CN111511094B - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
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- CN111511094B CN111511094B CN202010305654.0A CN202010305654A CN111511094B CN 111511094 B CN111511094 B CN 111511094B CN 202010305654 A CN202010305654 A CN 202010305654A CN 111511094 B CN111511094 B CN 111511094B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
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- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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Abstract
The invention discloses a circuit board assembly and electronic equipment, wherein the circuit board assembly comprises a circuit board body, an electronic device and a shielding film assembly, wherein the electronic device is arranged on the surface of the circuit board body, and the shielding film assembly is covered on the electronic device; the circuit board body is provided with a first grounding area, the shielding film assembly comprises a shielding layer and an insulating layer which are sequentially stacked, the insulating layer is positioned between the shielding layer and the electronic device, and the edge of the shielding layer is electrically connected with the first grounding area. The electronic device comprises a plurality of first devices, each first device is provided with a grounding terminal, the grounding terminals of the plurality of first devices are adjacently distributed and form a shielding isolation part, and the shielding film assembly, the shielding isolation part and the circuit board body form at least two shielding cavities; the shielding film component is provided with an avoiding area. Above-mentioned scheme can solve present circuit board assembly when dividing the chamber shielding, and the metal shield wall can cause the device layout area on circuit board surface to reduce and hinder the problem of walking the line between the different shielding cavity.
Description
Technical Field
The embodiment of the invention relates to the technical field of communication equipment, in particular to a circuit board assembly and electronic equipment.
Background
With the rapid development of technologies, the performance of electronic devices (such as mobile phones, tablet computers, etc.) is continuously optimized, and meanwhile, in order to obtain better experience, the light and thin design of electronic devices has become a development trend. At present, in order to realize the light and thin design of electronic equipment, one of the thinning processes is improved based on a circuit board assembly, an insulating film is attached to the surfaces of a circuit board and components, a layer of shielding film with conductive property is attached to the surface of the insulating film, the edge of the shielding film is connected with the edge grounding area of the circuit board, a Faraday cage is formed to carry out electromagnetic shielding on the circuit board assembly, so that the traditional metal shielding frame and the metal shielding cover are replaced, the thickness of the circuit board assembly is further thinned, and finally the light and thin of the electronic equipment is realized.
When the thinning process is applied, in order to shield the devices on the circuit board assembly in different cavities, a metal shielding wall generally needs to be welded on the circuit board, one end of the metal shielding wall is welded on the circuit board to realize grounding, and the other end of the metal shielding wall is connected with the shielding film so as to be further separated into a plurality of shielding cavities. However, because the circuit board is required to provide sufficient support for the metal shielding wall, the width of the welding end of the metal shielding wall is necessarily greater than the width of the metal shielding wall, which undoubtedly reduces the device installation space on the surface of the circuit board and is not convenient for routing between different shielding cavities.
Disclosure of Invention
The embodiment of the invention provides a circuit board assembly and electronic equipment, and aims to solve the problems that when the existing circuit board assembly is subjected to cavity-splitting shielding, a metal shielding wall can reduce the device installation space on the surface of a circuit board and block routing among different shielding cavities.
In order to solve the above problems, the present invention is realized by:
in a first aspect, an embodiment of the present invention provides a circuit board assembly, which includes a circuit board body, an electronic device, and a shielding film assembly, where the electronic device is disposed on a surface of the circuit board body, and the shielding film assembly covers the electronic device.
The circuit board body is provided with a first grounding area, the shielding film assembly comprises a shielding layer and an insulating layer which are sequentially stacked, the insulating layer is positioned between the shielding layer and the electronic device, and the edge of the shielding layer is electrically connected with the first grounding area.
The electronic device comprises a plurality of first devices, each first device is provided with a ground terminal, the ground terminals of the first devices are distributed adjacently and form a shielding isolation part, and the shielding film assembly, the shielding isolation part and the circuit board body form at least two shielding cavities.
The shielding film assembly is provided with an avoiding area, and the shielding layer is electrically connected with the shielding isolation part in the avoiding area.
In a second aspect, an embodiment of the present invention further provides an electronic device, including the circuit board assembly as described above.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the embodiment of the invention, the grounding terminals of the plurality of first devices are adjacently arranged to form the shielding isolation part, and meanwhile, the shielding film assembly, the shielding isolation part and the circuit board body form at least two shielding cavities, so that cavity-separated shielding is realized.
Compared with the prior art, the circuit board assembly disclosed by the embodiment of the invention does not need to add a shielding structure in the circuit board assembly, so that the installation space of the surface of the circuit board body is undoubtedly increased, the routing of electronic devices is facilitated, and meanwhile, the cost advantage is also achieved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention in a top view;
FIG. 2 isbase:Sub>A cross-sectional view taken from perspective A-A of FIG. 1 in accordance with an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view taken from perspective B-B of FIG. 1 in accordance with an embodiment of the present disclosure;
description of reference numerals:
100-circuit board body, 110-first grounding area, 120-second grounding area,
200-shielding film assembly, 210-shielding layer, 211-extending part, 220-insulating layer, 230-windowing region,
300-shield isolation, 310-ground terminal, 320-conductive filler,
400-shielded chamber.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 3, an embodiment of the invention discloses a circuit board assembly, which includes a circuit board body 100, an electronic device, and a shielding film assembly 200.
The circuit board body 100 is a base member of the circuit board assembly, which provides a mounting support base for both the electronic device and the shielding film assembly 200. It should be understood that the electronic device generates electromagnetic waves during operation, and these electromagnetic waves may generate electromagnetic interference to other devices outside the circuit board assembly, and accordingly, the electronic device on the circuit board assembly may also be easily interfered by electromagnetic interference of other devices, so that in order to ensure that the electronic device can operate normally, the electronic device on the circuit board assembly needs to be electromagnetically shielded. In the embodiment of the present invention, the electromagnetic shielding is achieved by the shielding film assembly 200.
In the embodiment of the present invention, the electronic device is disposed on the surface of the circuit board body 100, and the shielding film assembly 200 covers the electronic device, so as to shield the electronic device on the circuit board body 100.
The circuit board body 100 has a first grounding area 110, and the first grounding area 110 is connected to a ground plane (GND) of the circuit board body 100. The shielding film assembly 200 includes a shielding layer 210 and an insulating layer 220, which are sequentially stacked, and the insulating layer 220 is located between the shielding layer 210 and the electronic device. It should be understood that the shielding film assembly 200 can realize a thinning design of the circuit board assembly, which enables a user to obtain a better experience in use; in order to enable the shielding film assembly 200 to be attached to the surface of the electronic device, the shielding film assembly 200 should be a flexible structure. With such a configuration, the gap between the shielding film assembly 200 and the electronic device is reduced as much as possible, so that the overall thickness of the circuit board assembly is reduced, and the circuit board assembly is thinned.
Since the shielding film assembly 200 is a flexible structure, the shielding layer 210 may be brought into direct contact with the electronic device, which may cause a short circuit. Therefore, in the embodiment of the present invention, the insulating layer 220 is located between the shielding layer 210 and the electronic device, so that the shielding layer 210 and the electronic device can be separated, and thus, a short-circuit fault can be avoided.
Meanwhile, the edge of the shielding layer 210 is electrically connected to the first ground region 110. It should be noted that the shielding structure needs to be grounded, and since currents can be formed on the shielding structure, potential differences are formed at different positions of the shielding structure, and since the impedance of the ground signal is low, the currents can be conducted away after the shielding structure is grounded. Specifically, the edge of the shielding layer 210 is connected to a Ground (GND) on the circuit board body 100 through the first grounding region 110, so as to achieve grounding, and the current on the shielding layer 210 can be conducted away through the first grounding region 110. The first ground region 110 may be a ground pad, and the shielding layer 210 may be electrically connected to the ground pad by soldering, hot press molding, or the like.
The electronic device includes a plurality of first devices, each having a ground terminal 310. Specifically, the first device may be reliably connected to the circuit board body 100 through the ground terminal 310. Meanwhile, the ground terminals 310 of the plurality of first devices are adjacently distributed and form the shielding isolation part 300. It should be understood that the ground terminals 310 are conductive structures, so that when the ground terminals 310 are adjacently arranged, the whole ground terminals have conductive continuity, and thus the shielding effect can be achieved.
