CN203193891U - MEMS (micro-electromechanical systems) microphone - Google Patents
MEMS (micro-electromechanical systems) microphone Download PDFInfo
- Publication number
- CN203193891U CN203193891U CN 201320175154 CN201320175154U CN203193891U CN 203193891 U CN203193891 U CN 203193891U CN 201320175154 CN201320175154 CN 201320175154 CN 201320175154 U CN201320175154 U CN 201320175154U CN 203193891 U CN203193891 U CN 203193891U
- Authority
- CN
- China
- Prior art keywords
- mems
- wiring board
- hole
- strutting piece
- mems microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000000630 rising effect Effects 0.000 claims description 39
- 239000003292 glue Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 17
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 238000002955 isolation Methods 0.000 abstract 2
- 229920000297 Rayon Polymers 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Images
Abstract
The utility model belongs to the technical field of electroacoustic products, and in particular to an MEMS (micro-electromechanical systems) microphone. The MEMS microphone comprises a housing, and a circuit board integrally combined with the housing, wherein a first sound hole is formed in the circuit board; one side combined with the housing, of the circuit board, is defined to be the inner side of the circuit board; an MEMS chip is arranged at a position corresponding to the first sound hole, of the inner side of the circuit board in a covering manner; a support element is arranged on the circuit board located in the sound inlet cavity of the MEMS chip; at least two second sound holes are formed in the support element, and the aperture size of each second sound hole is less than the aperture size of the first sound hole; isolation plates used for preventing the mutual interference of airflows passing through the second sound holes are arranged on the support element, and the isolation plates are located in the sound inlet cavity of the MEMS chip. According to the MEMS microphone disclosed by the utility model, the technical problems that the MEMS chip is easy to damage, the service life is short, and the like, of an MEMS microphone in the prior art are overcome. The MEMS microphone disclosed by the utility model has the advantages of being long in service life, high in sensitivity, good in acoustic performance, and the like.
Description
Technical field
The utility model relates to the electro-acoustic product technical field, particularly a kind of MEMS microphone.
Background technology
Along with the fast development of electronic technology, MEMS(microelectromechanical systems) microphone little with its volume, be convenient to the SMT(surface mounting technology) install, high temperature resistant, good stability, automaticity is high and be fit to advantage such as production in enormous quantities has obtained application more and more widely.The wiring board that MEMS microphone of the prior art generally includes shell and is combined as a whole with shell, wiring board is provided with hole, in the inboard of wiring board the position in hole at the sound is provided with the MEMS chip.The MEMS chip is that back pole plate is last, diaphragm under structure, as shown in Figure 5, comprise substrate 31, substrate 31 is provided with diaphragm 32, and the edge of diaphragm 32 is provided with support ring 34, support ring 34 is provided with back pole plate 33, back pole plate 33 is provided with pole plate hole 331, is provided with oscillation space between back pole plate 33 and the diaphragm 32, has surrounded the operatic tunes that advances of MEMS chip between substrate 31 and the diaphragm 32.
The weak point of the MEMS microphone of this structure is: because the structure of MEMS chip is that diaphragm is following, back pole plate is last, do not block between diaphragm and the sound hole, damage diaphragm easily when the air-flow that enters when the sound hole is strong, thereby damage the MEMS chip, cause the MEMS microphone can't operate as normal, shortened the useful life of MEMS microphone.
The utility model content
Technical problem to be solved in the utility model provides a kind of MEMS microphone, this MEMS microphone reasonable use the MEMS chip enter the space of the operatic tunes, under the situation that does not increase original volume, effectively weakened the impact of air blast to the MEMS chip, thereby the MEMS chip has been played protection, reduce the damage probability of MEMS chip, prolonged the useful life of MEMS microphone; And improved the sensitivity of MEMS microphone.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of MEMS microphone, comprise shell and the wiring board that is combined as a whole with described shell, described wiring board is provided with the hole first, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the position in inboard corresponding described first hole of described wiring board is covered with the MEMS chip, be positioned at the described wiring board that described MEMS chip advances the operatic tunes and be provided with strutting piece, described strutting piece is provided with at least two rising tone holes, and described rising tone hole aperture size is less than described first hole aperture size; Described strutting piece is provided be used to the division board that prevents the air-flow phase mutual interference that each described rising tone hole is passed through, and described division board is positioned at described MEMS chip and advances the operatic tunes.
Wherein, described MEMS chip is by a substrate and be arranged on suprabasil capacitor and constitute, described capacitor comprise a rigid back pole plate, a flexible sheet and be arranged on back pole plate and diaphragm between support ring, described diaphragm end face links to each other with described substrate, described back pole plate end is away from described substrate, and described MEMS chip is installed on the described wiring board by described substrate.
Wherein, described division board is positioned at the centre position of described strutting piece, and each described rising tone pore size distribution is in the both sides of described division board.
Wherein, the aperture in described first hole is 0.25 ± 0.05mm; The aperture in each described rising tone hole is 0.01～0.1mm.
As a kind of execution mode, described strutting piece is the lid-like of an end opening, and the openend of described lid-like combines with described wiring board, is formed with the air-flow cushion chamber between described strutting piece and the described wiring board.
Wherein, each described rising tone hole all with the setting of staggering of described first hole.
As another execution mode, described strutting piece is slab construction, and each described rising tone hole all is positioned at the orthographic projection in described first hole.
As another execution mode, combine with the described wiring board wiring board of position of described strutting piece is provided be used to the excessive glue groove of depositing glue, and described excessive glue groove is arranged at the outward flange side of described strutting piece.
After having adopted technique scheme, the beneficial effects of the utility model are: because the wiring board of MEMS microphone described in the utility model is provided with the hole first, be positioned at the wiring board that the MEMS chip advances the operatic tunes and be provided with strutting piece, strutting piece is provided with at least two rising tone holes.The air-flow that external sound produces enters the MEMS microphone by first hole, is subjected to stopping of strutting piece after entering first hole, and the rising tone hole on supported shunts, and acts on after the shunting on the diaphragm of MEMS chip, finishes the conversion of acoustic-electric.As seen the utility model reasonable use the MEMS chip enter the space of the operatic tunes; under the situation that does not increase original volume, effectively weakened the impact of air blast to the MEMS chip; thereby avoided air blast directly to impact the diaphragm of MEMS chip; the MEMS chip has been played protective effect; effectively reduce the impaired probability of MEMS chip, thereby prolonged the useful life of MEMS microphone.Because strutting piece is provided with at least two rising tone holes, the air-flow that each rising tone hole is passed through can interfere with each other before the diaphragm that is applied to the MEMS chip, the phase mutual interference meeting of air-flow impacts the acoustical behavior of MEMS microphone, so between two rising tone holes of strutting piece, set up division board, division board has effectively stoped the phase mutual interference between the air-flow, guaranteed that the MEMS chip advances sound pressure equalization in the operatic tunes, improve the sensitivity of MEMS microphone greatly, improved the acoustical behavior of MEMS microphone.
Since strutting piece and wiring board paste in conjunction with the time, unnecessary viscose glue is easy to obstruction sound hole, makes the MEMS microphone normally to use, postorder also needs to remove the glue processing could guarantee that finished product is qualified; So be provided with the glue groove that overflows at combine with the wiring board wiring board of position of strutting piece, unnecessary viscose glue can flow in the glue groove that overflows, effectively solved the viscose glue problem in obstruction sound hole easily, thereby saved the operation of handling except glue, not only simplify the assembling procedure of MEMS microphone, also improved the product qualified rate of MEMS microphone.
In sum, the utility model MEMS microphone has solved technical problems such as MEMS microphone MEMS chip damages easily in the prior art, and useful life is short.The utility model MEMS microphone has long service life, highly sensitive, and acoustical behavior is good, the product qualified rate advantages of higher.
Description of drawings
Fig. 1 is the cross-sectional view of the utility model MEMS microphone embodiment one;
Fig. 2 is the cross-sectional view of the utility model MEMS microphone embodiment two;
Fig. 3 is the cross-sectional view of the utility model MEMS microphone embodiment three;
Fig. 4 is the cross-sectional view of the utility model MEMS microphone embodiment four;
Fig. 5 is the structural representation of the MEMS chip of the utility model MEMS microphone;
Among the figure: 1, wiring board, 11, first holes, 2, shell, 3, the MEMS chip, 31, substrate, 32, diaphragm, 33, back pole plate, 331, the pole plate hole, 34, support ring, 4a, strutting piece, 4b, strutting piece, 41, rising tone hole, 5, the air-flow cushion chamber, 6, division board, 7, the glue groove overflows.
Embodiment
Below in conjunction with drawings and Examples, further set forth the utility model.
Embodiment one:
As shown in Figure 1, a kind of MEMS microphone, comprise the shell 2 that is made by metal material or wiring board material, shell 2 is the tubular structure of an end opening one end sealing, the openend of shell 2 is combined with wiring board 1, the side that wiring board 1 combines with shell 2 is the inboard of wiring board 1, and the aperture that the center of wiring board 1 is provided with 11, the first holes 11, first hole is 0.25 ± 0.05mm.Be positioned at the inboard that MEMS chip 3 advances the wiring board 1 of the operatic tunes and be bonded with strutting piece 4a; be formed with air-flow cushion chamber 5 between strutting piece 4a and the wiring board 1; what air-flow cushion chamber 5 had avoided that first hole 11 enter directly impacts the diaphragm of MEMS chip 3 than air blast; MEMS chip 3 has been played protective effect; effectively reduce MEMS chip 3 impaired probability, thereby prolonged the useful life of MEMS microphone.And as the case may be, can regulate the high frequency curve of MEMS microphone by the size that changes air-flow cushion chamber 5, improve the high frequency performance of MEMS microphone.Strutting piece 4a is the lid-like of an end opening one end sealing, the blind end of strutting piece 4a is provided with two rising tone holes 41, the aperture in rising tone hole 41 is 0.01～0.1mm, the aperture in rising tone hole 41 is preferably 0.03～0.05mm in the present embodiment, and the openend of strutting piece 4a and wiring board 1 are pasted combination.Air-flow enters the MEMS microphone by first hole 11, at first passes through the buffering of air-flow cushion chamber 5, by acting on the diaphragm of MEMS chip 3 after 41 shuntings of two rising tone holes, finishes the conversion of acoustic-electric then.
As shown in Figure 5, MEMS chip 3 is made of a substrate 31 and the capacitor that is arranged in the substrate 31, capacitor comprise a rigid back pole plate 33, a flexible sheet 32 and be arranged on back pole plate 33 and diaphragm 32 between support ring 34, diaphragm 32 end faces link to each other with substrate 31, back pole plate 33 ends are away from substrate 31, back pole plate 33 is provided with pole plate hole 331, is provided with oscillation space between back pole plate 33 and the diaphragm 32.MEMS chip 3 is installed on the wiring board 1 by substrate 31.
As shown in Figure 1, the middle part on the strutting piece 4a is provided with the both sides that 6, two rising tone holes 41 of division board are distributed in division board 6, and division board 6 is positioned at the operatic tunes that advances of MEMS chip 3.In order to make the cushioning effect maximization of air-flow cushion chamber 5, be preferably two rising tone holes 41 all with the setting of staggering of first hole 11, namely two rising tone holes 41 all should be avoided being arranged in the orthographic projection in first hole 11.Because strutting piece 4a is provided with two rising tone holes 41, the air-flow that two rising tone holes 41 are passed through advances in the operatic tunes and can interfere with each other at MEMS chip 3, the phase mutual interference meeting of air-flow impacts the acoustical behavior of MEMS microphone, so between two rising tone holes 41 on the strutting piece 4a, set up division board 6, division board 6 has effectively stoped the phase mutual interference between the air-flow, guaranteed that MEMS chip 3 advances sound pressure equalization in the operatic tunes, improve the sensitivity of MEMS microphone greatly, improved the acoustical behavior of MEMS microphone.
Operation principle of the present utility model is as follows: the air-flow that sound produces enters from first hole 11, by passing through from rising tone hole 41 after the buffering of air-flow cushion chamber 5, be applied on the diaphragm 32 of MEMS chip 3, the air-flow that 6 pairs of two rising tone holes 41 of division board are passed through is isolated, can make the air-flow equilibrium that acts on diaphragm 32 different parts, MEMS chip 3 changes into the corresponding signal of telecommunication with amplitude with different voice signals according to the frequency of diaphragm 32 vibrations, thereby finishes the conversion of acoustic-electric.
Embodiment two:
As shown in Figure 2, present embodiment and embodiment one are basic identical, and its difference is:
Be positioned at the position that strutting piece 4a combines with wiring board 1 on the wiring board 1 and be provided with the glue groove 7 that overflows, the glue groove 7 that overflows is positioned at the outward flange side of strutting piece 4a.Strutting piece 4a and wiring board paste in conjunction with the time, unnecessary viscose glue is easy to obstruction sound hole, the glue groove 7 that overflows can be collected unnecessary viscose glue, has effectively solved easily blocked problem of sound hole, has improved the product qualified rate of MEMS microphone.
Embodiment three:
As shown in Figure 3, present embodiment and embodiment one are basic identical, and its difference is:
Strutting piece 4b is slab construction, pastes combination with wiring board 1.Strutting piece 4b is provided with the orthographic projection that 41, two rising tone holes 41, two rising tone holes all are positioned at first hole 11.The air-flow that external sound produces enters the MEMS microphone by first hole 11, after entering first hole 11, be subjected to stopping of strutting piece 4b, and shunt in the rising tone hole 41 of supported 4b, acts on after the shunting on the diaphragm of MEMS chip 3, finishes the conversion of acoustic-electric.Equally air blast is played the effect that stops and weaken, effectively protected the MEMS chip.
Present embodiment is compared with embodiment one, and its assembling is more simple and easy to do.
Embodiment four:
As shown in Figure 4, present embodiment and embodiment three are basic identical, and its difference is:
Be positioned at the position that strutting piece 4b combines with wiring board 1 on the wiring board 1 and be provided with the glue groove 7 that overflows, the glue groove 7 that overflows is positioned at the outward flange side of strutting piece 4b.The glue groove 7 that overflows can be collected unnecessary viscose glue, has effectively solved easily blocked problem of sound hole, has improved the product qualified rate of MEMS microphone.
The utility model is not limited to above-mentioned concrete execution mode, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion of having done all drop within the protection range of the present utility model.
Claims (10)
1.MEMS microphone, comprise shell and the wiring board that is combined as a whole with described shell, described wiring board is provided with the hole first, defining the side that described wiring board combines with described shell is the inboard of described wiring board, the position in inboard corresponding described first hole of described wiring board is covered with the MEMS chip, it is characterized in that: be positioned at the described wiring board that described MEMS chip advances the operatic tunes and be provided with strutting piece, described strutting piece is provided with at least two rising tone holes, and described rising tone hole aperture size is less than described first hole aperture size; Described strutting piece is provided be used to the division board that prevents the air-flow phase mutual interference that each described rising tone hole is passed through, and described division board is positioned at described MEMS chip and advances the operatic tunes.
2. MEMS microphone according to claim 1, it is characterized in that: described MEMS chip is by a substrate and be arranged on suprabasil capacitor and constitute, described capacitor comprise a rigid back pole plate, a flexible sheet and be arranged on back pole plate and diaphragm between support ring, described diaphragm end face links to each other with described substrate, described back pole plate end is away from described substrate, and described MEMS chip is installed on the described wiring board by described substrate.
3. MEMS microphone according to claim 2, it is characterized in that: described division board is positioned at the centre position of described strutting piece, and each described rising tone pore size distribution is in the both sides of described division board.
4. MEMS microphone according to claim 3, it is characterized in that: described strutting piece is the lid-like of an end opening, the openend of described lid-like combines with described wiring board, is formed with the air-flow cushion chamber between described strutting piece and the described wiring board.
5. MEMS microphone according to claim 4 is characterized in that: each described rising tone hole all with the setting of staggering of described first hole.
6. MEMS microphone according to claim 3, it is characterized in that: described strutting piece is slab construction, each described rising tone hole all is positioned at the orthographic projection in described first hole.
7. according to claim 5 or 6 described MEMS microphones, it is characterized in that: combine with the described wiring board wiring board of position of described strutting piece is provided be used to the excessive glue groove of depositing glue, and described excessive glue groove is arranged at the outward flange side of described strutting piece.
8. MEMS microphone according to claim 1, it is characterized in that: the aperture in described first hole is 0.25 ± 0.05mm; The aperture in each described rising tone hole is 0.01～0.1mm.
9. MEMS microphone as claimed in claim 8, it is characterized in that: the aperture size in described rising tone hole is between 0.03-0.05mm.
10. MEMS microphone according to claim 1, it is characterized in that: described shell is metal shell or wiring board shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320175154 CN203193891U (en) | 2013-04-09 | 2013-04-09 | MEMS (micro-electromechanical systems) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320175154 CN203193891U (en) | 2013-04-09 | 2013-04-09 | MEMS (micro-electromechanical systems) microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203193891U true CN203193891U (en) | 2013-09-11 |
Family
ID=49110713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320175154 Expired - Lifetime CN203193891U (en) | 2013-04-09 | 2013-04-09 | MEMS (micro-electromechanical systems) microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203193891U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103152683A (en) * | 2013-04-09 | 2013-06-12 | 歌尔声学股份有限公司 | MEMS (Micro-Electromechanical System) microphone |
-
2013
- 2013-04-09 CN CN 201320175154 patent/CN203193891U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103152683A (en) * | 2013-04-09 | 2013-06-12 | 歌尔声学股份有限公司 | MEMS (Micro-Electromechanical System) microphone |
| CN103152683B (en) * | 2013-04-09 | 2015-10-28 | 歌尔声学股份有限公司 | Mems microphone |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2017041514A1 (en) | Loudspeaker module and terminal device | |
| CN204598310U (en) | Loud speaker module | |
| WO2007081584A3 (en) | Electrostatic loudspeaker systems and methods | |
| CN104768112A (en) | Novel microphone structure | |
| CN203193893U (en) | MEMS (micro-electromechanical systems) microphone | |
| CN104902401A (en) | Sounder module | |
| CN103209373A (en) | Speaker module and production method thereof | |
| CN103179493B (en) | Mems microphone | |
| CN203225876U (en) | Loudspeaker module | |
| CN203193891U (en) | MEMS (micro-electromechanical systems) microphone | |
| CN105657616B (en) | A kind of loudspeaker mould group | |
| CN203193892U (en) | MEMS (micro-electromechanical systems) microphone | |
| CN103152683B (en) | Mems microphone | |
| CN102547535A (en) | Piezoelectricity ceramic piece and piezoelectricity ceramic loudspeaker adopting same | |
| CN102131140A (en) | Micro-electro-mechanical systems (MEMS) microphone | |
| CN203193890U (en) | MEMS (micro-electromechanical systems) microphone | |
| CN203193894U (en) | MEMS (micro-electromechanical systems) microphone | |
| CN204442674U (en) | A kind of loud speaker module | |
| CN201611949U (en) | Acoustic sensor with noise reducing function | |
| CN103200509A (en) | Mems microphone | |
| EP3484175A1 (en) | Piezoelectric low-frequency/high db electroacoustic assembly and piezoelectric speaker applying same | |
| CN204498348U (en) | A kind of sound equipment | |
| CN204836457U (en) | Outdoor portable speaker | |
| CN203225866U (en) | Loudspeaker module | |
| CN102036153B (en) | Double-film type piezoelectric ceramic loudspeaker |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130911 |
|
| CX01 | Expiry of patent term |