CN104219612A - Front sound entering MEMS (Micro Electro Mechanical Systems) microphone - Google Patents
Front sound entering MEMS (Micro Electro Mechanical Systems) microphone Download PDFInfo
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- CN104219612A CN104219612A CN201410511198.XA CN201410511198A CN104219612A CN 104219612 A CN104219612 A CN 104219612A CN 201410511198 A CN201410511198 A CN 201410511198A CN 104219612 A CN104219612 A CN 104219612A
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- chip
- mems
- circuit board
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- leading part
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- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims description 39
- 239000000565 sealant Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 239000012530 fluid Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Abstract
The invention provides a front sound entering MEMS (Micro Electro Mechanical Systems) microphone. The front sound entering MEMS microphone comprises an MEMS chip and an ASCI (Application Specific Integrated Circuit) chip which are internally arranged between a chamber formed between an outer casing and a circuit board; a metal wire connects the MEMS chip and the ASIC chip; the MEMS chip is fixed on the internal wall at the top of an outer casing; a back chamber is formed between the external side of the MEMS chip, the outer casing and the circuit board; a sound hole is formed in a casing portion to which the internal side of the MEMS faces; a front chamber is formed between the sound hole and the internal side of the MEMS chip; the top of a guiding part is fixed on the outer casing and the bottom which is provided with a bonding pad is fixed on the circuit board; the guiding part enables the MEMS chip, the ASIC chip and the circuit board to be communicated through the metal wire. The front sound entering MEMS microphone is relatively large in back chamber size and can provide a relatively high signal to noise ratio.
Description
Technical field
The present invention relates to microphone field, specifically, relate to a kind of advance sound MEMS microphone that can produce relative high s/n ratio.
Background technology
MEMS microphone is the microphone manufactured based on Micro Electro Mechanical System (Microelectromechanical Systems, is abbreviated as MEMS) technology.In prior art, advance sound MEMS microphone is a kind of conventional microphone.Fig. 1 is the structural representation of advance sound MEMS microphone of the prior art.
As shown in Figure 1, advance sound MEMS microphone comprises MEMS chip 2 ' and ASIC(Application Specific Integrated Circuit, be abbreviated as ASIC) chip 3 ', and be provided with on the circuit board 1 ' of pad bottom being all positioned at, three is connected by plain conductor 4 '; Sound hole 5 ' is arranged on shell 6 ', and the space between the outside and shell 6 ' of MEMS chip 2 ', printed circuit board (PCB) 1 ' is considered to ante-chamber 11 ', and the cavity of MEMS chip 2 ' bottom is considered to carry on the back chamber 21 '.The structures shape of the advance sound MEMS microphone size of its signal to noise ratio.The ratio of the power that signal to noise ratio refers to the output signal of amplifier and the noise power simultaneously exported, the higher noise showing that it produces of the signal to noise ratio of equipment is fewer.Signal to noise ratio is larger, and illustrate that the noise be mixed in signal is less, the sound quality of acoustic playback is higher.
Signal to noise ratio is relevant to back of the body chamber size, and back of the body chamber is larger, and the signal to noise ratio that can accomplish is higher.The back of the body chamber of advance sound MEMS microphone is only limitted to the cavity of MEMS chip 2 ' bottom, ante-chamber much larger than back of the body chamber, so advance sound MEMS microphone is difficult to produce high signal to noise ratio relatively.
Therefore, existing advance sound MEMS microphone is needed to be improved, to improve the signal to noise ratio of advance sound MEMS microphone.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of advance sound MEMS microphone, and back of the body cavity volume increases relatively, and can produce the advance sound MEMS microphone of relative high s/n ratio.
For achieving the above object, the invention provides a kind of advance sound MEMS microphone, it comprises: MEMS chip and asic chip are built between the cavity of shell and circuit board formation, metal wire connects described MEMS chip and described asic chip, described MEMS chip is fixed on described housing top end inwall, is formed and carry on the back chamber outside described MEMS chip and between described shell and described circuit board; Sound hole is opened on described housing right inside described MEMS chip, forms ante-chamber between inside described sound hole and described MEMS chip; The top of the company's of leading part is fixing, and bottom is provided with pad and is fixed on described circuit board on the housing, described in the company's of leading part realize described MEMS chip, conducting between described asic chip and described circuit board by described metal wire.