The shielding film assembly 200, the shielding separator 300, and the circuit board body 100 form at least two shielding cavities 400. Specifically, one end of the shielding isolation part 300 is connected to the shielding film assembly 200, and the other end of the shielding isolation part 300 is connected to the circuit board body 100, so that the shielding isolation part 300 partitions the inner shielding space of the circuit board assembly, thereby forming the shielding cavity 400.
It should be understood that the specific number of the shielding cavities 400 is determined by the specific shape of the shielding separator 300, and in the present embodiment, the shape of the shielding separator 300 may be various. In a specific embodiment, the shielding spacer 300 may linearly extend and divide the interior of the circuit board assembly into two shielding chambers 400. Of course, the shielding spacer 300 may have other shapes, such as a cross shape, in which case the interior of the circuit board assembly is divided into four shielding chambers 400; t-shaped, with the interior of the circuit board assembly being partitioned into three shielded chambers 400. Meanwhile, the embodiment of the present invention does not limit the linear extension characteristic of the shielding and isolating part 300, and the shielding and isolating part may also extend in a curved line shape or a broken line shape.
As described above, one end of the shielding and isolating part 300 needs to be connected to the shielding film assembly 200, that is, one end of the ground terminal 310 constituting the shielding and isolating part 300 needs to be connected to the shielding film assembly 200. However, since the insulating layer 220 is located between the electronic device and the shielding layer 210, the insulating layer 220 may cause the ground terminal 310 and the shielding film assembly 200 to be non-conductively continuous, and thus there may be an electromagnetic leakage problem between the shielding film assembly 200 and the shielding separator 300. Accordingly, in the present embodiment, the shielding film assembly 200 is provided with the escape area 230, and the shielding layer 210 is electrically connected to the shielding isolation part 300 in the escape area 230.
It should be understood that the relief area 230 is an area where the shielding film assembly 200 is windowed, and specifically, a part of the shielding film assembly 200 is peeled off. The shield layer 210 and the insulation layer 220 are usually connected by adhesion, and the shield layer 210 and the insulation layer 220 are not separated during the process of windowing the shielding film assembly 200.
Meanwhile, the ground terminal 310 is electrically connected to the ground network on the circuit board body 100 and also electrically connected to the shielding layer 210, so that reliable grounding of the shielding layer 210 around the avoiding region 230 is realized, and further electromagnetic leakage between the shielding film assembly 200 and the shielding isolation part 300 is avoided; meanwhile, the ground terminal 310 can fix the shielding layer 210 around the avoiding region 230, and as mentioned above, the shielding layer 210 and the insulating layer 220 are usually connected by bonding, so that under such a configuration, an attachment point is formed on the electronic device, and thus the shielding film assembly 200 is fixed, the shielding film assembly 200 can be prevented from falling off from the electronic device at the avoiding region 230, and the electromagnetic shielding effect is enhanced.
In the embodiment of the present invention, there may be various electrical connection relationships between the shielding isolation portion 300 and the shielding layer 210, and the embodiment of the present invention does not limit the electrical connection relationships, such as adhesion, thermoforming, etc., but all of them need to ensure the conductive relationship between the shielding isolation portion 300 and the shielding layer 210. In a specific embodiment, the shielding isolation portion 300 may be welded to the shielding layer 210, so that the connection stability and reliability of the shielding isolation portion 300 and the shielding layer 210 may be improved. It should be understood that the shielding isolation part 300 is welded to the shielding layer 210, that is, the shielding isolation part 300 includes the ground terminal 310 welded to the shielding layer 210.
It should be noted that, since the shielding separator 300 is located inside the shielding film assembly 200 during a specific installation process, it is inconvenient to connect the two. However, since the shielding film assembly 200 is provided with the escape region 230, the escape region 230 penetrates through the shielding film assembly 200, the shielding/isolating part 300 can be exposed to the shielding film assembly 200 through the window region 230, and the shielding/isolating part 300 and the shielding layer 210 can be connected in the window region 230.
As can be seen from the above description, in the embodiment of the present invention, the shielding diaphragm assembly 200, the shielding diaphragm assembly 300, and the circuit board body 100 form at least two shielding cavities 400, and thus the cavity shielding is realized, by adjacently arranging the ground terminals 310 of the plurality of first devices to form the shielding diaphragm 300.
In the prior art, a metal shielding wall needs to be additionally arranged to realize shielding, the metal shielding wall is complex to process and high in processing cost, the ground terminal 310 is a structure on the circuit board assembly, the formed shielding isolation part 300 does not occupy an additional installation space on the circuit board body 100, and meanwhile, the first device can also be directly wired from the side.
Referring to fig. 1 and 3 again, in general, due to defects existing in the surface processing of the ground terminals 310 themselves and mounting errors of the electronic devices, in the shielding isolation portion 300, a gap exists between two adjacent ground terminals 310, so that a conductive discontinuity exists on the shielding cavity 400, and further electromagnetic leakage occurs, and the electronic devices in different shielding cavities 400 are subjected to electromagnetic interference. Based on this, in an alternative scheme, the conductive filling members 320 can be arranged in the gaps. It should be understood that, since the conductive filling member 320 has conductivity, the adjacent ground terminals 310 can be electrically connected, the conductive discontinuity is eliminated, and thus electromagnetic leakage can be prevented, mutual electromagnetic interference of electronic devices separated in different shielding cavities 400 can be avoided, and the shielding effect is optimized.
Of course, in a specific installation process, the ground terminals 310 included in the shielding and isolating part 300 should be arranged as close as possible to reduce a gap therebetween, reduce electromagnetic leakage, and improve a shielding effect. The embodiment of the present invention does not limit the specific type of the conductive filler element 320, and the conductive filler element 320 may be a solder structure, and may also be other conductive structures, such as copper, aluminum, and other metal structures.
Referring again to fig. 2, in the embodiment of the present invention, the specific opening position of the unconfined avoiding region 230 on the shielding film assembly 200 is provided. In the alternative, the avoidance region 230 may be disposed opposite the shield separator 300. It should be understood that the shielding layer 210 needs to be electrically connected to the shielding isolation portion 300, and in this way, an excessively long electrical connection piece is avoided between the shielding layer and the shielding isolation portion, which is undoubtedly beneficial to achieve the connection between the shielding layer and the shielding isolation portion, and the cost is also reduced.
Meanwhile, the specific shape of the avoidance region 230 is not limited in this embodiment, the avoidance region 230 may generally match with the linear extension characteristic of the shielding isolation part 300, for example, the shielding isolation part 300 extends linearly, and the avoidance region 230 may be a rectangular avoidance region; the avoidance region 230 may be a square avoidance region, a circular avoidance region, or the like according to the shield isolation portion 300 having different shapes.
As mentioned above, there are a plurality of first devices, and there are various specific relationships with the avoidance region 230, which is not limited in this embodiment. In a specific embodiment, in a direction perpendicular to the circuit board body 100, the ground terminal 310 of each first device is at least partially covered by the relief area 230, and the ground terminal 310 of each first device is electrically connected to the shielding layer 210.
It should be understood that the ground terminals 310 are also provided in plural numbers, and if each ground terminal 310 is electrically connected to the shielding layer 210, the number of connection points between the shielding spacer 300 and the shielding film assembly 200 can be increased, and the mounting adhesion of the whole shielding film assembly 200 can be certainly improved. Even when the circuit board assembly is deformed or subjected to thermal stress, etc., it is ensured that the shielding film assembly 200 does not come off.
Of course, the present embodiment does not limit the covering relationship between the relief area 230 and the ground terminal 310, and a part of the ground terminal 310 may be exposed in the relief area 230, or the entire ground terminal 310 may be exposed. In general, the avoidance region 230 only needs a small window, and the small window has a small influence on the overall shielding effect of the circuit board assembly.
When the shielding layer 210 is windowed, the shielding layer 210 in the area of the avoidance region 230 is generally cut and then peeled off to expose the shielding isolation part 300; however, in this case, there is usually a distance between the edge of the shielding layer 210 surrounding the avoiding region 230 and the shielding isolation portion 300, and the shielding layer cannot be directly connected, so that an intermediate electrical connection member is inevitably required between the shielding layer and the shielding isolation portion, which makes the connection operation more complicated.
Based on this, in an alternative scheme, the shielding layer 210 may have an extension portion 211, and within the relief region 230, the extension portion 211 is electrically connected with the ground terminal 310 of the first device. Specifically, the extension portion 211 electrically connects the ground terminal 310 and the shielding layer 210 together, the extension portion 211 has a certain length dimension, which can make up for the distance between the ground terminal 310 and the shielding layer 210, and the shielding layer 210 is connected to the ground terminal 310 through the extension portion 211, thereby fixing the shielding film assembly 200. Of course, the embodiment of the present invention does not limit the specific type of the extension 211.
The extension 211 may be generally formed integrally with the shielding layer 210, and it is understood that the extension 211 is led out from the shielding layer 210, or the shielding layer 210 forms the extension 211 by electroplating. With such a configuration, the conduction reliability and connection stability of the shielding layer 210 and the extension portion 211 can be improved, so as to achieve a better grounding effect.
In a specific embodiment, after the shielding layer 210 is cut, the cut portion is not peeled off, and the connection between the cut portion and the shielding layer 210 is remained, so as to form the extension portion 211, that is, the extension portion 211 is a portion of the shielding layer 210 in the area of the avoiding region 230. Specifically, the extending portion 211 is bent and extends into the avoiding region 230, and the extending portion 211 can penetrate through the avoiding region 230 and be electrically connected with the ground terminal 310 after being bent, so that the shielding layer 210 is electrically connected with the ground terminal 310, and finally, the shielding film assembly 200 is attached and fixed.
As previously mentioned, the shielding film assembly 200 should be a flexible structure. Based on this, in an alternative scheme, the shielding layer 210 may be a copper layer, i.e., a copper foil. The copper foil is a conventional material in the electronic field and is convenient to obtain. With such a configuration, the shielding layer 210 has good conductive characteristics and soldering characteristics, which is beneficial to realize stable connection between the shielding layer 210 and the ground terminal 310; meanwhile, the shielding layer 210 has good flexibility, which is beneficial to the attachment of the shielding layer 210 and the electronic device. Of course, the embodiment of the present invention does not limit the specific type of the shielding layer 210, and the shielding layer may be a conductive metal layer such as an aluminum layer and a zinc layer, or may be a non-metal layer having a conductive property.
In order to facilitate the connection of the ground terminal 310 to the circuit board body 100 and to improve the connection stability and reliability of the two, in an alternative scheme, the circuit board body 100 may have a second ground region 120, and the shielding layer 210 is electrically connected to the second ground region 120 through the ground terminal 310. With this arrangement, the grounding process of the grounding terminal 310 can be completed only by mounting the grounding terminal 310 on the second grounding section 120.
Of course, the embodiment of the present invention does not limit the specific structure type of the second ground region 120, in a specific embodiment, the second ground region 120 may be selected as a ground pad region, and in a specific mounting process, only the ground terminal 310 needs to be mounted on the ground pad region corresponding to the second ground region 120, so that stable mounting of the first device is achieved. Typically, the electronic device further comprises a second device, the second device being located within the shielded chamber 400. It will be appreciated that the shielding spacer 300 needs to be formed by the ground terminals 310 of the first device and these ground terminals 310 need to be located adjacent to each other, thus having certain layout requirements for the first device, so that there is also a second device located within the shielding cavity 400 in the circuit board assembly.
Based on the circuit board assembly, the embodiment of the invention also discloses an electronic device which comprises the circuit board assembly.
Certainly, the electronic device according to the embodiment of the present invention may be a smart phone, a tablet computer, an electronic book reader, a wearable device, or the like, and the embodiment of the present invention does not limit the specific type of the electronic device.
