WO2021135119A1 - Structure étanche à la poussière pour dispositif mems et structure d'encapsulation de microphone mems - Google Patents

Structure étanche à la poussière pour dispositif mems et structure d'encapsulation de microphone mems Download PDF

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Publication number
WO2021135119A1
WO2021135119A1 PCT/CN2020/099280 CN2020099280W WO2021135119A1 WO 2021135119 A1 WO2021135119 A1 WO 2021135119A1 CN 2020099280 W CN2020099280 W CN 2020099280W WO 2021135119 A1 WO2021135119 A1 WO 2021135119A1
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WO
WIPO (PCT)
Prior art keywords
carrier
mesh film
dust
opening
proof structure
Prior art date
Application number
PCT/CN2020/099280
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English (en)
Chinese (zh)
Inventor
林育菁
宫岛博志
佐野豊
Original Assignee
潍坊歌尔微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2021135119A1 publication Critical patent/WO2021135119A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/001—Moulding aspects of diaphragm or surround

Definitions

  • the present invention belongs to the technical field of acoustic-electric conversion. Specifically, the present invention relates to a dustproof structure for MEMS devices and a MEMS microphone packaging structure.
  • the microphone as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products.
  • microphones have been widely used in many different types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smart watches, and smart wearables.
  • the design of the structure has become the focus and focus of research by those skilled in the art.
  • the existing microphone packaging structure usually includes a housing with a accommodating cavity in which components such as chip components (for example, MEMS chips and ASIC chips) are housed and fixed; and a sound pickup hole is also provided on the housing.
  • chip components for example, MEMS chips and ASIC chips
  • a sound pickup hole is also provided on the housing.
  • the currently adopted solution is usually to provide a corresponding isolation component on the pickup hole of the microphone packaging structure to block the entry of foreign particles, foreign objects, etc.
  • the existing isolation assembly includes a support part and an isolation mesh. When using the isolation component, install the isolation component on the pickup hole.
  • the existing isolation components because the isolation mesh is directly exposed, and the strength of the isolation mesh itself is low, it is prone to damage, which affects the sound quality of the microphone.
  • An object of the present invention is to provide a dust-proof structure and a MEMS microphone packaging structure for MEMS devices.
  • a dust-proof structure for a MEMS device including:
  • a mesh film configured to allow sound to pass through
  • a first carrier and a second carrier the first carrier has a through first opening, and the second carrier has a through second opening;
  • the first carrier and the second carrier are respectively arranged on both sides of the mesh film, and the mesh film is spaced between the first opening and the second opening;
  • the first carrier and/or the second carrier are configured to be fixed on the MEMS device.
  • the mesh membrane includes an isolation net and a fixing part, the fixing part is connected around the isolation net, the fixing part is fixedly connected to the first carrier and the second carrier, the isolation net Spaced between the first opening and the second opening.
  • the thickness of the mesh film ranges from 0.3 micrometers to 0.7 micrometers.
  • the thickness of the first carrier and/or the second carrier ranges from 25 microns to 55 microns.
  • the structural dimensions of the first carrier and the second carrier are the same.
  • the materials of the first carrier and the second carrier are the same.
  • the mesh film has a multilayer structure, the mesh film includes at least an upper mesh film and a lower mesh film, the first carrier is fixedly connected to the upper mesh film, and the second The carrier is fixedly connected with the lower mesh film.
  • the upper mesh film and the lower mesh film are bonded to form a fixed connection.
  • the materials of the first carrier and the second carrier are photolithographic materials, and the photolithographic materials used to form the first carrier and the second carrier are pre-formed on both sides of the mesh film, and are subjected to photolithography.
  • the etching process forms the first carrier and the second carrier.
  • a MEMS microphone packaging structure including:
  • a housing provided with a accommodating cavity, the housing is provided with a sound hole, and the sound hole communicates the inside and the outside of the housing;
  • a microphone device the microphone device is fixedly arranged in the housing;
  • At least the first carrier of the dust-proof structure is fixedly connected to the housing;
  • the mesh film closes the sound hole; and/or, the mesh film is spaced between the sound hole and the microphone device.
  • the invention discloses a dust-proof structure for MEMS devices, comprising a mesh membrane, a first carrier and a second carrier.
  • the first carrier has a through first opening
