CN103179493A - MEMS (Micro-electromechanical Systems) microphone - Google Patents
MEMS (Micro-electromechanical Systems) microphone Download PDFInfo
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- CN103179493A CN103179493A CN2013101212559A CN201310121255A CN103179493A CN 103179493 A CN103179493 A CN 103179493A CN 2013101212559 A CN2013101212559 A CN 2013101212559A CN 201310121255 A CN201310121255 A CN 201310121255A CN 103179493 A CN103179493 A CN 103179493A
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- strutting piece
- wiring board
- mems
- mems microphone
- rising tone
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- 230000000630 rising effect Effects 0.000 claims description 36
- 239000003292 glue Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 16
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 230000002452 interceptive effect Effects 0.000 abstract 1
- 229920000297 Rayon Polymers 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
The invention discloses an MEMS (Micro-electromechanical Systems) microphone, and relates to the technical field of electroacoustic products. The MEMS microphone comprises an outer shell and a circuit board which is combined with the outer shell integrally; the circuit board is provided with a first sound aperture; one side of the circuit board, which is combined with the outer shell, is defined to be the inner side of the circuit board; the inner side of the circuit board, corresponding to the first sound aperture, is provided with an MEMS chip which is installed on the circuit board through a support element; the support element is provided with at least two second sound apertures; the aperture diameter sizes of the second sound apertures are less than the aperture diameter size of the first sound aperture; each second sound aperture is positioned in an orthographic projection of the first sound aperture; and the support element is also provided with a baffle plate for preventing air flows passing through the second sound apertures from interfering mutually. According to the invention, the technical problems that in the prior art, the MEMS chip of the MEMS microphone is easy to damage and the like are solved. The MEMS microphone provided by the invention has the advantages of long service life, high flexibility, good acoustic performance, high finished product percent of pass and the like.
Description
Technical field
The present invention relates to the electro-acoustic product technical field, particularly a kind of MEMS microphone.
Background technology
Along with the fast development of electronic technology, MEMS(microelectromechanical systems) microphone little with its volume, be convenient to the SMT(surface mounting technology) install, high temperature resistant, good stability, automaticity is high and the advantage such as suitable production in enormous quantities has obtained using more and more widely.The wiring board that MEMS microphone of the prior art generally includes shell and is combined as a whole with shell, wiring board are provided with the sound hole, in the inboard of wiring board, the position in hole at the sound are provided with the MEMS chip.The MEMS chip is that back pole plate is upper, diaphragm under structure, as shown in Figure 7, comprise substrate 31, substrate 31 is provided with diaphragm 32, and the edge of diaphragm 32 is provided with support ring 34, and support ring 34 is provided with back pole plate 33, back pole plate 33 is provided with pole plate hole 331, is provided with oscillation space between back pole plate 33 and diaphragm 32.
The weak point of the MEMS microphone of this structure is: due to the structure of MEMS chip be diaphragm under, back pole plate is upper, do not block between diaphragm and sound hole, easy damage diaphragm when the air-flow that enters when the sound hole is stronger, thereby damage the MEMS chip, cause the MEMS microphone to work, shortened the useful life of MEMS microphone.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of MEMS microphone, the entering air-flow and can directly not impact the MEMS chip of this MEMS microphone, thus the MEMS chip has been played protection, reduced the damage probability of MEMS chip, long service life; And this MEMS microphone also has advantages of highly sensitive.
for solving the problems of the technologies described above, technical scheme of the present invention is: a kind of MEMS microphone, comprise shell and the wiring board that is combined as a whole with described shell, described wiring board is provided with the first sound hole, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the position in the inboard corresponding described first sound hole of described wiring board is provided with the MEMS chip, described MEMS chip is installed on described wiring board by strutting piece, described strutting piece is provided with at least two rising tone holes, described rising tone hole aperture size is less than described first sound hole aperture size, each described rising tone hole all is positioned at the orthographic projection in described first sound hole, also be provided with on described strutting piece be used to the division board that prevents the air-flow phase mutual interference that each described rising tone hole is passed through, described division board and described MEMS chip are positioned at the same side of described strutting piece.
Wherein, described MEMS chip is by a substrate and be arranged on suprabasil capacitor and consist of, described capacitor comprise a rigid back pole plate, a flexible sheet and be arranged on back pole plate and diaphragm between support ring, described diaphragm end face is connected with described substrate, described back pole plate end is away from described substrate, and described MEMS chip is arranged on described strutting piece by described substrate.
Wherein, described division board is positioned at the centre position of described strutting piece, and each described rising tone pore size distribution is in the both sides of described division board.
Wherein, described strutting piece is slab construction, is pasted on described wiring board.
Wherein, the aperture in described first sound hole is 0.25 ± 0.05mm; The aperture in each described rising tone hole is 0.01～0.1mm.
As a kind of execution mode, on described wiring board, the position of corresponding described strutting piece is provided with groove, and described strutting piece is pasted in described groove.
As another execution mode, combine with the described wiring board wiring board of position of described strutting piece is provided be used to the excessive glue groove of depositing glue, the edge of the corresponding described strutting piece of described excessive glue groove.
After having adopted technique scheme, the invention has the beneficial effects as follows: because the wiring board of MEMS microphone of the present invention is provided with the first sound hole, the MEMS chip is installed on wiring board by strutting piece, strutting piece is provided with at least two rising tone holes, and each rising tone hole all is positioned at the orthographic projection in first sound hole.The air-flow that external sound produces enters the MEMS microphone by the first sound hole, is subject to stopping of strutting piece after entering the first sound hole, and the rising tone hole on supported shunts, and acts on after shunting on the diaphragm of MEMS chip, completes the conversion of acoustic-electric.The setting of strutting piece has avoided stronger air-flow that the first sound hole enters directly to impact the diaphragm of MEMS chip, and the MEMS chip has been played protective effect, effectively reduces the impaired probability of MEMS chip, thereby has extended the useful life of MEMS microphone.Because strutting piece is provided with at least two rising tone holes, the air-flow that each rising tone hole is passed through can interfere with each other before the diaphragm that is applied to the MEMS chip, the phase mutual interference meeting of air-flow impacts the acoustical behavior of MEMS microphone, therefore set up division board between two rising tone holes of strutting piece, division board has effectively stoped the phase mutual interference between air-flow, guaranteed in MEMS chip chamber the air-flow equilibrium of boosting, improve greatly the sensitivity of MEMS microphone, improved the acoustical behavior of MEMS microphone.
Due to paste at strutting piece and wiring board in conjunction with the time, unnecessary viscose glue is easy to obstruction sound hole, makes the MEMS microphone normally to use, postorder also needs to remove glue, and to process the guarantee finished product qualified; Be provided with the glue groove that overflows on the wiring board of position therefore combine with wiring board at strutting piece, unnecessary viscose glue can flow in the glue groove that overflows, effectively solved the easily problem in obstruction sound hole of viscose glue, thereby saved the operation of processing except glue, not only simplify the assembling procedure of MEMS microphone, also improved the product qualified rate of MEMS microphone.
In sum, MEMS microphone of the present invention has solved the technical problems such as in prior art, MEMS microphone MEMS chip easily damages, and useful life is short.MEMS microphone of the present invention has long service life, highly sensitive, and acoustical behavior is good, the product qualified rate advantages of higher.
Description of drawings
Fig. 1 is the cross-sectional view of MEMS microphone embodiment one of the present invention;
Fig. 2 is the structural representation of the strutting piece of MEMS microphone of the present invention;
Fig. 3 is the cross-sectional view of MEMS microphone embodiment two of the present invention;
Fig. 4 is the cross-sectional view of MEMS microphone embodiment three of the present invention;
Fig. 5 is the section solution structure schematic diagram of MEMS microphone embodiment four of the present invention;
Fig. 6 is the structural representation of the wiring board of MEMS microphone embodiment four of the present invention;
Fig. 7 is the structural representation of the MEMS chip of MEMS microphone of the present invention;
In figure: 1, wiring board, 11, the first sound hole, 2, shell, 3, the MEMS chip, 31, substrate, 32, diaphragm, 33, back pole plate, 331, the pole plate hole, 34, support ring, 4, strutting piece, 41, rising tone hole, 5, division board, 6, the glue groove overflows.
Embodiment
Below in conjunction with drawings and Examples, further set forth the present invention.
Embodiment one:
As shown in Fig. 1 and Fig. 2 are common, a kind of MEMS microphone, comprise the shell 2 that is made by metal material or wiring board material, shell 2 is the tubular structure of end opening one an end sealing, the openend of shell 2 is combined with wiring board 1, the side that wiring board 1 combines with shell 2 is the inboard of wiring board 1, and the center of wiring board 1 is provided with first sound hole 11, and the aperture in first sound hole 11 is 0.25 ± 0.05mm.The inboard of the wiring board 1 in corresponding first sound hole 11 is bonded with strutting piece 4, strutting piece 4 is slab construction, strutting piece 4 is provided with two rising tone holes 41, the aperture in rising tone hole 41 is 0.01～0.1mm, in the present embodiment, the aperture in rising tone hole 41 is preferably 0.03～0.05mm, two rising tone holes 41 all are positioned at the orthographic projection in first sound hole 11, and MEMS chip 3 is installed on strutting piece 4.In Fig. 2, dotted line is the hookup wire of MEMS chip 3.Air-flow enters the MEMS microphone by first sound hole 11, is subject to stopping of strutting piece 4 after entering first sound hole 11, and two rising tone holes 41 on supported 4 shunt, and acts on after shunting on the diaphragm of MEMS chip 3, completes the conversion of acoustic-electric.Because strutting piece 4 is slab construction; in the situation that it is very little to increase MEMS microphone thickness; that has avoided that first sound hole 11 enters directly impacts the diaphragm of MEMS chip 3 than air blast; MEMS chip 3 has been played protective effect; effectively reduce the impaired probability of MEMS chip 3; thereby extended the useful life of MEMS microphone, promoted the overall quality of MEMS microphone.