In the above embodiments of the present invention, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (9)
1. A circuit board assembly, comprising a circuit board body (100), an electronic device disposed on a surface of the circuit board body (100), and a shielding film assembly (200) covering the electronic device;
the circuit board body (100) is provided with a first grounding area (110), the shielding film assembly (200) comprises a shielding layer (210) and an insulating layer (220) which are sequentially stacked, the insulating layer (220) is positioned between the shielding layer (210) and the electronic device, and the edge of the shielding layer (210) is electrically connected with the first grounding area (110);
the electronic device comprises a plurality of first devices, each first device is provided with a ground terminal (310), the ground terminals (310) of the plurality of first devices are distributed adjacently and form a shielding isolation part (300), and the shielding film assembly (200), the shielding isolation part (300) and the circuit board body (100) form at least two shielding cavities (400);
the shielding film assembly (200) is provided with an avoidance region (230), the avoidance region (230) is a region where a window is formed on the shielding film assembly (200), and in the avoidance region (230), the shielding layer (210) is electrically connected with the shielding isolation part (300);
in the shielding isolation part (300), a gap exists between two adjacent ground terminals (310), and a conductive filling piece (320) is arranged in the gap.
2. The circuit board assembly according to claim 1, wherein the shielding partition (300) extends linearly and divides the interior of the circuit board assembly into two shielding cavities (400).
3. The circuit board assembly of claim 1, wherein the relief area (230) is disposed opposite the shield spacer (300).
4. A circuit board assembly according to claim 3, characterized in that the ground terminal (310) of each first device is at least partially covered by the relief area (230) in a direction perpendicular to the circuit board body (100), and the ground terminal (310) of each first device is electrically connected to the shielding layer (210).
5. The circuit board assembly of claim 1, wherein the shielding layer (210) has an extension (211), the extension (211) being electrically connected to the ground terminal (310) of the first device within the relief region (230).
6. The circuit board assembly of claim 1, wherein the electronic device further comprises a second device, the second device being located within the shielded cavity (400).
7. The circuit board assembly according to claim 1, characterized in that the circuit board body (100) has a second grounding region (120), the shielding layer (210) being electrically connected with the second grounding region (120) through the grounding terminal (310).
8. The circuit board assembly of claim 7, wherein the second ground region (120) is a ground pad region.
9. An electronic device comprising a circuit board assembly according to any one of claims 1 to 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010305654.0A CN111511094B (en) | 2020-04-17 | 2020-04-17 | Circuit board assembly and electronic equipment |
| PCT/CN2021/087259 WO2021208974A1 (en) | 2020-04-17 | 2021-04-14 | Circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010305654.0A CN111511094B (en) | 2020-04-17 | 2020-04-17 | Circuit board assembly and electronic equipment |
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| Publication Number | Publication Date |
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| CN111511094A CN111511094A (en) | 2020-08-07 |
| CN111511094B true CN111511094B (en) | 2023-04-14 |
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|---|---|---|---|
| CN202010305654.0A Active CN111511094B (en) | 2020-04-17 | 2020-04-17 | Circuit board assembly and electronic equipment |
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| CN (1) | CN111511094B (en) |
| WO (1) | WO2021208974A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511094B (en) * | 2020-04-17 | 2023-04-14 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
| CN113573465B (en) * | 2021-07-23 | 2023-04-04 | 华为技术有限公司 | Circuit assembly and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8276268B2 (en) * | 2008-11-03 | 2012-10-02 | General Electric Company | System and method of forming a patterned conformal structure |
| US8115117B2 (en) * | 2009-06-22 | 2012-02-14 | General Electric Company | System and method of forming isolated conformal shielding areas |
| CN110729176A (en) * | 2019-10-15 | 2020-01-24 | 杭州见闻录科技有限公司 | EMI shielding process for communication module product and communication module product |
| CN111511094B (en) * | 2020-04-17 | 2023-04-14 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
| CN111491439A (en) * | 2020-04-17 | 2020-08-04 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
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2020
- 2020-04-17 CN CN202010305654.0A patent/CN111511094B/en active Active
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- 2021-04-14 WO PCT/CN2021/087259 patent/WO2021208974A1/en active Application Filing
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| WO2021208974A1 (en) | 2021-10-21 |
| CN111511094A (en) | 2020-08-07 |
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