CN208783110U - Microphone packaging scheme and electronic equipment - Google Patents
Microphone packaging scheme and electronic equipment Download PDFInfo
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- CN208783110U CN208783110U CN201920343504.1U CN201920343504U CN208783110U CN 208783110 U CN208783110 U CN 208783110U CN 201920343504 U CN201920343504 U CN 201920343504U CN 208783110 U CN208783110 U CN 208783110U
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- lug boss
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Abstract
It further include the MEMS microphone chip in enclosure space the utility model relates to a kind of microphone packaging scheme and electronic equipment, including substrate, lid, and the enclosure space surrounded by substrate and lid；It further include the lug boss for being disposed on the substrate and surrounding with substrate cavity；Connection cavity and the first extraneous acoustic aperture are provided on the substrate；The second acoustic aperture of connection cavity and MEMS microphone chip is provided on the lug boss；And first acoustic aperture and the second acoustic aperture are configured as not on same airflow path direction.One technical effect of the utility model is that can effectively reduce outer gas stream to the impact force of MEMS microphone chip interior vibrating diaphragm.
Description
Technical field
The utility model relates to electroacoustic techniques fields, more specifically, the utility model relates to a kind of microphone packaging schemes
And electronic equipment.
Background technique
Nowadays, as people are higher and higher to acoustical device performance requirement, acoustical device shows fast-developing trend.
Wherein, for more common microphone apparatus, people are proposed its signal-to-noise ratio, sensitivity and acoustical behavior etc.
Higher requirement.Therefore, the research emphasis for those skilled in the art is designed to for the structure of microphone apparatus in recent years.
MEMS (Micro-Electro-Mechanical System, MEMS) is a kind of utilization micro manufacturing technique
It is manufactured to minimize both mechanically and electrically mechanical organ.In use usually by itself and integrated circuit (Application
Specific Integrated Circuit, ASIC) chip is packaged in microphone apparatus using corresponding technology, form one
Kind MEMS microphone package structure.Wherein, MEMS microphone chip can perceive acoustic signal by vibration vibration of membrane, from
And convert acoustical signals into electric signal.Currently, MEMS microphone package structure can be mounted to such as mobile phone, plate electricity
In the different types of electronic equipments such as brain, laptop, VR equipment and intelligent wearable device, application is very extensive.
From the prior art, it is arranged on by the chip assembly that MEMS microphone chip and asic chip form by substrate
In an encapsulating structure made of enclosing with lid, and the sound entered for external voice is additionally provided on the encapsulating structure
Hole (acoustic aperture can according to need design on substrate or lid).However, the vibrating diaphragm in existing MEMS microphone chip is usual
Than relatively thin, the gas shock resistance of vibrating diaphragm is weaker.At this point, when extraneous stronger transient flow enters encapsulation knot by acoustic aperture
When inside structure and acting on vibrating diaphragm, the instantaneous impact that vibrating diaphragm is subject to is larger, be very easy to cause in this way vibrating diaphragm occur rupture,
The bad phenomenons such as damage, the acoustical behavior for eventually resulting in microphone is impaired, influences the normal use of electronic equipment.
Therefore, it is highly desirable to propose a kind of new solution of microphone packaging scheme, to solve to deposit in the prior art
The problem of.
Utility model content
One purpose of the utility model is to provide a kind of new solution of microphone packaging scheme.
First aspect according to the present utility model provides a kind of microphone packaging scheme, including substrate, lid, and
The enclosure space surrounded by substrate and lid further includes the MEMS microphone chip in enclosure space；It further include that setting exists
The lug boss of cavity is surrounded on substrate and with substrate；Connection cavity and the first extraneous acoustic aperture are provided on the substrate；It is described
The second acoustic aperture of connection cavity and MEMS microphone chip is provided on lug boss；And first acoustic aperture is matched with the second acoustic aperture
It is set to not on same airflow path direction.
Optionally, the MEMS microphone chip includes the vibrating diaphragm of substrate and setting with back chamber on substrate；Institute
One end on substrate far from vibrating diaphragm is stated to be arranged on lug boss in planar top position.
Optionally, the MEMS microphone chip includes the vibrating diaphragm of substrate and setting with back chamber on substrate；Institute
Lug boss is stated to extend into the part back chamber of substrate.
Optionally, the substrate is connected on substrate；Either, the two sides of the lug boss, which are additionally provided with, radially outward prolongs
It is stretching and with the integrally formed edge part of the lug boss, the edge part is connected on substrate, and the substrate is connected to side
On edge.
Optionally, first acoustic aperture is the strip-shaped hole upwardly extended in substrate first party or arcuate socket；Either, institute
It states the first acoustic aperture and is provided with multiple, multiple first acoustic aperture is successively arranged on the first direction of substrate.
Optionally, size of first acoustic aperture on the direction perpendicular to the first direction is no more than 0.2mm.
Optionally, second acoustic aperture is the strip-shaped hole upwardly extended in lug boss second party or arcuate socket；Either,
Second acoustic aperture is provided with multiple, and multiple second acoustic aperture is successively arranged in the second direction of lug boss.
Optionally, size of second acoustic aperture in the direction perpendicular to the second direction is no more than 0.2mm.
Optionally, first acoustic aperture is the straight hole perpendicular to surface where it；Either incline relative to surface where it
Oblique angling hole；Second acoustic aperture is the angling hole perpendicular to surface where it, or relative to surface inclination where it
Angling hole.
The second aspect according to the present utility model, provides a kind of electronic equipment, including Mike described in any of the above-described kind
Wind encapsulating structure.
Microphone packaging scheme provided by the embodiment of the utility model improves the structure of acoustic aperture, can be formed
A kind of pair of air-flow has the acoustic aperture structure of blocking, buffer function.When extraneous air-flow flows to MEMS microphone chip through the acoustic aperture
Vibrating diaphragm when, the acoustic aperture of above structure can carry out buffering appropriate, blocking to air-flow, to weaken the intensity and air-flow of air-flow
Fluctuation, and then airflow function can be weakened when on the vibrating diaphragm of MEMS microphone chip to impact force caused by vibrating diaphragm, it avoids
Vibrating diaphragm is damaged.Moreover, the acoustic aperture can also effectively stop the foreign matter being mingled in air-flow to enter in MEMES microphone chip
Portion can play good protection to MEMES microphone chip, so as to extend the service life of MEMES microphone chip.
By the detailed description referring to the drawings to the exemplary embodiment of the utility model, the utility model it is other
Feature and its advantage will become apparent.
Detailed description of the invention
The attached drawing for constituting part of specification describes the embodiments of the present invention, and uses together with the description
In explanation the principles of the present invention.
Fig. 1 is the structural schematic diagram for the microphone packaging scheme that a kind of embodiment of the utility model provides.
Fig. 2 is the structural schematic diagram for the microphone packaging scheme that the utility model another kind embodiment provides.
Fig. 3 is the structural exploded view of microphone packaging scheme provided by the embodiment of the utility model.
Fig. 4 is the structural schematic diagram of integrally formed lug boss and edge part provided by the embodiment of the utility model.
Description of symbols:
1- MEMS microphone chip, 11- vibrating diaphragm, 12- substrate, 13- back chamber, 2- substrate, the first acoustic aperture of 3-, 4- lug boss,
The second acoustic aperture of 5-, the edge part 6-, 7- lid, 8-ASIC chip, 9- cavity.
Specific embodiment
The various exemplary embodiments of the utility model are described in detail now with reference to attached drawing.It should also be noted that unless another
It illustrates outside, the component and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to this is practical
Novel and its application or any restrictions used.
Technology and equipment known to person of ordinary skill in the relevant may be not discussed in detail, but in appropriate situation
Under, the technology and equipment should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Microphone packaging scheme provided by the embodiment of the utility model can be applied to mobile phone, laptop, plate electricity
In a plurality of types of electronic products such as brain, VR equipment, intelligent wearable device, the vibrating diaphragm of MEMS microphone chip can be effectively prevent
Because by outer gas stream instantaneous impact it is excessive due to by destroy the phenomenon that, so as to extend the use of MEMS microphone chip
Service life.Moreover, the microphone packaging scheme also has good acoustical behavior.
The specific structure of microphone packaging scheme provided by the embodiment of the utility model is described further below.
With reference to embodiment shown in fig. 1, a kind of microphone packaging scheme of embodiment offer of the utility model comprising:
Substrate 2, lid 7, and the enclosure space as made of substrate 2 and the enclosing jointly of lid 7；Further include: it is located at the enclosure space
Interior MEMS microphone chip 1 and asic chip 8.
Also, the microphone packaging scheme of the utility model further includes that setting surrounds sky on a substrate 2 and with the substrate 2
The lug boss 4 of chamber 9.It is provided with connection cavity 9 and the first extraneous acoustic aperture 3 on a substrate 2, connection is provided on lug boss 4
Second acoustic aperture 5 of cavity 9 and MEMS microphone chip 1.Extraneous air-flow and sound wave can pass sequentially through the first acoustic aperture 3, second
Acoustic aperture 5 is entered in MEMS microphone chip 1 and is contacted with the vibrating diaphragm 11 of MEMS microphone chip 1.That is, passing through the first sound
Hole 3 and the second acoustic aperture 5 cooperate, and can be used to realize the incoming of external air flow and sound wave.Moreover, refering to what is shown in Fig. 3, described
One acoustic aperture 3 and the second acoustic aperture 5 are configured as not on same airflow path direction.At this point, the gas flowed into from the first acoustic aperture 3
Stream will not directly be flowed out from the second acoustic aperture 5, but could be flowed out from the second acoustic aperture 5 by the change in path.In other words, extraneous
Incoming air-flow completely, will not be flowed to directly in MEMS microphone chip 1 and be acted on its vibrating diaphragm 11.But it can be right
The incoming air-flow in the external world forms certain blocking and buffering, and impact force of such airflow function on vibrating diaphragm 11 will be by obvious weak
Change, and then it is possible to prevente effectively from vibrating diaphragm 11 is caused to damage.The set-up mode of first acoustic aperture 3 and the second acoustic aperture 5 can also be effective
The foreign matter (such as dust, impurity etc.) being mingled in external air flow is stopped to enter in MEMES microphone chip 1, it can be to MEMS wheat
Gram wind chip 1 plays a good protective effect, so as to extend the service life of MEMES microphone chip 1.
Substrate 2 in the utility model can use circuit board well known in the art, such as pcb board etc., the utility model
With no restriction to this.The circuit design of microphone packaging scheme may be implemented using circuit board for substrate 2.
It should be noted that the lug boss 4 can be connected directly between substrate 2 using the mode well known in the art that is fixedly connected
On.Either, refering to what is shown in Fig. 4, being provided with extending radially outwardly in the two sides of lug boss 4 and being integrally formed with lug boss 4
Edge part 6, edge part 6 is connected on a substrate 2 using the mode well known in the art that is fixedly connected.Wherein, lug boss 4 and base
Cavity 9 is formed between plate 2.At this point, can be first flowed into cavity 9, later when extraneous air-flow is after the entrance of the first acoustic aperture 3
It flows in MEMS microphone chip 1 through the second acoustic aperture 5 being arranged upper at the top of lug boss 4 and is contacted with vibrating diaphragm 11.In this course,
The top (not opening up the position of the second acoustic aperture) of lug boss 4 can play certain barrier effect to air-flow, need air-flow
It can just be entered in MEMS microphone chip 1 by the second acoustic aperture 5, impact of the air-flow to vibrating diaphragm 11 can be weakened during being somebody's turn to do
Power, so as to play a good protective effect to vibrating diaphragm 11.
Wherein, the structure of lid 7 are as follows: may include the top opposite with substrate 2, and from top edge towards base
The sidewall portion that 2 direction of plate extends.The semi-surrounding structure of lid 7 is defined by sidewall portion and top, substrate 2 is fixed at lid
7 opening end position, the two together form the encapsulating structure with enclosure space.Wherein, MEMS microphone chip 1 and ASIC
Chip 8 is packaged in inside the enclosure space.In the present embodiment, lid 7 can choose is made using metal material, with
Guarantee that the encapsulating structure formed has effectiveness, ensures the work of its internal MEMS microphone chip 1 and asic chip 8
Make performance not and will receive extraneous influence, so that it is guaranteed that entire microphone packaging scheme can normally work.Certainly, lid 7
Can using other materials well known in the art make, the utility model to this with no restriction.