As shown in Figure 7, MEMS chip 3 is made of a substrate 31 and the capacitor that is arranged in substrate 31, capacitor comprise a rigid back pole plate 33, a flexible sheet 32 and be arranged on back pole plate 33 and diaphragm 32 between support ring 34, diaphragm 32 end faces are connected with substrate 31, back pole plate 33 ends are away from substrate 31, back pole plate 33 is provided with pole plate hole 331, is provided with oscillation space between back pole plate 33 and diaphragm 32.MEMS chip 3 is arranged on strutting piece 4 by substrate 31.
As shown in Fig. 1 and 2 was common, the middle part on strutting piece 4 was provided with the both sides that 5, two of division boards rising tone hole 41 is distributed in division board 5, and division board 5 and MEMS chip 3 are positioned at the same side of strutting piece 4, and division board 5 is positioned at the operatic tunes that advances of MEMS chip 3.Because strutting piece 4 is provided with two rising tone holes 41, the air-flow that two rising tone holes 41 are passed through advances in the operatic tunes and can interfere with each other at MEMS chip 3, the phase mutual interference meeting of air-flow impacts the acoustical behavior of MEMS microphone, therefore set up division board 5 between two rising tone holes 41 on strutting piece 4, division board 5 has effectively stoped the phase mutual interference between air-flow, guaranteed that MEMS chip 3 advances in the operatic tunes air-flow equilibrium of boosting, improve greatly the sensitivity of MEMS microphone, improved the acoustical behavior of MEMS microphone.
Operation principle of the present invention is as follows: the air-flow that sound produces 11 enters from the first sound hole, stop after buffering from rising tone hole that by strutting piece 4 41 pass through, be applied on the diaphragm 32 of MEMS chip 3, the air-flow that 5 pairs two of division boards rising tone hole 41 is passed through is isolated, can make the air-flow that acts on diaphragm 32 different parts balanced, MEMS chip 3 changes into the corresponding signal of telecommunication according to frequency and the amplitude of diaphragm 32 vibrations with different voice signals, thereby completes the conversion of acoustic-electric.
Embodiment two:
As shown in Figure 3, present embodiment and embodiment one are basic identical, and its difference is:
Be positioned at the position that strutting piece 4 and wiring board 1 paste mutually on wiring board 1 and be provided with the glue groove 6 that overflows.Strutting piece 4 and wiring board paste in conjunction with the time, unnecessary viscose glue is easy to obstruction sound hole, the glue groove 6 that overflows can be collected unnecessary viscose glue, has effectively solved easily blocked problem of sound hole, has improved the product qualified rate of MEMS microphone.
Embodiment three:
As shown in Figure 4, present embodiment and embodiment one are basic identical, and its difference is:
On wiring board 1, the position of corresponding strutting piece 4 is provided with groove, and strutting piece 4 is pasted in groove, and the part of strutting piece 4 is protruded the plane of wiring board 1.
Present embodiment is compared with embodiment one, has utilized fully the thickness of wiring board 1 to reduce strutting piece 4 taking up room on the z direction of principal axis, can make becoming of MEMS microphone thinner, is applicable to slim product.
Embodiment four:
As shown in Fig. 5 and Fig. 6 were common, present embodiment and embodiment three were basic identical, and its difference is:
Be provided with for the bottom portion of groove of laying strutting piece 4 the glue groove 6 that overflows on wiring board 1.The glue groove 6 that overflows can collect unnecessary viscose glue, effectively solved easily blocked problem of sound hole, improved the product qualified rate of MEMS microphone.
The present invention is not limited to above-mentioned concrete execution mode, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion of having done are within all dropping on protection scope of the present invention.
Claims (9)
1.MEMS microphone, comprise shell and the wiring board that is combined as a whole with described shell, described wiring board is provided with the first sound hole, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the position in the inboard corresponding described first sound hole of described wiring board is provided with the MEMS chip, it is characterized in that: described MEMS chip is installed on described wiring board by strutting piece, described strutting piece is provided with at least two rising tone holes, described rising tone hole aperture size is less than described first sound hole aperture size, each described rising tone hole all is positioned at the orthographic projection in described first sound hole, also be provided with on described strutting piece be used to the division board that prevents the air-flow phase mutual interference that each described rising tone hole is passed through, described division board and described MEMS chip are positioned at the same side of described strutting piece.
2. MEMS microphone according to claim 1, it is characterized in that: described MEMS chip is by a substrate and be arranged on suprabasil capacitor and consist of, described capacitor comprise a rigid back pole plate, a flexible sheet and be arranged on back pole plate and diaphragm between support ring, described diaphragm end face is connected with described substrate, described back pole plate end is away from described substrate, and described MEMS chip is arranged on described strutting piece by described substrate.
3. MEMS microphone according to claim 2, it is characterized in that: described division board is positioned at the centre position of described strutting piece, and each described rising tone pore size distribution is in the both sides of described division board.
4. MEMS microphone according to claim 3, it is characterized in that: described strutting piece is slab construction, is pasted on described wiring board.
5. MEMS microphone according to claim 4, it is characterized in that: on described wiring board, the position of corresponding described strutting piece is provided with groove, and described strutting piece is pasted in described groove.
6. according to claim 4 or 5 described MEMS microphones, it is characterized in that: described strutting piece is provided be used to the excessive glue groove of depositing glue with the wiring board of described wiring board phase paste position.The edge of the corresponding described strutting piece of described excessive glue groove.
7. MEMS microphone according to claim 1 is characterized in that: the aperture in described first sound hole is 0.25 ± 0.05mm; The aperture in each described rising tone hole is 0.01～0.1mm.
8. MEMS microphone according to claim 7 is characterized in that: the aperture in each described rising tone hole is 0.03～0.05mm.
9. MEMS microphone according to claim 1, it is characterized in that: described shell is metal shell or wiring board shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310121255.9A CN103179493B (en) | 2013-04-09 | 2013-04-09 | Mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310121255.9A CN103179493B (en) | 2013-04-09 | 2013-04-09 | Mems microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103179493A true CN103179493A (en) | 2013-06-26 |
| CN103179493B CN103179493B (en) | 2016-02-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310121255.9A Active CN103179493B (en) | 2013-04-09 | 2013-04-09 | Mems microphone |
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| Country | Link |
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| CN (1) | CN103179493B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104555887A (en) * | 2013-10-16 | 2015-04-29 | 意法半导体股份有限公司 | Microelectromechanical device with protection for bonding and process for manufacturing a microelectromechanical device |
| WO2020186884A1 (en) * | 2019-03-15 | 2020-09-24 | 潍坊歌尔微电子有限公司 | Microphone and electronic device |
| CN111885469A (en) * | 2020-07-09 | 2020-11-03 | 诺思(天津)微系统有限责任公司 | MEMS speaker and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100246877A1 (en) * | 2009-01-20 | 2010-09-30 | Fortemedia, Inc. | Miniature MEMS Condenser Microphone Package and Fabrication Method Thereof |
| CN202085303U (en) * | 2011-05-27 | 2011-12-21 | 歌尔声学股份有限公司 | Silicon microphone |
| CN202310030U (en) * | 2011-10-18 | 2012-07-04 | 东莞泉声电子有限公司 | Dust-proof silicon sound transmitting device |
| CN203193892U (en) * | 2013-04-09 | 2013-09-11 | 歌尔声学股份有限公司 | MEMS (micro-electromechanical systems) microphone |
-
2013
- 2013-04-09 CN CN201310121255.9A patent/CN103179493B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100246877A1 (en) * | 2009-01-20 | 2010-09-30 | Fortemedia, Inc. | Miniature MEMS Condenser Microphone Package and Fabrication Method Thereof |
| CN202085303U (en) * | 2011-05-27 | 2011-12-21 | 歌尔声学股份有限公司 | Silicon microphone |
| CN202310030U (en) * | 2011-10-18 | 2012-07-04 | 东莞泉声电子有限公司 | Dust-proof silicon sound transmitting device |
| CN203193892U (en) * | 2013-04-09 | 2013-09-11 | 歌尔声学股份有限公司 | MEMS (micro-electromechanical systems) microphone |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104555887A (en) * | 2013-10-16 | 2015-04-29 | 意法半导体股份有限公司 | Microelectromechanical device with protection for bonding and process for manufacturing a microelectromechanical device |
| CN104555887B (en) * | 2013-10-16 | 2017-04-12 | 意法半导体股份有限公司 | Microelectromechanical device with protection for bonding and process for manufacturing a microelectromechanical device |
| WO2020186884A1 (en) * | 2019-03-15 | 2020-09-24 | 潍坊歌尔微电子有限公司 | Microphone and electronic device |
| CN111885469A (en) * | 2020-07-09 | 2020-11-03 | 诺思(天津)微系统有限责任公司 | MEMS speaker and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN103179493B (en) | 2016-02-03 |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |