WO2021135113A1 - Structure anti-poussière, structure d'emballage de microphone, et dispositif électronique - Google Patents

Structure anti-poussière, structure d'emballage de microphone, et dispositif électronique Download PDF

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Publication number
WO2021135113A1
WO2021135113A1 PCT/CN2020/099179 CN2020099179W WO2021135113A1 WO 2021135113 A1 WO2021135113 A1 WO 2021135113A1 CN 2020099179 W CN2020099179 W CN 2020099179W WO 2021135113 A1 WO2021135113 A1 WO 2021135113A1
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WO
WIPO (PCT)
Prior art keywords
dust
carrier
microphone
proof structure
filter screen
Prior art date
Application number
PCT/CN2020/099179
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English (en)
Chinese (zh)
Inventor
林育菁
池上尚克
畠山庸平
Original Assignee
潍坊歌尔微电子有限公司
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Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2021135113A1 publication Critical patent/WO2021135113A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/001—Moulding aspects of diaphragm or surround

Definitions

  • the present invention relates to the technical field of electro-acoustic conversion, and more specifically, the present invention relates to a dustproof structure, a microphone packaging structure, and an electronic device.
  • the microphone as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products.
  • microphones have been widely used in many different types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smart watches and smart wearables.
  • the design of the structure has become the focus and focus of research by those skilled in the art.
  • the existing microphone packaging structure usually includes a housing with a accommodating cavity in which components such as chip components (for example, MEMS chips and ASIC chips) are housed and fixed; and a sound pickup hole is also provided on the housing.
  • chip components for example, MEMS chips and ASIC chips
  • a sound pickup hole is also provided on the housing.
  • the currently adopted solution is usually to provide a corresponding isolation component on the pickup hole of the microphone packaging structure to block the entry of foreign particles, foreign objects, etc.
  • the existing isolation assembly as shown in FIG. 1 and FIG. 2, includes a support portion and an isolation mesh. When using the isolation component, install the isolation component on the pickup hole.
  • the existing isolation components due to the difference in size, material, structure, etc. between the support portion 101 and the isolation mesh 102, a certain internal stress difference is likely to occur at the position where the two are connected, which will lead to isolation.
  • the omentum 103 on the mesh cloth 102 produces wrinkles or wrinkles, which cannot guarantee that the omentum 103 is in a flat state, which will cause the quality of the product to decrease, and even affect the air flow at the omentum 103.
  • An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone packaging structure, and an electronic device.
  • a dust-proof structure including a carrier and a grid part
  • the carrier is a hollow structure; the grid part is arranged at one end of the carrier and covers the hollow structure;
  • the grid portion includes a filter screen, a stress buffer area provided around the filter screen, and a fixed portion provided around the stress buffer area.
  • the filter screen is opposite to the hollow structure, and the fixed portion is opposite to the carrier. Connected, the filter screen and the stress buffer area are suspended.
  • the stress buffer area is a ring structure with a predetermined width ⁇ , and the predetermined width ⁇ >0.
  • the ratio ⁇ of the width ⁇ of the filter screen to the predetermined width ⁇ of the stress buffer area is: 0% ⁇ 27%.
  • the width of the hollow structure of the carrier is greater than the maximum width of the filter screen.
  • the inner wall surface of the carrier is an inclined surface.
  • the inner wall surface of the carrier is formed with at least two inclination angles.
  • the inner wall surface of the carrier is a curved surface.
  • the fixing portion is fixedly connected to the carrier, the filter screen and the stress buffer area are suspended, and the cross section of the stress buffer area is L-shaped.
  • a microphone packaging structure includes a housing with an accommodating cavity, and a sound pickup hole is provided on the housing, and the sound pickup hole is used to communicate the inside and the outside of the housing;
  • the dust-proof structure is arranged on the sound pickup hole.
  • the dust-proof structure is located outside the housing.
  • the housing includes a substrate and a packaging cover, and the substrate and the packaging cover surround the containing cavity;
  • the dust-proof structure is contained in the containing cavity
  • the microphone device includes a MEMS chip and a signal amplifier.
  • the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the packaging cover.
  • the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.
  • the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly provided on the substrate at a position corresponding to the sound pickup hole.
  • the sound pickup hole is located on the substrate
  • the dustproof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole
  • the MEMS chip is arranged on the dustproof structure.
  • an electronic device includes the microphone packaging structure as described in any one of the above.
  • a stress buffer area is specially designed in it, which can keep the filter net on the grid part in a flat state and avoid the phenomenon of wrinkles or wrinkles on the filter net.
  • the dust-proof structure provided by the embodiment of the present invention can effectively protect the sound pickup hole of the microphone packaging structure, and the mesh part can block external particles and foreign objects from entering the inside of the microphone packaging structure, thereby effectively protecting the inside of the microphone.
  • the components in order to avoid affecting the acoustic performance and service life of the microphone.
  • Figure 1 is a side view of a conventional isolation assembly.
  • FIG. 2 is a schematic diagram of the structure of the isolation part in the existing isolation assembly.
  • Fig. 3 is a schematic structural diagram of a dust-proof structure according to an embodiment of the present invention.
  • Fig. 4 is a schematic structural diagram of a dust-proof structure according to another embodiment of the present invention.
  • Fig. 5 is a schematic structural diagram of a dust-proof structure according to another embodiment of the present invention.
  • Fig. 6 is a schematic structural diagram of a microphone packaging structure according to a first embodiment of the present invention.
  • Fig. 7 is a schematic structural diagram of a microphone packaging structure according to a second embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a microphone packaging structure according to a third embodiment of the present invention.
  • Fig. 9 is a schematic structural diagram of a microphone packaging structure according to a fourth embodiment of the present invention.
  • Fig. 10 is a schematic structural diagram of a microphone packaging structure according to a fifth embodiment of the present invention.
  • 1-carrier 11-inner wall surface, 12-air flow channel, 2-mesh part, 21-filter, 22-fixed part, 23-stress buffer area, 3-shell, 31-package cover, 32-substrate, 4 -Pickup hole, 5-MEMS chip, 6-signal amplifier.
  • a dust-proof structure is provided.
  • the dust-proof structure can be applied to, for example, a microphone packaging structure.
  • the dust-proof structure can effectively block external particles and foreign objects from entering the microphone packaging structure through the pickup hole on the microphone packaging structure, thereby effectively protecting the internal components of the microphone to avoid affecting the microphone's acoustic performance and Service life.
  • the dust-proof structure provided by the embodiment of the present invention includes a carrier 1 and a grid portion 2.
  • the carrier 1 has a hollow structure, and an air flow channel 12 is formed inside the hollow structure for air flow.
  • the grid portion 2 is arranged at one end of the carrier 1 and covers the hollow structure.
  • the mesh portion 2 includes a filter screen 21, a stress buffer area 23 provided around the filter screen 21, and a fixing portion 22 provided around the stress buffer area 23, and the filter screen 21 is opposite to the hollow structure
  • the fixing portion 22 is connected to the carrier 1, and the filter mesh 21 and the stress buffer area 23 are suspended.
  • the stress buffer area 23 is specially designed to keep the filter mesh 21 on the mesh portion 2 in a flat state and avoid the occurrence of wrinkles or wrinkles on the filter mesh 21.
  • the dust-proof structure provided by the embodiment of the present invention can effectively protect the microphone packaging structure, and the mesh portion 2 can effectively block external particles and foreign objects from entering the microphone packaging structure, thereby effectively protecting the microphone packaging structure.
  • the various components of the microphone to avoid affecting the acoustic performance and service life of the microphone.
  • the filter mesh 21 on the mesh portion 2 is in a flat state, this also facilitates the smooth flow of air here, and will not adversely affect the movement of the airflow.
  • the stress buffer area 23 is a ring structure with a predetermined width ⁇ .
  • the predetermined width ⁇ should be greater than zero.
  • the stress buffer region 23 may be, for example, a circular ring structure with a predetermined width ⁇ , a square ring structure with a predetermined width ⁇ , or other ring structures with a predetermined width ⁇ . The technical personnel can flexibly adjust according to the specific situation, which is not limited in the present invention.
  • the grid portion 2 includes a filter mesh 21, a stress buffer area 23 provided around the filter mesh 21, and a fixing portion 22 provided around the stress buffer area 23.
