CN204887447U - Sound production module - Google Patents
Sound production module Download PDFInfo
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- CN204887447U CN204887447U CN201520526555.XU CN201520526555U CN204887447U CN 204887447 U CN204887447 U CN 204887447U CN 201520526555 U CN201520526555 U CN 201520526555U CN 204887447 U CN204887447 U CN 204887447U
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- circuit board
- sounding module
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Abstract
Description
【技术领域】【Technical field】
本实用新型涉及声电转换技术领域,具体涉及一种发声模组。The utility model relates to the technical field of acoustic-electric conversion, in particular to a sounding module.
【背景技术】【Background technique】
随着消费类电子市场的扩大,手机、笔记本电脑等电子通讯产品得到广泛应用,人们对电子通讯产品的要求也越来越高,除了重视其功能的同时,也越来越重视外观、声学性能等。面对电子通讯产品小型化、微型化的发展趋势,人们对运用在其中的声学单元小型化,模块化的要求也越来越高,同时,为了提高市场竞争力,所述声学单元的集成化设计也受到生产厂商的关注。With the expansion of the consumer electronics market, electronic communication products such as mobile phones and notebook computers are widely used, and people have higher and higher requirements for electronic communication products. In addition to their functions, they also pay more and more attention to appearance and acoustic performance. wait. Faced with the development trend of miniaturization and miniaturization of electronic communication products, people have higher and higher requirements for the miniaturization and modularization of the acoustic unit used in it. At the same time, in order to improve market competitiveness, the integration of the acoustic unit Design is also concerned by manufacturers.
相关技术中,所述声学单元包括扬声器单体、麦克风、距离传感器和柔性电路板。当所述声学单元运用在所述电子通讯产品时,其各部分元器件需要按不同工序装配到所述电子通讯产品中,从而使得装配难度大、效率低,不利于所述将所述声学单元集成化运用。In related technologies, the acoustic unit includes a speaker unit, a microphone, a distance sensor and a flexible circuit board. When the acoustic unit is used in the electronic communication product, its various components need to be assembled into the electronic communication product according to different procedures, which makes the assembly difficult and inefficient, which is not conducive to the integration of the acoustic unit into the electronic communication product. Integrated use.
因此有必要提供一种新的技术方案克服上述问题。Therefore it is necessary to provide a new technical solution to overcome the above problems.
【实用新型内容】【Content of utility model】
为解决上述声学单元的麦克风、距离传感器、扬声器及柔性电路板无法一体化集成装配的技术问题,本实用新型提供一种麦克风、距离传感器、扬声器及柔性电路板一体化集成装配的发声模组。本实用新型提供一种发声模组,包括柔性电路板和安装于所述柔性电路板上的扬声器单体,所述扬声器单体与所述柔性电路板电连接,所述发声模组在所述柔性电路板上还集成有麦克风和距离传感器,所述麦克风和所述距离传感器与所述柔性电路板电连接。In order to solve the technical problem that the microphone, distance sensor, speaker and flexible circuit board of the above-mentioned acoustic unit cannot be integrated and assembled, the utility model provides a sound module in which the microphone, distance sensor, speaker and flexible circuit board are integrated and assembled. The utility model provides a sounding module, which includes a flexible circuit board and a speaker unit installed on the flexible circuit board, the speaker unit is electrically connected with the flexible circuit board, and the sounding module is installed on the flexible circuit board. A microphone and a distance sensor are also integrated on the flexible circuit board, and the microphone and the distance sensor are electrically connected to the flexible circuit board.
在本实用新型提供的发声模组一较佳实施例中,所述柔性电路板包括第一电路板、第二电路板和连接所述第一电路板和所述第二电路板的连接部,所述第一电路板和所述第二电路板设于相异平面,所述扬声器单体安装于所述第一电路板,所述麦克风和所述距离传感器安装于所述第二电路板。In a preferred embodiment of the sounding module provided by the present invention, the flexible circuit board includes a first circuit board, a second circuit board and a connecting portion connecting the first circuit board and the second circuit board, The first circuit board and the second circuit board are arranged on different planes, the loudspeaker unit is installed on the first circuit board, and the microphone and the distance sensor are installed on the second circuit board.
在本实用新型提供的发声模组一较佳实施例中,所述第一电路板低于所述第二电路板设置。In a preferred embodiment of the sounding module provided by the utility model, the first circuit board is arranged lower than the second circuit board.
在本实用新型提供的发声模组一较佳实施例中,所述发声模组还包括支撑框架,所述柔性电路板贴设于所述支撑框架。In a preferred embodiment of the sounding module provided by the present invention, the sounding module further includes a supporting frame, and the flexible circuit board is attached to the supporting frame.
