CN202310030U - Dust-proof silicon sound transmitting device - Google Patents
Dust-proof silicon sound transmitting device Download PDFInfo
- Publication number
- CN202310030U CN202310030U CN2011203962787U CN201120396278U CN202310030U CN 202310030 U CN202310030 U CN 202310030U CN 2011203962787 U CN2011203962787 U CN 2011203962787U CN 201120396278 U CN201120396278 U CN 201120396278U CN 202310030 U CN202310030 U CN 202310030U
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- CN
- China
- Prior art keywords
- counterbore
- dust
- transmission aperture
- sound
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a dust-proof silicon sound transmitting device which comprises a metal outer shell, a circuit board, a welding plate, an integrated circuit and a sensor, wherein the welding plate is arranged at one side of the circuit board; the integrated circuit is installed at the other side of the circuit board; a sound inlet hole is formed on the circuit board, and is arranged corresponding to the position of the sensor; a dust-proof support is arranged between the circuit board and the sensor; a counter bore is arranged on the surface of the dust-proof support facing towards the circuit board in a concave mode; the area of the counter hole is greater than the area of the sound inlet hole, and a plurality of sound transmitting holes which are not opposite to the sound inlet hole are formed on the base plate or the side wall of the counter bore. So, according to the utility model, through designing the sound transmitting holes into a zig-zag connecting channel, dust, tin beads, scaling powder or thermal shock and the like are prevented from directly entering a silicon microphone cavity, and the dust-proof protection effect of the dust-proof device to the interior of the silicon microphone cavity is improved effectively; and the dust-proof support is simple in structure, and is easy to produce and manufacture.
Description
Technical field
The utility model relates to the microphone art, refers in particular to a kind of dustproof silicon microphone.
Background technology
At present, utilize the integrated silicon Mike of MEMS technology to be widely applied on the electronic products such as mobile phone notebook.Usually, the sound hole of silicon microphone is offered in the circuit board, and the integrated circuit of this silicon microphone and transducer etc. can be installed in a side of wiring board; The realization zero elevation is installed; So, effectively reduced the height of electronic product, it more is applicable to the demand of the microminiaturized development of electronic product.
Yet, how effectively dustproof to the carrying out of the silicon microphone of said structure, also become a puzzlement in the industry.To this problem, there is the people Air Filter to be installed to play certain dustproof effect at sound hole outside (being that wiring board is outside), still, this kind design has also increased the height of product simultaneously, and difficulty satisfies the miniature electronic product demand.Afterwards, have the people that the dust guard of aforementioned similar Air Filter is changed and be located at wiring board inside, the sound transmission aperture of being offered on its dust guard is perpendicular to wiring board, promptly rectilinear connection sound hole and silicon microphone inside cavity.In actual production process, tend to find, because the rectilinear structural design of sound transmission aperture is difficult to from avoiding soldering residue, dust etc. directly to get into the silicon microphone inside cavity largely.
By this, need work out a kind of new technical scheme and solve the problems referred to above.
The utility model content
In view of this, the utility model is to the disappearance of prior art existence, and its main purpose provides a kind of dustproof silicon microphone, and its simple in structure, dustproof effect is good.
For realizing above-mentioned purpose, the utility model adopts following technical scheme:
A kind of dustproof silicon microphone; Include metal shell, wiring board, be arranged at the pad of this wiring board one side, the integrated circuit that is installed on this wiring board opposite side and transducer; Wherein, offer sound hole on this wiring board, and the corresponding sensor as aforementioned of this sound hole position is provided with; Be provided with dustproof support between this wiring board and the transducer; Should on the surface of wiring board, be concaved with a counterbore on dustproof support, the area of this counterbore is greater than the area of sound hole, and on the base plate of counterbore or sidewall, offer with sound hole non-over against a plurality of sound transmission aperture.
Preferably, said sound transmission aperture is arranged on the base plate of counterbore, and this counterbore and sound hole misplace each other.
Preferably, said sound transmission aperture is distributed in and is surrounded on the outer concentric circles of sound hole.
Preferably, said sound transmission aperture is arranged on the sidewall of counterbore, and sound transmission aperture is parallel to the wiring board extension.
Preferably, the short slot structure of said sound transmission aperture for directly offering in counterbore sidewall bottom surface.
Preferably, said sound transmission aperture is arranged on the sidewall of counterbore, and sound transmission aperture has angle obliquely with respect to wiring board and extends.
Preferably, said counterbore is the halfpace shape, and this sound transmission aperture is extended perpendicular to the halfpace inclined-plane.
