CN218734957U

CN218734957U - Microphone and electronic equipment

Info

Publication number: CN218734957U
Application number: CN202223449228.8U
Authority: CN
Inventors: 刘杰; 滕志爱
Original assignee: Gettop Acoustic Co Ltd
Current assignee: Gettop Acoustic Co Ltd
Priority date: 2022-12-23
Filing date: 2022-12-23
Publication date: 2023-03-24
Anticipated expiration: 2032-12-23

Abstract

The utility model discloses a microphone and electronic equipment, microphone include shell, back of the body polar plate, vibration subassembly, utmost point chamber and damping piece, and back of the body polar plate and vibration subassembly all are located the shell and the interval sets up relatively, and utmost point chamber and damping piece all are located the shell, and utmost point chamber runs through and is equipped with utmost point chamber sound hole, and the damping piece covers utmost point chamber sound hole, and is equipped with a plurality of through-holes that form through the MEMS technology on the damping piece, a plurality of through-holes and utmost point chamber sound hole intercommunication. The through holes processed by the MEMS process are high in precision and regular in shape, burrs cannot occur at the edges, the consistency of the through holes in the damping piece is good, and then the consistency number of the microphone is enabled to improve the noise reduction effect of the microphone. And the MEMS process is mature, and is suitable for industrial batch production.

Description

Microphone and electronic equipment

Technical Field

The utility model relates to an acoustics technical field especially relates to a microphone and electronic equipment.

Background

Along with the development of electroacoustic products and the improvement of the technology, people need to be higher and higher for noise elimination and remote sound pickup, and therefore acoustic sound pickup devices for reducing noise are needed.

At present, foam, metal wire woven meshes, laser punching metal sheets, acoustic mesh fabrics and the like are mainly adopted as damping materials for the unidirectional electret microphone, but the consistency of the materials is poor. Due to the influence of the consistency of the damping material, the product is difficult to achieve high consistency, and the noise reduction effect of the product is poor.

Disclosure of Invention

In view of this, the utility model provides a microphone and electronic equipment that the uniformity is good.

The utility model provides a microphone, includes shell, back of the body polar plate and vibration subassembly, the back of the body polar plate with the vibration subassembly all is located in the shell and the interval sets up relatively, microphone is still including being located utmost point chamber and damping piece in the shell, utmost point chamber runs through and is equipped with utmost point chamber sound hole, damping piece covers utmost point chamber sound hole, just be equipped with a plurality of through-holes that form through the MEMS technology on the damping piece, it is a plurality of the through-hole with utmost point chamber sound hole intercommunication.

In some embodiments, the aperture of the through-hole is 5 μm to 20 μm.

In some embodiments, the damping member has a thickness of 200 μm to 1000 μm; and/or

The number of the through holes is 30 to 1000.

In some embodiments, the vibration assembly includes a diaphragm and a support ring surrounding the diaphragm and supporting the pole cavity, and the diaphragm is located on a side of the support ring away from the pole cavity and spaced apart from the back plate.

In some embodiments, the damping member is secured to a side of the pole cavity adjacent the diaphragm by an adhesive layer.

In some embodiments, the housing is provided with a housing sound hole and a buffer cavity, the back plate is provided with a back plate sound hole in a penetrating manner, and the buffer cavity is located between the housing sound hole and the back plate sound hole and is communicated with the housing sound hole and the back plate sound hole.

In some embodiments, the housing has a plurality of the housing sound holes, the plurality of the housing sound holes are arranged at intervals, and the buffer cavity is communicated with the plurality of the housing sound holes.

In some embodiments, the microphone further includes a circuit board electrically connected to the back plate and the vibration component, the polar cavity includes a substrate spaced apart from the circuit board and a surrounding wall surrounding the periphery of the substrate and supporting the circuit board, and the polar cavity sound hole penetrates through the substrate.

In some embodiments, the substrate and the surrounding wall enclose a receiving space, the component on the circuit board is located in the receiving space, and a circuit board sound hole communicating the receiving space with the outside is formed through the circuit board.

The utility model also provides an electronic equipment, include as above the microphone.

The utility model provides a microphone utilizes the through-hole that MEMS technology processed, and the precision is high, and the burr can not appear at the edge in shape rule moreover for the uniformity of a plurality of through-holes on the damping piece is good, and then makes the uniformity number of microphone, with the noise reduction who promotes the microphone. And the MEMS process is mature, and is suitable for industrial batch production.

