CN202374441U - Silicon microphone - Google Patents
Silicon microphone Download PDFInfo
- Publication number
- CN202374441U CN202374441U CN2011204236000U CN201120423600U CN202374441U CN 202374441 U CN202374441 U CN 202374441U CN 2011204236000 U CN2011204236000 U CN 2011204236000U CN 201120423600 U CN201120423600 U CN 201120423600U CN 202374441 U CN202374441 U CN 202374441U
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- Prior art keywords
- silicon
- microphone
- sound hole
- chip
- inlet hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 57
- 239000010703 silicon Substances 0.000 title claims abstract description 57
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 125000006850 spacer group Chemical group 0.000 claims description 18
- 238000010276 construction Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims 4
- 238000013461 design Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 abstract 3
- 238000002955 isolation Methods 0.000 abstract 3
- 230000000903 blocking effect Effects 0.000 abstract 2
- 230000003139 buffering effect Effects 0.000 abstract 2
- 238000007664 blowing Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 12
- 230000009471 action Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003434 inspiratory effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a silicon microphone, which comprises an external encapsulation structure, wherein the external encapsulation structure comprises an upper board, a hollow cavity with a side wall and a lower circuit board, wherein a first sound inlet hole is formed in the upper board; a silicon acoustics chip and an electric signal chip are arranged on the lower circuit board; an isolation device for isolating the first sound inlet hole from the silicon acoustics chip is arranged in the encapsulation structure; a buffering cavity is formed between the isolation device and the upper board; a second sound inlet hole which is communicated with the first sound inlet hole and the silicon acoustics chip is formed in the isolation device; a blocking sheet is arranged between the first sound inlet hole and the second sound inlet hole; and the thickness of the blocking sheet is smaller than the height of the buffering cavity. Due to the design, the silicon microphone can protect the internal silicon acoustics chip diaphragm and prevent the internal silicon acoustics chip diaphragm from being impacted by outside air flow, so that the air flow blowing and absorbing resistance of the microphone is improved; and the silicon microphone has effects of preventing dust and water, and the reliability of the microphone is improved.
Description
Technical field
The utility model relates to the acoustical-electrical transducer field, is specifically related to a kind of silicon micro-microphone.
Background technology
The development of terminal consumption electronic product makes increasing acoustic-electrical transducer spare be widely used.In acoustic-electric switch technology field; Silicon micro-microphone; Be MEMS microphone (Micro-Electro-Mechanical Systems-Microphone); Be that a kind of employing silicon is raw material, with the become one acoustical-electrical transducer spare of the integrated M EMS acoustic-electro conversion chip of Micrometer-Nanometer Processing Technology of electronics and micromechanics.More traditional capacitance type minitype microphone, the MEMS microphone is little with its size, and high-performance can high temperature resistant Reflow Soldering and make the less cost advantage on a large scale, is penetrated into the consumer electronics product field gradually.
The silicon micro-microphone of traditional structure; As shown in Figure 4; The outer enclosure structure of metal cap 1 and 2 formation of wiring board lower plate; Wherein metal cap 1 is to be made up of the upper plate 11 of one and the cavity 12 of hollow, and silicon acoustics chip 4 and signal of telecommunication process chip 3 are installed in the inside of encapsulating structure, on metal cap 1, also is provided with sound hole 13.In the silicon micro-microphone that uses this traditional structure, have the action that suction nozzle is drawn microphone in the SMT operation; Simultaneously in assembling process, also through regular meeting with the blow action etc. of cleaning of high pressure air rifle, these blow, inspiratory flow all may produce damage to the vibrating diaphragm on the silicon acoustics chip 4 of sensitivity, reduce the rate of finished products of product; The silicon micro-microphone of this traditional structure also lacks waterproof and dustproof design simultaneously, and reliability of products is relatively poor.
So, be necessary the silicon micro-microphone of above-mentioned traditional structure is further improved, to avoid above-mentioned defective.
Summary of the invention
The utility model technical problem to be solved is: possibly damage silicon acoustics chip and cause the relatively poor defective of reliability because of dust and water to the silicon micro-microphone of traditional structure is in use existing; A kind of silicon micro-microphone structure that can protect inner silicon acoustics chip vibrating diaphragm is provided; Make it to avoid extraneous gas shock, promote the ability that microphone tolerance air-flow blows, inhales greatly; Also have dustproof, good waterproof effect simultaneously, improve the reliability of microphone.
For solving the problems of the technologies described above, the technical scheme of the utility model is: a kind of silicon micro-microphone, comprise the outer enclosure structure, and said outer enclosure structure comprises upper plate, forms the hollow cavity of sidewall, and the wiring board lower plate; Said upper plate is provided with first sound hole, and silicon acoustics chip and signal of telecommunication chip are installed on the said wiring board lower plate; And: the inside of said encapsulating structure is provided with the spacer assembly of isolating said first sound hole and said silicon acoustics chip; Form cushion chamber between said spacer assembly and the said upper plate, said spacer assembly is provided with second sound hole that is communicated with said first sound hole and said silicon acoustics chip; Between said first sound hole and said second sound hole, be provided with division board, and the thickness of said division board is less than the height of said cushion chamber.
As a kind of optimized technical scheme, said division board is a S shape.
As a kind of optimized technical scheme, said spacer assembly is fixed on the said upper plate.
As a kind of optimized technical scheme, said spacer assembly is fixed on the said wiring board lower plate.
As a kind of optimized technical scheme, said upper plate and said cavity are the metal cap construction of one.
After having adopted technique scheme; The beneficial effect of the utility model is: the silicon micro-microphone of the utility model can be protected the silicon micro-microphone structure of inner silicon acoustics chip vibrating diaphragm; Make it to avoid extraneous gas shock; Promoted the ability that microphone tolerance air-flow blows, inhales, prevent air-flow to silicon acoustics chip vibrating diaphragm damage, improved the rate of finished products of product; Also have dustproof, good waterproof effect simultaneously, improved the reliability of microphone.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is the cutaway view of the utility model embodiment one silicon micro-microphone;
Fig. 2 is the cutaway view of the utility model embodiment two silicon micro-microphones;
Fig. 3 is the cutaway view of the utility model embodiment three silicon micro-microphones;
Fig. 4 is the cutaway view of the silicon micro-microphone of prior art;
Among the figure: the 1-metal cap; The 11-upper plate; The 12-cavity; 13-first sound hole; 2-wiring board lower plate; 3-signal of telecommunication process chip; 4-silicon acoustics chip; 5,5 '-spacer assembly; 51,51 '-the second sound hole; 6,6 '-division board; 61,61 '-support.
Embodiment
In the following description; Only some example embodiment of the utility model is described through the mode of explanation; Mother is mediocre to doubt; Those of ordinary skill in the art can recognize, under the situation of spirit that does not depart from the utility model and scope, can revise described embodiment with various mode.Therefore, accompanying drawing be described in just illustratively in essence, rather than be used to limit the protection range of claim.In addition, in this manual, identical Reference numeral indicates identical part.
Embodiment one:
Fig. 1 is the cutaway view of the utility model embodiment one silicon micro-microphone; As shown in Figure 1; Silicon micro-microphone comprises the upper plate 11 that combines, the cavity 12 formed sidewalls of hollow from top to bottom, and wiring board lower plate 2 formed outer enclosure structures; Upper plate 11 is provided with first sound hole 13, and the encapsulating structure set inside has the silicon acoustics chip 4 and signal of telecommunication process chip 3 that is installed on the wiring board lower plate 2; On the inner upper plate 11 of encapsulating structure, also be provided with spacer assembly 5; Form cushion chamber between spacer assembly 5 and the upper plate 11 at interval; Spacer assembly 5 is provided with second sound hole 51 of UNICOM's first sound hole 13 and silicon acoustics chip 4; Between first sound hole 13 and second sound hole 51, also be provided with division board 6, and the thickness of division board 6 is less than the height of cushion chamber.
The silicon micro-microphone of this structure; Because spacer assembly 5 is set on upper plate 1; Spacer assembly 5 is provided with second sound hole 51 that is communicated with between first sound hole 13 and the silicon acoustics chip 4; And between first sound hole 13 and second sound hole 51, division board 6 is set, the thickness of division board 6 is less than the height of cushion chamber.This design in use, is drawn the action of microphone as have suction nozzle in the SMT operation; In assembling process, through regular meeting with the blow action etc. of cleaning of high pressure air rifle, blow, when air-breathing; Division board 6 is pressed close to towards second sound hole 51 and first sound hole 13 respectively; Can protect the vibrating diaphragm on 4 in the inner silicon acoustics core, make it to avoid extraneous gas shock, promote the ability that microphone tolerance air-flow blows, inhales; Prevent the damage of vibrating diaphragm generation has been improved rate of finished products; The silicon micro-microphone of this traditional structure design simultaneously also has waterproof and dustproof design, has improved reliability of products.
