CN211056708U - Silicon microphone packaging structure - Google Patents
Silicon microphone packaging structure Download PDFInfo
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- CN211056708U CN211056708U CN201921498195.1U CN201921498195U CN211056708U CN 211056708 U CN211056708 U CN 211056708U CN 201921498195 U CN201921498195 U CN 201921498195U CN 211056708 U CN211056708 U CN 211056708U
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Abstract
A silicon microphone package, the silicon microphone package comprising: a circuit board having opposing first and second surfaces; the first metal shell is arranged on the first surface of the circuit board, a first cavity is formed between the first metal shell and the circuit board, and the first metal shell is provided with a first sound hole; the second metal shell is arranged on the first surface of the circuit board, sleeved outside the first metal shell and provided with a second cavity between the first metal shell and the circuit board, the second metal shell is provided with a second sound hole with a side wall sunken towards the inner side, the side wall of the second sound hole is hermetically connected with the first metal shell, and the first sound hole is communicated with the second sound hole; and the microphone chip is arranged in the first cavity. The electromagnetic shielding capability of the silicon microphone packaging structure is improved.
Description
Technical Field
The utility model relates to a MEMS technical field especially relates to a silicon microphone packaging structure.
Background
A MEMS microphone generally includes a MEMS chip and an ASIC (application specific integrated Circuit) chip electrically connected to the MEMS chip, wherein the MEMS chip includes a substrate, and a diaphragm and a back electrode fixed to the substrate, the diaphragm and the back electrode forming a capacitor and integrated on the silicon wafer, sound enters the microphone through a sound hole and acts on the diaphragm of the MEMS chip, and a distance between the diaphragm and the back electrode is changed by vibration of the diaphragm, thereby converting a sound signal into an electrical signal.
In the face of complex electromagnetic environment, assembly process environment and the like in electronic equipment, the MEMS chip is required to have the performances of electromagnetic environment resistance, good heat insulation and the like, and higher requirements are provided for the packaging of the chip. In a conventional package structure, electromagnetic waves in the external environment are generally shielded by a metal housing. The packaging structure is simple, only a small part of electromagnetic waves can be shielded, and more electromagnetic waves can penetrate through the shell to influence the normal work of the chip in the package.
How to further improve the shielding capability of the silicon microphone against electromagnetic waves so as to improve the performance of the silicon microphone packaging structure is a problem to be solved urgently at present.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a silicon microphone packaging structure is provided, improves silicon microphone acoustic performance and anti-electromagnetic interference's ability.
In order to solve the above problem, the utility model provides a silicon microphone packaging structure, include: a circuit board having opposing first and second surfaces; the first metal shell is arranged on the first surface of the circuit board, a first cavity is formed between the first metal shell and the circuit board, and the first metal shell is provided with a first sound hole; the second metal shell is arranged on the first surface of the circuit board, sleeved outside the first metal shell and provided with a second cavity between the first metal shell and the circuit board, the second metal shell is provided with a second sound hole with a side wall sunken towards the inner side, the side wall of the second sound hole is hermetically connected with the first metal shell, and the first sound hole is communicated with the second sound hole; and the microphone chip is arranged in the first cavity.
Optionally, the first sound hole of the first metal shell has a side wall protruding toward the outside, and the first sound hole passes through the second sound hole.
Optionally, the side wall of the second sound hole is hermetically connected with the first metal shell through a sealing material, and the sealing material includes at least one of silica gel, epoxy glue, conductive silver glue, solder paste and high temperature resistant glue.
Optionally, the method further includes: and the channel is positioned in the circuit board, one end of the channel is communicated to the back cavity of the microphone chip, and the other end of the channel is communicated to the second cavity.
Optionally, the first metal housing and/or the second metal housing are hermetically connected to the circuit board through a conductive material.
Optionally, a ground terminal is formed on the circuit board, and the first metal shell and/or the second metal shell are connected to the ground terminal through a circuit wiring of the circuit board.
Optionally, a conductive slot corresponding to the first metal shell and/or the second metal shell is formed in the circuit board, and the first metal shell and/or the second metal shell are inserted into the conductive slot respectively and electrically connected to the conductive slot.