在本实用新型提供的发声模组一较佳实施例中,所述支撑框架包括贯穿其设置的若干通孔和设于所述通孔内的支撑板,所述支撑板与所述扬声器单体抵接。In a preferred embodiment of the sound module provided by the present invention, the support frame includes a plurality of through holes provided through it and a support plate disposed in the through holes, the support plate and the speaker unit Abut.
在本实用新型提供的发声模组一较佳实施例中,所述支撑框架还包括粘接层,所述柔性电路板通过所述粘接层固定在所述支撑框架上。In a preferred embodiment of the sound emitting module provided by the present invention, the support frame further includes an adhesive layer, and the flexible circuit board is fixed on the support frame through the adhesive layer.
在本实用新型提供的发声模组一较佳实施例中,所述发声模组还包括面板,所述面板设于所述支撑框架和所述第二电路板之间。In a preferred embodiment of the sounding module provided by the present invention, the sounding module further includes a panel, and the panel is arranged between the supporting frame and the second circuit board.
相较于相关技术,本实用新型提供发声模组具有以下有益效果:所述发声模组可将扬声器单体、距离传感器、麦克风及柔性电路板一体化集成设计,方便客户模块化应用,装配简便,可以大大降低装配成本。Compared with related technologies, the utility model provides a sound module with the following beneficial effects: the sound module can integrate a speaker unit, a distance sensor, a microphone and a flexible circuit board into an integrated design, which is convenient for customers to apply modularly and is easy to assemble , can greatly reduce the assembly cost.
【附图说明】【Description of drawings】
为了更清楚地说明本实用新型实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图,其中:In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some implementations of the present invention. For example, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative work, wherein:
图1是本实用新型提供的发声模组的立体分解示意图;Fig. 1 is a three-dimensional exploded schematic view of the sounding module provided by the utility model;
图2为本实用新型提供的发声模组的组装结构示意图。Fig. 2 is a schematic diagram of the assembly structure of the sound emitting module provided by the present invention.
【具体实施方式】【Detailed ways】
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本实用新型的一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
请一并参阅图1及图2,图1是本实用新型提供的发声模组的立体分解示意图,图2为本实用新型提供的发声模组的组装结构示意图。所述发声模组1包括柔性电路板10、支撑框架11、扬声器单体13、距离传感器15、麦克风17及面板19。所述柔性电路板10贴设于所述支撑框架11上。所述扬声器单体13、距离传感器15及麦克风17设于所述柔性电路板10上且与所述柔性电路板10电连接。Please refer to FIG. 1 and FIG. 2 together. FIG. 1 is a three-dimensional exploded view of the sounding module provided by the utility model, and FIG. 2 is a schematic diagram of the assembled structure of the sounding module provided by the utility model. The sound module 1 includes a flexible circuit board 10 , a support frame 11 , a speaker unit 13 , a distance sensor 15 , a microphone 17 and a panel 19 . The flexible circuit board 10 is mounted on the supporting frame 11 . The speaker unit 13 , the distance sensor 15 and the microphone 17 are disposed on the flexible circuit board 10 and electrically connected to the flexible circuit board 10 .
所述柔性电路板10包括第一电路板101、第二电路板103及连接部105,所述第一电路板101通过所述连接部105与所述第二电路板103连接,所述第二电路板103为配合电声转换设备除扬声器外其他元件而设计。所述第一电路板101和所述第二电路板103可以在不同一水平面,具体地,所述第二电路板103的位置高于所述第一电路板101的位置,所述第一电路板101、所述连接部105和所述第二电路板103呈类Z形。The flexible circuit board 10 includes a first circuit board 101, a second circuit board 103 and a connecting portion 105, the first circuit board 101 is connected to the second circuit board 103 through the connecting portion 105, and the second circuit board 101 is connected to the second circuit board 103 through the connecting portion 105. The circuit board 103 is designed to cooperate with other components of the electroacoustic conversion device except the speaker. The first circuit board 101 and the second circuit board 103 may not be on the same horizontal plane, specifically, the position of the second circuit board 103 is higher than the position of the first circuit board 101, and the position of the first circuit board 103 is higher than that of the first circuit board 101. The board 101 , the connecting portion 105 and the second circuit board 103 are in a Z-like shape.
所述第二电路板103的宽度方向是指所述扬声器单体13的宽度方向,所述扬声器单体13横截面为长方形,所述扬声器单体13的宽度方向是指与相邻边相比较,长度较短的边所在的方向。The width direction of the second circuit board 103 refers to the width direction of the speaker unit 13, the speaker unit 13 has a rectangular cross section, and the width direction of the speaker unit 13 refers to the width direction compared with the adjacent sides. , the direction of the side with the shorter length.
所述支撑框架11包括通孔111、支撑板113及粘接层115,所述支撑框架11的结构与所述柔性电路板10的形状相适应;所述通孔111的数量具体为四个,两两平行间隔设置,所述通孔111的形状为方形;所述支撑板113主要起支撑所述扬声器单体13的作用,设于所述通孔111一侧壁且与所述扬声器单体13抵接;所述粘接层115为胶层,所述第一电路板101和所述第二电路板103均通过所述粘接层115固定在所述支撑框架113上。The support frame 11 includes a through hole 111, a support plate 113 and an adhesive layer 115, and the structure of the support frame 11 is adapted to the shape of the flexible circuit board 10; the number of the through holes 111 is specifically four, The two through holes 111 are arranged at intervals in parallel, and the shape of the through holes 111 is square; the support plate 113 mainly plays the role of supporting the speaker unit 13, and is arranged on the side wall of the through hole 111 and is connected to the speaker unit. 13; the adhesive layer 115 is an adhesive layer, and both the first circuit board 101 and the second circuit board 103 are fixed on the support frame 113 through the adhesive layer 115 .
所述扬声器单体13设于所述第一电路板101上,所述距离传感器15和所述麦克风17沿所述第二电路板103的宽度方向并列设于所述第二电路板103,可以通过焊接方式与所述第二电路板103连接。The loudspeaker unit 13 is arranged on the first circuit board 101, and the distance sensor 15 and the microphone 17 are arranged side by side on the second circuit board 103 along the width direction of the second circuit board 103, which can It is connected with the second circuit board 103 by welding.
所述面板19设于所述支撑框架11与所述第二电路板103之间,起支撑和调节所述距离传感器15和所述麦克风17与所述扬声器单体13的相对高度的作用。The panel 19 is disposed between the supporting frame 11 and the second circuit board 103 , and plays a role of supporting and adjusting the relative heights of the distance sensor 15 , the microphone 17 and the speaker unit 13 .
本实用新型提供的所述发声模组1为一体化集成设计,其具体的实现方式为,所述支撑框架11分别支撑所述扬声器单体13、所述距离传感器15及所述麦克风17于其对应的区域,使得发声模组1的各元件能够实现模块化固定,并通过与所述支撑框架11配合设置的所述柔性电路板10与各元件电连接,使得各元件能集成化装配及应用。The sound module 1 provided by the utility model is an integrated design, and its specific implementation method is that the support frame 11 supports the speaker unit 13, the distance sensor 15 and the microphone 17 respectively. The corresponding area enables each component of the sound module 1 to be modularly fixed, and is electrically connected to each component through the flexible circuit board 10 arranged in cooperation with the support frame 11, so that each component can be assembled and applied in an integrated manner. .
本实用新型提供的发声模组1具有以下有益效果:柔性电路板10、扬声器单体13、距离传感器15及麦克风17一体化集成设计,方便客户模块化应用,装配简便,可以大大降低装配成本。The sound module 1 provided by the utility model has the following beneficial effects: the integrated design of the flexible circuit board 10, the loudspeaker unit 13, the distance sensor 15 and the microphone 17 is convenient for customers' modular application, easy to assemble, and can greatly reduce the assembly cost.
以上所述仅为本实用新型的优选实施例而已,并不用于限制本实用新型,对于本领域的技术人员来说,本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520526555.XU CN204887447U (en) | 2015-07-20 | 2015-07-20 | Sound production module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520526555.XU CN204887447U (en) | 2015-07-20 | 2015-07-20 | Sound production module |
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| CN204887447U true CN204887447U (en) | 2015-12-16 |
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| CN201520526555.XU Expired - Fee Related CN204887447U (en) | 2015-07-20 | 2015-07-20 | Sound production module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108429827A (en) * | 2018-02-26 | 2018-08-21 | 广东欧珀移动通信有限公司 | Electronic component and electronic device |
| CN113114806A (en) * | 2018-02-28 | 2021-07-13 | Oppo广东移动通信有限公司 | Electronic component and electronic device |
-
2015
- 2015-07-20 CN CN201520526555.XU patent/CN204887447U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108429827A (en) * | 2018-02-26 | 2018-08-21 | 广东欧珀移动通信有限公司 | Electronic component and electronic device |
| CN108429827B (en) * | 2018-02-26 | 2020-07-07 | Oppo广东移动通信有限公司 | Electronic components and electronic equipment |
| CN113114806A (en) * | 2018-02-28 | 2021-07-13 | Oppo广东移动通信有限公司 | Electronic component and electronic device |
| CN113114806B (en) * | 2018-02-28 | 2023-09-19 | Oppo广东移动通信有限公司 | Electronic component and electronic device |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20210720 |