The microphone packaging scheme of the utility model, extraneous air-flow and sound wave can be successively through the first acoustic aperture 3, the rising tone
Hole 5 and reach the inside of MEMS microphone chip 1 and contacted with vibrating diaphragm 11, thus realize MEMS microphone chip 1 to sound wave believe
The acquisition of breath.Wherein, MEMS microphone chip 1 is the transducer part for converting voice signal to electric signal.The MEMS microphone
Chip 1 utilizes MEMS(MEMS) technique production.
Refering to what is shown in Fig. 1, the structure of MEMS microphone chip 1 are as follows: including having the substrate 12 of back chamber 13 and setting to exist
Vibrating diaphragm 11 and back pole plate on the substrate 12, and multiple air holes are provided on the back pole plate.Wherein, in installation MEMS Mike
When wind chip 1, the substrate 12 of MEMS microphone chip 1 can be directly connected on a substrate 2, to realize to MEMS Mike
Wind chip 1 is installed.The substrate 12 of MEMS microphone chip 1 can also be connected on lug boss 4, the utility model does not make this
Limitation.
With reference to Fig. 2, in the present embodiment, one end on substrate 12 far from vibrating diaphragm 11 is arranged on lug boss 4 in planar
Top position.Usually, the volume of MEMS microphone chip 1 is smaller, and when installation will not occupy too big space, is arranged
Position is more flexible.Substrate 12 is connected directly between the top position of lug boss 4 by selection in the present embodiment, which realizes
Get up it is fairly simple, not will increase cost of manufacture.Importantly, the mounting means forms the base of air-flow buffer structure in guarantee
On plinth, entire encapsulating structure appropriate can be reduced in the size of short transverse.Wherein, the substrate 12 of MEMS microphone chip 1
The top position of lug boss 4 can be fixedly connected on using adhesive, the connection type is simple, stability is good and cost is relatively low.
It is of course also possible to use it is well known in the art it is other be fixedly connected mode the substrate 12 of MEMS microphone chip 1 is connected to it is convex
Rise portion 4 top position, the utility model to this with no restriction.
In the embodiment shown in fig. 1, the substrate 12 of MEMS microphone chip 1 is connected on edge part 6, lug boss 4
It can extend into the part back chamber 13 of substrate 12.That is, being by the substrate 12 of MEMS microphone chip 1 in the present embodiment
It is connected on edge part 6, and is conducive to the part back chamber 13 of substrate 12 to accommodate lug boss 4, which can further decrease whole
A microphone packaging scheme is advantageously implemented electronic product when being applied in electronic product in the size of short transverse
It is lightening.Also, which does not interfere with the volume of entire encapsulation back cavity, can guarantee the acoustics of microphone packaging scheme
Performance.
It further include having asic chip 8 in microphone packaging scheme other than above-mentioned MEMS microphone chip 1.In general,
Asic chip 8 links together with MEMS microphone chip 1, and the electric signal that MEMS microphone chip 1 is exported transmits
Into asic chip 8, and by the processing of asic chip 8, output.It wherein, can be between MEMS microphone chip 1 and asic chip 8
It is electrically connected by plain conductor (bonding wire), to realize the conducting of the two.Certainly, MEMS microphone chip 1 and ASIC core
Can also be by the way of upside-down mounting through the circuit layout conducting in substrate 2 between piece 8, this belongs to the public affairs of those skilled in the art
Know common sense, the utility model no longer illustrates herein.Wherein, asic chip 8 can be fixedly connected on substrate 2 using adhesive
On.It is of course also possible to use other modes that are fixedly connected well known in the art connect asic chip 8 on a substrate 2, this is practical
It is novel to this with no restriction.
In addition, it is necessary to explanation, the present embodiment 1 is only a kind of specific implementation of the utility model microphone packaging scheme
Mode.In actual application, lug boss 4 can also be set on lid 7, cavity 9 is surrounded by lug boss 4 and lid 7.This
When, the first acoustic aperture 3 is arranged on lid 7, the second acoustic aperture 5 is arranged on lug boss 4, to form microphone packaging scheme
Acoustic aperture.That is, the acoustic aperture of microphone packaging scheme also can be set on lid 7, the utility model to this with no restriction.
The shape of the utility model acoustic aperture and position can be configured according to actual needs, such as in the utility model one
In a optional embodiment, the first acoustic aperture 3 is the strip-shaped hole upwardly extended in 2 first party of substrate or arcuate socket.For item
The development length of shape hole or arcuate socket can be adjusted flexibly according to actual needs, the utility model to this with no restriction.First
Acoustic aperture 3 can be connected to extraneous and the second acoustic aperture 5, to realize being passed to for external air flow and sound wave.Certainly, make extraneous gas to reach
The effect that stream and sound wave are passed to, the first acoustic aperture 3 are not limited to above structure, the first acoustic aperture 3 can be set it is multiple, and multiple first
Acoustic aperture 3 is successively arranged on the first direction of substrate 2.Such as: multiple first acoustic aperture 3 on the first direction of substrate 2 in etc. between
Away from successively arranging.And when the first acoustic aperture 3 is provided with multiple, connect each first acoustic aperture 3 with extraneous and the second acoustic aperture 5
It is logical.The setting quantity of first acoustic aperture 3 can according to need flexible choice, the utility model to this with no restriction.
It should be noted that the first acoustic aperture 3 may be either perforation pore structure, it is also possible to the structure of other through substrates 2.Separately
Outside, when the first acoustic aperture 3 is set as multiple, the first acoustic aperture 3 can be round hole, square hole, slot, slotted eye,
Tri-angle-holed, diamond hole or parallelogram hole etc..The technology effect of the utility model can be achieved in first acoustic aperture 3 of diversified forms
Fruit is more conducive to fabricating, and practicability, reliability are higher.
Also, size (width) needs of first acoustic aperture 3 on the direction perpendicular to the first direction are no more than
0.2mm.It is using the reason of design: if width of first acoustic aperture 3 on the direction of vertical first direction is more than 0.2mm,
Then width of first acoustic aperture 3 on the direction of vertical first direction will be wide, this will will lead to the buffering to air-flow, stops effect
Fruit is substantially reduced, and will reduce to the strength reduction effect of the transient flow entered in MEMS microphone chip 1.
First acoustic aperture 3 is set on a substrate 2.Optionally, the first acoustic aperture 3 can be for perpendicular to the straight of surface where it
Hole.Certainly, the first acoustic aperture 3 may be relative to the inclined angling hole in surface where it.Two kinds of above-mentioned Kong Junke are so that gas
Stream smoothly passes over.It is specifically applying, straight hole or angling hole can set by the first acoustic aperture 3 as the case may be, this
Utility model to this with no restriction.
Wherein, the second acoustic aperture 5 is the strip-shaped hole upwardly extended in 4 top position second party of lug boss or arcuate socket.It is right
Can be adjusted flexibly according to actual needs in the development length of strip-shaped hole or arcuate socket, the utility model to this with no restriction.
Second acoustic aperture 5 can be connected to the first acoustic aperture 3 and MEMS microphone chip 1, to realize that external air flow and sound wave are passed to MEMS wheat
In gram wind chip 1.Certainly, in order to realize external air flow harmony wave energy be passed to MEMS microphone chip 1 in effect, the second acoustic aperture
5 are also not necessarily limited to above structure, and the second acoustic aperture 5 also can be set multiple, and multiple second acoustic aperture 5 are in 4 top position of lug boss
It successively arranges in second direction.Such as: multiple second acoustic aperture 5 in the top position second direction of lug boss 4 equally according to
Secondary arrangement.Moreover, when the second acoustic aperture 5 is set as multiple, each second acoustic aperture 5 with the first acoustic aperture 3 and MEMS microphone core
Piece 1 is connected to.The setting quantity of second acoustic aperture 5 can according to need flexible choice, the utility model to this with no restriction.
Similarly, the second acoustic aperture 5 may be either perforation pore structure, be also possible to the structure at other 4 tops of perforation lug boss, this
Utility model to this with no restriction.Also, when the second acoustic aperture 5 is set as multiple, the second acoustic aperture 5 can be round hole, just
Square hole, slot, slotted eye, tri-angle-holed, diamond hole or parallelogram hole etc..Second acoustic aperture 5 of diversified forms
The technical effect that the utility model can be achieved, is more conducive to fabricating, practicability, reliability are higher.
Also, size (width) needs of second acoustic aperture 5 in the direction perpendicular to the second direction are no more than
0.2mm.It is using the reason of design: if width of second acoustic aperture 5 on the direction of vertical second direction is more than 0.2mm,
Then width of second acoustic aperture 5 on the direction of vertical second direction will be wide, this will will lead to the buffering to air-flow, stops effect
Fruit is substantially reduced, and will reduce to the strength reduction effect of the transient flow entered in MEMS microphone chip 1.
The top position of lug boss 4 is arranged in second acoustic aperture 5.Optionally, the second acoustic aperture 5 can be for perpendicular to table where it
The straight hole in face.Second acoustic aperture 5 may be relative to the inclined angling hole in surface where it.Above-mentioned two ways can make
Air-flow smoothly passes through.In the application, straight hole or angling hole, this reality can be set by the second acoustic aperture 5 as the case may be
With it is novel to this with no restriction.
In the utility model, the shape of the first acoustic aperture 3 and the second acoustic aperture 5 be may be the same or different, the utility model
With no restriction to this.
For example, when the first acoustic aperture 3, the second acoustic aperture 5 are separately positioned on the lug boss 4 and substrate 2 being parallel to each other, and adopt
When with straight hole, needs to mutually stagger the first acoustic aperture 3, the second acoustic aperture 5, can just make the air-flow of the first acoustic aperture 3, the second acoustic aperture 5
Circulation path is different.
When angling hole is respectively adopted in the first acoustic aperture 3, the second acoustic aperture 5, need to make the axis of two angling holes not same
On tilt axis, to guarantee directly impact the second acoustic aperture 5 from the air-flow that the first acoustic aperture 3 circulates.
It should be noted that first direction described in the utility model and second direction can be same direction, it can also
To be different direction.When the first direction and second direction are same directions, the first acoustic aperture 3 and the second acoustic aperture 5 are answered
When being in mutually stagger setting, so that the first acoustic aperture 3 and the second acoustic aperture 5 be not on same airflow path direction.When described
When first direction and second direction are not the same directions, refering to what is shown in Fig. 3, being separately positioned on there are two the settings of the first acoustic aperture 3
The two sides of second acoustic aperture 5.When the first acoustic aperture 3 and the second acoustic aperture 5 be not on same airflow path direction, the first acoustic aperture 3
The structure constituted with the second acoustic aperture 5 is a kind of with buffering, the structure of barrier effect for air-flow.That is, when outer
During the vibrating diaphragm 11 of the air flow direction MEMS microphone chip 1 on boundary, which can be buffered air-flow, at blocking
Reason, so as to weaken the intensity of the transient flow entered in MEMS microphone chip 1, and weakens the fluctuation of air-flow, in turn
Can to avoid MEMS microphone chip 1 vibrating diaphragm 11 by instantaneously compared with the impact of air blast, avoiding the vibration of MEMS microphone chip 1
Film 11 is destroyed because outer gas stream is excessive.That is, structure design can improve the energy that microphone resists outer gas stream impact
Power.For conventional acoustic aperture structure, structure design has good dust-proof effect, can reduce external foreign matter entrance
The risk of MEMS microphone chip 1 and asic chip 8.Moreover, because sound is usually to pass in the form of a sound wave in air
It passs, although air-flow is partially obstructed, sound can easily penetrate above structure, therefore structure design can't shadow
Ring the acoustic efficiency for arriving microphone packaging scheme.In the present embodiment, in order to realize optimal buffering, blocking effect, can make
The projection square crossing of first direction and second direction in the same plane.
For the height of lug boss 4, height should be selected reasonably.If the height dimension mistake of lug boss 4
Greatly, then it is unfavorable for the encapsulation to MEMS microphone chip 1 and asic chip 8, can not only increases the technology difficulty of encapsulation, also increase
Production cost.Meanwhile it being also highly detrimental to make microphone miniaturization, micromation.Therefore, it should reasonably adjust according to the actual situation
It is whole.
On the other hand, the utility model additionally provides a kind of electronic equipment, which includes foregoing Mike
Wind encapsulating structure.The specific structure of the microphone packaging scheme can refer to embodiment 1 and embodiment 2 above-mentioned.
Wherein, electronic equipment can be mobile phone, laptop, tablet computer, VR equipment, intelligent wearable device etc., this
Utility model to this with no restriction.
Although being described in detail by some specific embodiments of the example to the utility model, this field
It is to be understood by the skilled artisans that above example merely to be illustrated, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case where, to above embodiments
It modifies.The scope of the utility model is defined by the following claims.
Claims (10)
1. a kind of microphone packaging scheme, which is characterized in that including substrate, lid, and the closing surrounded by substrate and lid
Space further includes the MEMS microphone chip in enclosure space；
It further include the lug boss for being disposed on the substrate and surrounding with substrate cavity；Connection cavity and the external world are provided on the substrate
The first acoustic aperture；The second acoustic aperture of connection cavity and MEMS microphone chip is provided on the lug boss；And first sound
Hole and the second acoustic aperture are configured as not on same airflow path direction.
2. microphone packaging scheme according to claim 1, which is characterized in that the MEMS microphone chip includes having
Carry on the back the vibrating diaphragm of the substrate and setting of chamber on substrate；It is in plane that one end on the substrate far from vibrating diaphragm, which is arranged on lug boss,
The top position of shape.
3. microphone packaging scheme according to claim 1, which is characterized in that the MEMS microphone chip includes having
Carry on the back the vibrating diaphragm of the substrate and setting of chamber on substrate；The lug boss is extend into the part back chamber of substrate.
4. microphone packaging scheme according to claim 3, which is characterized in that the substrate is connected on substrate；Or
Be, the two sides of the lug boss be additionally provided with it is extending radially outwardly and with the integrally formed edge part of the lug boss, it is described
Edge part is connected on substrate, and the substrate is connected on edge part.
5. microphone packaging scheme according to claim 1, which is characterized in that first acoustic aperture is in substrate first party
The strip-shaped hole or arcuate socket upwardly extended；
Either,
First acoustic aperture is provided with multiple, and multiple first acoustic aperture is successively arranged on the first direction of substrate.
6. microphone packaging scheme according to claim 5, which is characterized in that first acoustic aperture is perpendicular to described
Size on the direction in one direction is no more than 0.2mm.
7. microphone packaging scheme according to claim 1, which is characterized in that second acoustic aperture is in lug boss second
The strip-shaped hole or arcuate socket just upwardly extended；
Either,
Second acoustic aperture is provided with multiple, and multiple second acoustic aperture is successively arranged in the second direction of lug boss.
8. microphone packaging scheme according to claim 7, which is characterized in that second acoustic aperture is perpendicular to described
Size on the direction in two directions is no more than 0.2mm.
9. microphone packaging scheme according to claim 1, which is characterized in that first acoustic aperture is perpendicular to where it
The straight hole on surface；Either relative to the inclined angling hole in surface where it；
Second acoustic aperture is the straight hole perpendicular to surface where it, or relative to the inclined angling hole in surface where it.
10. a kind of electronic equipment, which is characterized in that including microphone packaging scheme as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920343504.1U CN208783110U (en) | 2019-03-19 | 2019-03-19 | Microphone packaging scheme and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920343504.1U CN208783110U (en) | 2019-03-19 | 2019-03-19 | Microphone packaging scheme and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN208783110U true CN208783110U (en) | 2019-04-23 |
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ID=66163804
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| CN201920343504.1U Active CN208783110U (en) | 2019-03-19 | 2019-03-19 | Microphone packaging scheme and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN208783110U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112995866A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | Sensor packaging structure and electronic equipment |
-
2019
- 2019-03-19 CN CN201920343504.1U patent/CN208783110U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112995866A (en) * | 2021-02-23 | 2021-06-18 | 歌尔微电子股份有限公司 | Sensor packaging structure and electronic equipment |
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