Optionally, the conductive socket is electrically connected to a ground terminal of the circuit board.
Optionally, the first sound hole and/or the second sound hole are/is covered with a dust-proof film.
Optionally, the dustproof film is a conductive thin film.
The silicon microphone packaging structure of the utility model is a top sound inlet structure, which comprises a first metal shell and a second metal shell, wherein a gap is arranged between the two shells, and the shielding capability to external electromagnetic waves is improved by two layers of metal shells; and first metal casing and second metal casing all are provided with the sound hole, can avoid because the inside gas expansion of cavity leads to the problem of bad welding in the packaging process.
Furthermore, a channel communicated with a back cavity of the microphone chip is formed in the circuit board, so that the effective back cavity volume of the silicon microphone is favorably improved, and the acoustic performance of the silicon microphone packaging structure is improved; the channel is also communicated with a second cavity between the first metal shell and the second metal shell, so that the effective back cavity volume of the microphone chip is further enlarged, and the acoustic performance of the silicon microphone packaging structure is improved.
Furthermore, the first metal shell and/or the second metal shell can also be connected to the grounding end of the circuit board, so that the electromagnetic shielding effect is favorably improved, and the electrostatic protection performance is favorably improved.
Drawings
Fig. 1 is a schematic structural diagram of a silicon microphone package structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention;
fig. 4 is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention;
fig. 5 is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention;
fig. 6 is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention;
fig. 7 is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention.
Detailed Description
The following describes in detail a specific embodiment of a silicon microphone package structure and a packaging method thereof according to the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of a microphone package structure according to an embodiment of the present invention.
In this specific embodiment, the microphone package structure includes: circuit board 100, first metal casing 110, second metal casing 120, microphone chip 150.
The circuit board 100 has a first surface and a second surface opposite to each other. Circuit wiring is formed in the circuit board 100.
The first metal housing 110 is disposed on the first surface of the circuit board 100, and a first cavity 130 is formed between the first metal housing and the circuit board 100. The second metal housing 120 is disposed on the first surface of the circuit board 100, and is sleeved outside the first metal housing 110, and a second cavity 140 is formed between the second metal housing 120 and the first metal housing 110 and the circuit board 100. The size of the second cavity 140 may be set according to the volume requirement of the package structure.
The first metal shell 110 and the second metal shell 120 may be made of the same or different metal materials, including copper base material, nickel base material, zinc base material, and the like.
The first metal housing 110 and the second metal housing 120 are respectively fixed on the first surface of the circuit board 100 in a sealing manner. The sealing connection between the first metal housing 110 and the second metal housing 120 and the circuit board 100 may be achieved by soldering, adhesive, or the like.
The microphone chip 150 is disposed in the first cavity 130. In this embodiment, the silicon microphone package structure further includes an ASIC chip 160, the ASIC chip 160 is also disposed in the first cavity 130, and the ASIC chip 160 is electrically connected to the microphone chip 150 and the circuit board 100 respectively. The microphone chip 150 includes a sound pressure sensing layer, and a back cavity 151 located at one side of the sound pressure sensing layer. The ASIC chip 160 may be electrically connected to the microphone chip 150 and the circuit board 100 through a wire, and is configured to receive an induction signal of the microphone chip 150, process the induction signal, and output the processed induction signal through the circuit board 100. The microphone chip 150 and the ASIC chip 160 may be fixed to the surface of the circuit board 100 by an insulating adhesive.
In other embodiments, the ASIC chip may be embedded in the circuit board 100 and directly connected to the circuit wiring in the circuit board 100, and the microphone chip 150 is connected to the ASIC chip by soldering or wire.
The microphone chip 150 and the ASIC chip 160 are disposed in the first cavity 130 and are covered by the first metal housing 110 and the second metal housing 120, and the first metal housing 110 and the second metal housing 120 serve as electromagnetic shielding layers, which is beneficial to shielding the influence of external electromagnetic waves on the ASIC chip 160 and the microphone chip 150.
