WO2021135120A1 - Structure antipoussière, structure d'emballage de microphone et dispositif électronique - Google Patents

Structure antipoussière, structure d'emballage de microphone et dispositif électronique Download PDF

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Publication number
WO2021135120A1
WO2021135120A1 PCT/CN2020/099290 CN2020099290W WO2021135120A1 WO 2021135120 A1 WO2021135120 A1 WO 2021135120A1 CN 2020099290 W CN2020099290 W CN 2020099290W WO 2021135120 A1 WO2021135120 A1 WO 2021135120A1
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WO
WIPO (PCT)
Prior art keywords
dust
carrier
hole
microphone
sound pickup
Prior art date
Application number
PCT/CN2020/099290
Other languages
English (en)
Chinese (zh)
Inventor
游振江
畠山庸平
林育菁
Original Assignee
潍坊歌尔微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2021135120A1 publication Critical patent/WO2021135120A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to the technical field of electro-acoustic conversion, and more specifically, the present invention relates to a dustproof structure, a microphone packaging structure, and an electronic device.
  • the microphone as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products.
  • microphones have been widely used in many different types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smart watches and smart wearables.
  • the design of the structure has become the focus and focus of research by those skilled in the art.
  • the existing microphone packaging structure usually includes a housing with a accommodating cavity in which components such as chip components (for example, MEMS chips and ASIC chips) are housed and fixed; and a sound pickup hole is also provided on the housing.
  • chip components for example, MEMS chips and ASIC chips
  • a sound pickup hole is also provided on the housing.
  • the currently adopted solution is usually to provide an isolation component on the pickup hole of the microphone packaging structure to block the entry of external particles, foreign objects, etc.
  • the existing isolation assembly as shown in FIG. 1 and FIG. 2, includes a support portion 101 and an isolation mesh 102.
  • When using the isolation component install the isolation component on the pickup hole.
  • a certain internal stress difference is likely to occur at the position where the two are connected, which will lead to isolation.
  • the omentum 103 on the mesh cloth 102 produces wrinkles or wrinkles, which cannot guarantee that the omentum 103 is in a flat state, which will cause the quality of the product to decrease, and even affect the air flow at the omentum 103.
  • a dust-proof structure including a carrier and a grid part
  • the grid part includes a filter net and a fixing part arranged around the filter net;
  • the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected to the carrier.
  • the pore structure includes a plurality of first pores, and the plurality of first pores are distributed on an edge portion of the carrier.
  • the cross section of the first channel is circular, and the hole diameter of the first channel is 5-300 ⁇ m.
  • the pore structure further includes a plurality of second pores, the plurality of second pores are close to the hollow structure, and the plurality of second pores are arranged around the edge of the hollow structure.
  • the second channel is a through hole or a blind hole.
  • the width of the second channel is 25-50 ⁇ m, and the length of the second channel is 300-600 ⁇ m.
  • a microphone packaging structure includes a housing with an accommodating cavity, and a sound pickup hole is provided on the housing, and the sound pickup hole is used to communicate the inside and the outside of the housing;
  • the dust-proof structure is arranged on the sound pickup hole.
  • the dust-proof structure is located outside the housing.
  • the dust-proof structure is contained in the containing cavity
  • the microphone device includes a MEMS chip and a signal amplifier.
  • an electronic device includes the microphone packaging structure as described in any one of the above.
  • Figure 1 is a side view of a conventional isolation assembly.
  • Fig. 2 is a side view of a dust-proof structure provided according to an embodiment of the present invention.
  • Fig. 3 is a schematic structural diagram of a carrier provided according to an embodiment of the present invention.
  • Fig. 4 is a schematic structural diagram of a carrier provided according to another embodiment of the present invention.
  • Fig. 6 is a schematic structural diagram of a microphone packaging structure according to a second embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a microphone packaging structure according to a third embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a microphone packaging structure according to a fourth embodiment of the present invention.
  • Fig. 9 is a schematic structural diagram of a microphone packaging structure according to a fifth embodiment of the present invention.
  • a dust-proof structure is provided.
  • the dust-proof structure can be applied to, for example, a microphone packaging structure.
  • the dust-proof structure can effectively block external particles and foreign objects from entering the inside of the microphone packaging structure through the pickup hole on the microphone packaging structure, thereby effectively protecting the internal components of the microphone to avoid affecting the acoustic performance of the microphone. Service life.
  • the dust-proof structure provided by the embodiment of the present invention includes a carrier 1 and a grid portion 2.
  • the grid portion 2 includes a filter mesh 21 and a fixing portion 22 arranged around the filter mesh 21.
  • the carrier 1 has a hollow structure, and a channel structure 11 extending along the thickness direction of the carrier 1 is provided on the carrier 1.
  • the grid portion 2 is provided at one end of the carrier 1 and covers the hollow structure 12, the filter mesh 21 is opposite to the hollow structure 12, and the fixing portion 22 is connected to the carrier 1.
  • the dustproof structure provided by the embodiment of the present invention can effectively protect the microphone packaging structure.
  • the mesh portion 2 is provided with a filter mesh 21, which can pass airflow, and the filter mesh 21 can effectively block external particles and foreign matter (for example, dust and impurities) from entering the inside of the microphone packaging structure, thereby enabling Effectively protect the various components inside the microphone package structure to avoid affecting the acoustic performance and service life of the microphone.
  • the filter mesh 21 on the mesh portion 2 can be in a flat state, this is also conducive to the smooth flow of air here, and will not adversely affect the movement of the airflow.
  • the grid portion 2 includes a filter mesh 21 and a fixing portion 22 provided around the filter mesh 21.
  • the fixing portion 22 can be used to connect the grid portion 2 and the carrier 1 so that the grid portion 2 can cover the carrier 1. It should be noted that when the fixed portion 22 of the grid portion 2 is connected to the carrier 1, the fixed portion 22 is actually connected to the edge portion 13 of the carrier 1.
  • the fixing portion 22 of the grid portion 2 and the edge portion 13 of the carrier 1 can be connected together by means of adhesive bonding, of course, the two can also be connected by fasteners or Those skilled in the art can flexibly choose to connect together by means of welding etc. according to specific needs, and the present invention does not limit this.
  • the shape of the filter screen 21 itself can be a regular shape such as a circle, a square, an oval, etc.
  • the filter screen 21 can also have other irregular shapes. Those skilled in the art can make adjustments flexibly according to actual needs, and the present invention does not limit this.
  • the cross section of the first hole 111 may be circular, for example.
  • the pore size of the first channel 111 may range from 5 ⁇ m to 300 ⁇ m.
  • the cross section of the first channel 111 is not limited to a circular shape, but may also be square, elliptical, triangular, trapezoidal, and other shapes. Those skilled in the art can flexibly adjust according to specific conditions, and there is no limitation on this.
  • the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside.
  • the dust-proof structure is installed on the outside of the microphone packaging structure to cover the pickup hole 4, and does not occupy the space inside the microphone packaging structure.
  • the position of the dustproof structure can be reasonably installed according to the position of the pickup hole 4, so that the dustproof structure can be aligned with the pickup hole 4, so as to prevent external particles and foreign objects from passing through the pickup hole 4. It is introduced into the microphone packaging structure.
  • the sound pickup hole 4 is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the substrate 32 corresponding to the sound pickup hole 4 At the same time, the dust-proof structure also covers the MEMS chip 5, which can effectively protect the chip in the microphone packaging structure.
  • the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, and may also be opened on the substrate 32.
  • the sound pickup hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4.
  • the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4, and the MEMS chip 5 is provided On the dust-proof structure.
  • the substrate 32 may be a circuit board well-known in the art, for example, a PCB board, etc., which is not limited.
  • the packaging cover 31 and the substrate 32 can be fixed together by, for example, adhesive bonding or solder paste welding. Those skilled in the art can choose flexibly according to their needs, and there is no limitation on this.
  • a microphone device is fixedly accommodated in the accommodating cavity of the housing 3.
  • the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.
  • the signal amplifier 6 can be mounted on the package cover 31, of course, can also be mounted on the substrate 32.
  • the signal amplifier 6 can be, for example, an ASIC chip.
  • the ASIC chip is connected to the MEMS chip 5.
  • the electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed and output by the ASIC chip.
  • the MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.
  • the MEMS chip 5 and/or the signal amplifier 6 may also be embedded in the substrate 32 or half embedded in the substrate 32.
  • a conductor is provided in the substrate 32, and a pad is provided on the substrate 32.
  • the conductor is, for example, a metalized through hole provided in the substrate 32.
  • the pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through a conductor.
  • the MEMS chip 5 and the signal amplifier 6 are buried in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6 directly opposite. Ground the metal layer as a shield. A plurality of metal conductors are arranged around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer.
  • the design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 eliminates the need to cover the surface of the signal amplifier 6 with protective glue, which can simplify the process and improve the product's resistance to light noise.
  • the present invention also provides an electronic device.
  • the electronic device includes the microphone packaging structure as described above.
  • the electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, a smart wearable device, etc., which is not limited in the present invention.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne une structure antipoussière, une structure d'emballage de microphone et un dispositif électronique. La structure antipoussière comprend un support et une partie en filet ; la partie en filet comprend un tamis de filtre et une pièce de fixation entourant le tamis de filtre ; le support a une structure creuse, et le support est pourvu d'une structure à trous s'étendant dans le sens de l'épaisseur du support ; la partie en filet est disposée à une extrémité du support et recouvre la structure creuse ; le tamis de filtre est opposé à la structure creuse ; et la pièce de fixation est reliée au support. Un effet technique de la présente invention est que le tamis de filtre sur la partie en filet peut être maintenu dans un état plat, et la partie en filet peut bloquer efficacement une matière particulaire externe et un corps étranger entrant à l'intérieur de la structure d'emballage de microphone.
PCT/CN2020/099290 2019-12-31 2020-06-30 Structure antipoussière, structure d'emballage de microphone et dispositif électronique WO2021135120A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911423067.5A CN111131985A (zh) 2019-12-31 2019-12-31 防尘结构、麦克风封装结构以及电子设备
CN201911423067.5 2019-12-31

Publications (1)

Publication Number Publication Date
WO2021135120A1 true WO2021135120A1 (fr) 2021-07-08

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WO (1) WO2021135120A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111147993A (zh) * 2019-12-31 2020-05-12 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN111131985A (zh) * 2019-12-31 2020-05-08 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备

Citations (8)

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CN1787693A (zh) * 2004-12-10 2006-06-14 美律实业股份有限公司 可降低振动膜应力的硅晶凝缩式麦克风结构
US20160304337A1 (en) * 2015-04-08 2016-10-20 Microlink Senstech Shanghai Ltd. Mems silicone microphone and manufacturing method thereof
CN209105452U (zh) * 2019-01-15 2019-07-12 歌尔科技有限公司 Mems麦克风和电子设备
CN110099344A (zh) * 2019-05-18 2019-08-06 安徽奥飞声学科技有限公司 一种mems结构
CN110602602A (zh) * 2019-09-18 2019-12-20 歌尔股份有限公司 一种电子设备及其音频模组
CN111131986A (zh) * 2019-12-31 2020-05-08 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN111131985A (zh) * 2019-12-31 2020-05-08 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN111147993A (zh) * 2019-12-31 2020-05-12 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1787693A (zh) * 2004-12-10 2006-06-14 美律实业股份有限公司 可降低振动膜应力的硅晶凝缩式麦克风结构
US20160304337A1 (en) * 2015-04-08 2016-10-20 Microlink Senstech Shanghai Ltd. Mems silicone microphone and manufacturing method thereof
CN209105452U (zh) * 2019-01-15 2019-07-12 歌尔科技有限公司 Mems麦克风和电子设备
CN110099344A (zh) * 2019-05-18 2019-08-06 安徽奥飞声学科技有限公司 一种mems结构
CN110602602A (zh) * 2019-09-18 2019-12-20 歌尔股份有限公司 一种电子设备及其音频模组
CN111131986A (zh) * 2019-12-31 2020-05-08 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN111131985A (zh) * 2019-12-31 2020-05-08 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN111147993A (zh) * 2019-12-31 2020-05-12 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备

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