Preferably, described shell and described circuit board form cavity by sealant sealing.
Preferably, described asic chip is fixed on described housing top end inwall.
Preferably, the company's of leading part described in is positioned at described MEMS chip and asic chip the same side.
Preferably, described asic chip is fixed on described circuit board.
Preferably, described in, the company's of leading part is between described MEMS chip and asic chip.
Preferably, described in the top of the company's of leading part bonding by fixing glue with described shell, pad solder described in bottom or fixing glue are bonded on described circuit board.
Preferably, bonding by fixing glue with described shell bottom described MEMS chip, pass through fixing glue with described shell or described circuit board bottom described asic chip bonding.
Preferably, described in the bottom of the company's of leading part body stepped, described in the company's of leading part top bonding by fixing glue with described shell, pad solder described in bottom or fixing glue are bonded on described circuit board.
In addition, preferably, described asic chip be fixed on described on the company's of leading part body.
From above-mentioned description with put into practice, advance sound MEMS microphone provided by the invention, one, MEMS chip is fixed on shell, and sound hole is arranged on shell corresponding inside MEMS chip, forms ante-chamber inside MEMS chip and between shell, and outside MEMS chip and shell, formed between circuit board and carry on the back chamber, the volume in back of the body chamber obviously increases relative to the volume of advance sound MEMS microphone of the prior art, so signal to noise ratio will improve, forms the MEMS microphone with high s/n ratio; Its two, in the confined space that shell and circuit board are formed, be provided with the company's of leading part, the company's of leading part one end is fixed on shell, and one end is fixing on circuit boards, plays the effect that conducting between the effect of support and chip with circuit board is connected; The company's of leading part is for the conducting of MEMS chip, asic chip and circuit board, thus, the relative position of MEMS chip, asic chip can be arranged flexibly, especially the position of asic chip can be arranged on shell, on circuit board and on the company's of leading part, connect to coordinate the conducting of the two, the position of leading part and shape also relative flexibly, MEMS chip, asic chip the same side or therebetween can be arranged on.
Accompanying drawing explanation
By below in conjunction with the description of accompanying drawing to embodiment, above-mentioned characteristic sum technological merit of the present invention will become apparent and easy understand.In the accompanying drawings,
Fig. 1 is the structural representation of advance sound MEMS microphone of the prior art;
Fig. 2 is the schematic diagram of the advance sound MEMS microphone described in one embodiment of the invention;
Fig. 3 is the schematic diagram of the advance sound MEMS microphone described in further embodiment of this invention;
Fig. 4 is the schematic diagram of the advance sound MEMS microphone described in third embodiment of the invention;
Fig. 5 is the schematic diagram of the advance sound MEMS microphone described in fourth embodiment of the invention;
Fig. 6 is the schematic diagram of the advance sound MEMS microphone described in fifth embodiment of the invention.
MEMS microphone 100 '
1 ': printed circuit board (PCB); 2 ': MEMS chip; 3 ': asic chip; 4 ': gold thread;
5 ': sound hole; 6 ': shell; 7 ': pad; 11 ': ante-chamber; 21: back of the body chamber ':
Advance sound MEMS microphone 100
1: circuit board; 2:MEMS chip; 3:ASIC chip; 4: metal wire;
5: sound hole; 6: shell; 7: the company's of leading part; 71: pad; 8: fixing glue; 9: fluid sealant;
10: back of the body chamber; 20: ante-chamber.
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, and below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 2 is the schematic diagram of the advance sound MEMS microphone described in one embodiment of the invention.As shown in Figure 2, advance sound MEMS microphone 100 comprises circuit board 1, MEMS chip 2, asic chip 3, metal wire 4, sound hole 5, shell 6, the company's of leading part 7 and fixing glue 8.
MEMS chip 2 and asic chip 3 are built between the cavity of shell 6 and circuit board 1 formation.Preferably, shell 6 and circuit board 1 are sealed by fluid sealant 9 and form cavity.In the present embodiment, MEMS chip 2 and asic chip 3 are all fixed on shell 6.Preferably, bonding by fixing glue 8 with shell 6 bottom MEMS chip 2, bonding by fixing glue 8 with shell 6 bottom asic chip 3.MEMS chip 2 is connected by metal wire 4 with asic chip 3.In the present embodiment, gold thread is adopted to connect between MEMS chip 2 and asic chip 3.
MEMS chip 2 is fixed on the inwall of shell 6 top, bonding by fixing glue 8 with shell 6 bottom MEMS chip 2; Outside MEMS chip 2 and shell 6, space between circuit board 1 is called as carries on the back chamber 10.
Sound hole 5 is opened on housing 6 right inside MEMS chip 2, and sound hole 5 is relative with the space inside MEMS chip 2, and the space between inside sound hole 5 and MEMS chip 2 is called as ante-chamber 20.
In the confined space that shell 6 and circuit board 1 are formed, the top of the company's of leading part 7 is fixed on shell 6, bottom is provided with pad 71, and by fixing glue 8 fixed bonding on the circuit card 1, also can by welding or fixing glue 8 on circuit boards bonding, can play a supporting role, start conducting effect simultaneously.The company's of leading part 7 realizes MEMS chip 2, conducting between asic chip 3 and circuit board 1 by metal wire 4.Asic chip near the company's of leading part 7 side is connected by metal wire 4 with the company of leading part 7.If away from the company's of leading part 7 side and near MEMS chip side connection metal line 4, be easily short-circuited phenomenon.
In the present embodiment, be bonded on shell 6 by fixing glue 8 bottom MEMS chip 2, be bonded on shell 6 by fixing glue 8 bottom asic chip 3, MEMS chip 2 is connected by metal wire 4 with asic chip 3, asic chip 3 is coated with fluid sealant 9 to encapsulate, the company's of leading part 7 is positioned at the same side of MEMS chip 2 and asic chip 3, the company's of leading part 7 top is bonded on shell 6 by fixing glue 8, the pad 71 of bottom is by metal wire and asic chip 2 conducting, and pad 71 is on the circuit card 1 bonding by fixing glue 8.
Fig. 3 is the schematic diagram of the advance sound MEMS microphone described in further embodiment of this invention.The main distinction of the advance sound MEMS microphone shown in Fig. 3 and the advance sound MEMS microphone shown in Fig. 2 is: in figure 3, be bonded on shell 6 by fixing glue 8 bottom MEMS chip 2, on the circuit card 1 bonding by fixing glue 8 bottom asic chip 3, the company's of leading part 7 is provided with between MEMS chip 2 and asic chip 3, the company's of leading part 7 top is bonded on shell 6 by fixing glue 8, the pad 71 of bottom is on the circuit card 1 bonding by fixing glue 8, metal wire 4 is respectively stretched out in pad 71 both sides, the metal wire 4 of one end is connected with MEMS chip 2, the metal wire 4 of one end is connected with asic chip 3.
Fig. 4 is the schematic diagram of the advance sound MEMS microphone described in third embodiment of the invention.The main distinction of the advance sound MEMS microphone shown in Fig. 4 and the advance sound MEMS microphone shown in Fig. 2 is: in the diagram, in the confined space that shell 6 and circuit board 1 are formed, the bottom of the company's of leading part 7 is stepped, the stair-stepping top of MEMS chip 2 and the company's of leading part 7, namely outstanding part, is connected by metal wire 4; The stair-stepping below of the company's of leading part 7, namely recessed part, bottom is connected on pad 71, on the circuit card 1 bonding by fixing glue 8, the top of the company's of leading part 7 is fixed on shell 6, and bottom is provided with pad 71, and by fixing glue 8 fixed bonding on the circuit card 1, also can by welding or fixing glue 8 on circuit boards bonding, can play a supporting role, start conducting effect simultaneously.The company's of leading part 7 realizes MEMS chip 2, conducting between asic chip 3 and circuit board 1 by metal wire 4.
Fig. 5 is the schematic diagram of the advance sound MEMS microphone described in fourth embodiment of the invention.The main distinction of the advance sound MEMS microphone shown in Fig. 5 and the advance sound MEMS microphone shown in Fig. 2 is: in Figure 5, in the confined space that shell 6 and circuit board 1 are formed, be bonded on shell 6 by fixing glue 8 bottom MEMS chip 2, on the circuit card 1 bonding by fixing glue 8 bottom asic chip 3, MEMS chip 3 is positioned at the top of asic chip 3, the company's of leading part 7 is positioned at the same side of MEMS chip 2 and asic chip 3, the top of the company's of leading part 7 is fixed on shell 6, bottom is provided with pad 71, and by fixing glue 8 fixed bonding on the circuit card 1, also can by welding or fixing glue 8 on circuit boards bonding, can play a supporting role, start conducting effect simultaneously.The bottom of the company's of leading part 7 is stepped, the stair-stepping top of MEMS chip 2 and the company's of leading part 7, and namely outstanding part, is connected by metal wire 4; The stair-stepping below of the company's of leading part 7, namely recessed part, bottom is connected on pad 71, on the circuit card 1 bonding by fixing glue 8.Pad 71 stretches out a metal line 4, realize the conducting of the pad 71 of asic chip 3 one end and the company's of leading part 7, asic chip 3 other end stretches out a metal line 4 and connects on the circuit card 1.The company's of leading part 7 realizes MEMS chip 2, conducting between asic chip 3 and circuit board 1 by metal wire 4.
Fig. 6 is the schematic diagram of the advance sound MEMS microphone described in fifth embodiment of the invention.The main distinction of the advance sound MEMS microphone shown in Fig. 6 and the advance sound MEMS microphone shown in Fig. 2 is: in figure 6, in the confined space that shell 6 and circuit board 1 are formed, the company's of leading part 7 is in L-type, article one, the side of side is used for shell 6 by fixing glue 8 fixed bonding, opposite side is used for providing attachment ground, and asic chip 3 is fixedly bonded on the company's of leading part 7 by fixing glue 8; MEMS chip 2 is connected by metal wire 4 with asic chip 3, asic chip 3 is coated with fluid sealant 9 and encapsulates; And the bottom of another side is stepped; The stair-stepping top of asic chip 3 and the company's of leading part 7, namely outstanding part, is connected by metal wire 4; The stair-stepping below of the company's of leading part 7, namely recessed part, bottom is connected on pad 71, on the circuit card 1 bonding by fixing glue 8, the top of the company's of leading part 7 is fixed on shell 6, and bottom is provided with pad 71, and by fixing glue 8 fixed bonding on the circuit card 1, also can by welding or fixing glue 8 on circuit boards bonding, can play a supporting role, start conducting effect simultaneously.The company's of leading part 7 realizes MEMS chip 2, conducting between asic chip 3 and circuit board 1 by metal wire 4.
The advance sound MEMS microphone that the embodiment provided by the invention described above is provided, one, MEMS chip is fixed on shell, sound hole is arranged on shell corresponding inside MEMS chip, form ante-chamber inside MEMS chip and between shell, and outside MEMS chip and shell, formed between circuit board and carry on the back chamber, the volume in back of the body chamber obviously increases relative to the volume of advance sound MEMS microphone of the prior art, so signal to noise ratio will improve, form the MEMS microphone with high s/n ratio; Its two, in the confined space that shell and circuit board are formed, be provided with the company's of leading part, the company's of leading part one end is fixed on shell, and one end is fixing on circuit boards, plays the effect that conducting between the effect of support and chip with circuit board is connected; The company's of leading part is for the conducting of MEMS chip, asic chip and circuit board, thus, the relative position of MEMS chip, asic chip can be arranged flexibly, especially the position of asic chip can be arranged on shell, on circuit board and on the company's of leading part, connect to coordinate the conducting of the two, the position of leading part and shape also relative flexibly, MEMS chip, asic chip the same side or therebetween can be arranged on.
The above; be only the present invention's preferably embodiment, but protection scope of the present invention is not limited thereto, any people being familiar with this technology is in the technical scope disclosed by the present invention; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (10)
1. an advance sound MEMS microphone, it comprises: MEMS chip and asic chip are built between the cavity of shell and circuit board formation, and metal wire connects described MEMS chip and described asic chip, it is characterized in that,
Described MEMS chip is fixed on described housing top end inwall, is formed and carry on the back chamber outside described MEMS chip and between described shell and described circuit board;
Sound hole is opened on described housing right inside described MEMS chip, forms ante-chamber between inside described sound hole and described MEMS chip;
The top of the company's of leading part is fixing, and bottom is provided with pad and is fixed on described circuit board on the housing, described in the company's of leading part realize described MEMS chip, conducting between described asic chip and described circuit board by described metal wire.
2. advance sound MEMS microphone as claimed in claim 1, it is characterized in that, described shell and described circuit board form cavity by sealant sealing.
3. advance sound MEMS microphone as claimed in claim 1, it is characterized in that, described asic chip is fixed on described housing top end inwall.
4. advance sound MEMS microphone as claimed in claim 3, is characterized in that, described in the company's of leading part be positioned at described MEMS chip and asic chip the same side.
5. advance sound MEMS microphone as claimed in claim 1, it is characterized in that, described asic chip is fixed on described circuit board.
6. advance sound MEMS microphone as claimed in claim 5, is characterized in that, described in the company's of leading part between described MEMS chip and asic chip.
7. the advance sound MEMS microphone as described in claim 1 or 4 or 6, is characterized in that, described in the top of the company's of leading part bonding by fixing glue with described shell, pad solder described in bottom or fixing glue are bonded on described circuit board.
8. advance sound MEMS microphone as claimed in claim 1, is characterized in that, bonding by fixing glue with described shell bottom described MEMS chip, passes through fixing glue bonding bottom described asic chip with described shell or described circuit board.
9. the advance sound MEMS microphone as described in claim 1 or 4, it is characterized in that, the bottom of the described company of leading part body is stepped, described in the company's of leading part top bonding by fixing glue with described shell, pad solder described in bottom or fixing glue are bonded on described circuit board.
10. advance sound MEMS microphone as claimed in claim 9, is characterized in that, on the company's of leading part body described in described asic chip is fixed on.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410511198.XA CN104219612B (en) | 2014-09-29 | 2014-09-29 | A kind of advance sound MEMS microphone |
| JP2015155683A JP6180474B2 (en) | 2014-09-29 | 2015-08-06 | Top port type micro electro mechanical system microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410511198.XA CN104219612B (en) | 2014-09-29 | 2014-09-29 | A kind of advance sound MEMS microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104219612A true CN104219612A (en) | 2014-12-17 |
| CN104219612B CN104219612B (en) | 2019-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410511198.XA Active CN104219612B (en) | 2014-09-29 | 2014-09-29 | A kind of advance sound MEMS microphone |
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| Country | Link |
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| JP (1) | JP6180474B2 (en) |
| CN (1) | CN104219612B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2555659A (en) * | 2016-11-07 | 2018-05-09 | Cirrus Logic Int Semiconductor Ltd | Package for MEMS device and process |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018208230B4 (en) | 2018-05-24 | 2021-01-28 | Infineon Technologies Ag | MEMS BLOCK AND METHOD FOR MANUFACTURING A MEMS BLOCK |
| US10863282B2 (en) | 2019-01-30 | 2020-12-08 | Sae Magnetics (H.K.) Ltd. | MEMS package, MEMS microphone and method of manufacturing the MEMS package |
| US11350220B2 (en) | 2020-01-17 | 2022-05-31 | Sae Magnetics (H.K.) Ltd. | MEMS package, MEMS microphone and method of manufacturing the MEMS package |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6180474B2 (en) | 2017-08-16 |
| CN104219612B (en) | 2019-06-28 |
| JP2016072959A (en) | 2016-05-09 |
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