Adopt double-deck metal casing can improve the shielding ability to the electromagnetic wave, and, in the specific embodiment of the utility model first metal casing 110 with certain clearance has between the second metal casing 120, can further improve electromagnetic shield effect, play double-shielded effect.
The microphone packaging structure further includes: and a channel 170 located in the circuit board 100, wherein one end of the channel 170 is connected to the back cavity 151 of the microphone chip 150.
In some embodiments, the other end of the channel 170 may be located in the circuit board 100 and not communicate with the second cavity 140. The channel 170 and the back cavity 151 increase the actual back cavity volume of the microphone chip 150, which is beneficial to improving the acoustic performance of the microphone packaging structure.
In this embodiment, the other end of the channel 170 is connected to the second cavity 140, and both the second cavity 140 and the channel 170 are connected to the back cavity 151, so as to further increase the actual back cavity volume of the microphone chip 150 and further improve the acoustic performance of the microphone package structure.
The second metal casing 120 of the microphone package structure has a second sound hole 121, and a sidewall 1211 of the second sound hole 121 is recessed toward the inside. The first metal housing 110 has a first sound hole 111, a sidewall 1211 of the second sound hole 121 is hermetically connected to the first metal housing 110, and the first sound hole 111 communicates with the second sound hole 121.
In this embodiment, the side wall 1111 of the first sound hole 111 protrudes toward the outside and passes through the second deep hole. The cross section of the second sound hole 121 may be trapezoidal, and the size of the smallest caliber of the second sound hole is equivalent to that of the first sound hole 111, so that after the first sound hole 111 passes through the second sound hole 121, the gap between the sidewall 1211 of the second sound hole 121 and the sidewall 1111 of the first sound hole 111 is small, and the first sound hole is easily connected in a sealing manner. In this embodiment, the side wall of the second sound hole 121 and the side wall of the first sound hole 111 are sealed by a sealing material 122, so that the second cavity 140 is sealed, and the first cavity 130 communicates with the outside through the first sound hole 111. The sealing material 122 may be at least one of silica gel, epoxy glue, conductive silver glue, solder paste, and high temperature resistant glue, and preferably, the sidewall of the first sound hole 111 and the second sound hole 121 are sealed by an insulating glue, so that the first metal housing 110 and the second metal housing 120 are insulated from each other, and the first metal housing 110 and the second metal housing 120 are respectively used as shielding housings, thereby achieving a double shielding effect on electromagnetic waves.
Due to the protrusion of the sidewall of the first sound hole 111, the sealing material 122 can be prevented from falling from the first sound hole 111 into the first cavity 130, which may cause contamination to the microphone chip 150 and affect the performance of the silicon microphone structure.
The first metal housing 110 and/or the second metal housing 120 are hermetically connected to the circuit board 100 through a conductive material. The conductive material may be solder or silver paste, and the first metal housing 110 and the second metal housing 120 are electrically connected to the circuit board 100 while being fixedly connected to the circuit board 100. In this embodiment, the first metal housing 110 and the second metal housing 120 are hermetically connected to the circuit board 100 through a conductive material.
Specifically, the first metal housing 110 and the second metal housing 120 are electrically connected to the circuit wiring 101 in the circuit board 100 through a conductive material, and are electrically connected to the ground terminal 102 through the circuit wiring 101. In this embodiment, the ground terminal 102 is a pad formed on the second surface of the circuit board 100. In other embodiments, the ground terminal 102 may also be a ground ring or other ground structure formed on the surface or inside the circuit board 100.
In other embodiments, only one of the first metal housing 110 and the second metal housing 120 may be connected to the ground terminal 102.
The first metal housing 110 and/or the second metal housing 120 can further improve the shielding effect of the electromagnetic wave, and can discharge the static electricity generated by the electromagnetic wave or other reasons through the ground terminal 102.
Please refer to fig. 2, which is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention.
In this embodiment, the second sound hole 121 of the second metal shell 120 is covered with a dust-proof film 200 to prevent impurities from entering the first cavity 130. The dust-proof film 200 covers the first sound hole 111 at the same time. In a specific embodiment, the dustproof film 200 is a conductive thin film with holes, so that the second metal housing 120 and the first metal housing 110 form a complete conductor structure to improve the electromagnetic shielding effect. In other embodiments, the second sound hole 121 may only be covered with a generally non-conductive dust-proof net.