Drawings

Fig. 1 is an exploded schematic view of a microphone according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of the microphone shown in FIG. 1 as assembled;

fig. 3 is a partially enlarged schematic view of a damping member according to an embodiment of the present invention.

In the figure: 10. a microphone; 12. a housing; 14. a back plate; 16. a vibrating assembly; 18. an accommodating cavity; 20. an opening; 22. a sound hole of the housing; 24. a buffer chamber; 26. a dust screen; 28. a back plate sound hole; 30. a circuit board; 32. vibrating diaphragm; 34. a support ring; 36. a gasket; 38. a cavity ring; 40. a pole cavity; 42. a damping member; 44. a polar cavity sound hole; 46. a through hole; 48. an adhesive layer; 50. a substrate; 52. a surrounding wall; 54. an accommodating space; 56. an element; 58. the circuit board sound hole.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

It should be noted that all the directional indicators (such as up, down, left, right, front, back, inner, outer, top, bottom \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

It will also be understood that when an element is referred to as being "secured" or "disposed" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Referring to fig. 1 and 2, a microphone 10 according to an embodiment of the present invention is suitable for an electronic product, such as a mobile phone or an earphone, to convert a sound signal into an electrical signal. The specific type of the microphone 10 is not limited, and in the present application, the microphone 10 is a unidirectional electret microphone.

The microphone 10 includes a housing 12, a backplate 14, and a vibration assembly 16, the backplate 14 and the vibration assembly 16 being located within the housing 12 and spaced apart from each other to allow room for the vibration assembly 16 to vibrate.

The specific shape of the housing 12 is not limited, and in the present embodiment, the housing 12 is cylindrical, and has a housing cavity 18 therein, and an opening 20 communicating the housing cavity 18 with the outside is provided at one end. The backplate 14 and the vibration assembly 16 are both received in a receiving cavity 18 of the housing 12.

The housing 12 has a housing acoustic port 22, and the housing acoustic port 22 is located at an end of the housing 12 away from the opening 20 and communicates with the receiving cavity 18 and the outside. After the external air enters the receiving cavity 18 through the sound hole 22 of the housing, the pressure on both sides of the vibration component 16 changes, and the vibration component 16 can vibrate relative to the backplate.

The specific number of the housing sound holes 22 is not limited, and may be one or more. In the present embodiment, the housing 12 is provided with a plurality of housing sound holes 22, and the plurality of housing sound holes 22 are arranged at intervals. Specifically, the number of the case tone holes 22 is three.

The inside of the housing 12 is provided with a buffer chamber 24, and the buffer chamber 24 communicates with the plurality of housing sound holes 22. The external air enters the buffer cavity 24 through the sound hole 22 of the housing, and then enters the receiving cavity 18 after being buffered, so as to prevent the air flow velocity from being too fast to impact and damage the vibration component 16.

The outer side of the end of the casing 12 remote from the opening 20 is provided with a dust-proof net 26, and the dust-proof net 26 covers the casing sound hole 22 to prevent dust in the outside air from entering the inside of the microphone 10 through the casing sound hole 22.

The connection manner of the dust-proof net 26 and the housing 12 is not limited, and in the present embodiment, the dust-proof net 26 is fixed on the housing 12 by gluing.

The relative positions of the backplate 14 and the vibration assembly 16 are not limited, and for example, in the axial direction of the microphone 10, the backplate 14 may be between the vibration assembly 16 and the housing 12, or the vibration assembly 16 may be between the backplate 14 and the housing 12. In this embodiment, the backplate 14 is located between the vibration assembly 16 and the housing 12.

The back plate 14 has back plate sound holes 28 formed therethrough, and the buffer cavity 24 is located between the back plate sound holes 28 and the case sound holes 22 and communicates the back plate sound holes 28 and the case sound holes 22. Ambient air enters the buffer chamber 24 through the housing sound holes 22, is buffered and then passes through the back plate sound holes 28 and finally reaches the vibration assembly 16, causing the vibration assembly 16 to vibrate relative to the back plate 14.

The specific number of the back plate sound holes 28 is not limited, and may be one or more, and in this embodiment, three back plate sound holes 28 are provided on the back plate 14 at intervals.