  • the second carrier has a through second. Opening; the first carrier and the second carrier are respectively arranged on both sides of the mesh film, the arrangement of the first carrier and the second carrier of the present invention play a very good support and Protective effects.
  • Fig. 1 is a schematic structural diagram of a dust-proof structure for MEMS devices according to the present invention
  • FIG. 2 is a schematic diagram of a grid membrane structure used in a dust-proof structure of a MEMS device according to the present invention
  • FIG. 3 is a schematic cross-sectional structure diagram of a dust-proof structure for MEMS devices according to the present invention.
  • FIG. 4 is a schematic diagram of the structure of a dust-proof structure for MEMS devices in the lithography stage according to the present invention.
  • FIG. 5 is a schematic diagram of the photolithography stage structure of a dust-proof structure for MEMS devices according to the present invention.
  • FIG. 6 is a schematic diagram of the structure of a lithography stage of a dustproof structure for a MEMS device according to the present invention.
  • FIG. 7 is a schematic structural diagram of another dustproof structure for MEMS devices according to the present invention.
  • FIG. 8 is a schematic structural diagram of a MEMS microphone packaging structure of the present invention.
  • FIG. 9 is a schematic structural diagram of another MEMS microphone packaging structure of the present invention.
  • 100-dust-proof structure 100-dust-proof structure; 1-grid film; 101-isolation net; 102-fixed part; 103-upper grid film; 104-lower grid film; 2-first carrier; 3-second carrier; 4-first opening; 5-second opening; 6-housing; 7-sound hole; 8-microphone device; 9-first supporting part; 10-second supporting part; 11-protective layer; 12-first adhesive Junction layer; 13-substrate.
  • the present invention discloses a dust-proof structure 100 for MEMS devices, including:
  • the mesh film 1, the first carrier 2 and the second carrier 3, the mesh film 1 is configured to transmit sound;
  • the first carrier 2 has a first opening 4 through which the second carrier 3 has A through second opening 5;
  • the first carrier 2 and the second carrier 3 are respectively arranged on both sides of the mesh film 1, and the mesh film 1 is spaced from the first opening 4 and the second opening 5 between;
  • the first carrier 2 and/or the second carrier 3 are configured to be fixed on the MEMS device.
  • the mesh film 1 has a plurality of through holes through which air can pass, which is convenient for the transmission of sound, and the first carrier 2 and the second carrier 3 are respectively arranged on both sides of the mesh film 1 and can be aligned with each other.
  • the mesh film 1 plays a very good role in supporting and protecting, and can avoid the direct contact damage of the mesh film 1, and the first opening 4 and the second opening 5 communicate with each other on the mesh film 1.
  • the holes are arranged relatively to provide a smooth passage for the air and facilitate the transmission of sound.
  • the mesh film 1 includes an isolation net 101 and a fixing portion 102, the fixing portion 102 is connected around the isolation net 101, and the fixing portion 102 is connected to the second A carrier 2 and a second carrier 3 are fixedly connected, and the isolation net 101 is spaced between the first opening 4 and the second opening 5.
  • the isolation mesh 101 of the mesh film 1 is provided with many through holes, the strength of the isolation mesh 101 is low, and the dense fixing portion 102 around the isolation mesh 101 can increase the mesh film 1.
  • the fixed part 102 is fixedly connected with the first carrier 2 and the second carrier 3 to ensure the structural stability of the dust-proof structure 100.
  • the thickness of the mesh film 1 ranges from 0.3 micrometers to 0.7 micrometers. Since the mesh film 1 is used on a MEMS device, there is a high requirement on its size, and the thickness of the mesh film 1 must be in a relatively low range to achieve a good dust-proof effect. However, if the mesh film 1 is too thin, the strength is too low and it is easy to cause damage, but if the mesh film 1 is too thick, the size and weight of the dust-proof structure 100 will be increased on the one hand, and on the other hand It is inconvenient for air to pass, and it is difficult to transmit sound.
  • the thickness of the first carrier 2 and/or the second carrier 3 ranges from 25 microns to 55 microns.
  • the first carrier 2 and the second carrier 3 In order to support and protect the mesh film 1, it is necessary for the first carrier 2 and the second carrier 3 to have a certain thickness, but the thickness should not be too high. If the first carrier 2 and the second carrier 2 If the thickness of the second carrier 3 is too large, the size and weight of the dust-proof structure 100 are increased, which is not suitable for application in MEMS devices.
  • the structural dimensions of the first carrier 2 and the second carrier 3 are the same.
  • the structural dimensions of the first carrier 2 and the second carrier 3 are the same on the one hand, which facilitates rapid manufacturing and assembly, and improves the efficiency of manufacturing and assembly. On the other hand, it improves the applicability of the dust-proof structure 100, which can be It can be used flexibly in all directions.
  • the materials of the first carrier 2 and the second carrier 3 are the same.
  • rapid manufacturing and assembly can also be facilitated, the efficiency of manufacturing and assembly is improved, and the applicability of the dust-proof structure 100 is improved.
  • the mesh film 1 has a multi-layer structure
  • the mesh film 1 includes at least an upper mesh film 103 and a lower mesh film 104, and the first carrier 2 and the upper mesh
  • the grid film 103 is fixedly connected
  • the second carrier 3 is fixedly connected to the lower layer grid film 104.
  • the multi-layer structure of the mesh film 1 can also be a combination of three, four or more layers, as long as the size quality and the dust-proof effect can be balanced.
  • the structural strength of the mesh film 1 is weaker, so the combination of the upper mesh film 103 and the lower mesh film 104 can be improved.
  • the structural strength and service life of the mesh film 1; on the other hand, the material and the size of the through holes of the upper mesh film 103 and the lower mesh film 104 may be the same or different.
  • the filtering effect of impurities such as dust of different types and sizes can be achieved, and the applicability of the dust-proof structure 100 is improved.
  • the upper mesh film 103 and the lower mesh film 104 are bonded to form a fixed connection.
  • the upper mesh film 103 and the lower mesh film 104 are bonded by the first adhesive layer 12.
  • the bonding may be by double-sided adhesive bonding or glue. Adhesive, the bonding connection method is flexible and convenient on the one hand, and on the other hand, the connection strength is high and the effect is good.
  • the materials of the first carrier 2 and the second carrier 3 are photolithographic materials, and the photolithographic materials used to form the first carrier 2 and the second carrier 3 are pre-formed on the mesh film 1 On both sides, the first carrier 2 and the second carrier 3 are formed through a photolithography process.
  • the photolithography process includes the following steps:
  • a mask is provided on the side of the first carrier 2 close to the lithography equipment, and a through hole is provided on the mask at a position opposite to the first opening 4;
  • the photolithography equipment performs photolithography on the first carrier 2 to obtain the first carrier 2 with the first opening 4;
  • a mask is provided on the side of the second carrier 3 close to the lithography equipment, and a through hole is provided on the mask at a position opposite to the second opening 5;
  • the second carrier 3 is lithographically etched by the photolithography equipment to obtain the second carrier 3 with the second opening 5;
  • the mask and the protective layer 11 are removed, and the dust-proof structure 100 is obtained.
  • the support portion may include a first support portion 9 and a second support portion 10.
  • the first support portion 9 may be an organic layer directly connected to the second carrier 3, and the second support portion 10 It may be a silicon wafer layer connected to the first supporting portion 9.
  • the MEMS device may be a MEMS microphone, a MEMS sensor, a MEMS chip, a MEMS switch, and the like.
  • the present invention also discloses a MEMS microphone packaging structure, including:
  • a housing 6 provided with a accommodating cavity, the housing 6 is provided with a sound hole 7, and the sound hole 7 communicates the inside and the outside of the housing 6;
  • a microphone device 8, the microphone device 8 is fixedly arranged in the housing 6;
  • At least the first carrier 2 of the dust-proof structure 100 is fixedly connected to the housing 6;
  • the mesh film 1 closes the sound hole 7; and/or, the mesh film 1 is spaced between the sound hole 7 and the microphone device 8.
  • the first carrier 2 of the dust-proof structure 100 may be fixedly connected to the housing 6.
  • the first carrier 2 and the second carrier 3 may be both It is fixedly connected to the housing 6; in addition, the dust-proof structure 100 may be arranged outside the housing 6 opposite to the sound hole 7, or inside the housing 6 opposite to the sound hole 7, or further directly
  • the microphone device 8 arranged in the housing 6 may be directly arranged around a plurality of the microphone devices 8, or it may be arranged only around an important microphone device 8 such as a chip. It is also possible to use the dust-proof structure 100 around the microphone device 8 and the dust-proof structure 100 at the sound hole 7 to play a dual protective role.
  • the housing 6 includes a substrate 13, the sound hole 7 is provided on the substrate 13, the dust-proof structure 100 encloses the sound hole 7, the microphone device 8 includes a MEMS chip, and the dust The structure 100 is spaced between the sound hole 7 and the MEMS chip.
  • the dust-proof structure 100 and the MEMS chip may be directly connected or not connected to form a spaced support structure as shown in FIG. 8.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)

Abstract

Une structure étanche à la poussière pour un dispositif MEMS et une structure d'encapsulation de microphone MEMS sont divulgués. La structure étanche à la poussière comprend un film de grille, un premier support et un second support, le premier support étant pourvu d'une première ouverture traversante, et le second support étant pourvu d'une seconde ouverture traversante ; le premier support et le second support étant disposés sur deux côtés du film de grille respectivement, et le film de grille étant espacé entre la première ouverture et la seconde ouverture ; et le premier support et/ou le second support sont conçus pour être fixés sur un dispositif MEMS. L'agencement du premier support et du second support de la présente invention permet un bon support et un bon rôle de protection pour le film de grille, et peut empêcher un endommagement par contact direct du film de grille ; et la première ouverture et la seconde ouverture sont disposées à l'opposé de trous traversants dans le film de grille, de telle sorte que des canaux lisses sont prévus pour l'air, et la transmission du son est facilitée.
PCT/CN2020/099280 2019-12-31 2020-06-30 Structure étanche à la poussière pour dispositif mems et structure d'encapsulation de microphone mems WO2021135119A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911415114.1A CN111031461A (zh) 2019-12-31 2019-12-31 一种用于mems器件的防尘结构及mems麦克风封装结构
CN201911415114.1 2019-12-31

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WO2021135119A1 true WO2021135119A1 (fr) 2021-07-08

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111031461A (zh) * 2019-12-31 2020-04-17 歌尔股份有限公司 一种用于mems器件的防尘结构及mems麦克风封装结构
CN111654796B (zh) * 2020-06-30 2021-12-28 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

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CN107105378A (zh) * 2017-06-05 2017-08-29 歌尔股份有限公司 Mems芯片、麦克风及制作方法与封装方法
US9813790B1 (en) * 2016-10-25 2017-11-07 AAC Technologies Pte. Ltd. Microphone package
CN208540162U (zh) * 2018-02-11 2019-02-22 瑞声科技(新加坡)有限公司 Mems麦克风
CN111031461A (zh) * 2019-12-31 2020-04-17 歌尔股份有限公司 一种用于mems器件的防尘结构及mems麦克风封装结构

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CN209134193U (zh) * 2018-10-17 2019-07-19 河源友华微机电科技有限公司 应用于vcm具有防尘功能的载体结构
CN209419845U (zh) * 2018-12-18 2019-09-20 歌尔科技有限公司 Mems芯片和mems麦克风
CN209105452U (zh) * 2019-01-15 2019-07-12 歌尔科技有限公司 Mems麦克风和电子设备
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CN104760924A (zh) * 2015-04-20 2015-07-08 歌尔声学股份有限公司 一种mems麦克风芯片及其封装结构、制造方法
US9813790B1 (en) * 2016-10-25 2017-11-07 AAC Technologies Pte. Ltd. Microphone package
CN107105378A (zh) * 2017-06-05 2017-08-29 歌尔股份有限公司 Mems芯片、麦克风及制作方法与封装方法
CN208540162U (zh) * 2018-02-11 2019-02-22 瑞声科技(新加坡)有限公司 Mems麦克风
CN111031461A (zh) * 2019-12-31 2020-04-17 歌尔股份有限公司 一种用于mems器件的防尘结构及mems麦克风封装结构

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