The dustproof film 200 may be fixed on the second metal housing 120 through a conductive material such as a conductive adhesive, and in this specific embodiment, the dustproof film 200 covers an outer wall of the second metal housing 120; in other specific embodiments, the dust-proof film 200 may cover only the first sound hole 111.
Please refer to fig. 3, which is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention.
In this embodiment, the first metal shell 110 has a hole as the first sound hole 301, and an opening of the first sound hole 301 is flush with a main body of the first metal shell 110; the second sound hole 302 of the second metal case 120 has a side wall 3021 recessed inward. The aperture of the second sound hole 302 is larger than that of the first sound hole 301, and the first sound hole 301 is located in the orthographic projection area of the second sound hole 302. The distance between the lower edge of the side wall 3021 of the second sound hole 302 and the first metal case 110 is small, which facilitates sealing between the side wall 3021 of the second sound hole 302 and the first metal case 110. The space between the side wall 3021 of the second sound hole 302 and the first metal case 110 is sealed by a sealing material 303, which may be at least one of silicone adhesive, epoxy adhesive, conductive silver adhesive, solder paste, and high temperature resistant adhesive.
Please refer to fig. 4, which is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention.
On the basis of the silicon microphone package structure shown in fig. 3, in this embodiment, the first sound hole 301 is further covered with a dust-proof film 400, and the dust-proof film 400 has a hole and may be a conductive thin film, so as to improve the shielding effect of the first metal housing 110 on electromagnetic waves.
The dustproof film 400 covers the outer wall of the first metal shell 110; in other embodiments, the dustproof film 400 may also cover the inner wall of the first metal housing 110.
Please refer to fig. 5, which is a schematic diagram of a silicon microphone package structure according to another embodiment of the present invention.
In this embodiment, the circuit board 100 is further formed with a conductive slot 500 corresponding to the first metal housing 110 and the second metal housing 120, and the first metal housing 110 and the second metal housing 120 are respectively inserted into the conductive slot 500 to form an electrical connection with the conductive slot 500. The conductive socket 500 is further electrically connected to the ground terminal 102 of the circuit board 100 through the circuit wiring 101 in the circuit board 100, and the first metal housing 110 and the second metal housing 120 are grounded through the conductive socket 500, respectively, to improve electromagnetic shielding and antistatic capabilities.
In another embodiment, the circuit board 100 may be formed with only one conductive slot corresponding to one of the second metal housing 120 and the first metal housing 110.
The joints of the first metal housing 110 and the second metal housing 120 and the circuit board 100 may also be sealed by conductive adhesive or non-conductive adhesive.
Please refer to fig. 6, which is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention.
In this embodiment, based on the structure shown in fig. 1, an annular protrusion 601 is formed on the sidewall 1111 of the first sound hole 111, the bottom of the sidewall 1222 of the second sound hole 121 contacts the annular protrusion 601, and when the sidewall 1222 and the sidewall 1111 are sealed by the sealing material 122, the protrusion 601 prevents the sealing material 122 from flowing down along the sidewall 1111 of the first sound hole 111 and entering the second cavity 140.
The annular protrusion 601 may be integrally formed with the first metal shell 110 by a mold; in other embodiments, the annular protrusion 601 may be additionally fixed to the surface of the sidewall 1111 by adhesion or welding. The annular protrusion 601 may be made of high temperature resistant materials such as metal and silica gel.
Fig. 7 is a schematic structural diagram of a silicon microphone package structure according to another embodiment of the present invention.
In this embodiment, based on the structure shown in fig. 3, the edge of the first sound hole 301 of the first metal case has a protruding portion 701 disposed around the first sound hole 301, and the protruding portion 701 can prevent the sealing material 303 from flowing into the first sound hole 301 when the sealing material 303 seals between the side wall 3021 of the second sound hole 302 and the first metal case 110. The protrusion 701 may be integrally formed with the first casing 110, or may be formed separately by adhering or welding to the edge of the first sound hole 301 of the first casing 110. The silicon microphone packaging structure of the above specific embodiment includes a first metal casing and a second metal casing, and a gap is provided between the first metal casing and the second metal casing, so that the shielding capability to external electromagnetic waves is improved by two layers of metal casings. And first metal casing and second metal casing all are provided with the sound hole, can avoid because the inside gas expansion of cavity leads to the problem of bad welding in the packaging process.
Furthermore, a channel communicated with a back cavity of the microphone chip is formed in the circuit board, so that the effective back cavity volume of the silicon microphone is favorably improved, and the acoustic performance of the silicon microphone packaging structure is improved; the channel is also communicated with a second cavity between the first metal shell and the second metal shell, so that the effective back cavity volume of the microphone chip is further enlarged, and the acoustic performance of the silicon microphone packaging structure is improved.
Furthermore, the first metal shell and/or the second metal shell can also be connected to the grounding end of the circuit board, so that the electromagnetic shielding effect is favorably improved, and the electrostatic protection performance is favorably improved.
The utility model discloses a concrete implementation mode still provides a silicon microphone packaging method.
Referring to fig. 1, in the present embodiment, a method for packaging a silicon microphone package structure includes:
providing a circuit board 100 having first and second opposing surfaces, the circuit board 100 having a channel 170 formed therein; a microphone chip and an ASIC chip 160 are fixed on the circuit board 100, so that the ASIC chip 160 and the microphone chip 150 and the circuit board 100 are electrically connected, respectively, and meanwhile, one end of the channel 170 is communicated with the back cavity 151 of the microphone chip 150. In other embodiments, an ASIC chip may be embedded in the circuit board 100, and the ASIC chip does not need to be fixed on the surface of the circuit board 100.
Providing a first metal case 110, disposing the first metal case 110 on a first surface of the circuit board 100, forming a first cavity 130 with the circuit board 100, the microphone chip 150 and the ASIC chip 160 being located in the first cavity 130, the first metal case 110 having a first sound hole 111, the first sound hole 111 having a side wall 1111 protruding to an outer side.
Providing a second metal housing 120, sleeving the second metal housing 120 outside the first metal housing 110 and fixing the second metal housing 120 on the first surface of the circuit board 100, and forming a second cavity 140 between the second metal housing 120 and the first metal housing 110 and the circuit board 100. The other end of the channel 170 is connected to the second chamber 140. The second metal case 120 has a second sound hole 121, and the second sound hole 121 has a sidewall 1211 recessed toward the inside. The space between the sidewall 1211 of the second sound hole 121 and the first sidewall 1111 is sealed by a sealing material 122. The first sound hole 111 communicates with the second sound hole 121.
In this embodiment, the side wall 1111 of the first sound hole 111 protrudes toward the outside and passes through the second deep hole. The cross section of the second sound hole 121 may be trapezoidal, and the size of the smallest caliber of the second sound hole is equivalent to that of the first sound hole 111, so that after the first sound hole 111 passes through the second sound hole 121, the gap between the sidewall 1211 of the second sound hole 121 and the sidewall 1111 of the first sound hole 111 is small, and the first sound hole is easily connected in a sealing manner. In this embodiment, the side wall of the second sound hole 121 and the side wall of the first sound hole 111 are sealed by a sealing material 122, so that the second cavity 140 is sealed, and the first cavity 130 communicates with the outside through the first sound hole 111. The sealing material 122 may be at least one of silica gel, epoxy glue, conductive silver glue, solder paste, and high temperature resistant glue, and preferably, the sidewall of the first sound hole 111 and the second sound hole 121 are sealed by an insulating glue, so that the first metal housing 110 and the second metal housing 120 are insulated from each other, and the first metal housing 110 and the second metal housing 120 are respectively used as shielding housings, thereby achieving a double shielding effect on electromagnetic waves. Due to the protrusion of the sidewall of the first sound hole 111, the sealing material 122 can be prevented from falling from the first sound hole 111 into the first cavity 130, which may cause contamination to the microphone chip 150 and affect the performance of the silicon microphone structure.