  • the fixing portion 22 can be used to connect the grid portion 2 and the carrier 1 so that the grid portion 2 can be stably covered on the carrier 1.
  • the fixing portion 22 of the grid portion 2 and the edge portion of the carrier 1 can be connected together, for example, by means of adhesive bonding.
  • the two can also be connected by fasteners or welding.
  • the filter mesh 21 can be, for example, a metal mesh cloth with a mesh diameter of less than about 10 ⁇ m, so that the air flow can pass smoothly, and at the same time, it can effectively block the ingress of external dust, impurities and other particles.
  • the metal mesh cloth has the characteristics of good durability, does not need to be replaced frequently, and has a long service life.
  • the filter mesh 21 can also be made of meshes with other pore sizes and other materials.
  • the shape of the mesh opening of the filter mesh 21 may be, for example, a circle, a square, a triangle, or the like. Those skilled in the art can make adjustments flexibly according to specific needs, and there is no restriction on this.
  • the shape of the filter 21 itself can be, for example, a circle, a square, an oval, etc.
  • the filter 21 can also have other irregular shapes. Those skilled in the art can make adjustments flexibly according to actual needs, and the present invention does not limit this.
  • the size of the stress buffer area 23 should be reasonably adjusted and set according to the size of the filter mesh 21 on the grid portion 2.
  • the width dimension of the filter screen 21 is defined as ⁇
  • the ratio ⁇ between the width ⁇ of the filter screen 21 and the predetermined width ⁇ of the stress buffer area 23 should satisfy the relationship: 0% ⁇ 27%.
  • the inventors of the present invention found that within this range, ⁇ helps to keep the filter mesh 21 in a flat state without causing wrinkles thereon.
  • the filter mesh 21 on the grid portion 2 has a circular structure.
  • the ratio ⁇ of the diameter aa' of the filter screen 21 to the predetermined width ⁇ of the stress buffer region 23 should satisfy: 0% ⁇ 27%.
  • the width dimension of the hollow structure of the carrier 1 is larger than the width (or width) of the filter mesh 21.
  • the width dimension of the hollow structure of the carrier 1 should be greater than the maximum width of the filter screen 21. That is, what is designed in the present invention is that the filter mesh 21 itself cannot completely cover the hollow structure of the carrier 1.
  • the carrier 1 is improved, and the wall thickness of the carrier 1 is reduced, so that the width dimension of the hollow structure becomes larger. In this way, when the grid portion 2 is fixed on the carrier 1, a stress buffer area 23 with a certain space can be formed at the edge of the connecting position of the two. The stress buffering area 23 can well improve the defect that the filter mesh 21 is prone to wrinkles in the prior art.
  • the inner wall surface 11 of the carrier 1 is an inclined surface. That is, the wall surface of the hollow structure of the carrier 1 has a slope structure. Wherein, the inner wall surface of the carrier 1 may be inclined at a predetermined angle, and the inner wall surface forms a conical surface structure. Those skilled in the art can appropriately adjust the inclination angle according to specific needs, and there is no limitation on this.
  • the width of the carrier 1 is relatively large; the carrier 1 is far from the grid portion 2 At one end, the width of the carrier 1 is relatively small. This design makes the hollow structure of the carrier 1 form a tapered air flow channel 12.
  • the width of the carrier 1 is larger, which helps the two to be firmly and stably combined, and the tapered structure
  • the air flow channel 12 is conducive to air flow.
  • the inner wall surface 11 of the carrier 1 is formed with at least two inclination angles. It should be noted that when the inner wall surface of the carrier 1 forms two or more inclination angles, the slopes of the different inclination angles can be the same, of course, can also be different, and those skilled in the art can flexibly adjust according to the specific situation. , There is no restriction on this.
  • the width of the carrier 1 is relatively large; the carrier 1 is far from the grid portion 2 At one end, the width of the carrier 1 is relatively small.
  • the width of the carrier 1 is also relatively large due to the connection between the grid portion 2 and the carrier 1, which also contributes to the firm and stable combination of the two.
  • the inner wall surface 11 of the carrier 1 is not limited to the above two structures.
  • the inner wall surface 11 of the carrier 1 may also have an arc-shaped structure, that is, an arc-shaped surface, for example. This structure is relatively simple to implement.
  • the fixing portion 22 of the grid portion 2 is fixedly connected to the edge portion of the carrier 1, wherein the filter mesh 21 and the stress buffer area 23 is suspended, and the cross section of the stress buffer area 23 is L-shaped.
  • the thickness of the mesh portion 2 may be 0.5 ⁇ m, for example.
  • the height of the carrier 1 may be 40 ⁇ m, for example. This size is suitable for most microphone packaging structures. Of course, those skilled in the art can also make appropriate adjustments to the size according to specific assembly requirements, and there is no limitation on this.
  • a microphone packaging structure is also provided.
  • the microphone packaging structure can be applied to various types of electronic products such as mobile phones, notebook computers, Ipads, VR devices, and smart wearable devices, and its applications are relatively wide.
  • the microphone packaging structure provided by the embodiments of the present invention can effectively prevent internal chip components and other components from being damaged due to external dust, impurities and other particles and foreign objects, and can prolong the service life of the microphone and also make the microphone Maintain excellent acoustic performance.
  • the microphone packaging structure provided by the embodiment of the present invention includes a housing 3 with a receiving cavity, and a sound pickup hole 4 is provided on the housing 3.
  • the sound pickup hole 4 is used to communicate the inside and outside of the housing 3.
  • a microphone device is accommodated and fixed in the accommodating cavity of the housing 3.
  • the microphone packaging structure provided by the present invention further includes the dust-proof structure as described above, and the dust-proof structure is fixedly installed on the sound pickup hole 4.
  • the dustproof structure can effectively protect the components inside the microphone packaging structure.
  • the shape of the sound pickup hole 4 may be, for example, a circle, a square, a triangle, an ellipse, or the like.
  • the sound pickup hole 4 can be set to one or more according to needs.
  • the specific location of the sound pickup hole 4 can also be flexibly adjusted according to the specific situation of the microphone packaging structure, which is not limited in the present invention.
  • the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside.
  • the dust-proof structure is installed on the outside of the microphone packaging structure to cover the pickup hole 4, and does not occupy the space inside the microphone packaging structure.
  • the position of the dustproof structure can be reasonably installed according to the position of the pickup hole 4, so that the dustproof structure can be aligned with the pickup hole 4, so as to prevent external particles and foreign objects from passing through the pickup hole 4. It is introduced into the microphone packaging structure.
  • the present invention is not limited to disposing the dust-proof structure outside the housing 3, and the dust-proof structure may also be disposed in the containing cavity of the housing 3.
  • the present invention can flexibly adjust the location of the dust-proof structure according to specific needs.
  • the housing 3 has a structure including a substrate 32 and a packaging cover 31, and the substrate 32 and the packaging cover 31 are combined to form the containing cavity.
  • the dust-proof structure is contained in the containing cavity of the housing 3.
  • the microphone device includes a MEMS chip 5 and a signal amplifier 6.
  • the sound pickup hole 4 is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the packaging cover 32.
  • the position of the dust-proof structure corresponds to the sound pickup hole 4, which can prevent external particles and foreign objects from being introduced into the microphone packaging structure through the sound pickup hole 4.
  • the sound pickup hole 4 is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the substrate 32 corresponding to the sound pickup hole 4 At the same time, the dust-proof structure also covers the MEMS chip 5, which can effectively protect the chip in the microphone packaging structure.
  • the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, and may also be opened on the substrate 32.
  • the sound pickup hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4.
  • the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4, and the MEMS chip 5 is provided On the dust-proof structure.
  • the packaging cover 31 has a dish-like structure as a whole, which has an open end.
  • the material of the packaging cover 31 can be, for example, a metal material, a plastic material, or a PCB board.
  • the shape of the packaging cover 31 may be, for example, a cylindrical shape, a rectangular parallelepiped shape, or the like. Those skilled in the art can flexibly adjust according to actual needs, and there is no restriction on this.
  • the substrate 32 may be a circuit board well-known in the art, for example, a PCB board, etc., which is not limited.