In the present embodiment, upper plate 11 is the metal cap construction of one with cavity 12.The production design of this deisgn product is more simple, helps the miniaturization of product design.
In addition, preferred construction is in the present embodiment, and division board 6 is a slab construction.The division board of slab construction passes through under the prerequisite of effect at satisfied sound, designs more simple.
Embodiment two:
Fig. 2 is the cutaway view of the utility model embodiment two silicon micro-microphones; As shown in Figure 2; This implementation process is that with the main distinction of embodiment one two ends of the division board 6 ' in this implementation process are provided with in the other direction and support 61 ', thereby make the structure of division board 6 ' present S shape.
This design, in practical application, the design feature of division board 6 ' makes that having bigger sound passes through effect, can satisfy the demand that more production design is passed through sound.
Embodiment three:
Fig. 3 is the cutaway view of the utility model embodiment three silicon micro-microphones, and is as shown in Figure 3, and the main distinction of this implementation process and above-mentioned implementation process is, spacer assembly 5 ' difference is set, the spacer assembly 5 ' in this implementation process is arranged on the wiring board lower plate 2.
This design of this implementation process can realize above-mentioned technique effect equally, and the spacer assembly design in this implementation process is more easy when silicon micro-microphone assembles.
In the enforcement of the invention, division board also can be L shaped other shape that waits, and the design of concrete shape can be selected according to the demand that sound passes through effect; Upper plate and cavity also can be absolute construction, the i.e. silicon micro-microphone of three ply board structure.
More than show and described basic principle of the utility model and the advantage of principal character and the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection range to be defined by appending claims and equivalent thereof.
Claims (6)
1. a silicon micro-microphone comprises the outer enclosure structure, and said outer enclosure structure comprises upper plate, forms the hollow cavity of sidewall, and the wiring board lower plate; Said upper plate is provided with first sound hole, and silicon acoustics chip and signal of telecommunication chip are installed on the said wiring board lower plate; It is characterized in that: the inside of said encapsulating structure is provided with the spacer assembly of isolating said first sound hole and said silicon acoustics chip; Form cushion chamber between said spacer assembly and the said upper plate, said spacer assembly is provided with second sound hole that is communicated with said first sound hole and said silicon acoustics chip; Between said first sound hole and said second sound hole, be provided with barrier sheet, and the thickness of said barrier sheet is less than the height of said cushion chamber.
2. silicon micro-microphone according to claim 1 is characterized in that,
Said barrier sheet is a slab construction.
3. silicon micro-microphone according to claim 1 is characterized in that,
Said barrier sheet is a S shape.
4. according to the said silicon micro-microphone of the arbitrary claim of claim 1-3, it is characterized in that,
Said spacer assembly is fixed on the said upper plate.
5. according to the described silicon micro-microphone of the arbitrary claim of claim 1-3, it is characterized in that,
Said spacer assembly is fixed on the said wiring board lower plate.
6. silicon micro-microphone according to claim 1 is characterized in that,
Said upper plate and said cavity are the metal cap construction of one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204236000U CN202374441U (en) | 2011-10-31 | 2011-10-31 | Silicon microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204236000U CN202374441U (en) | 2011-10-31 | 2011-10-31 | Silicon microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202374441U true CN202374441U (en) | 2012-08-08 |
Family
ID=46598128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204236000U Expired - Lifetime CN202374441U (en) | 2011-10-31 | 2011-10-31 | Silicon microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202374441U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103391502A (en) * | 2013-06-25 | 2013-11-13 | 歌尔声学股份有限公司 | Method for manufacturing waterproof sheets of microphones |
| CN112839291A (en) * | 2020-12-24 | 2021-05-25 | 佳禾智能科技股份有限公司 | Device and method for testing pop sound generated by negative pressure of microphone |
-
2011
- 2011-10-31 CN CN2011204236000U patent/CN202374441U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103391502A (en) * | 2013-06-25 | 2013-11-13 | 歌尔声学股份有限公司 | Method for manufacturing waterproof sheets of microphones |
| CN112839291A (en) * | 2020-12-24 | 2021-05-25 | 佳禾智能科技股份有限公司 | Device and method for testing pop sound generated by negative pressure of microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120808 |
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| CX01 | Expiry of patent term |