The microphone 10 further includes a circuit board 30 located inside the housing 12, the circuit board 30 being disposed at the opening 20 of the housing 12. The circuit board 30 is electrically connected with the back plate 14 and the vibration component 16 respectively, the back plate 14 and the vibration component 16 form two plates of a capacitor, when the vibration component 16 vibrates relative to the back plate 14 under the action of sound pressure, the distance between the back plate 14 and the vibration component 16 changes, the capacitor between the back plate 14 and the vibration component 16 changes, and further the voltage changes, the strength of the external sound pressure is reflected, the circuit board 30 receives a voltage signal and outputs the voltage signal after processing, and the sound-electricity conversion is completed.

The vibration assembly 16 includes a diaphragm 32 and a support ring 34 surrounding the diaphragm 32, and the diaphragm 32 is disposed opposite to the back plate 14 at a distance and can vibrate relative to the back plate 14.

The manner in which the circuit board 30 is electrically connected to the vibration assembly 16 and the backplate 14 is not limited. In some embodiments, the support ring 34 and the housing 12 are made of conductive materials, the circuit board 30 is electrically connected to the diaphragm 32 through the support ring 34, and the circuit board 30 is electrically connected to the back plate 14 through the housing 12.

A spacer 36 is disposed within the housing 12, the spacer 36 being positioned between the vibration assembly 16 and the backplate 14 to space the vibration assembly 16 from the backplate 14 to allow room for the diaphragm 32 to vibrate.

The spacer 36 has a ring shape and is made of an insulating material. The spacer 36 is located between the support ring 34 and the back plate 14 to avoid the support ring 34 and the back plate 14 being electrically connected through the spacer 36 to short circuit the two plates of the capacitor.

A cavity ring 38 is provided within the housing 12, the cavity ring 38 surrounding the periphery of the support ring 34. The cavity ring 38 is made of an insulating material, and therefore, by disposing the cavity ring 38 between the support ring 34 and the housing 12, the vibration assembly 16 is prevented from being electrically connected to the back plate 14 through the housing 12.

In some embodiments, the microphone 10 further includes a pole cavity 40 and a damping member 42, both the pole cavity 40 and the damping member 42 being located within the housing 12. A pole cavity 40 is located between the vibration assembly 16 and the circuit board 30 to support the circuit board 30, and a damping member 42 is mounted to the pole cavity 40. Specifically, the pole cavity 40 abuts the support ring 34 of the vibratory assembly 16 and is partially inside the cavity ring 38.

Referring to fig. 2 and 3, the pole cavity 40 has a pole cavity sound hole 44 formed therethrough, and the damping member 42 covers the pole cavity sound hole 44. The damper 42 is provided with a plurality of through holes 46 formed by a Micro-Electro-Mechanical System (MEMS) process, and the plurality of through holes 46 are communicated with the electrode chamber sound hole 44. The through holes 46 processed by the MEMS process are high in precision and regular in shape, burrs cannot occur on the edges of the through holes 46, the through holes 46 on the damping piece 42 are good in consistency, and therefore the microphone 10 is good in consistency, and the noise reduction effect of the microphone 10 is improved. And the MEMS process is mature, and is suitable for industrial batch production.

The specific shape of the through hole 46 is not limited, and is, for example, circular, elliptical, polygonal, or the like.

The specific arrangement of the plurality of through holes 46 is not limited, and may be, for example, a matrix arrangement, a honeycomb arrangement, or the like.

In some embodiments, the aperture of the via 46 is 5 μm to 20 μm. With the through holes 46 manufactured by the MEMS process, the hole diameter can reach the μm level, thereby ensuring the uniformity of the plurality of through holes 46.

The damping member 42 is in the form of a sheet having a thickness of 200 to 1000 μm and 30 to 1000 through holes 46 distributed therein.

In one embodiment, the thickness of the damping member 42 is 500 μm, 100 through holes 46 are distributed on the damping member 42, and the aperture of the through holes 46 is 10 μm.

The specific position of the damper 42 is not limited, and for example, the damper 42 may be disposed inside the pole chamber sound hole 44 or may be disposed axially outside the pole chamber sound hole 44. In this embodiment, the damping member 42 is disposed on one side of the pole cavity 40 adjacent to the diaphragm 32 and on the inner side of the support ring 34, and the diaphragm 32 and the damping member 42 are spaced apart from each other.