  • the packaging cover 31 and the substrate 32 can be fixed together by, for example, adhesive bonding or solder paste welding. Those skilled in the art can flexibly choose according to their needs, and there is no limitation on this.
  • a microphone device is fixedly accommodated in the accommodating cavity of the housing 3.
  • the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.
  • the MEMS chip 5 includes a substrate and a sensing film.
  • the substrate is also a hollow structure.
  • the sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, and the like.
  • the sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate.
  • the hollow structure forms a back cavity.
  • the MEMS chip 5 can be mounted on the substrate 32.
  • the MEMS chip 5 can also be mounted on the package cover 31, for example, a special adhesive can be used to bond the MEMS chip 5 on the package cover 31.
  • the MEMS chip 5 can also be turned on through the circuit layout in the substrate 32 in a flip-chip manner, which belongs to the common knowledge of those skilled in the art, and the present invention will not be described in detail here.
  • the signal amplifier 6 can be mounted on the package cover 31, of course, can also be mounted on the substrate 32.
  • the signal amplifier 6 can be, for example, an ASIC chip.
  • the ASIC chip is connected to the MEMS chip 5.
  • the electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed and output by the ASIC chip.
  • the MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.
  • the MEMS chip 5 and/or the signal amplifier 6 may also be embedded in the substrate 32 or half embedded in the substrate 32.
  • a conductor is provided in the substrate 32, and a pad is provided on the substrate 32.
  • the conductor is, for example, a metalized through hole provided in the substrate 32.
  • the pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through a conductor.
  • the MEMS chip 5 and the signal amplifier 6 are buried in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6 directly opposite. Ground the metal layer as a shield. A plurality of metal conductors are arranged around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer.
  • the design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 eliminates the need to cover the surface of the signal amplifier 6 with protective glue, which can simplify the process and improve the product's resistance to light noise.
  • the present invention also provides an electronic device.
  • the electronic device includes the microphone packaging structure as described above.
  • the electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, a smart wearable device, etc., which is not limited in the present invention.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

L'invention concerne une structure anti-poussière, une structure d'emballage de microphone, et un dispositif électronique. La structure étanche à la poussière comprend un support et une partie de grille ; le support est une structure creuse ; la partie de grille est disposée à une extrémité du support et couvre la structure creuse ; la partie de grille comprend un écran filtrant, une zone tampon de contrainte disposée autour de l'écran filtrant, et une partie de fixation disposée autour de la zone tampon de contrainte, l'écran filtrant est opposé à la structure creuse, la partie de fixation est reliée au support, et l'écran filtrant et la zone tampon de contrainte sont disposés de manière suspendue. Un effet technique de la présente invention est que l'écran filtrant sur la partie de grille peut être maintenu dans un état plat, de sorte que la partie de grille peut bloquer efficacement les particules externes et les matières étrangères pour les empêcher de pénétrer dans la structure d'emballage du microphone.
PCT/CN2020/099179 2019-12-31 2020-06-30 Structure anti-poussière, structure d'emballage de microphone, et dispositif électronique WO2021135113A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911421956.8 2019-12-31
CN201911421956.8A CN111147995A (zh) 2019-12-31 2019-12-31 防尘结构、麦克风封装结构以及电子设备

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WO2021135113A1 true WO2021135113A1 (fr) 2021-07-08

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Publication number Priority date Publication date Assignee Title
CN111147992A (zh) * 2019-12-31 2020-05-12 歌尔股份有限公司 用于mems器件的防尘结构及mems麦克风封装结构
CN110933579A (zh) * 2019-12-31 2020-03-27 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN111147995A (zh) * 2019-12-31 2020-05-12 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN110958549A (zh) * 2019-12-31 2020-04-03 歌尔股份有限公司 用于mems器件的防尘结构及mems麦克风封装结构
CN111711905B (zh) * 2020-06-24 2021-08-17 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风
CN111711903B (zh) * 2020-06-24 2021-10-01 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风
CN111711907B (zh) * 2020-06-30 2021-08-06 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风
CN112087696B (zh) * 2020-06-30 2022-01-07 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风
CN112492476B (zh) * 2020-12-02 2022-08-09 潍坊歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风
CN112492481A (zh) * 2020-12-02 2021-03-12 潍坊歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

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