The utility model compared with prior art has tangible advantage and beneficial effect; Particularly; Can be known that by technique scheme main system is through being concaved with a counterbore on dustproof support, the area of this counterbore is greater than the area of sound hole; And on the base plate of counterbore or sidewall, offer with sound hole non-over against a plurality of sound transmission aperture; Make sound transmission aperture form the interface channel of dioptric type, avoided dust, tin sweat(ing), scaling powder or thermal shock etc. directly to get into the silicon microphone inside cavity, effectively improved the proofing dust and protecting effect of this dust guard the silicon microphone inside cavity; Next is, aforementioned dustproof supporting structure is simple, be easy to manufacture.
Be architectural feature and the effect of more clearly setting forth the utility model, come the utility model is elaborated below in conjunction with accompanying drawing and specific embodiment.
Description of drawings
Fig. 1 a is the assembling sectional view of first kind of embodiment of the utility model;
Fig. 1 b is the cross section exploded view of first kind of embodiment of the utility model;
Fig. 1 c is the perspective view of dustproof support among first kind of embodiment of the utility model;
Fig. 1 d is the schematic cross-section of Fig. 1 c;
Fig. 2 a is the assembling sectional view of second kind of embodiment of the utility model;
Fig. 2 b is the cross section exploded view of second kind of embodiment of the utility model;
Fig. 2 c is the perspective view of dustproof support among second kind of embodiment of the utility model;
Fig. 2 d is the schematic cross-section of Fig. 2 c;
Fig. 3 a is the assembling sectional view of the third embodiment of the utility model;
Fig. 3 b is the cross section exploded view of the third embodiment of the utility model;
Fig. 3 c is the perspective view of dustproof support among the third embodiment of the utility model;
Fig. 3 d is the schematic cross-section of Fig. 3 c.
The accompanying drawing identifier declaration:
10, metal shell 20, wiring board
21, sound hole 30, pad
40, integrated circuit 50, MEMS transducer
60,70,80, dustproof support 61,71,81, counterbore
62,72,82, sound transmission aperture.
Embodiment
Please with reference to shown in Fig. 1 a to Fig. 1 d; It has demonstrated the concrete structure of first kind of embodiment of the utility model; Include metal shell 10, wiring board 20, be arranged at the pad 30 of these wiring board 20 1 sides, the integrated circuit 40 that is installed on these wiring board 20 opposite sides and MEMS transducer 50; Wherein, offer sound hole 21 on this wiring board 20, and these sound hole 21 corresponding aforementioned MEMS transducers 50 positions are provided with.
Be provided with dustproof support 60 between this wiring board 20 and the MEMS transducer 50; Should on the surface of sound hole 21, be concaved with a counterbore 61 by dustproof stent cover, the area of counterbore 61 should then further offer a plurality of little sound transmission aperture 62 greater than the area of sound hole 21 on the base plate of counterbore 61; The area of these little sound transmission aperture 62 is preferably less than the area of sound hole 21; And being in non-ly over against the position with sound hole 21, but dislocation with it forms the interface channel of dioptric type.For example being distributed in shown in Fig. 1 c is surrounded on the outer concentric circles of sound hole 21, and dust, tin sweat(ing), scaling powder or the thermal shock etc. that got into by sound hole 21 like this are unlikely to directly over against rushing at transducer 50, receives 61 stopping of base plate of counterbore and alleviates even eliminate.
See also shown in Fig. 2 a to Fig. 2 d; It has shown the concrete structure of second kind of embodiment of the utility model; Compare above-mentioned first kind of embodiment, its difference is: sound transmission aperture 72 is provided with the improvement of position on the dustproof support 70 of present embodiment, and it is no any sound transmission aperture 72 on the base plate of counterbore 71; But sound transmission aperture 72 is changed on the side wall surface that is arranged at counterbore 71, and these sound transmission aperture 72 are parallel to aforementioned wiring board 20 extensions.So, dust, tin sweat(ing), scaling powder or the thermal shock etc. of sound hole 21 entering more are difficult for transducer is impacted.And sound transmission aperture 72 wherein can be the short slot structure of directly offering in counterbore 71 sidewall bottom surfaces, makes sound transmission aperture be easier to processing and fabricating like this, simplifies working process.
See also shown in Fig. 3 a to Fig. 3 d; It has shown the concrete structure of the third embodiment of the utility model; Compare above-mentioned first kind of embodiment, its difference is: it remains the improvement of sound transmission aperture 82 on the dustproof support 80, and the counterbore 81 in the present embodiment is landing shape; It does not have any sound transmission aperture yet on the base plate of counterbore 81; But sound transmission aperture 82 is arranged on the side wall surface of counterbore 81, and these sound transmission aperture 82 have angle with aforementioned wiring board 20 and extend obliquely, sound transmission aperture 82 is extended perpendicular to the halfpace inclined-plane.So, the dust, tin sweat(ing), scaling powder or the thermal shock that are not only got into by sound hole 21 more are difficult for transducer is impacted, and the transaudient distance of sound hole and transducer is optimum, can obtain the more transaudient effect of high-quality.
In sum; The design focal point of the utility model is that main system is through being concaved with a counterbore on dustproof support, and the area of this counterbore is greater than the area of sound hole; And on the base plate of counterbore or sidewall, offer with sound hole non-over against a plurality of sound transmission aperture; Make sound transmission aperture form the interface channel of dioptric type, avoided dust, tin sweat(ing), scaling powder or thermal shock etc. directly to get into the silicon microphone inside cavity, effectively improved the proofing dust and protecting effect of this dust guard the silicon microphone inside cavity; Next is, aforementioned dustproof supporting structure is simple, be easy to manufacture.
The above; It only is the preferred embodiment of the utility model; Be not that the technical scope of the utility model is done any restriction; So every technical spirit according to the utility model all still belongs in the scope of the utility model technical scheme any trickle modification, equivalent variations and modification that above embodiment did.
Claims (7)
1. dustproof silicon microphone; Include metal shell, wiring board, be arranged at the pad of this wiring board one side, the integrated circuit that is installed on this wiring board opposite side and transducer; Wherein, offer sound hole on this wiring board, and the corresponding sensor as aforementioned of this sound hole position is provided with; It is characterized in that: be provided with dustproof support between this wiring board and the transducer; Should on the surface of wiring board, be concaved with a counterbore on dustproof support, the area of this counterbore is greater than the area of sound hole, and on the base plate of counterbore or sidewall, offer with sound hole non-over against a plurality of sound transmission aperture.
2. dustproof silicon microphone according to claim 1 is characterized in that: said sound transmission aperture is arranged on the base plate of counterbore, and this counterbore and sound hole misplace each other.
3. dustproof silicon microphone according to claim 2 is characterized in that: said sound transmission aperture is distributed in and is surrounded on the outer concentric circles of sound hole.
4. dustproof silicon microphone according to claim 1 is characterized in that: said sound transmission aperture is arranged on the sidewall of counterbore, and sound transmission aperture is parallel to the wiring board extension.
5. dustproof silicon microphone according to claim 4 is characterized in that: the short slot structure of said sound transmission aperture for directly offering in counterbore sidewall bottom surface.
6. dustproof silicon microphone according to claim 1 is characterized in that: said sound transmission aperture is arranged on the sidewall of counterbore, and sound transmission aperture has angle obliquely with respect to wiring board and extends.
7. dustproof silicon microphone according to claim 6 is characterized in that: said counterbore is the halfpace shape, and this sound transmission aperture is extended perpendicular to the halfpace inclined-plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203962787U CN202310030U (en) | 2011-10-18 | 2011-10-18 | Dust-proof silicon sound transmitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203962787U CN202310030U (en) | 2011-10-18 | 2011-10-18 | Dust-proof silicon sound transmitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202310030U true CN202310030U (en) | 2012-07-04 |
Family
ID=46378837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203962787U Expired - Lifetime CN202310030U (en) | 2011-10-18 | 2011-10-18 | Dust-proof silicon sound transmitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202310030U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179493A (en) * | 2013-04-09 | 2013-06-26 | 歌尔声学股份有限公司 | MEMS (Micro-electromechanical Systems) microphone |
| CN103200509A (en) * | 2013-04-09 | 2013-07-10 | 歌尔声学股份有限公司 | Mems microphone |
| CN110873497A (en) * | 2018-08-30 | 2020-03-10 | Lg电子株式会社 | Refrigerator with a door |
-
2011
- 2011-10-18 CN CN2011203962787U patent/CN202310030U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179493A (en) * | 2013-04-09 | 2013-06-26 | 歌尔声学股份有限公司 | MEMS (Micro-electromechanical Systems) microphone |
| CN103200509A (en) * | 2013-04-09 | 2013-07-10 | 歌尔声学股份有限公司 | Mems microphone |
| CN103200509B (en) * | 2013-04-09 | 2015-11-11 | 歌尔声学股份有限公司 | Mems microphone |
| CN103179493B (en) * | 2013-04-09 | 2016-02-03 | 歌尔声学股份有限公司 | Mems microphone |
| CN110873497A (en) * | 2018-08-30 | 2020-03-10 | Lg电子株式会社 | Refrigerator with a door |
| US11713919B2 (en) | 2018-08-30 | 2023-08-01 | Lg Electronics Inc. | Refrigerator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Dust-proof silicon sound transmitting device Effective date of registration: 20180118 Granted publication date: 20120704 Pledgee: Kingston Technology Company, Inc. Pledgor: Dongguan Transound Electronics Co., Ltd. Registration number: 2018990000059 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201224 Granted publication date: 20120704 Pledgee: Kingston Technology Corp. Pledgor: TRANSOUND ELECTRONICS Co.,Ltd. Registration number: 2018990000059 |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |