CN210958790U - Microphone structure with improved substrate - Google Patents

Abstract

The embodiment of the utility model discloses a microphone structure with improved base material, which comprises an L-shaped base plate, wherein the front section of the L-shaped base plate is L-shaped; the packaging shell and the L-shaped substrate form a microphone acoustic cavity; the microphone acoustic cavity is internally provided with: an acoustic sensor; the special integrated chip is in signal connection with the acoustic sensor; an acoustics through-hole, set up in L type base plate or on the encapsulation shell, designed L type ceramic substrate to set up the pad on the perpendicular of L type substrate, thereby make electronic equipment weld on the perpendicular of L type substrate, thereby avoided on the substrate electronic equipment too much and the electronic equipment that causes lays the area too big, utilize the installation space on the vertical face of microphone and the horizontal plane as far as possible, thereby reduced the length or the width of microphone, reached and reduced microphone size, the purpose of high integration.

Description

Microphone structure with improved substrate

Technical Field

The utility model relates to an electronic equipment field especially relates to a improve microphone structure of substrate.

Background

A Microphone, known as a Microphone, is an energy conversion device that converts a sound signal into an electrical signal, and is transliterated from the english word "Microphone". Also called microphone, microphone. In the twentieth century, microphones were developed from the initial sound-electricity conversion by resistance to the inductance-capacitance conversion, and a great number of new microphone technologies were developed, including aluminum strip, moving coil, etc., as well as condenser microphones and electret microphones which are widely used at present.

The silicon microphone is based on the CMOSMEMS technology and has smaller volume. The consistency will be more than 4 times better than that of electret capacitor microphones, so MEMS microphones are particularly suitable for cost-effective microphone array applications, where a better matched microphone will improve sound wave formation and reduce noise.

In the micro-electro-mechanical microphone in the prior art, a PCB is adopted as a substrate, and a bonding pad is positioned on the bottom surface of the PCB; the advantages are low cost, simple process and intensive production, and the structure has the problems of limited integration and incapability of meeting the requirement of customers on the minimum length or width size.

Disclosure of Invention

An object of the utility model is to provide an improve microphone structure of substrate, solve above technical problem.

The utility model provides a technical problem can adopt following technical scheme to realize:

a microphone structure with improved substrate comprises

The front section of the L-shaped substrate is L-shaped;

the packaging shell and the L-shaped substrate form an acoustic cavity of the microphone; the microphone acoustic cavity is internally provided with:

an acoustic sensor;

the special integrated chip is in signal connection with the acoustic sensor;

and the acoustic through hole is arranged on the L-shaped substrate or the packaging shell.

Preferably, the L-shaped substrate is an integrally formed ceramic substrate.

Preferably, the L-shaped substrate includes a first substrate and a second substrate vertically connected to the first substrate, the length of the second substrate is smaller than that of the first substrate, and a plurality of pads are disposed on the first substrate or the second substrate.

Preferably, the acoustic sensor and the asic are disposed on the first substrate, the acoustic through hole is disposed at a position where the acoustic sensor is mounted on the first substrate, and the bonding pad is disposed on an outer side surface of the first substrate.

Preferably, the acoustic sensor is disposed on the first substrate, and the application specific integrated chip is disposed on the second substrate.

Preferably, the asic is disposed on the first substrate, the acoustic sensor is disposed on the second substrate, the acoustic through hole is disposed at a mounting position of the acoustic sensor on the second substrate, and the bonding pad is disposed on an outer side surface of the second substrate.

Preferably, the acoustic vias are disposed on a top or side surface of the package housing.

Preferably, the package housing is a metal housing.

Preferably, the package housing is an L-shaped package housing, and the package housing is matched with the L-shaped substrate to form the acoustic cavity.

Has the advantages that: the utility model discloses a L type ceramic substrate, and set up the pad on the perpendicular of L type substrate, thereby make electronic equipment weldable on the perpendicular of L type substrate, thereby the too much electronic equipment that causes on the substrate has been avoided and the area is too big laid, make use of installation space on the vertical face of microphone and the horizontal plane as far as possible, thereby the length or the width of microphone have been reduced, reach and reduce the microphone size, the purpose of high integration, and L type ceramic substrate has high temperature resistance function, the high temperature damage of high integration electronic device has been avoided, the life-span of microphone has been prolonged, and special integrated chip and acoustic sensor have multiple mounting means, and wide applicability, the setting of acoustics through-hole is also nimble various, and is applicable to multiple equipment.

Drawings

Fig. 1 is a schematic cross-sectional structural diagram of a microphone according to an embodiment of the present invention;

fig. 2 is a schematic perspective view of a microphone according to an embodiment of the present invention;

fig. 3 is a schematic view illustrating another arrangement of an acoustic through hole on a microphone according to a first embodiment of the present invention;

fig. 4 is a schematic diagram of an internal cross-sectional structure of a second microphone according to an embodiment of the present invention;

fig. 5 is a schematic diagram of an internal cross-sectional structure of a three-microphone according to an embodiment of the present invention.

In the figure: a 1-L-shaped substrate; 2-a pad; 3-an acoustic sensor; 4-special integrated chip; 5-an acoustic via; 6-packaging the shell; 7-an acoustic cavity;

11-a first substrate; 12-second substrate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

The present invention will be further described with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.

Example one

As shown in fig. 1 and 2, the present invention provides a microphone structure with improved substrate, which comprises

An L-shaped substrate 1, wherein the front section of the L-shaped substrate 1 is L-shaped;

a packaging shell 6, which forms a microphone acoustic cavity 7 with the L-shaped substrate 1; the microphone acoustic cavity 7 is internally provided with:

an acoustic sensor 3;

the special integrated chip 4 is in signal connection with the acoustic sensor 3;

an acoustic through hole 5 is disposed on the L-shaped substrate 1 or the package housing 6.

The utility model has the advantages that:

the utility model discloses a L type ceramic substrate to set up the pad on the perpendicular of L type substrate, thereby make electronic equipment weldable on the perpendicular of L type substrate, thereby avoided on the substrate electronic equipment too much and the electronic equipment that causes lay the area too big, utilize the installation space on the vertical face of microphone and the horizontal plane as far as possible, thereby reduced the length or the width of microphone, reach and reduce the microphone size, the purpose of high integration.

As a preferred embodiment of the present invention, the L-shaped substrate 1 is an integrally formed ceramic substrate. The ceramic substrate has the function of high temperature resistance, avoids high-temperature damage of highly integrated electronic devices, and prolongs the service life of the microphone.

As a preferred embodiment of the present invention, the package housing 6 is a metal housing.

Encapsulation shell 6 is L shape in the positive cross-section, and encapsulation shell 6's the short lateral part bottom of length and the one end top fixed connection of first base plate 11, and the long lateral part one end of encapsulation shell 6 length and the top fixed connection of the medial surface of second base plate 12, the volume of whole microphone has been saved to the mode of connecting like this, connects compacter, and the gap is littleer, and sealing performance is good.

As a preferred embodiment of the present invention, the L-shaped substrate 1 includes a first substrate 11 and a second substrate 12 vertically connected to the first substrate 11, the length of the second substrate 12 is smaller than that of the first substrate 11, and a plurality of pads 2 are disposed on the first substrate 11 or the second substrate 12.

As a preferred embodiment of the present invention, the acoustic sensor 3 and the asic 4 are disposed on the first substrate 11, the acoustic through hole 5 is disposed at the mounting position of the acoustic sensor 3 on the first substrate 11, and the bonding pad 2 is disposed on the outer side surface of the first substrate 11. The bonding pad 2 is used for being electrically connected with external equipment and transmitting signals in the microphone to the outside of the microphone.

Some electronic devices of the traditional microphone are directly welded on a flat plate type substrate, and if a large number of electronic devices are arranged, the area of the substrate is required to be large enough, so that the whole volume of the microphone is large. Preferably, as shown in fig. 2, the utility model designs an L-shaped substrate 1, install acoustic sensor 3 and application specific integrated chip 4 on first substrate 11, install electric capacity, resistance and some microphone necessary circuit chip on the vertical face of second substrate 12 (or install acoustic sensor 3 on second substrate 12, other electron device are installed on first substrate 11), the horizontal space and the vertical space of L-shaped substrate 1 have been utilized greatly like this, convert the plane installation into the plane, the mode that the three-dimensional installation combines, thereby the length of L-shaped substrate 1 has been reduced, thereby the area occupied of base plate has significantly reduced. And the L-shaped substrate 1 is manufactured by adopting an integrated forming process, so that the manufacturing is convenient and fast, and the structure is compact. Therefore, the total volume of the microphone is reduced as much as possible along the direction of the x axis or the y axis in fig. 2, the length or the width of the substrate is greatly reduced, and the effect of reducing the area of the substrate is achieved.

As a preferred embodiment of the present invention, the package housing 6 may be provided with an acoustic through hole 5 (or not), the acoustic through hole 5 is used to receive the speaking voice of the external user, so that the silicon diaphragm on the acoustic sensor 3 generates vibration, then the acoustic sensor 3 converts the voltage variation generated by the vibration of the silicon diaphragm into an electrical signal and transmits the electrical signal to the integrated chip 4 dedicated for the microphone, so that the signal is converted into a signal capable of being transmitted and received, and the signal is transmitted to the receiving terminal such as the speaker.