The specific connection of the damping member 42 to the pole cavity 40 is not limited, and in this embodiment, the damping member 42 is fixed to one side of the pole cavity 40 by an adhesive layer 48.

As shown in fig. 1 and 2, the pole chamber 40 includes a substrate 50 and a surrounding wall 52 surrounding the substrate 50, the substrate 50 is located between the diaphragm 32 and the circuit board 30 and spaced apart from the circuit board 30 and the diaphragm 32, and the surrounding wall 52 is located between the support ring 34 and the circuit board 30 and supports the circuit board 30. The pole chamber sound hole 44 is provided through the substrate 50, and the damper 42 is fixed to the substrate 50.

The substrate 50 and the wall 52 enclose a receiving space 54, and a component 56 such as a Field Effect Transistor (FET) on the circuit board 30 is located in the receiving space 54, i.e. inside the wall 52, so as to protect the component 56 on the circuit board 30.

The circuit board 30 has a circuit board sound hole 58, and the circuit board sound hole 58 communicates the accommodating space 54 with the outside. When the diaphragm 32 of the vibration assembly 16 vibrates in a direction away from the back plate 14, the air inside the vibration assembly 16 passes through the through holes 46 of the damper 42 and the sound holes 44 of the pole cavity 40 in sequence, enters the accommodating space 54, and is finally discharged out of the microphone 10 through the sound holes 58 of the circuit board. The air moving from the chamber sound holes 44 to the circuit board sound holes 58 flows through the components 56 on the circuit board 30 to remove heat therefrom, thereby preventing the components 56 on the circuit board 30 from being damaged due to excessive temperatures.

The utility model discloses a microphone utilizes the through-hole that MEMS technology processed, and the precision is high, and the burr can not appear at the edge in shape rule moreover for the uniformity of a plurality of through-holes on the damping piece is good, and then makes the uniformity number of microphone, with the noise reduction who promotes the microphone. And the MEMS process is mature, and is suitable for industrial batch production.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. The utility model provides a microphone, includes shell, back of the body polar plate and vibration subassembly, the back of the body polar plate with the vibration subassembly all is located in the shell and the interval sets up relatively, its characterized in that, microphone still including being located utmost point chamber and damping piece in the shell, utmost point chamber runs through and is equipped with utmost point chamber sound hole, damping piece covers utmost point chamber sound hole, just be equipped with a plurality of through-holes that form through the MEMS technology on the damping piece, it is a plurality of the through-hole with utmost point chamber sound hole intercommunication.

2. The microphone of claim 1, wherein the aperture of the through hole is 5 μ ι η to 20 μ ι η.

3. The microphone of claim 1, wherein the damping member has a thickness of 200 to 1000 μ ι η; and/or

The number of the through holes is 30 to 1000.

4. The microphone of claim 1, wherein the vibration assembly comprises a diaphragm and a support ring surrounding the diaphragm and supporting the polar cavity, and the diaphragm is located on a side of the support ring away from the polar cavity and spaced apart from the back plate.

5. The microphone of claim 4, wherein the damping member is secured to the side of the pole cavity adjacent the diaphragm by an adhesive layer.

6. The microphone as claimed in claim 1, wherein the casing has casing tone holes and a buffer cavity, the back plate has back plate tone holes formed therethrough, and the buffer cavity is located between and communicates the casing tone holes and the back plate tone holes.

7. The microphone of claim 6, wherein the housing has a plurality of the housing sound holes spaced apart from each other, and the buffer chamber is in communication with the plurality of the housing sound holes.

8. The microphone of claim 1, further comprising a circuit board electrically connected to the back plate and the vibrating element, wherein the polar cavity comprises a substrate spaced apart from the circuit board and a surrounding wall surrounding the substrate and supporting the circuit board, and the polar cavity sound hole penetrates through the substrate.

9. The microphone of claim 8, wherein the substrate and the surrounding wall form a receiving space, the component on the circuit board is located in the receiving space, and a sound hole of the circuit board is formed through the circuit board to connect the receiving space and the outside.

10. An electronic device, characterized in that it comprises a microphone according to any of claims 1-9.