The first metal housing 110 and the second metal housing 120 may be fixed on the first surface of the circuit board 100 by soldering or adhesive. In one embodiment, the first metal housing 110 and the second metal housing 120 may be hermetically connected to the circuit board 100 by a conductive material. The conductive material can be soldering tin, silver paste or the like. The first metal case 110 and the second metal case 120 may be further electrically connected to a line within the circuit board 100 through the conductive material. In this embodiment, a ground terminal 102 is formed on the circuit board 100, and the first metal shell 110 and the second metal shell 120 are connected to the ground terminal 102 through a circuit wiring 101 of the circuit board 100, so as to improve shielding capability against electromagnetic waves and antistatic capability.
The ground terminal 102 is a pad formed on the second surface of the circuit board 100. In other embodiments, the ground terminal 102 may also be a substrate ring or other ground structure formed in or on the surface of the circuit board 100. In other embodiments, only one of the first metal housing 110 and the second metal housing 120 may be connected to the ground terminal 320.
In another embodiment, referring to fig. 6, an annular protrusion 601 is formed on a sidewall 1111 of the first sound hole 111, a bottom of a sidewall 1222 of the second sound hole 121 contacts the annular protrusion 601, and when the sidewall 1222 and the sidewall 1111 are sealed by the sealing material 122, the protrusion 601 prevents the sealing material 122 from flowing down the sidewall 1111 of the first sound hole 111 and entering the second cavity 140. The annular protrusion 601 may be integrally formed with the first metal shell 110 by a mold; in other embodiments, the annular protrusion 601 may be additionally fixed to the surface of the sidewall 1111 by adhesion or welding. The annular protrusion 601 may be made of high temperature resistant materials such as metal and silica gel.
Referring to fig. 2, in this embodiment, a dust-proof film 200 covering the second sound hole 121 is further formed, and the dust-proof film 200 covers the first sound hole 111 at the same time. In a specific embodiment, the dustproof film 200 is a conductive thin film with holes, so that the second metal housing 120 and the first metal housing 110 form a complete conductor structure to improve the electromagnetic shielding effect.
Referring to fig. 3, the first sound hole 301 of the first metal shell 110 is a hole on the first metal shell 110, and has no convex or concave sidewall. The second sound hole 302 of the second metal case 120 has a side wall 3021 recessed inward. The aperture of the second sound hole 302 is larger than that of the first sound hole 301, and the first sound hole 301 is located in the orthographic projection area of the second sound hole 302, so as to seal between the side wall 3021 of the second sound hole 302 and the first metal shell 110.
In another embodiment, referring to fig. 7, the edge of the first sound hole 301 of the first metal shell further has a protrusion 701 disposed around the first sound hole 301, and the protrusion 701 can prevent the sealing material 303 from flowing into the first sound hole 301 when the sealing material 303 seals between the side wall 3021 of the second sound hole 302 and the first metal shell 110. The protrusion 701 may be integrally formed with the first casing 110, or may be formed separately by adhering or welding to the edge of the first sound hole 301 of the first casing 110.
Referring to fig. 4, in another embodiment, a dustproof film 400 is further formed to cover the first acoustic hole 301, and the dustproof film 400 has a hole, which may be a conductive film, to improve the shielding effect of the first metal housing 110 on electromagnetic waves. In this embodiment, the dust-proof film 400 is formed on the outer wall of the first metal case 110; in other specific embodiments, the dust-proof film 400 may be formed on the inner wall of the first metal housing 110.
Referring to fig. 5, in another embodiment, a conductive slot 500 corresponding to the first metal shell 110 and the second metal shell 120 is formed in the circuit board 100; the first metal shell 110 and the second metal shell 120 are inserted into the conductive slot 500 to form an electrical connection with the conductive slot 500. The conductive socket 500 is also electrically connected to the ground terminal 102 of the circuit board 100 through the circuit wiring 101 in the circuit board 100, so as to ground the first metal shell 110 and the second metal shell 120, thereby improving electromagnetic shielding and antistatic capabilities.
In another embodiment, the circuit board 100 may be formed with only one conductive slot corresponding to one of the second metal housing 120 and the first metal housing 110.
The joints of the first metal housing 110 and the second metal housing 120 and the circuit board 100 may be sealed by a conductive adhesive or a non-conductive adhesive.
The packaging method of the silicon microphone can improve the shielding and antistatic impact capacity of the formed silicon microphone packaging structure on electromagnetic waves, effectively increase the back cavity volume of the microphone chip and improve the acoustic performance of the silicon microphone packaging structure.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A silicon microphone package structure, comprising:
a circuit board having opposing first and second surfaces;
the first metal shell is arranged on the first surface of the circuit board, a first cavity is formed between the first metal shell and the circuit board, and the first metal shell is provided with a first sound hole;
the second metal shell is arranged on the first surface of the circuit board, sleeved outside the first metal shell and provided with a second cavity between the first metal shell and the circuit board, the second metal shell is provided with a second sound hole with a side wall sunken towards the inner side, the side wall of the second sound hole is hermetically connected with the first metal shell, and the first sound hole is communicated with the second sound hole;
and the microphone chip is arranged in the first cavity.
2. A silicon microphone package according to claim 1, wherein the first sound hole of the first metal case has a side wall that protrudes toward the outside, and the first sound hole passes through the second sound hole.
3. The silicon microphone package structure of claim 1, wherein the side wall of the second sound hole and the first metal case are hermetically connected by a sealing material, the sealing material comprising: silica gel, epoxy glue, conductive silver glue, soldering paste or high-temperature resistant viscose.
4. A silicon microphone package structure as claimed in claim 1 further comprising: and the channel is positioned in the circuit board, one end of the channel is communicated to the back cavity of the microphone chip, and the other end of the channel is communicated to the second cavity.
5. A silicon microphone package according to claim 1, wherein the first metal casing and/or the second metal casing are hermetically connected to the circuit board by a conductive material.
6. A silicon microphone package according to claim 5, wherein the circuit board has a ground formed thereon, and the first metal shell and/or the second metal shell are connected to the ground through circuit wiring of the circuit board.
7. A silicon microphone package according to claim 1, wherein the circuit board has conductive slots formed therein corresponding to the first and/or second metal shells, respectively, and the first and/or second metal shells are inserted into the conductive slots, respectively, to form electrical connections with the conductive slots.
8. A silicon microphone package according to claim 7, wherein the conductive socket is electrically connected to a ground terminal of the circuit board.
9. A silicon microphone package structure according to claim 1, characterized in that the first acoustic aperture and/or the second acoustic aperture is/are covered with a dust-proof membrane.
10. A silicon microphone package according to claim 9, wherein the dust-proof film is a conductive thin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921498195.1U CN211056708U (en) | 2019-09-10 | 2019-09-10 | Silicon microphone packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921498195.1U CN211056708U (en) | 2019-09-10 | 2019-09-10 | Silicon microphone packaging structure |
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| CN211056708U true CN211056708U (en) | 2020-07-21 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110482477A (en) * | 2019-09-10 | 2019-11-22 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
| CN114630236A (en) * | 2022-02-28 | 2022-06-14 | 歌尔微电子股份有限公司 | Vibration sensor and electronic device |
| CN115996341A (en) * | 2023-03-23 | 2023-04-21 | 荣耀终端有限公司 | Noise reduction structure, pickup assembly and electronic equipment |
-
2019
- 2019-09-10 CN CN201921498195.1U patent/CN211056708U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110482477A (en) * | 2019-09-10 | 2019-11-22 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
| CN114630236A (en) * | 2022-02-28 | 2022-06-14 | 歌尔微电子股份有限公司 | Vibration sensor and electronic device |
| CN115996341A (en) * | 2023-03-23 | 2023-04-21 | 荣耀终端有限公司 | Noise reduction structure, pickup assembly and electronic equipment |
| CN115996341B (en) * | 2023-03-23 | 2023-09-19 | 荣耀终端有限公司 | Noise reduction structure, pickup assembly and electronic equipment |
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