Preferably, an acoustic port is provided on the side of the package housing 6, the acoustic port 5 communicating with the acoustic cavity 7. The acoustic vias may be mounted at the vertical corners of the device such that adjacent sides of the device have acoustic vias and the other acoustic via can still receive sound when either side is covered (e.g., when the flip device is closed). The design of the two acoustic vias 5 increases the sound's way into the microphone, thereby increasing the fault tolerance of the microphone. I.e. when any one of the acoustic through holes 5 is damaged or blocked, sound can enter the microphone through the other sound through hole 5. Is suitable for more types of equipment.

In addition, as shown in fig. 3, the acoustic through holes 5 may also be disposed on the top surface of the package housing 6, and the air inlet directions of the two acoustic through holes 5 are opposite, so that after the microphone is mounted on the device, the two acoustic through holes 5 can be located on two opposite surfaces of the device, and thus when the microphone is disposed in the center of the front surface of the flip device, there is no need to worry about the problem that the microphone cannot receive sound after the flip device is closed (because the acoustic through holes 5 on the back of the device can easily receive sound).

Example two

As shown in fig. 4, the acoustic sensor 3 is provided on the first substrate 11, and the application specific integrated chip 4 is provided on the second substrate 12.

Relative to the first embodiment, the adjustment of this embodiment is:

the asic 4 on the first substrate 11 is moved to the outer side of the second substrate 12, and the rest is not changed. The advantages of such a design are: the mounting surface of the acoustic sensor 3 and the mounting surface of the application-specific integrated chip 4 can be separated, so that other transfer electronic devices such as resistors, signal processors and the like can be mounted between the acoustic sensor and the application-specific integrated chip, and the acoustic sensor and the application-specific integrated chip are not easy to transmit heat and do not interfere with each other due to the increase of the distance between the acoustic sensor and the application-specific integrated chip, and the sound transmission effect is better.

EXAMPLE III

As shown in fig. 5, the application specific integrated chip 4 is provided on the first substrate 11, the acoustic sensor 3 is provided on the second substrate 12, the acoustic through hole 5 is provided at the mounting position of the acoustic sensor 3 on the second substrate 12, and the bonding pad 2 is provided on the outer side surface of the second substrate 12.

Relative to the first embodiment, the adjustment of this embodiment is:

the acoustic sensor 3 on the first substrate 11 is replaced on the second substrate 12, and the acoustic through hole 5 on the first substrate 11 is used for converting the position of the acoustic sensor 3 on the second substrate 12, so that the microphone sound transmission efficiency is better. In addition, the bonding pad 2 may also be disposed on the outer side surface of the second substrate 12 to facilitate connection of the microphone with external devices.

According to the three embodiments, the installation positions of the application specific integrated chip 7, the acoustic sensor 3 and the bonding pad 2 are not fixed, and the microphone with special functions can be customized according to the characteristics of the equipment, so that the practicability is good. In addition, the number and the positions of the acoustic through holes 5 are not limited, and the acoustic through holes can be flexibly adjusted according to the sealing property and the ventilation property of the equipment, so that the microphone is suitable for most of sound equipment, and the applicability is wide.

The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the invention, and it should be appreciated by those skilled in the art that various equivalent substitutions and obvious changes made in the specification and drawings should be included within the scope of the present invention.

Claims (9)

1. A microphone structure with improved substrate is characterized by comprising

The front section of the L-shaped substrate is L-shaped;

the packaging shell and the L-shaped substrate form an acoustic cavity of the microphone; the acoustic cavity is internally provided with:

an acoustic sensor;

the special integrated chip is in signal connection with the acoustic sensor;

and the acoustic through hole is arranged on the L-shaped substrate or the packaging shell.

2. The microphone structure of claim 1, wherein the L-shaped substrate is a ceramic substrate formed integrally.

3. The microphone structure of claim 1, wherein the L-shaped substrate comprises a first substrate and a second substrate vertically connected to the first substrate, the second substrate has a smaller length than the first substrate, and a plurality of pads are disposed on the first substrate or the second substrate.

4. The microphone structure of claim 3, wherein the acoustic sensor and the asic are disposed on the first substrate, the acoustic through hole is disposed at a position where the acoustic sensor is mounted on the first substrate, and the bonding pad is disposed on an outer side of the first substrate.

5. The improved substrate microphone structure as claimed in claim 3, wherein the acoustic sensor is disposed on the first substrate, and the asic is disposed on the second substrate.

6. The microphone structure of claim 3, wherein the asic is disposed on the first substrate, the acoustic sensor is disposed on the second substrate, the acoustic through hole is disposed at a position where the acoustic sensor is mounted on the second substrate, and the bonding pad is disposed on an outer side of the second substrate.

7. The substrate modified microphone structure of claim 1, wherein the acoustic vias are disposed on a top or side surface of the package housing.

8. The improved substrate microphone structure as claimed in claim 1, wherein the package housing is a metal housing.

9. The improved substrate microphone structure as claimed in claim 1, wherein the package housing is an L-shaped package housing, and the L-shaped substrate is matched with the package housing to form the acoustic cavity.

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