, institute
It states the first cavity 130 and is connected to by first acoustic aperture 111 with outside.The sealing material 122 can for silica gel, epoxy glue,
At least one of conductive silver glue, solder(ing) paste and high temperature resistant viscose, preferably, 111 side wall of the first acoustic aperture and described the
By insulation colloid sealing between two acoustic aperture 121 so that first metal shell 110 and second metal shell 120 it
Between insulate, first metal shell 110 and second metal shell 120 play electromagnetic wave respectively as shield shell
Dual shield effect.
Due to the projected side wall of first acoustic aperture 111, the sealing material 122 can be stopped from first acoustic aperture
111 fall in first cavity 130, pollute to the microphone chip 150, influence the silicon microphone structure
Performance.
First metal shell 110 and/or second metal shell 120 pass through conductive material and the circuit board
100 are tightly connected.The conductive material can realize first metal shell 110 and described for scolding tin or silver paste etc.
While two metal shells 120 are fixedly connected with circuit board 100, realize and be electrically connected with route in circuit board 100.The specific reality
It applies in mode, first metal shell 110 and second metal shell 120 pass through conductive material and the wiring board
100 are tightly connected.
Specifically, first metal shell 110 and second metal shell 120 pass through conductive material and the electricity
Wiring 101 in road plate 100 is electrically connected, and is electrically connected to ground terminal 102 by the wiring 101.The specific implementation
In mode, the ground terminal 102 is the pad for being formed in the second surface of the circuit board 100.In other specific embodiments
In, the ground terminal 102 can also be the ground loop or other ground structures for being formed in 100 surface of circuit board or inside.
In other specific embodiments, can also only have first metal shell 110 and second metal shell
A metal shell in 120 is connected to ground terminal 102.
First metal shell 110 and/or second metal shell 120 can further increase the screen to electromagnetic wave
Effect is covered, and the electrostatic that electromagnetic wave or other reasons generate can be discharged by ground terminal 102.
Referring to FIG. 2, the structural schematic diagram of the silicon microphone packaging structure for another specific embodiment of the present invention.
In the specific embodiment, it is covered with dustproof membrane 200 at the second acoustic aperture 121 on second metal shell 120,
To avoid impurity enter in first cavity 130.The dustproof membrane 200 covers first acoustic aperture 111 simultaneously.At one
In specific embodiment, the dustproof membrane 200 is the conductive film with hole, so that second metal shell 120, first
Metal shell 110 is formed with complete conductor structure, to improve effectiveness.It is described in other specific embodiments
General non-conductive Air Filter can also be only covered at second acoustic aperture 121.
The dustproof membrane 200 can be fixed on second metal shell 120 by conductive materials such as conducting resinls, the tool
In body embodiment, the dustproof membrane 200 is covered in the outer wall of second metal shell 120；In other specific embodiments
In, the dustproof membrane 200 can also only cover first acoustic aperture 111.
Referring to FIG. 3, the structural schematic diagram of the silicon microphone packaging structure for another specific embodiment of the present invention.
In the specific embodiment, first metal shell 110 has a hole, as the first acoustic aperture 301, described the
The opening of one acoustic aperture 301 is flushed with the main body of first metal shell 110；The rising tone on second metal shell 120
Hole 302 has the side wall 3021 being recessed inwardly.The aperture of second acoustic aperture 302 is greater than the aperture of first acoustic aperture 301,
First acoustic aperture 301 is located in the orthographic projection region of second acoustic aperture 302.The side wall 3021 of second acoustic aperture 302
It is smaller with the distance between first metal shell 110 below, convenient for second acoustic aperture 302 side wall 3021 with it is described
It is sealed between first metal shell 110.By sealing material 303 to the side wall 3021 of second acoustic aperture 302 with it is described
Be sealed between first metal shell 110, the sealing material can for silica gel, epoxy glue, conductive silver glue, solder(ing) paste and
At least one of high temperature resistant viscose.
Referring to FIG. 4, the structural schematic diagram of the silicon microphone packaging structure for another specific embodiment of the present invention.
On the basis of silicon microphone packaging structure shown in Fig. 3, in the specific embodiment, first acoustic aperture 301
On be also covered with dustproof membrane 400, the dustproof membrane 400 has hole, can be conductive film, to improve first metal-back
Body 110 is to shielding electromagnetic waves effect.
The dustproof membrane 400 is covered in the outer wall of first metal shell 110；In other specific embodiments, institute
State the inner wall that dustproof membrane 400 can also be covered in first metal shell 110.
Referring to FIG. 5, the schematic diagram of the silicon microphone packaging structure for another specific embodiment of the present invention.
In the specific embodiment, it is also formed on the circuit board 100 and first metal shell 110 and the second gold medal
Belong to the corresponding non-conductive socket 500 of shell 120, first metal shell 110 and second metal shell 120 are inserted into institute respectively
It states in non-conductive socket 500, is electrically connected with the non-conductive socket 500 formation.The non-conductive socket 500 also passes through the circuit board
Wiring 101 in 100 is electrically connected to the ground terminal 102 of the circuit board 100, first metal shell 110 and second
Metal shell 120 is grounded by the non-conductive socket 500 respectively, to improve electromagnetic shielding and antistatic effect.
In another specific embodiment, the circuit board 100 can also be simply formed with and second metal shell 120
Non-conductive socket corresponding with a metal shell in first metal shell 110.
First metal shell 110 and the second metal shell 120 can also be by leading with 100 junction of circuit board
Electric colloid or non-conductive colloid are sealed.
Referring to FIG. 6, the structural schematic diagram of the silicon microphone packaging structure for another specific embodiment of the present invention.
In the specific embodiment, in structure basis shown in Fig. 1, shape on the side wall 1111 of first acoustic aperture 111
Cheng Youyi annular relief 601, the bottom of the side wall 1222 of second acoustic aperture 121 are contacted with the annular relief 601, In
When to being sealed between the side wall 1222 and the side wall 1111 by sealing material 122, the lug boss 601 can be kept away
Exempt from sealing material 122 to flow downward along the side wall 1111 of the first acoustic aperture 111, into second cavity 140.
The annular relief 601 can be structure as a whole with first metal shell 110, by mold one at
Type；In other specific embodiments, the annular relief 601 is also possible to be fixed on additionally by stickup or welding manner
The surface of the side wall 1111.The annular relief 601 can be the heat-resisting materials such as metal, silica gel.
Referring to FIG. 7, the structural schematic diagram of the silicon microphone packaging structure for another specific embodiment of the present invention.
In the specific embodiment, on the basis of Fig. 3 structure, 301 edge of the first acoustic aperture of first metal shell
The protrusion 701 being arranged with one around first acoustic aperture 301, the protrusion 701 can be right by sealing material 303
When being sealed between the side wall 3021 of second acoustic aperture 302 and first metal shell 110, the sealing material is avoided
303 flow in first acoustic aperture 301.The lug boss 701 can be integrally formed with the first shell 110, be also possible to
The edge with the first acoustic aperture 301 of the first shell 110 is formed additionally by stickup or welding manner.Above-mentioned specific embodiment party
The silicon microphone packaging structure of formula, including the first metal shell and the second metal shell, and first metal shell and described
There is gap between second metal shell, improved by double layer of metal shell to external shielding electromagnetic waves ability.And described
One metal shell and the second metal shell are provided with acoustic aperture, can avoid in encapsulation process due to inside cavity gas expansion
The problem of leading to failure welding.
Further, it is formed with the channel of connection microphone chip back chamber in the circuit board, is conducive to improve silicon microphone
Effective back cavity volume, improve the acoustical behavior of the silicon microphone packaging structure；The channel is also connected to first metal
The second cavity between shell and the second metal shell, further expansion by effective back cavity volume of the microphone chip, from
And improve the acoustical behavior of the silicon microphone packaging structure.
Further, first metal shell and/or second metal shell may also connect to the ground connection of circuit board
End is conducive to improve effectiveness, also advantageously improves electrostatic protection performance.
A specific embodiment of the invention also provides a kind of silicon microphone packaging method.
Referring to FIG. 1, in the specific embodiment, the packaging method of silicon microphone packaging structure includes:
Circuit board 100 is provided, there are opposite first surface and second surface, form channel in the circuit board 100
170；Microphone chip and asic chip 160 are fixed on the circuit board 100, makes the asic chip 160 and the Mike
Electrical connection is respectively formed between wind chip 150, the circuit board 100, meanwhile, the one end in the channel 170 and the microphone
The back chamber 151 of chip 150 is connected to.In other specific embodiments, there can be ASIC core in the circuit board 100 with embedding
Piece is no longer needed in the fixed asic chip in 100 surface of circuit board.
First metal shell 110 is provided, 110 body of the first metal-back is set to the first table of the circuit board 100
On face, the first cavity 130 is formed between the circuit board 100, the microphone chip 150 and the asic chip 160
In in first cavity 130, first metal shell 110 has the first acoustic aperture 111, and first acoustic aperture 111 has convex
Side wall 1111 outward.
Second metal shell 120 is provided, second metal shell 120 is sheathed on outside first metal shell 110
It portion and is fixed on the first surface of the circuit board 100, forms between first metal shell 110, circuit board 100
Two cavitys 140.The other end in the channel 170 is connected to second cavity 140.Second metal shell 120 has the
Two acoustic aperture 121, second acoustic aperture 121 have the side wall 1211 being recessed towards inside.The side wall 1211 of second acoustic aperture 121
Sealing is sealed by sealing material 122 between described first side wall 1111.First acoustic aperture 111 and second acoustic aperture
121 connections.
In the specific embodiment, it is deep to pass through described second towards outer projection for the side wall 1111 of first acoustic aperture 111
Hole.The cross section of second acoustic aperture 121 can be trapezoidal, the size phase of size and first acoustic aperture 111 at lowest calibre
When, so that after first acoustic aperture 111 passes through second acoustic aperture 121, the side wall 1211 of second acoustic aperture 121 and described the
Gap is smaller between the side wall 1111 of one acoustic aperture 111, is easy to be tightly connected.In the specific embodiment, second acoustic aperture 121
It is sealed between side wall and the side wall of first acoustic aperture 111 by sealing material 122, so that second cavity 140 seals, institute
It states the first cavity 130 and is connected to by first acoustic aperture 111 with outside.The sealing material 122 can for silica gel, epoxy glue,
At least one of conductive silver glue, solder(ing) paste and high temperature resistant viscose, preferably, 111 side wall of the first acoustic aperture and described the
By insulation colloid sealing between two acoustic aperture 121 so that first metal shell 110 and second metal shell 120 it
Between insulate, first metal shell 110 and second metal shell 120 play electromagnetic wave respectively as shield shell
Dual shield effect.Due to the projected side wall of first acoustic aperture 111, the sealing material 122 can be stopped from described first
Acoustic aperture 111 is fallen in first cavity 130, is polluted to the microphone chip 150, and the silicon microphone knot is influenced
The performance of structure.
It is solid that first metal shell 110 and second metal shell 120 can be equal to sealing by welding or viscose
Due on the first surface of the circuit board 100.It in a specific embodiment, can be by conductive material by described first
Metal shell 110 and second metal shell 120 and the circuit board 100 are tightly connected.The conductive material can be weldering
Tin or silver paste etc..First metal shell 110 and second metal shell 120 can be by the conductive materials into one
Walk the route being electrically connected in the circuit board 100.In this specific embodiment, ground connection is formed on the circuit board 100
End 102 connects first metal-back 110 and second metal-back 120 by the wiring 101 of the circuit board 100
It is connected to the ground terminal 102, to improve to shielding electromagnetic waves ability and antistatic effect.
The ground terminal 102 is the pad for being formed in 100 second surface of circuit board.In other specific embodiments
In, the ground terminal 102 can also be the substrate ring or other ground structures of formation and 100 inside of circuit board or surface.
It, can also be only by one in first metal shell 110 and second metal shell 120 in other specific embodiments
A metal shell is connected to the ground terminal 320.
In another specific embodiment, referring to FIG. 6, being formed with a ring on the side wall 1111 of first acoustic aperture 111
Shape lug boss 601, the bottom of the side wall 1222 of second acoustic aperture 121 is contacted with the annular relief 601, to the side
When being sealed between wall 1222 and the side wall 1111 by sealing material 122, the lug boss 601 can be avoided sealing material
Material 122 flows downward along the side wall 1111 of the first acoustic aperture 111, into second cavity 140.The annular relief 601
It can be structure as a whole with first metal shell 110, be integrally formed by mold；In other specific embodiments, institute
Annular relief 601 is stated to be also possible to be fixed on the surface of the side wall 1111 additionally by stickup or welding manner.The ring
Shape lug boss 601 can be the heat-resisting materials such as metal, silica gel.
Referring to FIG. 2, further including forming the dustproof membrane for covering second acoustic aperture 121 in this specific embodiment
200, the dustproof membrane 200 covers first acoustic aperture 111 simultaneously.In a specific embodiment, the dustproof membrane 200 is
Conductive film with hole, so that second metal shell 120, the first metal shell 110 are formed with complete conductor knot
Structure, to improve effectiveness.
Referring to FIG. 3, the first acoustic aperture 301 of first metal shell 110 is the hole on first metal shell 110
Hole does not have raised or sunken side wall.The second acoustic aperture 302 on second metal shell 120 has to be recessed inwardly
Side wall 3021.The aperture of second acoustic aperture 302 is greater than the aperture of first acoustic aperture 301, and first acoustic aperture 301 is located at institute
In the orthographic projection region for stating the second acoustic aperture 302, to the side wall 3021 and first metal shell 110 of second acoustic aperture 302
Between be sealed.
In another specific embodiment, referring to FIG. 7,301 edge of the first acoustic aperture of first metal shell also has
There is a protrusion 701 around first acoustic aperture 301 setting, the protrusion 701 can pass through 303 pairs of institutes of sealing material
It states when being sealed between the side wall 3021 of the second acoustic aperture 302 and first metal shell 110, avoids the sealing material
303 flow in first acoustic aperture 301.The lug boss 701 can be integrally formed with the first shell 110, be also possible to
The edge with the first acoustic aperture 301 of the first shell 110 is formed additionally by stickup or welding manner.
Referring to FIG. 4, further including forming the dustproof membrane for covering first acoustic aperture 301 in another specific embodiment
400, the dustproof membrane 400 has hole, can be conductive film, to improve first metal shell 110 to electromagnetic wave
Shield effectiveness.In the specific embodiment, the dustproof membrane 400 is formed on the outer wall of first metal shell 110；At it
In his specific embodiment, the dustproof membrane 400 can also be formed on the inner wall of first metal shell 110.
Referring to FIG. 5, being formed in the circuit board 100 and first metal-back in another specific embodiment
Body 110 and the corresponding non-conductive socket 500 of the second metal shell 120；By first metal-back 110 and second metal shell
In the 120 insertion non-conductive sockets 500, it is electrically connected with the non-conductive socket 500 formation.The non-conductive socket 500 also passes through institute
The ground terminal 102 that the wiring 101 in circuit board 100 is electrically connected to the circuit board 100 is stated, thus by first metal
Shell 110 and second metal shell 120 ground connection, to improve electromagnetic shielding and antistatic effect.
In another specific embodiment, the circuit board 100 can also be simply formed with and second metal shell 120
Non-conductive socket corresponding with a metal shell in first metal shell 110.
Can by conductive rubber or non-conductive colloid to first metal shell 110 and the second metal shell 120 with
100 junction of circuit board is sealed.
The packaging method of above-mentioned silicon microphone can be improved the silicon microphone packaging structure to be formed to shielding electromagnetic waves and
Antistatic impact capacity, and effectively increase the back cavity volume of microphone chip, promote the acoustics of the silicon microphone packaging structure
Performance.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (20)
1. a kind of silicon microphone packaging structure characterized by comprising
Circuit board has opposite first surface and second surface；
First metal shell is set on the first surface of the circuit board, and the first cavity, institute are formed between the circuit board
The first metal shell is stated with the first acoustic aperture；
Second metal shell is set on the first surface of the circuit board, and is sheathed on outside first metal shell, with
The second cavity is formed between first metal shell, circuit board, there is second metal shell side wall to be recessed towards inside
The second acoustic aperture, the side wall of second acoustic aperture and first metal shell be tightly connected, first acoustic aperture and described the
The connection of two acoustic aperture；
Microphone chip is set in first cavity.
2. the silicon microphone packaging structure according to claim 1, which is characterized in that the first sound of first metal shell
Hole has the side wall towards outer projection, and first acoustic aperture passes through second acoustic aperture.
3. the silicon microphone packaging structure according to claim 1, which is characterized in that the side wall of second acoustic aperture with it is described
It is tightly connected between first metal shell by sealing material, the sealing material includes: silica gel, epoxy glue, conductive silver glue, weldering
At least one of tin cream and high temperature resistant viscose.
4. the silicon microphone packaging structure according to claim 1, which is characterized in that further include: channel is located at the circuit
In plate, the one end of the channel is connected to the back chamber of the microphone chip, and the other end is connected to second cavity.
5. the silicon microphone packaging structure according to claim 1, which is characterized in that first metal shell and/or institute
The second metal shell is stated to be tightly connected by conductive material and the circuit board.
6. the silicon microphone packaging structure according to claim 5, which is characterized in that be formed with ground connection on the circuit board
End, first metal-back and/or second metal-back are connected to the ground terminal by the wiring of the circuit board.
7. the silicon microphone packaging structure according to claim 1, which is characterized in that be formed in the circuit board respectively with
First metal shell and/or the corresponding non-conductive socket of second metal shell, first metal-back and/or the second gold medal
Belong to shell to be inserted into respectively in the non-conductive socket, be electrically connected with non-conductive socket formation.
8. the silicon microphone packaging structure according to claim 7, which is characterized in that the non-conductive socket is electrically connected to described
The ground terminal of circuit board.
9. the silicon microphone packaging structure according to claim 1, which is characterized in that first acoustic aperture and/or the rising tone
Dustproof membrane is covered on hole.
10. the silicon microphone packaging structure according to claim 9, which is characterized in that the dustproof membrane is conductive film.
11. a kind of silicon microphone packaging method characterized by comprising
Circuit board is provided, there are opposite first surface and second surface；
Microphone chip is fixed on the circuit board；
First metal shell is provided, first metal shell is set on the first surface of the circuit board, with the electricity
The first cavity is formed between the plate of road, the microphone chip is located in first cavity, and first metal shell has the
One acoustic aperture；
First metal shell is provided, second metal shell is placed on outside first metal shell and is fixed on the electricity
On the first surface of road plate, the second cavity, the second metal shell tool are formed between first metal shell, circuit board
The side wall of second acoustic aperture and first metal shell are tightly connected by the second acoustic aperture for having side wall to be recessed towards inside,
First acoustic aperture is connected to second acoustic aperture.
12. silicon microphone packaging method according to claim 11, which is characterized in that the first of first metal shell
Acoustic aperture has the side wall towards outer projection, and first acoustic aperture passes through second acoustic aperture.
13. silicon microphone packaging method according to claim 11, which is characterized in that by the side wall of second acoustic aperture with
First metal shell is tightly connected by sealing material, and the sealing material includes silica gel, epoxy glue, conductive silver glue, weldering
At least one of tin cream and high temperature resistant viscose.
14. silicon microphone packaging method according to claim 11, which is characterized in that be also formed in the circuit board logical
Road, the one end of the channel are connected to the back chamber of the microphone chip, and the other end is connected to second cavity.
15. silicon microphone packaging method according to claim 11, which is characterized in that by conductive material by described first
Metal shell and/or second metal shell and the circuit board are tightly connected.
16. silicon microphone packaging method according to claim 15, which is characterized in that be formed with ground connection on the circuit board
End, is connected to the ground connection by the wiring of the circuit board for first metal-back and/or second metal-back
End.
17. silicon microphone packaging method according to claim 11, which is characterized in that be formed with difference in the circuit board
Non-conductive socket corresponding with first metal shell and/or second metal shell；By first metal-back and/or
Two metal-backs are inserted into respectively in the non-conductive socket, are electrically connected with non-conductive socket formation.
18. silicon microphone packaging method according to claim 17, which is characterized in that the non-conductive socket is electrically connected to institute
State the ground terminal of circuit board.
19. silicon microphone packaging method according to claim 11, which is characterized in that formed and cover first acoustic aperture
And/or second acoustic aperture dustproof membrane.
20. the silicon microphone packaging method according to claim 19, which is characterized in that the dustproof membrane is conductive film.
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| CN201910851812.XA CN110482477A (en) | 2019-09-10 | 2019-09-10 | Silicon microphone packaging structure and its packaging method |
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| CN201910851812.XA CN110482477A (en) | 2019-09-10 | 2019-09-10 | Silicon microphone packaging structure and its packaging method |
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| CN111510835A (en) * | 2020-06-01 | 2020-08-07 | 无锡韦尔半导体有限公司 | Packaging structure and manufacturing method of solid conduction MEMS microphone and mobile terminal |
| WO2021135108A1 (en) * | 2019-12-31 | 2021-07-08 | 潍坊歌尔微电子有限公司 | Dustproof structure, microphone packaging structure and electronic device |
| WO2022000646A1 (en) * | 2020-06-30 | 2022-01-06 | 瑞声声学科技(深圳)有限公司 | Microphone |
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